CN218973535U - Vibration temperature signal acquisition module - Google Patents

Vibration temperature signal acquisition module Download PDF

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Publication number
CN218973535U
CN218973535U CN202223525688.4U CN202223525688U CN218973535U CN 218973535 U CN218973535 U CN 218973535U CN 202223525688 U CN202223525688 U CN 202223525688U CN 218973535 U CN218973535 U CN 218973535U
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China
Prior art keywords
box body
temperature signal
module
signal acquisition
box
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CN202223525688.4U
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Chinese (zh)
Inventor
窦涛
吕其栋
马俊豪
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Sinoma Intelligent Technology Chengdu Co ltd
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Anrui Zhida Chengdu Technology Co ltd
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Priority to CN202223525688.4U priority Critical patent/CN218973535U/en
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Abstract

The utility model relates to the field of sensors and discloses a vibration temperature signal acquisition module which is convenient for long-time vibration and temperature signal acquisition in a severe working environment; the device comprises a box body, a box cover, an acquisition chip module, a physical interface and a connecting wire; an opening is formed in one end of the box body, the box cover is detachably connected to the opening, and the acquisition chip module is fixedly connected to one side of the box cover for sealing the box body; one end of the connecting wire in the box body is an R485 interface, and the acquisition chip module is provided with a corresponding slot; a through hole is formed in one side of the box body, the connecting wire penetrates through the through hole and is inserted into the acquisition chip module through an R485 connector, and a sealing ring is further arranged at the position of the through hole; the box body bottom is provided with the supporting plate, the supporting plate is formed with the fixed breach of connecting wire in perforation corresponding position.

