CN218989377U - Vacuum system of electron beam evaporation coating equipment - Google Patents
Vacuum system of electron beam evaporation coating equipment Download PDFInfo
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- CN218989377U CN218989377U CN202221607561.4U CN202221607561U CN218989377U CN 218989377 U CN218989377 U CN 218989377U CN 202221607561 U CN202221607561 U CN 202221607561U CN 218989377 U CN218989377 U CN 218989377U
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Abstract
The utility model discloses a vacuum system of electron beam evaporation coating equipment, which comprises a first vacuum mechanism and a second vacuum mechanism; the first vacuum mechanism comprises a condensing pump and a condensing pump backing pump which are connected with a cavity of the workpiece loading unit; the second vacuum mechanism comprises a molecular pump and a molecular pump backing pump which are connected with the chamber of the evaporation unit; the first vacuum mechanism can independently vacuumize the workpiece loading unit or vacuumize the workpiece loading unit and the deposition material evaporation unit simultaneously when the workpiece loading unit and the deposition material evaporation unit are communicated; the second vacuum mechanism may be used to evacuate the deposition material evaporation unit alone or simultaneously with the workpiece loading unit and the deposition material evaporation unit when communicating therebetween. The vacuum system reduces the process maintenance frequency of the condensing pump in configuration, so as to improve the production efficiency, enlarge the application range of the electron beam evaporation technology for making process products, and ensure the stability of the quality of the plated products.
Description
Technical Field
The utility model belongs to the technical field of electron beam evaporation coating equipment, and particularly relates to a vacuum system of the electron beam evaporation coating equipment.
Background
Electron beam evaporation (Electron Beam Evaporation) is one type of physical vapor deposition, and has been increasingly used and important in the fields of semiconductors, microelectronics, aerospace, and the like in recent years. The electron beam evaporation coating process generally needs a vacuum environment, so a vacuum system is generally provided, and the vacuum system has important influence and effect on the product quality, production efficiency and the like of the electron beam evaporation coating industry on the vacuum degree, the vacuumizing time and the like in the equipment cavity.
Currently, a vacuum pumping system of an electron beam evaporation coating device generally adopts a condensing pump (or a low-temperature pump), which is a vacuum pump for condensing gas by using a low-temperature surface. The condensing pump is provided with a cold plate cooled to an extremely low temperature by liquid helium or a refrigerator, and the condensing pump condenses gas during operation and keeps the vapor pressure of condensate below the limit pressure of the pump, thereby achieving the effect of air extraction. In the aspect of obtaining clean and oilless vacuum environment, compared with other products, the condensing pump has obvious advantages, does not have any moving parts in vacuum, has high stability and can not bring sealing problems. And thus is widely used in vacuum systems of electron beam evaporation coating apparatuses. But the main processes of the condensing pump for low-temperature air extraction include low-temperature condensation, low-temperature adsorption and low-temperature trapping. Wherein the low temperature adsorption process refers to adsorption of gas molecules onto the adsorbent surface coated on the cold plate in a monolayer thickness. In the process, the condensing pump needs to help the condensing pump to pump out gas through the adsorption material, and the residual particles in the evaporation coating process can be adsorbed together by the condensing pump when the condensing pump is used for pumping out, so that the frequency of maintenance of the condensing pump is obviously increased by the process residues, the production efficiency is influenced, and the equipment cost is increased.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a vacuum system of an electron beam evaporation coating device.
The complete technical scheme of the utility model comprises the following steps:
a vacuum system of electron beam evaporation coating equipment, which comprises a first vacuum mechanism and a second vacuum mechanism;
the vacuum system comprises a first vacuum mechanism and a second vacuum mechanism;
the first vacuum mechanism comprises a condensation pump and a condensation pump backing pump, wherein the condensation pump is connected with the condensation pump backing pump and a cavity of the workpiece loading unit, and the condensation pump backing pump is connected with the cavity of the workpiece loading unit;
the second vacuum mechanism comprises a molecular pump and a molecular pump backing pump, the molecular pump is connected with the molecular pump backing pump and the chamber of the evaporation unit, and the molecular pump backing pump is connected with the molecular pump and the chamber of the evaporation unit;
the first vacuum mechanism is used for independently vacuumizing the workpiece loading unit when the workpiece loading unit and the deposition material evaporation unit are closed, or simultaneously vacuumizing the workpiece loading unit and the deposition material evaporation unit when the workpiece loading unit and the deposition material evaporation unit are communicated;
the second vacuum mechanism is used for independently vacuumizing the deposition material evaporation unit when the workpiece loading unit and the deposition material evaporation unit are closed, or simultaneously vacuumizing the workpiece loading unit and the deposition material evaporation unit when the workpiece loading unit and the deposition material evaporation unit are communicated.
