CN219017584U

CN219017584U - Combined packaging structure of GaN power semiconductor device

Info

Publication number: CN219017584U
Application number: CN202223471619.XU
Authority: CN
Inventors: 黄升; 刘毅; 肖延兵; 吴文杰
Original assignee: Xinzhongxiang Chengdu Microelectronics Co ltd
Current assignee: Xinzhongxiang Chengdu Microelectronics Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-05-12
Anticipated expiration: 2032-12-26

Abstract

The utility model relates to a combined packaging structure of a GaN power semiconductor device in the technical field of packaging structures, which comprises a substrate, wherein a pin groove is fixedly formed in the surface of the substrate, a packaging liquid groove is fixedly formed in the lower end of the pin groove, a sliding piston is sleeved in the packaging liquid groove, the lower end of the sliding piston is fixedly connected with a pushing plate, two sides of the upper end of the pushing plate are fixedly connected with a hydraulic telescopic shaft, one end of the hydraulic telescopic shaft is fixedly connected in the substrate, the pushing plate is sleeved in the substrate, the pin groove arranged in the way is favorable for fixedly packaging pins for placing chips, liquid flows into the packaging liquid groove when being cast in the pin groove during packaging, the substrate is pressed downwards at the moment, the pushing plate is pushed upwards, so that the packaging liquid of the packaging liquid groove is pushed upwards by the sliding piston in a sliding way, and the pin groove is prevented from being connected with similar casting liquid.

Description

Combined packaging structure of GaN power semiconductor device

Technical Field

The utility model relates to the technical field of packaging structures, in particular to a combined packaging structure of a GaN power semiconductor device.

Background

As the semiconductor integrated circuit industry has experienced rapid growth, technological advances in integrated circuit materials and designs have led to smaller and more complex circuits of each generation than those of the previous generation, but these advances have increased the complexity of integrated circuit processes, and in the course of integrated circuits, as geometries (minimum features or lines that can be produced by the process) shrink, functional densities (the number of interconnect devices per chip area) have increased, as well as technical requirements for chip packaging, such as the disclosure of device packages and electronic devices, for example, the publication of the specification cn202284511.9 gan.

In the existing packaging structure, when the chip pins are packaged, the distance between the pins is also closer and closer due to smaller chips, and when the chip pins are packaged, packaging liquids of adjacent pins can be connected together to cause the chip circuit to be short-circuited, parts cannot be normally used, and certain limitation exists.

Disclosure of Invention

Aiming at the problems, the utility model provides a combined packaging structure of a GaN power semiconductor device, which aims to solve the problems that the prior packaging structure is similar in pins and is easy to connect together, so that a chip cannot be used and certain limitation exists.

The technical scheme of the utility model is as follows:

the utility model provides a combination packaging structure of GaN power semiconductor device, includes the base plate, the pin groove has been seted up to the fixed surface of base plate, the fixed encapsulation cistern that has seted up of lower extreme in pin groove, the inside in encapsulation cistern has cup jointed the slip piston, the lower extreme fixedly connected with bulldozing board of slip piston, the upper end both sides fixedly connected with hydraulic telescoping shaft of bulldozing board, the one end fixed connection of hydraulic telescoping shaft is in the inside of base plate, the inside at the base plate is cup jointed to the bulldozing board.

The working principle of the technical scheme is as follows:

the pin groove that is favorable to placing the chip carries out fixed encapsulation through the pin that sets up, when liquid casting is at pin inslot portion when the encapsulation, flow into the encapsulation cistern, press the base plate downwards this moment, make the hydraulic telescoping shaft receive the compression, bulldoze the board and upwards advance and make the encapsulation liquid that sliding piston slip promotion encapsulation cistern upwards remove, avoid flowing out the pin groove and being connected with similar casting liquid, the pin of encapsulation chip is cooled off, avoid conventional encapsulation, two pin distance are advanced, the liquid of casting encapsulation is easy to be connected together makes the core pin parallelly connected, lead to the part to be unable to use, encapsulation liquid distance is too tight force adhesion technical problem together among the prior art has been solved.

