CN219015502U - Temperature measuring instrument - Google Patents
Temperature measuring instrument Download PDFInfo
- Publication number
- CN219015502U CN219015502U CN202223380567.5U CN202223380567U CN219015502U CN 219015502 U CN219015502 U CN 219015502U CN 202223380567 U CN202223380567 U CN 202223380567U CN 219015502 U CN219015502 U CN 219015502U
- Authority
- CN
- China
- Prior art keywords
- bottom plate
- fixed
- multiunit
- temperature measuring
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The application discloses thermoscope relates to electronic components reflow soldering technical field, comprising a base plate, the through-hole has been seted up to one side of the inside of bottom plate, the second mounting groove body has all been seted up to the inside bottom plate of through-hole both sides, two sets of the inner chamber of second mounting groove body all is fixed with the spring, two sets of the end fixing of spring has scalable piece, bottom plate top position is provided with the base plate that contacts with scalable piece roof position, the top position of base plate is fixed with the multiunit and places the tool, the multiunit place the roof position of tool is fixed with the chip body, multiunit the bottom position of chip body all is fixed with the temperature measurement line. This application can be with the help of temperature measurement line and the record of thermoscope body measuring temperature through the inner chamber installation chip body of placing the tool, when measuring, outside pulling scalable piece removes to proper position department, and then can adjust the horizontal interval between scalable piece and the bottom plate, conveniently is applicable to not unidimensional base plate and chip body.
Description
Technical Field
The application relates to the technical field of reflow soldering of electronic components, in particular to a thermometer.
Background
With the rapid development of the semiconductor industry, a reflow soldering process is used for solidifying solder of an IC device, the IC device needs to be matched with different temperature control areas for soldering in the soldering process, and a temperature measuring device is generally used for measuring and recording the temperature in a reflow oven, so that the soldering process requirement of the IC device is ensured to be met.
The prior art discloses a thermoscope protection tool and temperature measuring equipment for reflow oven, wherein thermoscope protection tool includes: the heat insulation box comprises a heat insulation box body and a heat insulation cover, wherein the heat insulation box body comprises a box body and a first heat insulation layer arranged on the surface of the box body; the heat insulation cover comprises a heat insulation cover body and a second heat insulation layer arranged on the surface of the heat insulation cover body; the thermocouple type temperature sensor is arranged outside the heat insulation box and used for collecting temperature signals outside the heat insulation box; and one end of the connecting piece is arranged inside the heat insulation box, and the other end of the connecting piece is electrically connected with the at least one thermocouple type temperature sensor.
The above patent document only can measure the chip temperature on the substrate for a single chip thickness on a single substrate thickness during operation, however, the substrates and chips with different thicknesses have the same absorption temperature parts, which results in larger measurement temperature difference, and the above patent document cannot meet the requirements, therefore, the application provides a temperature measuring instrument different from the prior art to solve the above technical problems.
Disclosure of Invention
In order to solve the problem that the above-mentioned Chinese patent document with publication number of CN211347134U cannot be applied to substrates and chips with different thicknesses during operation, the application provides a temperature measuring instrument.
The application provides a thermoscope, adopts following technical scheme:
the utility model provides a thermoscope, includes the bottom plate, the through-hole has been seted up to one side of the inside of bottom plate, the second mounting groove body has all been seted up to the inside bottom plate of through-hole both sides, two sets of the inner chamber of second mounting groove body all is fixed with the spring, two sets of the end fixing of spring has scalable piece, bottom plate top position is provided with the base plate that contacts with scalable piece roof position, the top position of base plate is fixed with the multiunit and places the tool, and the multiunit place the roof position of tool is fixed with the chip body, multiunit the bottom position of chip body all is fixed with the temperature measurement line, multiunit the one end that the tool was placed is kept away from to the temperature measurement line is fixed with the thermoscope body.
Optionally, the thermometer body is electrically connected with a plurality of groups of temperature measuring wires through a plurality of groups of temperature measuring points respectively.