Description

Vibration temperature signal acquisition module
Technical Field
The utility model relates to the field of sensors, in particular to a vibration temperature signal acquisition module.
Background
In industrial production and various occasions, the motor and the speed reducer have wide application, and the normal operation of the motor and the speed reducer is an important factor for ensuring the production efficiency, so that the monitoring of the working conditions of the motor and the speed reducer is particularly important.
Monitoring working conditions of the motor and the speed reducer, wherein vibration and temperature are very important reference indexes; at present, for the working condition monitoring of a motor and a speed reducer, a vibration sensor and a temperature sensor are generally adopted, and signals acquired by the sensors are transmitted to a processing module for processing; however, some motors and reducers have a severe working environment, such as a dust-intensive or wet factory building, which has a large impact on the accuracy and service life of vibration and temperature sensors.
Disclosure of Invention
The utility model aims to provide a vibration temperature signal acquisition module which can be used for a long time in a severe working environment of equipment.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the vibration temperature signal acquisition module is used for acquiring vibration and temperature signals of equipment in a severe working environment and comprises a box body, a box cover, an acquisition chip module and a connecting wire; an opening is formed in one end of the box body, the box cover is detachably connected to the opening, and the acquisition chip module is fixedly connected to one side of the box cover for sealing the box body; one end of the connecting wire in the box body is an R485 interface, and the acquisition chip module is provided with a corresponding slot; a through hole is formed in one side of the box body, the connecting wire penetrates through the through hole and is inserted into the acquisition chip module through an R485 connector, and a sealing ring is further arranged at the position of the through hole; the box body bottom is provided with the supporting plate, the supporting plate is formed with the fixed breach of connecting wire in perforation corresponding position.
The principle and the advantages of the scheme are as follows: through the closed box body structure of the acquisition module and the sealing ring arranged at the perforation, the scheme has better sealing performance and can adapt to the severe environment of the motor and the reducer; the box body and the box cover are detachably connected, so that the inside of the box body is convenient to overhaul;
in practical application, the joint of the box body interface inevitably generates heat, the interface is easy to thermally deform, and the interface is easy to fall off; in general, in order to make things convenient for the grafting of joint, can leave the surplus line in the box body, if vibration or fall the coming off that produces, lead to the joint to strike in the box body easily and destroy, and fix the surplus line through the backing sheet of this scheme, avoided the emergence of above-mentioned condition.
As an improvement, the box body is connected with the box cover through screws, a sealing ring groove is formed at the opening of the box body, and corresponding threaded holes are formed in the periphery of the box body and the box cover;
the beneficial effects of this improvement are: screw holes are formed in four top angles of the box body and the box cover, so that the box body and the box cover can be conveniently detached and installed; meanwhile, when the box body is closed by the box cover, the sealing ring which is not arranged in the sealing ring groove can play a good sealing role.
As an improvement, the opening of the box body is protruded upwards at one side of the inside of the box body, and the sealing ring groove is formed at the outer side of the protruded upwards;
the beneficial effects of this improvement are: the inner side of the opening of the box body is convex upwards, and the sealing ring groove is formed in the position of the convex part and the outer side of the opening, so that the sealing effect can be further achieved, and meanwhile, the box body and the box cover have good consistency.
As an improvement, the opening of the box body is sunk at one side of the inside of the box body, one side of the box body is sealed by the box cover, and the upper convex edge is provided with a sealing adhesive tape;
the beneficial effects of this improvement are: through the sunken part at the opening of the box body and the upward protruding part of the box cover, the box cover is matched with the box body, so that the box cover of the box body has consistency after being installed, and the sealing property of the module is better through the sealing rubber strip.
As an improvement, the box body is of a hollow cuboid structure, and the length of each side of the box body is not more than 5cm;
the beneficial effects of this improvement are: the size of the box body is similar to the area of the chip module, and the module is miniaturized under the condition of convenient installation.
As an improvement, the acquisition chip module is a DTU module;
the beneficial effects of this improvement are: the DTU module in the box body comprises a CPU control module, a wireless communication module and a power module, and can directly transmit the collected vibration signals and temperature signals to a monitoring end in a factory, so that the working conditions of a motor and a speed reducer can be conveniently and remotely monitored.
Drawings
Fig. 1 is a schematic structural diagram of a vibration temperature signal acquisition module according to an embodiment of the present utility model.
Fig. 2 is a schematic top view of a case according to an embodiment of the utility model.
Fig. 3 is a schematic diagram of a box cover structure according to an embodiment of the utility model.
Fig. 4 is a schematic view of a supporting sheet structure according to an embodiment of the utility model.
Fig. 5 is a partial schematic view illustrating a contact position between a case body and a case cover according to an embodiment of the present utility model.
FIG. 6 is a partial schematic view showing the contact position between the case body and the case cover according to the embodiment of the present utility model
Detailed Description
The following is a further detailed description of the embodiments:
reference numerals in the drawings of the specification include: the box body 1, lid 2, collection chip module 3, connecting wire 4, contact pin formula joint 5, screw hole 6, R485 interface 7, slot 8, backing sheet 9, sealing washer groove 10, joint strip 11.
An example is substantially as shown in figure 1: a vibration temperature signal acquisition module consists of a box body 1, a box cover 2, an acquisition chip module 3 and a connecting wire 4;
in implementation, as shown in fig. 2, the box body 1 is of a hollow cuboid structure, and in order to miniaturize the module, the length of each side of the box body 1 is not more than 5cm; the upper end face of the box body 1 is provided with an opening or is of an open structure, one side face of the box body is provided with a perforation for connecting wires to pass through, and when the box is implemented, a sealing ring is adopted at the perforation position for sealing in order to ensure tightness; in practice, the perforation may be a pin joint 5, so that the tightness is better.
In implementation, the box body 1 and the box cover 2 are detachably connected, and particularly are connected by screws; in the concrete implementation, threaded holes 6 are formed in the positions of the four top angles of the box body and the box cover, and the box body 1 and the box cover 2 are connected through screws;
in implementation, as shown in fig. 2 and fig. 3, the acquisition chip module 3 is fixed on the box cover, and specifically, may be adhered by using adhesive, or may be fixed by using other fixing modes; when the device is implemented, one end of the connecting wire in the box body is connected with an R485 interface 7, the acquisition chip module is provided with a corresponding slot 8, and acquired signals can be smoothly transmitted to the acquisition chip module for processing through the R485 interface and the slot; in specific implementation, the box body is internally provided with a surplus wire, an interface is conveniently inserted into the slot 8 through the surplus wire, and then the box body 1 is sealed by the box cover 2; when the system is implemented, the acquisition chip module adopts the DTU module, the DTU module specifically comprises a CPU control module, a wireless communication module and a power module, and can directly transmit acquired vibration signals and temperature signals to a monitoring end in a factory, so that the system can conveniently and remotely monitor the working conditions of a motor and a speed reducer.
Because the interface is inevitably heated, the interface is likely to deform and fall off due to heat after long-time working; in the implementation, as shown in fig. 4, the supporting sheet 9 is arranged in the box body, so that the interface is supported, and the possibility of falling off the interface and the slot is reduced; in specific implementation, the supporting sheet 9 can be made of soft rubber and adhered to the inside of the box body, or can be in other clamping modes; the upper part of the supporting sheet is provided with a fixing bayonet smaller than the diameter of the connecting wire, and when the fixing bayonet is implemented, the fixing bayonet can be U-shaped or semicircular, and the connecting wire 4 is fixed in an interference fit mode; in implementation, through holes are formed in the supporting sheet 9 at intervals, so that heat dissipation is facilitated.
In implementation, as shown in fig. 5, a sealing ring groove 10 is further formed in the position of the box body 1 or the box cover 2 and used for placing a sealing ring, so that the box body has stronger sealing performance after being closed by the box cover; in specific implementation, the sealing ring groove 10 is formed in the sinking critical position of the inner side of the box body 1, meanwhile, the outer side of the box cover 2 protrudes upwards, and after the box body is connected with the box cover, matching is formed, so that the whole module has better consistency and sealing performance.
The sealing ring can also be arranged on the box cover, as shown in figure 6, when in implementation, the inner side of the box body 1 is sunken, the outer side of the box cover 2 is sunken, the edge of the lower part is provided with a sealing rubber strip 11, and the sealing rubber strip can be in an adhesive mode or sleeved; in this way, the case body 1 and the case cover 2 can also form a fit, so that the whole module has better consistency and tightness.
The vibration temperature acquisition module provided by the scheme has excellent sealing performance, has the effects of water resistance and dust resistance, and can continuously work in a severe working environment; the consistency is achieved, and the appearance is more attractive; through the effect of backing sheet, have better protection effect to the joint, the life-span is longer.
The foregoing is merely exemplary of the present utility model, and specific technical solutions and/or features that are well known in the art have not been described in detail herein. It should be noted that, for those skilled in the art, several variations and modifications can be made without departing from the technical solution of the present utility model, and these should also be regarded as the protection scope of the present utility model, which does not affect the effect of the implementation of the present utility model and the practical applicability of the patent. The protection scope of the present application shall be subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.