In a further technical scheme, the lower end of the pushing plate is fixedly provided with a plurality of ventilation openings.

Can cool off the bulldozing board through the vent that sets up, be favorable to cooling sliding piston for encapsulation liquid cools off fast, has solved the technical problem that encapsulation liquid is apart from too tight power adhesion together among the prior art.

In a further technical scheme, the inside upper end of bulldozing the board is provided with the circulation groove, the inside of circulation groove is equipped with water, the inside one end fixedly connected with circulating pump of circulation groove, the inside other end fixedly connected with waterproof battery of circulation groove, waterproof battery moves worker wire and circulating pump electric connection.

The waterproof battery through setting up provides the power for the circulating pump, can let circulating pump operation drive the inside hydrologic cycle flow of circulation groove, is favorable to dispelling the heat and cools off fast, has solved the technical problem that encapsulation cooling is slow among the prior art.

In a further technical scheme, the inside of the sliding piston is fixedly provided with a cooling water tank, and the cooling water tank is led into the inside of the circulating tank through a pipeline.

Through the cooling water tank that sets up, when circulation tank inside water circulation flows, drive the inside water of cooling water tank and flow the circulation for the slip piston can cool off fast, is favorable to accelerating encapsulation shaping, has solved the slow technical problem of encapsulation cooling among the prior art.

In a further technical scheme, auxiliary pin columns are fixedly connected to two sides of the pin groove, and the auxiliary pin columns are made of copper materials.

Through the vice pin post that sets up, can prevent that former chip from damaging the fracture, follow-up chip inconvenient encapsulation can carry out conductive encapsulation with vice pin post, carries out the sculpture of secondary change chip circuit through the vice pin post that sets up, has solved the technical problem of prevention short circuit that can not be fine among the prior art.

The beneficial effects of the utility model are as follows:

1. according to the utility model, the pins for placing the chips are favorable for fixing and packaging through the pin grooves, when liquid is cast in the pin grooves during packaging, the liquid flows into the packaging liquid groove, at the moment, the base plate is pressed downwards, so that the hydraulic telescopic shaft is compressed, the pushing plate is pushed upwards, the sliding piston is pushed to slide and push packaging liquid in the packaging liquid groove to move upwards, the pin grooves are prevented from flowing out to be connected with similar casting liquid, pins of the packaged chips are cooled, conventional packaging is avoided, the two pins are too far apart, the casting packaged liquid is easy to be connected together, the pins of the cores are connected in parallel, and parts cannot be used.

2. According to the utility model, the pushing plate can be cooled through the ventilation opening, so that the sliding piston can be cooled, and through the cooling water tank, when water in the circulating tank circularly flows, the water in the cooling water tank is driven to flow and circulate, so that the sliding piston can be cooled secondarily, and the packaging and forming can be accelerated.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

fig. 2 is a schematic structural view of the push plate of the present utility model.

Reference numerals illustrate:

1. a substrate; 2. a pin slot; 3. packaging liquid tanks; 4. a sliding piston; 5. a push plate; 6. a hydraulic telescopic shaft; 7. a vent; 8. a circulation tank; 9. a circulation pump; 10. a waterproof battery; 11. a cooling water tank; 12. and a secondary pin post.

Detailed Description

Embodiments of the present utility model are further described below with reference to the accompanying drawings.

Example 1

As shown in fig. 1-2, the utility model provides a combined packaging structure of a GaN power semiconductor device, which comprises a substrate 1, wherein a pin groove 2 is fixedly formed in the surface of the substrate 1, a packaging liquid groove 3 is fixedly formed in the lower end of the pin groove 2, a sliding piston 4 is sleeved in the packaging liquid groove 3, the lower end of the sliding piston 4 is fixedly connected with a pushing plate 5, two sides of the upper end of the pushing plate 5 are fixedly connected with hydraulic telescopic shafts 6, one end of each hydraulic telescopic shaft 6 is fixedly connected in the substrate 1, and the pushing plate 5 is sleeved in the substrate 1.

