CN219003547U

CN219003547U - Automatic filling device for microelectronic material

Info

Publication number: CN219003547U
Application number: CN202222687948.1U
Authority: CN
Inventors: 蔡怀瑞
Original assignee: Tangshan Ruihuan Technology Co ltd
Current assignee: Tangshan Ruihuan Technology Co ltd
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-05-12
Anticipated expiration: 2032-10-12

Abstract

The utility model discloses an automatic filling device of microelectronic materials, which belongs to the technical field of microelectronic materials and comprises a supporting table, wherein one side of the top of the supporting table is fixedly connected with a supporting column, the upper end of the supporting column is fixedly connected with a glue storage barrel, one side of the supporting column is provided with an extrusion pipe, a communicating pipe is arranged between the glue storage barrel and the extrusion pipe, a one-way valve with the direction of communication facing the extrusion pipe is arranged on the communicating pipe, the top of the extrusion pipe is fixedly connected with a cylinder, the inside of the extrusion pipe is connected with a piston in a sliding manner, the output end of the cylinder is fixedly connected with the piston, and the inner wall of the extrusion pipe close to the bottom is fixedly connected with a glue stop plate. According to the rubber plug disclosed by the utility model, the rubber extruding port can be sealed, when the piston is attached to the rubber stopping plate, the piston is driven to rise, the adhesive in the adhesive storage barrel can be pumped into the extruding pipe, the capacity between the piston and the rubber stopping plate is the amount of single-time extruded adhesive, the amount of single-time extruded adhesive can be regulated, and the use flexibility is improved.

Description

Automatic filling device for microelectronic material

Technical Field

The utility model relates to the technical field of microelectronic materials, in particular to an automatic filling device of a microelectronic material.

Background

The microelectronic material is a semiconductor material synthesized by GeSi alloy and wide forbidden band, and is a kind of microelectronic material, including silicon polished wafer, epitaxial wafer, SOI wafer, lead frame, plastic package material, bond alloy wire, ultra-clean high purity chemical reagent, ultra-high purity gas, etc. required by oxidation, photoresist coating, mask alignment, exposure, development, corrosion, cleaning, diffusion, encapsulation, etc. in IC manufacture process.

The patent of bulletin number CN210668291U discloses a microelectronic material's portable automatic filling device, base top mid-mounting has the processing seat, the mount pad is installed to base top position department in processing seat one side, the mount pad is close to the one end of processing seat and is connected with first electronic hydraulic stem, the one end of first electronic hydraulic stem is connected with the piece of supporting, the frame is installed to the one end at base top, the cylinder is installed to the inboard bottom in frame top, the bottom of cylinder is connected with the telescopic link, the bottom of telescopic link is connected with the briquetting, the extrusion case is installed to the one end that the frame was kept away from at the base top, the one end at extrusion case top is connected with the holding vessel, the feed inlet is installed at the top of holding vessel.

According to the technical scheme, the viscose glue flows into the extrusion box, the extrusion block is driven to advance through the second electric hydraulic rod, the viscose glue in the extrusion box is extruded, flows to the spray head along the filling pipe, and is sprayed to the surface of the circuit substrate through the spray head. The applicant believes that since the glue naturally flows downwards under the influence of gravity and enters the extrusion box, and a filling pipe communicating with the extrusion box is provided at one side of the extrusion box, the glue easily flows out of the filling pipe. In order to prevent the viscose from flowing out, the second electric hydraulic rod is required to be driven to drive the extrusion block and the stop block to move before the height of the viscose reaches the filling pipe, so that the stop block seals the communication part of the extrusion box and the liquid storage tank, the viscose amount in the extrusion box is difficult to determine, and the extruded viscose amount is difficult to effectively control finally.