Claims (6)

1. The utility model provides a vibration temperature signal acquisition module for vibrate and temperature signal acquisition to equipment under abominable operating condition, its characterized in that: comprises a box body, a box cover, an acquisition chip module and a connecting wire; an opening is formed in one end of the box body, the box cover is detachably connected to the opening, and the acquisition chip module is fixedly connected to one side, close to the box body, of the box cover; one end of the connecting wire in the box body is an R485 interface, and the acquisition chip module is provided with a corresponding slot; a through hole is formed in one side of the box body, the connecting wire penetrates through the through hole and is inserted into the acquisition chip module through an R485 connector, and a sealing ring is further arranged at the position of the through hole; the bottom of the box body is provided with a supporting sheet, and connecting wire fixing bayonets are formed in positions corresponding to the through holes of the supporting sheet.
2. The vibration temperature signal acquisition module of claim 1, wherein: the box body is connected with the box cover through screws, a sealing ring groove is formed in an opening of the box body, and corresponding threaded holes are formed in the periphery of the box body and the periphery of the box cover.
3. The vibration temperature signal acquisition module of claim 2, wherein: the box body opening is protruding on one side in the box body, the sealing ring groove is arranged on the outer side of the protruding.
4. The vibration temperature signal acquisition module of claim 1, wherein: the box body opening is sunken at one side in the box body, one side of the box body is sealed by the box cover and protrudes upwards, and the upper convex edge is provided with a sealing adhesive tape.
5. The vibration temperature signal acquisition module of claim 1, wherein: the box body is of a hollow cuboid structure, and the length of each side of the box body is not more than 5cm.
6. The vibration temperature signal acquisition module of claim 1, wherein: the acquisition chip module is a DTU module.
CN202223525688.4U 2022-12-28 2022-12-28 Vibration temperature signal acquisition module Active CN218973535U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223525688.4U CN218973535U (en) 2022-12-28 2022-12-28 Vibration temperature signal acquisition module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223525688.4U CN218973535U (en) 2022-12-28 2022-12-28 Vibration temperature signal acquisition module

Publications (1)

Publication Number Publication Date
CN218973535U true CN218973535U (en) 2023-05-05

Family

ID=86152316

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223525688.4U Active CN218973535U (en) 2022-12-28 2022-12-28 Vibration temperature signal acquisition module

Country Status (1)

Country Link
CN (1) CN218973535U (en)

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Address after: No. 320 and 436 Pingtang East Road, Puxing Street, Xinjin District, Chengdu City, Sichuan Province, 610000

Patentee after: Sinoma Intelligent Technology (Chengdu) Co.,Ltd.

Address before: No. 320, 436, Pingtang East Road, Jinhua Town, Xinjin County, Chengdu, Sichuan 610000 (Xinjin Industrial Park)

Patentee before: Anrui Zhida (Chengdu) Technology Co.,Ltd.