Optionally, the placing jig is in a hollow design, an adhesive layer is filled in the placing jig, and the chip body is fixed in the adhesive layer.
Through adopting above-mentioned technical scheme, place the inner chamber installation chip body of tool can take advantage of temperature measurement line and thermoscope body record measurement temperature, when measuring, outside pulling scalable piece removes to suitable position department, and then can adjust the horizontal interval between scalable piece and the bottom plate, conveniently is applicable to not unidimensional base plate.
Optionally, the inside of bottom plate has seted up multiunit first mounting groove body, multiunit first mounting groove body inner chamber all wears to be equipped with the connecting rod fixed mutually with scalable piece outer wall.
Optionally, the roof position of connecting rod has evenly seted up multiunit first screw, the bottom plate top wear to be equipped with first screw threaded connection's second bolt.
Through adopting above-mentioned technical scheme, can stimulate the connecting rod in the removal in-process of scalable piece and move to suitable position department in the inner chamber of first mounting groove body in step, then reverse screw the second bolt make its and the corresponding position between the first screw threaded connection to can fix scalable piece's position, and then can adjust the horizontal interval between scalable piece and the bottom plate, the convenience is applicable to not unidimensional base plate.
Optionally, a plurality of groups of second screw holes are formed in the top wall position of the bottom plate, a plurality of groups of second pressing plates are arranged in the top wall position of the substrate, and third bolts in threaded connection with the second screw holes are respectively arranged at two ends of the plurality of groups of second pressing plates in a penetrating mode.
Through adopting above-mentioned technical scheme, place the second clamp plate on the base plate, screw and twist and make threaded connection between its and the second screw, and then can fix the position of second clamp plate and base plate.
Optionally, the outside cover of thermoscope body is equipped with the insulating cover, the third screw of multiunit has been seted up to the roof position of bottom plate, insulating cover roof wall position is provided with multiunit first clamp plate, multiunit first clamp plate both ends all wear to be equipped with third screw threaded connection's first bolt.
Through adopting above-mentioned technical scheme, laminate multiunit first clamp plate in the surface position of insulating cover, then screw first bolt makes threaded connection between its and the third screw, and then can fix the position of insulating cover.
In summary, the present application includes at least one of the following beneficial effects:
the second bolt is screwed to separate the second bolt from the first screw hole, then the telescopic block is pulled outwards to drive the spring to stretch to a proper position, the connecting rod can be pulled to synchronously move to a proper position in the inner cavity of the first installation groove body in the moving process of the telescopic block, and then the second bolt is reversely screwed to enable the second bolt to be in threaded connection with the first screw hole at the corresponding position, so that the position of the telescopic block can be fixed, the horizontal distance between the telescopic block and the bottom plate can be adjusted, and the telescopic block is convenient to be suitable for substrates with different sizes.
Drawings
FIG. 1 is a schematic elevational cross-sectional view of the present application;
FIG. 2 is a schematic top cross-sectional view of the present application;
fig. 3 is a schematic top view of the present application.
In the figure: 1. a thermometer body; 2. a bottom plate; 3. a through hole; 4. a substrate; 5. a retractable block; 6. a first bolt; 7. a first platen; 8. a heat insulation cover; 9. a temperature measuring point; 10. a chip body; 11. a temperature measuring line; 12. a first mounting groove body; 13. a second mounting groove body; 14. a spring; 15. a connecting rod; 16. a first screw hole; 17. placing a jig; 18. a second screw hole; 19. a third screw hole; 20. a second pressing plate; 21. a second bolt; 22. and a third bolt.
Detailed Description
The present application is described in further detail below in conjunction with figures 1-3.