Disclosure of Invention

The present utility model is directed to an automatic filling device for microelectronic materials, which solves the above-mentioned problems.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an automatic filling device of microelectronic material, includes the brace table, the top one side fixedly connected with support column of brace table, the upper end fixedly connected with of support column stores up the gluey bucket, one side of support column is provided with the extrusion pipe, store up and be provided with communicating pipe between gluey bucket and the extrusion pipe, be provided with the check valve that leads to direction orientation extrusion pipe on the communicating pipe, the top fixedly connected with cylinder of extrusion pipe, the inside sliding connection of extrusion pipe has the piston, the output and the piston fixed connection of cylinder, the inner wall fixedly connected with that the extrusion pipe is close to the bottom ends the glued board, the middle part of ending the glued board is provided with the crowded mouth that glues, the extrusion pipe is located the inside of ending the glued board below and is provided with the rubber pad, the top fixedly connected with rubber end cap of rubber pad activity is pegged graft in the crowded mouth, the bottom of extrusion pipe is provided with out the glued mouth.

As a still further scheme of the utility model, the bottom of the extrusion pipe is provided with a glue outlet, and the glue outlet is arranged at the bottom of the glue outlet.

As a still further scheme of the utility model, a mounting ring is arranged in the extrusion pipe below the glue stop plate, two ends of the rubber pad are fixedly connected with two ends of the inner wall of the mounting ring respectively, the bottom of the mounting ring is abutted against the glue outlet head, the top of the rubber plug is abutted against the hole wall of the glue extrusion port edge, and a glue flowing hole is arranged between the rubber pad and the mounting ring.

As a still further proposal of the utility model, the lower edge of the glue storage barrel is higher than the upper edge of the extrusion pipe.

As a still further proposal of the utility model, the top of the supporting table is provided with a placing plate, and the placing plate is opposite to the glue outlet.

As a still further scheme of the utility model, one side of the support column is provided with a mounting frame, one end of the mounting frame is fixedly connected with a sliding sleeve, the extrusion pipe is fixedly connected with one end of the mounting frame far away from the sliding sleeve, the sliding sleeve is sleeved on the outer surface of the support column, the side surface of the sliding sleeve is penetrated and connected with a locking bolt in a threaded manner, and the locking bolt is abutted against the support column.

Compared with the prior art, the utility model has the beneficial effects that:

1. this automatic filling device of microelectronic material has adopted the mutually supporting between end offset plate, crowded glue mouth, rubber pad, rubber end cap and the check valve, and the rubber end cap can seal to crowded glue mouth, and when piston and end offset plate pasted mutually, the drive piston risees, and the viscose in the storage glue bucket can be drawn into the extrusion intraductal, and the capacity between piston and the end offset plate is the volume of single extrusion viscose promptly, effectively solves the viscose volume in the extrusion case and is difficult to confirm, finally is difficult to carry out the problem of effective control to the viscose volume of extruding.

2. The automatic filling device of the microelectronic material can adjust the single extrusion quantity by driving the piston to lift, namely adjusting the capacity between the piston and the glue stop plate, thereby improving the use flexibility.

3. The automatic filling device of the microelectronic material can detach the glue outlet head and the mounting ring so as to clean the glue solidified in the glue outlet and the glue extruding opening, thereby being beneficial to long-term use.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

fig. 2 is a schematic view showing a connection structure of a communication pipe and an extrusion pipe of the present utility model;

FIG. 3 is a schematic view showing the internal structure of the extruded tube of the present utility model;

fig. 4 is a schematic top view of the rubber pad and rubber stopper of the present utility model.

The correspondence between the reference numerals and the component names in the drawings is as follows:

1. a support table; 2. a support column; 21. a mounting frame; 211. a sliding sleeve; 3. a glue storage barrel; 31. a communicating pipe; 311. a one-way valve; 4. extruding the tube; 41. a cylinder; 411. a piston; 42. a glue outlet; 43. a glue stop plate; 431. a glue extruding port; 44. a mounting ring; 441. a rubber pad; 442. a rubber plug; 443. a gumming hole; 45. a glue outlet head; 5. the plate is placed.