The number of the molecular pump and the molecular pump pre-pump is 1 or more.
The number of the condensing pump and the pump in the front stage of the condensing pump is 1 or more.
The condensing pump backing pump is connected with the cavity of the workpiece loading unit through a pipeline, and a sealing mechanism is arranged at the joint of the pipeline and the cavity.
The molecular pump backing pump is connected with the chamber of the deposition material evaporation unit through a pipeline, and a sealing mechanism is arranged at the joint of the pipeline and the chamber of the deposition material evaporation unit.
The condensing pump is positioned behind the workpiece loading unit of the electron beam evaporation coating equipment.
And during the vacuumizing operation, the backing pump of the condensing pump firstly performs rough vacuumizing, and then the condensing pump performs normal vacuumizing operation to reach the required vacuum degree.
And during the vacuumizing operation, the molecular pump backing pump firstly performs rough vacuumizing, and then the molecular pump performs normal vacuumizing operation to reach the required vacuum degree.
The workpiece loading unit and the deposition material evaporation unit are of independent sealed cavity structures and can be respectively and independently opened or closed, the workpiece loading unit and the deposition material evaporation unit are connected through an isolation valve, when the isolation valve is opened, the workpiece loading unit and the deposition material evaporation unit are communicated, and after the isolation valve is closed, the workpiece loading unit and the deposition material evaporation unit are closed. When the coating operation with the residual particles of the process is executed, the high-vacuum isolation valve is opened, the high valve of the condensing pump of the workpiece loading unit is closed, the molecular pump and the front stage of the molecular pump of the deposition material evaporation unit remove the residual particles of a certain special process from the cavity, and the vacuum required by the process is maintained.
The present utility model has the advantage over the prior art that,
1. the difference is that in the prior art, the electron beam evaporation coating equipment adopts the condensing pump entirely, and the problem that the condensing pump is easy to cause to maintain the frequency to increase, the production cost is high and the production efficiency is reduced when the process with the residual particles of the process is executed. The utility model designs the workpiece loading unit and the deposition material evaporating unit which can be independently closed and opened, and adopts independent vacuum mechanisms for the workpiece loading unit and the deposition material evaporating unit respectively, so that the vacuumizing time can be effectively shortened, and the production efficiency of the equipment is improved. And expands the application range of the process product made by using the electron beam evaporation technology.
2. When executing some special processes, the workpiece loading unit and the deposition material evaporating unit can be pumped to the vacuum degree required by the process by using independent vacuum mechanisms respectively, the high vacuum isolation valve is opened, the high valve of the cold pump of the workpiece loading unit is closed, the electron beam evaporating system is used for coating or ion source etching, the molecular pump and the front stage of the molecular pump of the deposition material evaporating unit are used for removing the residual particles in the process of the chamber and keeping the vacuum of the process chamber, so that the maintenance frequency of the condensing pump in the process is reduced, the production cost is reduced, the production efficiency is improved, and the stability of the quality of the plated product is kept.
Drawings
FIG. 1 is a schematic diagram of a vacuum system of a dual-chamber electron beam evaporation coating apparatus according to the present utility model.
In the figure: 1-first vacuum mechanism, 2-second vacuum mechanism, 3-condensing pump, 4-condensing pump backing pump, 5-molecular pump, 6-molecular pump backing pump, 7-work piece loading unit, 8-deposition material evaporating unit, 9-isolation valve.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only examples and are not intended to limit the present application.
A vacuum system of an electron beam evaporation coating device, which comprises a first vacuum mechanism 1 for vacuumizing a workpiece loading unit 7 of the electron beam evaporation coating device and a second vacuum mechanism 2 for vacuumizing a deposition material evaporation unit 8 of the electron beam evaporation coating device;
wherein the first vacuum mechanism 1 comprises a condensation pump 3 and a condensation pump backing pump 4, wherein the condensation pump backing pump 4 is respectively connected with a chamber of the workpiece loading unit and the condensation pump; the condensing pump 3 is connected to the workpiece loading unit chamber through a high valve, and is also connected to the condensing pump backing pump 4. A regeneration valve is arranged between the condensation pump backing pump 4 and the condensation pump 3, the condensation pump backing pump 4 is connected with a cavity of the workpiece loading unit through a pipeline, a rough pumping valve is arranged on a connecting pipeline between the condensation pump backing pump 4 and the cavity, and a sealing mechanism is arranged at the joint of the pipeline and the cavity; the condensing pump backing pump is used for rough pumping the cavity and is used for exhausting air in the condensing pump regeneration process.
