CN219016644U - High-speed radiating optical module tube shell structure - Google Patents

Abstract

The utility model discloses a high-speed heat dissipation optical module tube shell structure which comprises a heat conducting sheet, a semiconductor refrigerating sheet and a first heat conducting plate, wherein the heat conducting sheet is arranged at the top of the first heat conducting plate, the semiconductor refrigerating sheet is arranged at one side of the first heat conducting plate, a plurality of first threaded holes are formed in the top of the heat conducting sheet, and a fixing plate is arranged at the top of the heat conducting sheet. According to the utility model, through the arrangement of the first heat conducting plate, the first heat radiating frame, the second heat conducting plate and the second heat radiating frame, the heat radiating effect of the optical module body is improved, the first heat conducting plate and the second heat conducting plate are connected with each other through the second fixing bolt, so that the optical module body with various models can be clamped by the first heat conducting plate and the second heat conducting plate, and the heat radiating effect of the optical module body is further improved through the arrangement of the heat conducting sheet, the first threaded hole, the fixing plate, the first fixing bolt, the sleeve, the fan and the filter screen, so that the problem of damage to internal components caused by overhigh temperature is avoided.

Description

High-speed radiating optical module tube shell structure

Technical Field

The utility model relates to the technical field of optical module equipment, in particular to a high-speed heat dissipation optical module tube shell structure.

Background

The optical module is composed of an optoelectronic device, a functional circuit, an optical interface and the like, wherein the optoelectronic device comprises a transmitting part, a receiving part and the like, the main function is photoelectric conversion, the transmitting end converts an electric signal into an optical signal, the optical signal is converted into the electric signal by the receiving end after being transmitted through an optical fiber, and a large amount of heat generated in the signal conversion process is required to be subjected to heat dissipation treatment.

The defects of the high-speed heat dissipation optical module tube shell structure in the prior art are that:

patent document CN211123391U discloses an optical module heat radiation structure, including longitudinal radiating fins, ventilation heat conduction pipes, an upper clamping seat, an upper fixing block, fastening screws, a lower fixing block, a heat conduction rubber plate and transverse radiating fins, the upper and lower end faces of an optical module main body are symmetrically attached with the heat conduction rubber plate, the lower end face of the lower clamping seat is welded with the transverse radiating fins, the left and right end faces of the lower clamping seat are symmetrically welded with the lower fixing block, the fastening screws are engaged in the middle position inside the lower fixing block, the upper side of the lower clamping seat is provided with an upper clamping seat, the upper end face of the upper clamping seat is welded with the longitudinal radiating fins, the left and right end faces of the upper clamping seat are symmetrically welded with the upper fixing block, and the ventilation heat conduction pipes are embedded in the upper clamping seat.

The optical module heat dissipation structure disclosed in the above publication mainly considers how to achieve the effect of improving the heat dissipation effect by embedding the ventilation heat conduction pipe into the upper clamping seat, and the heat dissipation effect of the existing high-speed heat dissipation optical module tube shell structure needs to be improved in the use process, so that the situation that the internal components are damaged easily due to overhigh temperature is avoided.

In view of this, it is necessary to develop a high-speed heat dissipation optical module package structure, and further to improve the heat dissipation effect of the optical module package structure during use.

Disclosure of Invention

The utility model aims to provide a high-speed radiating optical module tube shell structure so as to solve the problems that the radiating effect of the optical module tube shell structure needs to be improved and the internal components are easy to damage due to overhigh temperature in the background technology.

In order to achieve the above purpose, the utility model provides a high-speed heat dissipation optical module tube shell structure, which comprises a heat conducting sheet, a semiconductor refrigerating sheet and a first heat conducting plate, wherein the heat conducting sheet is arranged at the top of the first heat conducting plate, and the semiconductor refrigerating sheet is arranged at one side of the first heat conducting plate;

the top of the heat conducting fin is provided with a plurality of first threaded holes, the top of the heat conducting fin is provided with a fixing plate, the top of the fixing plate is provided with a plurality of first fixing bolts in a penetrating way, and the outer wall of each first fixing bolt is arranged on the inner wall of each first threaded hole;

the top of fixed plate is installed the sleeve, the fan is installed to the bottom of sleeve inner wall, the filter screen is installed at the top of sleeve inner wall.

Preferably, the bottom of one side of the semiconductor refrigerating sheet is provided with a second heat conducting plate, the top of the other side of the semiconductor refrigerating sheet is provided with a group of first clamping cushions, one side of each first clamping cushion is provided with a first clamping block, and one end of each first clamping block is provided with a first threaded rod.