Specifically, vent 7 has been fixedly seted up to the lower extreme of push plate 5, the quantity of vent 7 has a plurality ofly, the inside upper end of push plate 5 is provided with circulation groove 8, the inside of circulation groove 8 is equipped with water, the inside one end fixedly connected with circulating pump 9 of circulation groove 8, the inside other end fixedly connected with waterproof battery 10 of circulation groove 8, waterproof battery 10 moves worker wire and circulating pump 9 electric connection, cooling water tank 11 has been fixedly seted up to the inside of sliding piston 4, cooling water tank 11 leads to the inside of circulation groove 8 through the pipeline, the both sides fixedly connected with pair pin post 12 of pin groove 2, pair pin post 12 adopts the copper material to construct.

The working principle and the beneficial effects of the embodiment are as follows.

The pin through the pin groove 2 that sets up is favorable to placing the chip carries out fixed encapsulation, when casting liquid in pin groove 2 inside, flow into encapsulation cistern 3, press base plate 1 downwards this moment, make hydraulic telescoping shaft 6 receive the compression, push away board 5 upwards impel the encapsulation liquid that makes sliding piston 4 slip promote encapsulation cistern 3 upwards move, avoid flowing pin groove 2 and similar casting liquid connection, the pin of cooling package chip, avoid conventional encapsulation, two pin distances are advanced, the liquid easy-to-connect that the casting was packed makes the core pin parallelly connected, the part can not be used to result in, can cool down push away board 5 through vent 7 that sets up, be favorable to cooling sliding piston 4, make encapsulation liquid rapid cooling, provide the power through the waterproof battery 10 that sets up for circulating pump 9 through setting, can let circulating pump 9 operation drive the inside hydrologic cycle flow of circulating groove 8, be favorable to dispel the rapid cooling, through cooling trough 11 that sets up, when circulating groove 8 inside hydrologic cycle flows, it flows the circulation to drive cooling trough 11 inside water, make sliding piston 4 can accelerate the rapid cooling, can be favorable to the chip, can be broken through the chip post 12 is convenient to set up through the secondary chip, the chip is broken, the secondary chip is broken to the secondary chip is convenient to be packed to the secondary, the secondary chip is broken, the secondary chip is convenient to be packed through setting 12, the secondary chip is broken, the secondary is convenient to be broken, the secondary chip is convenient to be 12.

The foregoing examples merely illustrate specific embodiments of the utility model, which are described in greater detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model.

Claims

The combined packaging structure of the GaN power semiconductor device comprises a substrate and is characterized in that: the surface mounting of base plate has seted up the pin groove, the fixed encapsulation cistern that has seted up of lower extreme in pin groove, the inside of encapsulation cistern has cup jointed the sliding piston, the lower extreme fixedly connected with push plate of sliding piston, the upper end both sides fixedly connected with hydraulic telescoping shaft of push plate, the inside at the base plate of one end fixed connection of hydraulic telescoping shaft, the inside at the base plate is cup jointed to the push plate.
2. The combined package structure of the GaN power semiconductor device according to claim 1, wherein: the lower end of the pushing plate is fixedly provided with a plurality of ventilation openings.
3. The combined package structure of the GaN power semiconductor device according to claim 1, wherein: the inside upper end of bulldozing the board is provided with the circulation groove, the inside of circulation groove is equipped with water, the inside one end fixedly connected with circulating pump of circulation groove, the inside other end fixedly connected with waterproof battery of circulation groove, the power conductor and the circulating pump electric connection of waterproof battery.
4. The combined package structure of the GaN power semiconductor device according to claim 1, wherein: the inside of the sliding piston is fixedly provided with a cooling water tank, and the cooling water tank is communicated with the inside of the circulating tank through a pipeline.
5. The combined package structure of the GaN power semiconductor device according to claim 1, wherein: auxiliary pin columns are fixedly connected to two sides of the pin groove, and the auxiliary pin columns are made of copper materials.