When vacuumizing, firstly, opening a rough vacuumizing valve to rough vacuumize the cavity, closing the rough vacuumizing valve after vacuumizing to the corresponding vacuum degree, opening a high valve of the condensing pump 3, vacuumizing by the condensing pump 3 according to the vacuum required by the working procedure, and closing the pre-pump 4 of the condensing pump.
When the condensing pump 3 performs the regeneration process, a condensing pump backing pump is opened, a regeneration valve is opened, the cold pump regeneration process is started, the backing pump is used for exhausting, and when the cold pump is started, the regeneration valve is closed.
The second vacuum mechanism 2 comprises a molecular pump 5 and a molecular pump forepump 6, the molecular pump 5 is positioned behind a deposition material evaporation unit of the electron beam evaporation coating equipment, and the molecular pump 5 is connected with the molecular pump forepump 6 and a deposition material evaporation unit chamber; the molecular pump backing pump 6 is connected with the molecular pump 5 and is connected with the chamber of the deposition material evaporation unit through a pipeline, and a sealing mechanism is arranged at the joint of the pipeline and the chamber of the deposition material evaporation unit. The molecular pump backing pump 6 is used for rough evacuation of the chamber vacuum and for evacuation of the molecular pump pumped gas. A backing valve is arranged between the molecular pump and the molecular pump backing pump, a rough pumping valve is arranged on a pipeline between the molecular pump backing pump and the cavity, and a high valve is arranged between the molecular pump and the cavity.
When the vacuum pumping operation is performed, a forepump of the molecular pump is firstly opened, a forevalve is opened, and the molecular pump is started. After the molecular pump is started, closing a backing valve, opening a rough pumping valve, and performing rough pumping on a cavity of the evaporation unit by the molecular pump backing pump 6; after the vacuum degree is pumped to the corresponding vacuum degree, the rough pumping valve is closed, the backing valve is opened, the high valve is opened, and the molecular pump 5 performs normal vacuum pumping operation on the cavity of the evaporation unit so as to enable the cavity to reach the required vacuum degree. When the molecular pump works normally, the front-stage valve of the molecular pump must be opened to be used as an exhaust pump of the molecular pump.
The workpiece loading unit and the deposition material evaporating unit are of independent sealed cavity structures and can be respectively and independently opened or closed. In addition, the workpiece loading unit and the deposition material evaporating unit may be connected through a high vacuum isolation valve, and when the high vacuum isolation valve is opened, the workpiece loading unit and the deposition material evaporating unit form a communicated integral chamber, and the first vacuum mechanism 1 and the second vacuum mechanism 2 may simultaneously perform a vacuum pumping operation on the communicated integral chamber, and of course, the operation may also be performed by the first vacuum mechanism 1 or the second vacuum mechanism 2 alone. When the high vacuum isolation valve is closed, the workpiece loading unit and the deposition material evaporation unit are respectively and independently opened or closed, and at the moment, the first vacuum mechanism 1 performs vacuum pumping operation on the workpiece loading unit, and the second vacuum mechanism 2 performs vacuum pumping operation on the deposition material evaporation unit. And in order to prevent the high vacuum isolation valve operation from influencing the stability of the molecular pump, a damping device is arranged on the molecular pump, and the damping device comprises buffering damping cotton contacted with the molecular pump, so that the operation stability of the molecular pump is improved.
And a workpiece fixing disc is arranged in the workpiece loading unit cavity and is used for loading a workpiece needing to be coated. The deposition material evaporation unit is characterized in that a deposition material evaporation unit cavity is internally provided with a deposition material and an evaporation source for evaporating the deposition material, and the evaporation source is an electron gun system. By adopting the workpiece loading unit and the deposited material evaporating unit of the independent sealing mechanism, after the film deposition process of a certain batch is completed, the isolating valve is closed, and film deposition can be started after the workpiece loading unit loads the workpieces of the next batch, so that the evaporated material is kept in a vacuum state, the initial purity is ensured, and the film quality of film deposition is better ensured. Under the condition that the process is not finished, the evaporation material is used up, the isolation valve can be closed, the workpiece loading unit is kept under the vacuum process condition capable of carrying out film deposition, the film deposition process is continued after the evaporation material is added, and the rejection rate of the workpieces in the process and the vacuumizing time are reduced.
