CN218975251U - Single-phase H bridge contravariant output filter inductance water-cooling structure - Google Patents
Single-phase H bridge contravariant output filter inductance water-cooling structure Download PDFInfo
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- CN218975251U CN218975251U CN202223515298.9U CN202223515298U CN218975251U CN 218975251 U CN218975251 U CN 218975251U CN 202223515298 U CN202223515298 U CN 202223515298U CN 218975251 U CN218975251 U CN 218975251U
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Abstract
The application provides a single-phase H bridge contravariant output filter inductance water-cooling structure, include: a housing including a cavity with an open upper portion; the inductance component comprises a single-phase H-bridge circuit, an inductance coil, a resistor and a capacitor, wherein the single-phase H-bridge circuit is connected with the inductance coil, the inductance coil is connected with the resistor and the capacitor, and the inductance coil is arranged in the cavity; the heat-conducting glue is filled in the cavity, and a water cooling structure is arranged on one side face of the cavity and comprises a water cooling plate and a water cooling pipe arranged in the water cooling plate. According to the heat conduction glue, the product becomes a whole through the encapsulation heat conduction glue, and the water cooling plate is utilized to conduct heat, so that the light weight and low noise solution is realized. Compared with similar products, the volume can be saved by about 30%, and the noise is reduced by about 5 DB. Preferably, the resistor can be cooled by the water cooling plate at the same time, so that the space and the volume are further saved.
Description
Technical Field
The utility model relates to an inductance heat dissipation technology, in particular to a single-phase H-bridge inversion output filter inductance water cooling structure.
Background
In recent years, as the power capacity of power electronics is increased, the volume and heat generation amount required by the magnetic core components are increased, and in this case, it is necessary to timely dissipate heat of products, and in addition, it is necessary to miniaturize the volume of products as much as possible for some electrical systems, and noise is controlled below 65 DB. The traditional natural cooling products have larger volume and higher noise level, and cannot meet the technical requirements of miniaturization and low noise.
Disclosure of Invention
The utility model aims to provide a single-phase H-bridge inversion output filter inductance water-cooling structure with lower noise and smaller volume.
The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.
According to an aspect of the present utility model, there is provided a water cooling structure of a single-phase H-bridge inverter output filter inductor, including:
a housing including a cavity with an open upper portion;
the inductance component comprises a single-phase H-bridge circuit, an inductance coil, a resistor and a capacitor, wherein the single-phase H-bridge circuit is connected with the inductance coil, the inductance coil is connected with the resistor and the capacitor, and the inductance coil is arranged in the cavity;
the heat-conducting glue is filled in the cavity, and a water cooling structure is arranged on one side face of the cavity and comprises a water cooling plate and a water cooling pipe arranged in the water cooling plate.
In an embodiment, the water inlet and the water outlet of the water cooling pipe are arranged at the upper end of the water cooling plate, and the water cooling pipe is U-shaped or S-shaped inside the water cooling plate.
In an embodiment, the resistor includes two heat dissipation resistors, and the two heat dissipation resistors are both disposed on an outer side surface of the water cooling plate.
In one embodiment, the inductor coil comprises a ferromagnetic core and two copper foil coils wound on the ferromagnetic core.
In one embodiment, each copper foil coil is wound with 8 layers, the copper foil has a width of 80mm, a thickness of 0.6mm and a cross-sectional area of 48mm 2 。
In an embodiment, the thermally conductive adhesive is a high thermal conductivity epoxy adhesive.
In an embodiment, the thermal conductivity of the high thermal conductivity epoxy glue is not lower than 4.0.
The beneficial effects of the embodiment of the application are that: the heat-conducting glue is filled and sealed integrally, and heat is conducted by the water cooling plate, so that the product is integrated, and the volume is saved by about 30%. The encapsulated heat-conducting glue can conduct heat and reduce vibration of products, so that noise is reduced. Preferably, the resistor can be cooled by the water cooling plate at the same time, so that the space and the volume are further saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
The above features and advantages of the present utility model will be better understood after reading the detailed description of embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily to scale and components having similar related features or characteristics may have the same or similar reference numerals.
FIG. 1 is a schematic diagram of an embodiment of the present application prior to potting a heat transfer adhesive;
FIG. 2 is a schematic illustration of an embodiment of the present application after potting a heat transfer adhesive;
FIG. 3 is a schematic view of the internal structure of an embodiment of the present application;
fig. 4 is a circuit block diagram of an inductance assembly of an embodiment of the present application;
wherein: 1-a housing; 11-a cavity; a 2-inductor assembly; 21-single phase H-bridge circuit; 22-an inductor; a 221-ferromagnetic core; 222-copper foil coil; 23-resistance; 24-capacitance; 3-heat conducting glue; 4-a water cooling structure; 41-water cooling plates; 42-a water-cooled tube; 421-water inlet; 422-water outlet.
Detailed Description
The utility model is described in detail below with reference to the drawings and the specific embodiments. It is noted that the aspects described below in connection with the drawings and the specific embodiments are merely exemplary and should not be construed as limiting the scope of the utility model in any way.