Detailed Description

Example 1

Referring to fig. 1-4, an automatic filling device for microelectronic materials in this embodiment includes a supporting table 1, a supporting column 2 is fixedly connected to one side of the top of the supporting table 1, a glue storage barrel 3 for filling glue is fixedly connected to the upper end of the supporting column 2, an extrusion tube 4 for extruding the glue is arranged on one side of the supporting column 2, and a communicating tube 31 is arranged between the glue storage barrel 3 and the extrusion tube 4. The lower edge of the glue storage barrel 3 is higher than the upper edge of the extrusion pipe 4, so that the glue in the glue storage barrel 3 can naturally flow into the extrusion pipe 4 from the communicating pipe 31 under the action of gravity. The top fixedly connected with cylinder 41 of extrusion pipe 4, the inside sliding connection of extrusion pipe 4 has piston 411, and the output and the piston 411 fixed connection of cylinder 41, the bottom of extrusion pipe 4 is provided with out the glue mouth 42. The output end of the driving cylinder 41 stretches, and the adhesive in the extrusion pipe 4 can be pushed by the piston 411 to be discharged from the adhesive outlet 42. The top of supporting bench 1 is provided with the board 5 of placing that is used for placing the circuit substrate, places board 5 just to glue outlet 42, extrudees the viscose on circuit substrate surface, is convenient for the circuit basically bond with the integrated circuit board.

Wherein, the inner wall of the extrusion pipe 4 near the bottom is fixedly connected with a glue stop plate 43, the glue stop plate 43 is positioned below the joint of the extrusion pipe 4 and the glue storage barrel 3, the middle part of the glue stop plate 43 is provided with a glue extrusion opening 431, and the glue in the extrusion pipe 4 can be extruded from the glue outlet 42 only after passing through the glue extrusion opening 431. The inside that extrusion pipe 4 is located the glue stop plate 43 below is provided with rubber pad 441, and the position of rubber pad 441 in extrusion pipe 4 is fixed, and rubber plug 442 is fixedly connected with at the top of rubber pad 441, and rubber plug 442 activity is pegged graft in the glue extrusion mouth 431 and is sealed glue extrusion mouth 431. When the piston 411 is attached to the glue stop plate 43, the piston 411 is driven to rise, the glue in the glue storage barrel 3 can be pumped into the extrusion pipe 4, the capacity between the piston 411 and the glue stop plate 43 is the single-extrusion glue amount, and the single-extrusion glue amount can be adjusted by driving the piston 411 to rise and fall.

In addition, the communicating pipe 31 is provided with the one-way valve 311 with the guiding direction facing the extruding pipe 4, so that the adhesive can only be guided into the extruding pipe 4 from the adhesive storage barrel 3, and can not flow back from the communicating pipe 31. The piston 411 is driven downwards and extrudes the adhesive in the extrusion pipe 4, the adhesive can apply downward pressure to the rubber plug 442, so that the rubber pad 441 is elastically deformed, an opening is formed between the rubber plug 442 and the inner wall of the extrusion opening 431, the adhesive can pass through the extrusion opening 431, and the adhesive passing through the extrusion opening 431 can be discharged from the adhesive outlet 42.

Example two

Referring to fig. 3, in an automatic filling device for microelectronic materials of the present embodiment, a glue outlet 45 is disposed at the bottom of the extrusion tube 4, a glue outlet 42 is disposed at the bottom of the glue outlet 45, the glue outlet 45 can be connected with the extrusion tube 4 in a threaded manner, and the glue outlet 45 can be detached from the extrusion tube 4. Since the glue is easy to cure at the glue outlet 42, the glue outlet head 45 can be disassembled to clean the cured glue in the glue outlet 42.