The working mode of the vacuum system is as follows: after loading the workpiece on the fixed disk in the workpiece loading unit, the workpiece loading unit is closed. And after the evaporation material is loaded in the evaporation material unit, closing the evaporation material unit. And respectively starting the first vacuum mechanism 1 and the second vacuum mechanism 2, pumping the workpiece loading unit chamber and the deposition material evaporation unit chamber to vacuum required by the process, then melting the evaporation material to an evaporable state by the electron gun system, opening the high-vacuum isolation valve, enabling the workpiece loading unit and the deposition material evaporation unit to be communicated into an integral chamber, and evaporating and coating the workpiece. In some special processes with residual particles, a condensing pump high valve of a first vacuum mechanism is closed before a high-vacuum isolation valve is opened, one or more molecular pumps and a molecular pump backing pump of the deposition material evaporation unit are used for discharging the residual particles in the process from a chamber, the required vacuum of the process chamber is maintained, and the quality of the product coating film is stable.
The above applications are only some of the embodiments of the present application. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the inventive concept.
Claims (7)
1. A vacuum system of electron beam evaporation coating equipment is characterized in that,
the vacuum system comprises a first vacuum mechanism and a second vacuum mechanism;
the first vacuum mechanism comprises a condensation pump and a condensation pump backing pump, wherein the condensation pump is connected with the condensation pump backing pump and a cavity of the workpiece loading unit, and the condensation pump backing pump is connected with the condensation pump backing pump and the cavity of the workpiece loading unit;
the second vacuum mechanism comprises a molecular pump and a molecular pump backing pump, the molecular pump is connected with the molecular pump backing pump and the chamber of the evaporation unit, and the molecular pump backing pump is connected with the molecular pump and the chamber of the evaporation unit;
the first vacuum mechanism is used for independently vacuumizing the workpiece loading unit when the workpiece loading unit and the deposition material evaporation unit are closed, or simultaneously vacuumizing the workpiece loading unit and the deposition material evaporation unit when the workpiece loading unit and the deposition material evaporation unit are communicated;
the second vacuum mechanism is used for independently vacuumizing the deposition material evaporation unit when the workpiece loading unit and the deposition material evaporation unit are closed, or simultaneously vacuumizing the workpiece loading unit and the deposition material evaporation unit when the workpiece loading unit and the deposition material evaporation unit are communicated.
2. The vacuum system of an electron beam evaporation coating apparatus according to claim 1, wherein the number of the molecular pump and the molecular pump pre-pump is one or more.
3. The vacuum system of an electron beam evaporation coating apparatus according to claim 1, wherein the number of the condensing pump and the pump preceding the condensing pump is one or more.
4. The vacuum system of an electron beam evaporation coating apparatus according to claim 1, wherein the pump of the condensing pump is connected to the chamber of the workpiece loading unit through a pipe, and a sealing mechanism is provided at the connection between the pipe and the chamber.
5. The vacuum system of claim 4, wherein the molecular pump backing pump is connected to the chamber of the deposition material evaporation unit via a pipe, and a sealing mechanism is provided at the connection between the pipe and the chamber of the deposition material evaporation unit.
6. The vacuum system of an e-beam evaporation coating apparatus according to claim 1, wherein the condensing pump is located behind a workpiece loading unit of the e-beam evaporation coating apparatus.
7. The vacuum system of an electron beam evaporation coating apparatus according to claim 1, wherein the workpiece loading unit and the deposition material evaporation unit are independently sealed chamber structures and can be opened or closed independently, the workpiece loading unit and the deposition material evaporation unit are connected through an isolation valve, when the isolation valve is opened, the workpiece loading unit and the deposition material evaporation unit are communicated, and when the isolation valve is closed, the workpiece loading unit and the deposition material evaporation unit are closed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221607561.4U CN218989377U (en) | 2022-06-20 | 2022-06-20 | Vacuum system of electron beam evaporation coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221607561.4U CN218989377U (en) | 2022-06-20 | 2022-06-20 | Vacuum system of electron beam evaporation coating equipment |
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| Publication Number | Publication Date |
|---|---|
| CN218989377U true CN218989377U (en) | 2023-05-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221607561.4U Active CN218989377U (en) | 2022-06-20 | 2022-06-20 | Vacuum system of electron beam evaporation coating equipment |
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| Country | Link |
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| CN (1) | CN218989377U (en) |
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- 2022-06-20 CN CN202221607561.4U patent/CN218989377U/en active Active
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