Referring to fig. 1, 2 and 3 of the drawings, one embodiment provided in the present application is: the utility model provides a thermoscope, including bottom plate 2, through-hole 3 has been seted up to one side of bottom plate 2 inside, through-hole 3 runs through bottom plate 2, multiunit second mounting groove body 13 has been seted up to bottom plate 2 inside, the outer wall of bottom plate 2 is run through to the tip of second mounting groove body 13, second mounting groove body 13 sets up both sides position around through-hole 3, the inner chamber of two sets of second mounting groove bodies 13 all is fixed with spring 14, the tip of two sets of spring 14 is fixed with scalable piece 5, bottom plate 2 top position is provided with the base plate 4 that contacts with scalable piece 5 roof position, the top position of base plate 4 is fixed with multiunit and places tool 17.
Please see fig. 2 and 3 in the drawing of the specification, the placement jig 17 is of a hollow design, the inside of the placement jig 17 is filled with a glue layer, the top position of the glue layer is fixedly provided with a chip body 10, the bottom position of the glue layer is covered with a temperature measuring wire 11, one end of the plurality of groups of temperature measuring wires 11, which is far away from the placement jig 17, is fixedly provided with a temperature measuring instrument body 1, the temperature measuring instrument body 1 is fixed at the top position of the bottom plate 2, the temperature measuring instrument body 1 is respectively electrically connected with the plurality of groups of temperature measuring wires 11 through the plurality of groups of temperature measuring points 9, and the bottom plate 2 is made of heat insulation materials, so that the damage to the temperature measuring instrument body 1 can be prevented as much as possible.
The inner cavity of the placing jig 17 is filled with the adhesive layer, then the chip body 10 is placed in the adhesive layer, the adhesive layer is pressed and covered with the temperature measuring wire 11, so that the temperature measuring wire 11 is connected with the thermometer body 1, the temperature of the bottom of the chip body 10 in the placing jig 17 can be recorded and measured under the action of the plurality of groups of temperature measuring points 9, when the temperature is measured, the telescopic block 5 is pulled outwards to drive the spring 14 to stretch to a proper position, the horizontal distance between the telescopic block 5 and the bottom plate 2 can be adjusted, and the device is convenient to be applied to substrates 4 with different sizes.
Referring to fig. 2 and 3 in the drawings, a plurality of groups of first installation groove bodies 12 are formed in the bottom plate 2, the plurality of groups of first installation groove bodies 12 are all arranged at the outer side positions of the plurality of groups of second installation groove bodies 13, and connecting rods 15 fixed with the outer walls of the telescopic blocks 5 are all arranged in the inner cavities of the plurality of groups of first installation groove bodies 12 in a penetrating manner. A plurality of groups of first screw holes 16 are uniformly formed in the top wall of the connecting rod 15, and a second bolt 21 in threaded connection with the first screw holes 16 is arranged on the top of the bottom plate 2 in a penetrating manner.
When the telescopic block 5 is moved, the second bolt 21 is screwed first to separate the telescopic block 5 from the first screw hole 16, then the telescopic block 5 is pulled outwards to pull the connecting rod 15 to move to a proper position in the inner cavity of the first mounting groove body 12 synchronously, and then the second bolt 21 is screwed reversely to enable the second bolt 21 to be in threaded connection with the first screw hole 16 at the corresponding position, so that the position of the telescopic block 5 can be fixed, the horizontal distance between the telescopic block 5 and the bottom plate 2 can be adjusted, and the telescopic block is convenient to be suitable for substrates 4 with different sizes.
Referring to fig. 2 and 3 of the drawings, a plurality of sets of second screw holes 18 are formed in the top wall of the bottom plate 2, the plurality of sets of second screw holes 18 are all disposed at the front and rear sides of the through hole 3, the plurality of sets of second screw holes 18 are all disposed at positions between the plurality of sets of second mounting grooves 13, a plurality of sets of second pressing plates 20 are disposed at the top wall of the substrate 4, and third bolts 22 in threaded connection with the second screw holes 18 are respectively disposed at two ends of the plurality of sets of second pressing plates 20. After the substrate 4 is placed, the second pressing plate 20 is placed on the substrate 4, and the third bolt 22 is screwed to be in threaded connection with the second screw hole 18, so that the position of the second pressing plate 20 can be fixed, and the position of the substrate 4 can be fixed.