As shown in fig. 1 and fig. 2, the embodiment of the application provides a water cooling structure of a single-phase H-bridge inverter output filter inductor, which comprises a shell 1 and an inductor assembly 2. Wherein the housing 1 is a specially-made structure and comprises a cavity 11 with an open upper part. The circuit connection relation of the inductance component 2 is shown in fig. 4, and the inductance component comprises a single-phase H-bridge circuit 21, an inductance coil 22, a resistor 23 and a capacitor 24, wherein the single-phase H-bridge circuit 21 is connected with the inductance coil 22, the inductance coil 22 is connected with the resistor 23 and the capacitor 24, and the inductance coil 22 is arranged in the cavity 11. The cavity 11 is filled with heat-conducting glue 3.
Fig. 1 shows a state before potting the heat-conductive adhesive 3, and fig. 2 shows a state after potting the heat-conductive adhesive 3. During installation, the inductance coil 22 is wound and assembled, the inductance is debugged, then the inductance coil 22 is soaked in paint, and then the inductance coil 22 is placed in the cavity 11, and the heat-conducting glue 3 is filled and sealed to enable the product to be a whole. The heat-conducting glue 3 can conduct out the heat of the coil, reduce the whole vibration and reduce the noise.
One side surface of the cavity 11 is provided with a water cooling structure 4, and the water cooling structure 4 comprises a water cooling plate 41 and a water cooling pipe 42 arranged inside the water cooling plate 41. The water cooling structure 4 is contacted with the heat conducting glue 3 to form a complete heat dissipation path.
The water inlet 421 and the water outlet 422 of the water cooling pipe 42 are disposed at the upper end of the water cooling plate 41 and connected with an external water pump to form a water cooling cycle, thereby conducting the heat generated inside to the air. In order to improve the heat exchange effect, the water cooling pipes 42 may be disposed in a U-shape or S-shape inside the water cooling plate 41.
In a possible embodiment, the resistor 23 includes two heat dissipation resistors, and both the two heat dissipation resistors can be disposed on the outer side surface of the water cooling plate 41, so that the water cooling plate 41 can also dissipate heat of the resistor 23 at the same time, thereby saving the product volume.
Specifically, the inductor 22 is formed by copper foil winding, and includes a ferromagnetic core 221 and two copper foil coils 222 wound around the ferromagnetic core 221, as shown in fig. 3. Each copper foil coil was wound with 8 layers for 16 turns. The copper foil has a width of 80mm, a thickness of 0.6mm and a cross-sectional area of 48mm 2 。
In this embodiment, the heat conductive adhesive is high heat conductive epoxy adhesive, and the heat conductivity coefficient thereof should be not lower than 4.0, so as to ensure the heat dissipation effect.
In summary, the embodiment of the application provides a single-phase H bridge contravariant output filter inductance water-cooling structure, through heat conduction glue and water-cooling combination, realized lightweight and low noise's solution, the volume can practice thrift about 30%, and the noise has reduced about 5DB than like product.
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
The foregoing description is of the preferred embodiment of the present application and is not intended to limit the utility model to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, alternatives, and alternatives falling within the spirit and scope of the utility model.
Claims (7)
1. The utility model provides a single-phase H bridge contravariant output filter inductance water-cooling structure which characterized in that includes:
a housing including a cavity with an open upper portion;
the inductance component comprises a single-phase H-bridge circuit, an inductance coil, a resistor and a capacitor, wherein the single-phase H-bridge circuit is connected with the inductance coil, the inductance coil is connected with the resistor and the capacitor, and the inductance coil is arranged in the cavity;
the heat-conducting glue is filled in the cavity, and a water cooling structure is arranged on one side face of the cavity and comprises a water cooling plate and a water cooling pipe arranged in the water cooling plate.
2. The water cooling structure of the single-phase H-bridge inverter output filter inductor according to claim 1, wherein the water inlet and the water outlet of the water cooling pipe are arranged at the upper end of the water cooling plate, and the water cooling pipe is in a U shape or an S shape inside the water cooling plate.
3. The water cooling structure of the single-phase H-bridge inverter output filter inductor according to claim 1, wherein the resistor comprises two heat dissipation resistors, and the two heat dissipation resistors are both arranged on the outer side surface of the water cooling plate.
4. The water cooling structure of the single-phase H-bridge inverter output filter inductor according to claim 1, wherein the inductor coil comprises a ferromagnetic core and two copper foil coils wound on the ferromagnetic core.
5. The single-phase H-bridge inverter output filter inductor of claim 4The water cooling structure is characterized in that 8 layers of copper foil coils are wound, the width of the copper foil is 80mm, the thickness is 0.6mm, and the cross-sectional area is 48mm 2 。
6. The water cooling structure of the single-phase H-bridge inverter output filter inductor according to claim 1, wherein the heat-conducting glue is high-heat-conducting epoxy glue.
7. The water cooling structure of the single-phase H-bridge inverter output filter inductor according to claim 6, wherein the thermal conductivity of the high thermal conductivity epoxy glue is not lower than 4.0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223515298.9U CN218975251U (en) | 2022-12-28 | 2022-12-28 | Single-phase H bridge contravariant output filter inductance water-cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223515298.9U CN218975251U (en) | 2022-12-28 | 2022-12-28 | Single-phase H bridge contravariant output filter inductance water-cooling structure |
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| Publication Number | Publication Date |
|---|---|
| CN218975251U true CN218975251U (en) | 2023-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223515298.9U Active CN218975251U (en) | 2022-12-28 | 2022-12-28 | Single-phase H bridge contravariant output filter inductance water-cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218975251U (en) |
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2022
- 2022-12-28 CN CN202223515298.9U patent/CN218975251U/en active Active
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