Preferably, a group of first heat dissipation frames are installed at the top of the first heat conduction plate, two groups of first fixed blocks are installed on the outer wall of the first heat conduction plate, second fixed bolts are installed at the top of the first fixed blocks in a penetrating mode, the optical module body is installed on the inner wall of the first heat conduction plate, and the bottom of the optical module body is installed on the inner wall of the second heat conduction plate.

Preferably, the bottom of the second heat conducting plate is provided with a second heat dissipation frame, the outer wall of the second heat conducting plate is provided with two groups of second fixing blocks, the top of each second fixing block is provided with a second threaded hole, and the inner wall of each second threaded hole is arranged on the outer wall of each second fixing bolt.

Preferably, the outer wall of the first heat-conducting plate is provided with two groups of first limiting blocks, the inner wall of each first limiting block is provided with a first mounting groove, the inner wall of each first mounting groove is arranged on the outer wall of each first clamping block, one side of each first mounting groove is provided with a third threaded hole, and the inner wall of each third threaded hole is provided with the outer wall of each first threaded rod.

Preferably, the outer wall of the second heat-conducting plate is provided with two groups of second limiting blocks, the inner wall of each second limiting block is provided with a second mounting groove, and one side of each second mounting groove is provided with a fourth threaded hole.

Preferably, the second threaded rod is installed to the inner wall of fourth threaded hole, and the second grip block is installed to the one end of second threaded rod, and the second centre gripping cushion is installed to one side of second grip block, and the bottom in semiconductor refrigeration piece one side is installed to one side of second centre gripping cushion.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, through the arrangement of the first heat conducting plate, the first heat radiating frame, the second heat conducting plate and the second heat radiating frame, the heat radiating effect of the optical module body is improved, the first heat conducting plate and the second heat conducting plate are connected with each other through the second fixing bolt, so that the optical module body with various models can be clamped by the first heat conducting plate and the second heat conducting plate, and the heat radiating effect of the optical module body is further improved through the arrangement of the heat conducting sheet, the first threaded hole, the fixing plate, the first fixing bolt, the sleeve, the fan and the filter screen, so that the problem of damage to internal components caused by overhigh temperature is avoided.

2. According to the utility model, through the arrangement of the first limiting block and the second limiting block, the semiconductor refrigerating piece can be inserted into the inner walls of the first limiting block and the second limiting block, the movement of the first clamping block and the second clamping block can be regulated by rotating the first threaded rod and the second threaded rod, and the semiconductor refrigerating piece can be clamped and fixed through the first clamping soft cushion and the second clamping soft cushion, so that the heat dissipation effect of the optical module body can be improved, and the semiconductor refrigerating piece can be disassembled and installed conveniently.

Drawings

FIG. 1 is a perspective view of the overall structure of the present utility model;

FIG. 2 is a schematic view of a fan structure according to the present utility model;

FIG. 3 is a schematic view of a semiconductor refrigeration sheet according to the present utility model;

FIG. 4 is a schematic view of a first heat conducting plate structure according to the present utility model;

fig. 5 is a schematic diagram of a second heat conducting plate structure according to the present utility model.

In the figure: 1. a heat conductive sheet; 2. a semiconductor refrigeration sheet; 3. a first heat-conducting plate; 101. a first threaded hole; 102. a fixing plate; 103. a first fixing bolt; 104. a sleeve; 105. a blower; 106. a filter screen; 201. a second heat-conducting plate; 202. a first clamping cushion; 203. a first clamping block; 204. a first threaded rod; 301. a first heat dissipation frame; 302. a first fixed block; 303. a second fixing bolt; 304. an optical module body; 401. a second heat dissipation frame; 402. a second fixed block; 403. a second threaded hole; 501. a first limiting block; 502. a first mounting groove; 503. a third threaded hole; 601. a second limiting block; 602. a second mounting groove; 603. a fourth threaded hole; 701. a second threaded rod; 702. a second clamping block; 703. and a second clamping cushion.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1, in an embodiment of the present utility model, a high-speed heat dissipation optical module tube shell structure includes a heat conducting plate 1, a semiconductor refrigeration plate 2 and a first heat conducting plate 3, wherein the heat conducting plate 1 is installed at the top of the first heat conducting plate 3, and the semiconductor refrigeration plate 2 is installed at one side of the first heat conducting plate 3;