Meanwhile, a mounting ring 44 is arranged in the extrusion pipe 4 below the glue stop plate 43, the mounting ring 44 is movably inserted into the extrusion pipe 4, two ends of a rubber pad 441 are fixedly connected with two ends of the inner wall of the mounting ring 44 respectively, the bottom of the mounting ring 44 is abutted with the glue outlet head 45, and the top of a rubber plug 442 is abutted with the wall of the edge of the glue extrusion opening 431. After the glue outlet head 45 is disassembled, the mounting ring 44 can be taken out from the extrusion pipe 4, so that the solidified glue in the glue extrusion opening 431 can be cleaned conveniently. A glue flowing hole 443 is arranged between the rubber pad 441 and the mounting ring 44, and the glue passing through the glue extruding hole 431 can flow from the glue flowing hole 443 to the glue outlet 42.

Example III

Referring to fig. 1, in an automatic filling device for microelectronic materials in this embodiment, a mounting frame 21 for fixing an extrusion tube 4 is disposed on one side of a support column 2, a sliding sleeve 211 is fixedly connected to one end of the mounting frame 21, the extrusion tube 4 is fixedly connected to one end of the mounting frame 21 far away from the sliding sleeve 211, the sliding sleeve 211 is sleeved on the outer surface of the support column 2, a locking bolt is threaded on the side surface of the sliding sleeve 211 in a penetrating manner, the locking bolt is abutted against the support column 2, and after loosening the locking bolt, the sliding sleeve 211 can slide along the support column 2 so as to adjust the height of the extrusion tube 4, thereby improving the flexibility of use.

The foregoing description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical solution of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides an automatic filling device of microelectronic material, includes brace table (1), a serial communication port, top one side fixedly connected with support column (2) of brace table (1), the upper end fixedly connected with of support column (2) stores up gluey bucket (3), one side of support column (2) is provided with extrusion pipe (4), store up and be provided with communicating pipe (31) between gluey bucket (3) and the extrusion pipe (4), be provided with on communicating pipe (31) and lead direction check valve (311) towards extrusion pipe (4), the top fixedly connected with cylinder (41) of extrusion pipe (4), the inside sliding connection of extrusion pipe (4) has piston (411), the output and piston (411) fixedly connected with of cylinder (41), the inner wall fixedly connected with that extrusion pipe (4) is close to the bottom ends gluey board (43), the middle part of ending gluey board (43) is provided with extrusion mouth (431), the inside that extrusion pipe (4) are located to end gluey board (43) below is provided with rubber pad (441), top fixedly connected with cylinder (41) and piston (411) are connected with rubber plug (442), plug (442) in extrusion mouth (442).

2. An automatic filling device for microelectronic materials according to claim 1, characterized in that the bottom of the extrusion tube (4) is provided with a glue outlet head (45), the glue outlet (42) being arranged at the bottom of the glue outlet head (45).

3. The automatic filling device of microelectronic materials according to claim 2, characterized in that the extrusion tube (4) is provided with a mounting ring (44) in the lower part of the glue stop plate (43), two ends of the rubber pad (441) are fixedly connected with two ends of the inner wall of the mounting ring (44) respectively, the bottom of the mounting ring (44) is abutted against the glue outlet head (45), the top of the rubber plug (442) is abutted against the wall of the edge of the glue extrusion opening (431), and a glue flowing hole (443) is arranged between the rubber pad (441) and the mounting ring (44).

4. An automatic filling device for microelectronic materials according to claim 1, characterized in that the lower edge of the glue storage barrel (3) is higher than the upper edge of the extruded tube (4).

5. An automatic filling device for microelectronic materials according to claim 1, characterized in that the top of the support table (1) is provided with a placement plate (5), the placement plate (5) being opposite to the glue outlet (42).

6. The automatic filling device of microelectronic materials according to claim 1, characterized in that one side of the support column (2) is provided with a mounting frame (21), one end of the mounting frame (21) is fixedly connected with a sliding sleeve (211), the extrusion tube (4) is fixedly connected with one end of the mounting frame (21) far away from the sliding sleeve (211), the sliding sleeve (211) is sleeved on the outer surface of the support column (2), and a locking bolt is arranged on the side surface of the sliding sleeve (211) in a penetrating and threaded manner and is abutted against the support column (2).