Referring to fig. 1, 2 and 3 in the drawings, a heat insulation cover 8 is sleeved outside the thermometer body 1, a plurality of groups of third screw holes 19 are formed in the top wall of the bottom plate 2, a plurality of groups of first pressing plates 7 are arranged in the top wall of the heat insulation cover 8, and first bolts 6 in threaded connection with the third screw holes 19 are respectively arranged at two ends of the plurality of groups of first pressing plates 7. When the temperature measuring instrument is used, the heat insulation cover 8 is sleeved at the outer position of the temperature measuring instrument body 1, so that heat can be isolated as much as possible, damage to the temperature measuring instrument body 1 is avoided, after the heat insulation cover 8 is placed, a plurality of groups of first pressing plates 7 are attached to the surface position of the heat insulation cover 8, then the first bolts 6 are screwed to enable the first bolts to be in threaded connection with the third screw holes 19, and then the position of the heat insulation cover 8 can be fixed.
Working principle: when the temperature measuring instrument is used, the inner cavity of the placing jig 17 is filled with the adhesive layer, then the chip body 10 is placed in the adhesive layer, the adhesive layer is pressed and covered with the temperature measuring wire 11, so that the temperature measuring wire 11 is connected with the temperature measuring instrument body 1, the temperature of the bottom of the chip body 10 in the placing jig 17 can be recorded and measured under the action of a plurality of groups of temperature measuring points 9, when the temperature measuring instrument is used, the second bolt 21 is screwed firstly to separate from the first screw hole 16, then the telescopic block 5 is pulled outwards to drive the spring 14 to stretch to a proper position, the connecting rod 15 can be pulled to synchronously move to a proper position in the inner cavity of the first mounting groove body 12 in the moving process of the telescopic block 5, then the second bolt 21 is reversely screwed to enable the connecting rod to be in threaded connection with the first screw hole 16 at the corresponding position, so that the position of the telescopic block 5 can be fixed, and then the horizontal distance between the telescopic block 5 and the bottom plate 2 can be adjusted, and the temperature measuring instrument is convenient to be applied to substrates 4 with different sizes.
After the substrate 4 is placed, the second pressing plate 20 is placed on the substrate 4, the third bolt 22 is screwed to enable the second pressing plate 20 to be in threaded connection with the second screw hole 18, and then the position of the second pressing plate 20 can be fixed, so that the position of the substrate 4 can be fixed, when the temperature measuring instrument is used, the heat insulating cover 8 is sleeved at the outer position of the temperature measuring instrument body 1, heat can be isolated as far as possible, the temperature measuring instrument body 1 is prevented from being damaged, after the heat insulating cover 8 is placed, the plurality of groups of first pressing plates 7 are attached to the surface position of the heat insulating cover 8, and then the first bolt 6 is screwed to enable the first bolt 6 to be in threaded connection with the third screw hole 19, so that the position of the heat insulating cover 8 can be fixed.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (7)
1. The utility model provides a thermoscope, includes bottom plate (2), its characterized in that: through-hole (3) have been seted up to one side of bottom plate (2) inside, second mounting groove body (13) have all been seted up to the bottom plate (2) inside of through-hole (3) both sides, two sets of the inner chamber of second mounting groove body (13) all is fixed with spring (14), two sets of the end fixing of spring (14) has scalable piece (5), bottom plate (2) top position is provided with base plate (4) that contact with scalable piece (5) roof position, the top position of base plate (4) is fixed with multiunit and places tool (17), multiunit place the roof position of tool (17) is fixed with chip body (10), multiunit the bottom position of chip body (10) all is fixed with temperature measuring wire (11), multiunit place the one end that tool (17) was kept away from to temperature measuring wire (11) is fixed with thermoscope body (1).
2. A thermometer according to claim 1 wherein: the temperature measuring instrument body (1) is electrically connected with a plurality of groups of temperature measuring wires (11) through a plurality of groups of temperature measuring points (9).