referring to fig. 1, 2, 4 and 5, a plurality of first screw holes 101 are opened at the top of the heat conductive sheet 1, a fixing plate 102 is installed at the top of the heat conductive sheet 1, a plurality of first fixing bolts 103 are installed at the top of the fixing plate 102 in a penetrating manner, the outer wall of the first fixing bolts 103 is installed at the inner wall of the first screw holes 101, a sleeve 104 is installed at the top of the fixing plate 102, a fan 105 is installed at the bottom of the inner wall of the sleeve 104, a filter screen 106 is installed at the top of the inner wall of the sleeve 104, a group of first heat dissipation frames 301 are installed at the top of the first heat conductive sheet 3, two groups of first fixing blocks 302 are installed at the outer wall of the first heat conductive sheet 3 in a penetrating manner, a second fixing bolt 303 is installed at the top of the first fixing blocks 302 in a penetrating manner, a light module body 304 is installed at the inner wall of the first heat conductive sheet 3, and the bottom of the light module body 304 is installed at the inner wall of the second heat conductive sheet 201, the bottom of the second heat-conducting plate 201 is provided with the second heat-radiating frame 401, the outer wall of the second heat-conducting plate 201 is provided with two groups of second fixing blocks 402, the top of the second fixing block 402 is provided with the second threaded hole 403, the inner wall of the second threaded hole 403 is arranged on the outer wall of the second fixing bolt 303, the heat-radiating effect of the optical module body 304 is improved by the arrangement of the first heat-conducting plate 3, the first heat-radiating frame 301, the second heat-conducting plate 201 and the second heat-radiating frame 401, the first heat-conducting plate 3 and the second heat-conducting plate 201 are connected with each other by the second fixing bolt 303, the optical module body 304 with various models can be clamped by the first heat-conducting plate 3 and the second heat-conducting plate 201, the heat-radiating effect of the optical module body 304 is further improved by the arrangement of the heat-conducting plate 1, the first threaded hole 101, the fixing plate 102, the first fixing bolt 103, the sleeve 104, the fan 105 and the filter screen 106, thereby avoiding the problem of damage to internal components caused by overhigh temperature;

referring to fig. 1 and 3, a second heat-conducting plate 201 is installed at the bottom of one side of a semiconductor refrigerating plate 2, a group of first clamping cushions 202 is installed at the top of the other side of the semiconductor refrigerating plate 2, a first clamping block 203 is installed at one side of the first clamping cushions 202, a first threaded rod 204 is installed at one end of the first clamping block 203, two groups of first limiting blocks 501 are installed at the outer wall of the first heat-conducting plate 3, a first installation groove 502 is provided at the inner wall of the first limiting block 501, the inner wall of the first installation groove 502 is installed at the outer wall of the first clamping block 203, a third threaded hole 503 is provided at one side of the first installation groove 502, the outer wall of the first threaded rod 204 is installed at the inner wall of the third threaded hole 503, two groups of second limiting blocks 601 are installed at the outer wall of the second heat-conducting plate 201, a second installation groove 602 is provided at the inner wall of the second limiting block 601, a fourth threaded hole 603 is formed in one side of the second installation groove 602, a second threaded rod 701 is installed on the inner wall of the fourth threaded hole 603, a second clamping block 702 is installed at one end of the second threaded rod 701, a second clamping cushion 703 is installed on one side of the second clamping cushion 702, one side of the second clamping cushion 703 is installed at the bottom of one side of the semiconductor refrigerating piece 2, the semiconductor refrigerating piece 2 can be inserted into the inner walls of the first limiting block 501 and the second limiting block 601 through the arrangement of the first limiting block 501 and the second limiting block 601, the movement of the first clamping block 203 and the second clamping block 702 can be adjusted by rotating the first threaded rod 204 and the second threaded rod 701, the semiconductor refrigerating piece 2 can be clamped and fixed through the first clamping cushion 202 and the second clamping cushion 703, the radiating effect of the optical module body 304 can be improved, and the semiconductor refrigerating piece 2 can be detached and installed conveniently.

The working principle is that the heat dissipation effect of the optical module body 304 is improved through the arrangement of the first heat conducting plate 3, the first heat dissipation frame 301, the second heat conducting plate 201 and the second heat dissipation frame 401, the first heat conducting plate 3 and the second heat conducting plate 201 are connected with each other through the second fixing bolt 303, the first heat conducting plate 3 and the second heat conducting plate 201 can be used for clamping the optical module body 304 of various types, the heat dissipation effect of the optical module body 304 is further improved through the arrangement of the heat conducting fin 1, the first threaded hole 101, the fixing plate 102, the first fixing bolt 103, the sleeve 104, the fan 105 and the filter screen 106, the problem that the internal components are damaged due to overhigh temperature is avoided, the semiconductor refrigerating fin 2 can be inserted into the inner walls of the first limiting module 501 and the second limiting module 601 through the arrangement of the first limiting module 501, the movement of the first threaded rod 204 and the second threaded rod 701 can be adjusted to the first clamping module 203 and the second clamping module 702, the semiconductor refrigerating fin 2 can be clamped by the first clamping 202 and the second clamping fin 703, the semiconductor refrigerating fin 2 can be further fixed by the first clamping fin 202 and the second clamping fin 703, the semiconductor fin 2 can be further installed and the semiconductor refrigerating fin 2 can be further conveniently and the refrigerating fin 2 can be detached, and the semiconductor fin can be further be conveniently installed and the refrigerating fin 2 can be conveniently.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. The utility model provides a high-speed radiating optical module tube shell structure, includes conducting strip (1), semiconductor refrigeration piece (2) and first heat-conducting plate (3), its characterized in that: the top of the first heat conducting plate (3) is provided with a heat conducting sheet (1), and one side of the first heat conducting plate (3) is provided with a semiconductor refrigerating sheet (2);

a plurality of first threaded holes (101) are formed in the top of the heat conducting fin (1), a fixing plate (102) is arranged at the top of the heat conducting fin (1), a plurality of first fixing bolts (103) are arranged at the top of the fixing plate (102) in a penetrating mode, and the outer walls of the first fixing bolts (103) are arranged on the inner walls of the first threaded holes (101);

the top of fixed plate (102) is installed sleeve (104), fan (105) are installed to the bottom of sleeve (104) inner wall, filter screen (106) are installed at the top of sleeve (104) inner wall.

2. The high-speed heat dissipation optical module package structure as defined in claim 1, wherein: the bottom of semiconductor refrigeration piece (2) one side is installed second heat-conducting plate (201), and a set of first centre gripping cushion (202) is installed at the top of semiconductor refrigeration piece (2) opposite side, and first grip block (203) is installed to one side of first centre gripping cushion (202), and first threaded rod (204) are installed to one end of first grip block (203).

3. The high-speed heat dissipation optical module package structure as defined in claim 1, wherein: a group of first heat dissipation frames (301) are installed at the top of first heat-conducting plate (3), two groups of first fixed blocks (302) are installed on the outer wall of first heat-conducting plate (3), second fixing bolts (303) are installed in a penetrating mode at the top of first fixed blocks (302), optical module bodies (304) are installed on the inner walls of first heat-conducting plate (3), and the bottoms of the optical module bodies (304) are installed on the inner walls of second heat-conducting plates (201).

4. The high-speed heat dissipation optical module package structure as defined in claim 2, wherein: the bottom of second heat-conducting plate (201) is installed second heat dissipation frame (401), and two sets of second fixed blocks (402) are installed to the outer wall of second heat-conducting plate (201), and second screw hole (403) have been seted up at the top of second fixed block (402), and the outer wall in second fixing bolt (303) is installed to the inner wall of second screw hole (403).

5. The high-speed heat dissipation optical module package structure as defined in claim 1, wherein: two sets of first limiting blocks (501) are installed on the outer wall of first heat-conducting plate (3), first mounting groove (502) has been seted up to the inner wall of first limiting block (501), and the inner wall of first mounting groove (502) is installed in the outer wall of first grip block (203), third screw hole (503) has been seted up to one side of first mounting groove (502), and the outer wall of first threaded rod (204) is installed to the inner wall of third screw hole (503).

6. The high-speed heat dissipation optical module package structure as defined in claim 2, wherein: two groups of second limiting blocks (601) are arranged on the outer wall of the second heat-conducting plate (201), a second mounting groove (602) is formed in the inner wall of the second limiting block (601), and a fourth threaded hole (603) is formed in one side of the second mounting groove (602).

7. The high-speed heat dissipation optical module package structure as defined in claim 6, wherein: the inner wall of fourth screw hole (603) is installed second threaded rod (701), and second grip block (702) is installed to one end of second threaded rod (701), and second centre gripping cushion (703) are installed to one side of second grip block (702), and the bottom in semiconductor refrigeration piece (2) one side is installed to one side of second centre gripping cushion (703).

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