3. A thermometer according to claim 1 wherein: the placement jig (17) is in a hollowed-out design, an adhesive layer is filled in the placement jig (17), and the chip body (10) is fixed in the adhesive layer.
4. A thermometer according to claim 1 wherein: a plurality of groups of first installation groove bodies (12) are formed in the bottom plate (2), and a plurality of groups of connecting rods (15) fixed with the outer wall of the telescopic block (5) are arranged in the inner cavities of the first installation groove bodies (12) in a penetrating mode.
5. The thermometer of claim 4 wherein: the top wall of the connecting rod (15) is uniformly provided with a plurality of groups of first screw holes (16), and the top of the bottom plate (2) is provided with a second bolt (21) in threaded connection with the first screw holes (16).
6. A thermometer according to claim 1 wherein: the top wall position of the bottom plate (2) is provided with a plurality of groups of second screw holes (18), the top wall position of the base plate (4) is provided with a plurality of groups of second pressing plates (20), and two ends of each group of second pressing plates (20) are respectively provided with a third bolt (22) in threaded connection with the second screw holes (18).
7. A thermometer according to claim 1 wherein: the outside cover of thermoscope body (1) is equipped with insulating cover (8), multiunit third screw (19) have been seted up to the roof position of bottom plate (2), insulating cover (8) roof position is provided with multiunit first clamp plate (7), multiunit first clamp plate (7) both ends all wear to be equipped with first bolt (6) with third screw (19) threaded connection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223380567.5U CN219015502U (en) | 2022-12-16 | 2022-12-16 | Temperature measuring instrument |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223380567.5U CN219015502U (en) | 2022-12-16 | 2022-12-16 | Temperature measuring instrument |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219015502U true CN219015502U (en) | 2023-05-12 |
Family
ID=86248254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202223380567.5U Active CN219015502U (en) | 2022-12-16 | 2022-12-16 | Temperature measuring instrument |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219015502U (en) |
-
2022
- 2022-12-16 CN CN202223380567.5U patent/CN219015502U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8026730B2 (en) | Process for measuring heat spreader tilt | |
CN219015502U (en) | Temperature measuring instrument | |
US20130044435A1 (en) | System in package, printed circuit board provided with such system in package | |
DE102014111439B4 (en) | Electronic module and method for its production | |
CN216940353U (en) | Multi-station clamping tool for capacitor machining | |
CN206362866U (en) | A kind of test fixture of L-band 80W power amplifier modules | |
CN114441079B (en) | Residual stress measuring device based on blind hole method | |
CN112710696B (en) | Test tool and test equipment for heat-conducting medium | |
CN211825390U (en) | IGBT module brazing filler metal layer bending thermal coupling stress measuring device | |
CN210808126U (en) | Pressure detection device for suction nozzle of chip mounter | |
CN212567735U (en) | Temperature measuring probe and temperature measuring instrument | |
CN217845006U (en) | Thickness test fixture for precise sheet metal part | |
CN213716870U (en) | Clamp for packaging thick film hybrid integrated circuit | |
CN111157333A (en) | IGBT module solder layer bending thermal coupling stress measuring device and measuring method thereof | |
CN220006810U (en) | Tool for machining lateral groove of thin-wall cylinder | |
CN219532716U (en) | Jig for mechanical test of molded surface mount components | |
CN213364070U (en) | Tester for semiconductor vacuum equipment | |
CN219302504U (en) | Inductance coil test fixture | |
CN117491814B (en) | Method for evaluating insulation reliability of plastic package interface | |
CN108966488B (en) | Half-hole micro-groove circuit board and processing equipment and processing technology thereof | |
CN220896921U (en) | Integrated circuit board chip limit structure | |
CN111081672A (en) | Novel chip packaging body and packaging method thereof | |
CN219600020U (en) | Electronic ceramic inner hole machining anti-cracking device | |
CN215866800U (en) | Probe seat and point measuring machine | |
CN220440988U (en) | Integrated circuit board with corner protection function |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |