CN218957134U - Board card module and electronic equipment - Google Patents
Board card module and electronic equipment Download PDFInfo
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- CN218957134U CN218957134U CN202221928406.2U CN202221928406U CN218957134U CN 218957134 U CN218957134 U CN 218957134U CN 202221928406 U CN202221928406 U CN 202221928406U CN 218957134 U CN218957134 U CN 218957134U
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Abstract
The application provides a board module and electronic equipment, relates to electronic equipment technical field. Wherein, this integrated circuit board module includes: a base having a first installation space; the support piece is arranged in the first installation space; wherein, the support piece can take place the displacement along the installation direction in the first installation space to assemble different grade type integrated circuit board.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a board card module and electronic equipment.
Background
In the prior art, the single-sided solid state disk and the double-sided solid state disk are required to be matched with heat conducting fins with different heights to meet the heat dissipation requirement, so that the operation is complex, the assembly time of workers is greatly increased, and the risk of misloading is increased.
Disclosure of Invention
The embodiment of the application provides the following technical scheme:
the first aspect of the present application provides a board module, the board module includes: a base having a first installation space;
the support piece is arranged in the first installation space;
wherein, the support piece can take place the displacement along the installation direction in the first installation space to assemble different grade type integrated circuit board.
In some variations of the first aspect of the present application, the support has a second installation space for accommodating the board, and the board module further includes:
and the heat dissipation assembly is arranged in the second installation space and used for dissipating heat of the board.
In some variations of the first aspect of the present application, the support comprises:
a support plate body forming a bottom wall of the second installation space to support placement of the board;
the support piece is installed in the first installation space of the base through the elastic piece structure, and the elastic piece structure can relatively displace along the installation direction relative to the base.
In some modified embodiments of the first aspect of the present application, the heat dissipation assembly includes a heat dissipation plate and a heat sink stacked in the second installation space;
the heat dissipation plate is attached to the support plate body, and the board card is arranged between the heat dissipation plate and the radiator.
In some modification embodiments of the first aspect of the present application, the base is provided with a first limit structure corresponding to the elastic sheet structure, the elastic sheet structure is provided with a first limit portion corresponding to the first limit structure, and the first limit structure and the first limit portion cooperate to limit the direction and the displacement amount of the support member relative to the base for generating displacement.
In some modified embodiments of the first aspect of the present application, the base is provided with a first opening corresponding to the interface end of the board, and in the case that the board is assembled to the board module, the interface end of the board can extend out of the first installation space through the first opening to be plugged with a corresponding interface structure provided on the motherboard.
In some modified embodiments of the first aspect of the present application, the base or the elastic piece structure is provided with a second limiting structure corresponding to the radiator, the radiator is provided with a second limiting part corresponding to the second limiting structure, and the first limiting structure and the second limiting part cooperate to be able to keep the relative positions of the radiator, the base and the supporting piece.
A second aspect of the present application provides an electronic device, comprising: the mainboard is provided with at least one interface structure;
the board card module can be inserted with the interface structure so as to be connected to the main board.
In some variation embodiments of the second aspect of the present application, further comprising: elastic movable piece for fixing the integrated circuit board module, elastic movable piece includes: the fixing piece is arranged on the main board and located on one side, away from the interface structure, of the board card module, the opposite ends of the elastic piece in the elastic expansion direction of the elastic piece are respectively connected with the movable piece and the fixing piece, the movable piece can move relative to the fixing piece, and the movable piece is pressed and held in the board card module under the condition that the board card module is inserted into the interface structure.
In some modified embodiments of the second aspect of the present application, the fixing member has a third installation space inside, and includes a back plate, the movable member is slidably mounted in the opening of the third installation space facing away from the main plate, the elastic member is mounted in the third installation space, one end of the elastic member is connected to the back plate, and the other end of the elastic member is connected to the movable member;
in the process of inserting the board card module and the interface structure, the movable part is displaced to one side deviating from the interface structure, and the elastic part is in a compressed state;
under the condition that the board card module is spliced with the interface structure, the elastic piece is switched from the compressed state to the non-compressed state, and the movable piece is driven to move to the side close to the interface structure until being pressed and held on the board card module.
Compared with the prior art, the board card module and the electronic equipment provided by the application are characterized in that the base is adopted and matched with the supporting piece, when different types of board cards are installed, the supporting piece can displace in the first installation space along the installation direction to different degrees so as to adapt to the size difference of the different types of board cards, thereby realizing the heat dissipation compatibility problem of the different types of board cards, and being convenient for the disassembly and assembly of the board cards, and being convenient to operate.
Drawings
The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. Several embodiments of the present application are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings, in which like reference numerals refer to similar or corresponding parts and in which:
fig. 1 schematically illustrates a schematic diagram of a split structure of a board card module provided by an embodiment of the present utility model;
fig. 2 schematically illustrates a schematic cross-sectional structure of a board card module according to an embodiment of the present utility model;
fig. 3 schematically illustrates a structural diagram of a support member of a board card module according to an embodiment of the present utility model mounted in a first mounting space of a base;
fig. 4 schematically illustrates a structural schematic diagram of a support member of a board card module according to an embodiment of the present utility model;
fig. 5 schematically illustrates a structural schematic diagram of an electronic device provided by an embodiment of the present utility model;
fig. 6 schematically illustrates a structural schematic diagram of an elastic movable member of an electronic device according to an embodiment of the present utility model;
fig. 7 schematically illustrates a structural diagram of another angle of the elastic movable member of the electronic device according to the embodiment of the present utility model;
fig. 8 schematically illustrates a split structure of an elastic movable member of an electronic device according to an embodiment of the present utility model;
reference numerals illustrate:
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.
At present, as the thickness of the single-sided solid state disk and the thickness of the double-sided solid state disk are different, the thickness of the double-sided solid state disk is larger than that of the single-sided solid state disk, in order to solve the problem of compatibility of heat dissipation of the single-sided solid state disk and the double-sided solid state disk, two solutions are mainly adopted at present, one solution is to adapt heat conducting sheets with different thicknesses according to the thickness of the single-sided solid state disk and the double-sided solid state disk to meet the heat dissipation requirement, and the solution needs to manually identify the configuration of the heat conducting sheets after the single-sided solid state disk and the double-sided solid state disk, so that the operation is complicated, the assembly time of workers is greatly increased, and the risk of misloading is increased; the other scheme is to fix the solid state disk by adopting a screw or button scheme, namely, the difference of thickness is not needed to be considered, but the scheme needs additional operation steps to realize disassembly and assembly, and the operation is relatively complicated.
Example 1
Referring to fig. 1 to 5, a first embodiment of the present utility model provides a board 3 module, where the board 3 module includes: a base 1 having a first installation space; a support member 2 installed in the first installation space; wherein the support 2 is displaceable in the first installation space in an installation direction X for assembling different types of boards 3.
Specifically, the board 3 module provided in this embodiment may be applied to, but not limited to, electronic devices such as a chassis, and different types of board 3 may be installed through the board 3 module, where the board 3 may be, but not limited to, a solid state disk, and the board 3 may be a single-sided solid state disk or a double-sided solid state disk, and in order to solve the problem of compatibility between the single-sided solid state disk and heat dissipation of the double-sided solid state disk, in the technical scheme adopted in this application, the structure of the board 3 module mainly includes: the base 1 and the support 2, wherein the base 1 is used for installing and installing a motherboard 5 of an electronic device, and has a first installation space, and can be used for installing a card 3, a heat dissipation component 4, and the like, referring to fig. 1 and 3, as shown in the drawings, the structure of the base 1 may include: the base plate 11 and the first side plates 12 provided on opposite sides of the base plate 11 in the width direction, the second side plates 13 may be provided on only one side of the opposite sides of the base plate 11 in the length direction, or the second side plates 13 may not be provided on both sides, so that a side opening communicating with the top opening is formed, and the first installation space is formed by at least enclosing the base plate 11 and the two first side plates 12 of the base 1; the support piece 2 is arranged in the first installation space, and the support piece 2 can displace in the first installation space along the installation direction X of the board card 3, so that when different types of board cards 3, particularly single-sided solid state disks or double-sided solid state disks with different thicknesses are installed, the support piece 2 can displace in the first installation space to different degrees in the installation direction X, and the assembly of different types of solid state disks is realized; when the second side plate 13 is disposed on one side of the bottom plate 11 in the length direction, the first opening 131 may be formed on the first side plate 12 corresponding to the interface of the board card 3, so that the interface end 31 of the board card 3 can extend out of the first installation space through the first opening 131 to be plugged with the corresponding interface structure 6 disposed on the motherboard 5 under the condition that the board card 3 is assembled to the board card 3 module.
In particular, the displacement of the support 2 in the first installation space can be achieved in a number of ways, for example: the support 2 may be movably mounted in the first mounting space of the base 1, or may be implemented by using a support 2 having elasticity and capable of generating elastic deformation, and a specific structural form of the support 2 will be described in detail below; the mounting direction X may be a thickness direction of the board 3, the mounting direction X is a direction indicated by an arrow X in fig. 1 to 3 and a direction opposite thereto, hereinafter, a length direction of the base 1 and the board 3 is defined as a first direction Y, the first direction Y is a direction indicated by an arrow Y in fig. 1 and 3 and a direction opposite thereto, a width direction of the base 1 and the board 3 is defined as a second direction Z, the second direction Z is a direction indicated by an arrow Z in fig. 1 to 3 and a direction opposite thereto, and the mounting direction X, the first direction Y and the second direction Z are perpendicular to each other.
According to the above-mentioned embodiments, the board card 3 module is provided by adopting the base 1 and matching with the supporting member 2, when different types of board cards 3 are installed, the supporting member 2 can displace in the first installation space along the installation direction X to different degrees so as to adapt to the size difference of the different types of board cards 3, thereby realizing the heat dissipation compatibility problem of the different types of board cards 3, facilitating the disassembly and assembly of the board cards 3, and being convenient to operate.
Further, referring to fig. 1 and 2, in an embodiment, the supporting member 2 has a second installation space for accommodating the board 3, and the board 3 module further includes: and the heat dissipation component 4 is arranged in the second installation space and is used for dissipating heat of the board 3.
Specifically, in order to realize the heat dissipation of different types of boards 3, in the technical scheme adopted by the utility model, the supporting piece 2 can be provided with a structure with a second installation space, so that the supporting piece can accommodate the boards 3 and the heat dissipation components 4 for dissipating the boards 3, the different types of boards 3 drive the supporting piece 2 to displace in the first installation space to different degrees along the installation direction X of the supporting piece during the installation, and the different types of boards 3 are matched with the same heat dissipation components 4, so that the heat dissipation compatibility of the different types of boards 3 is realized.
Specifically, the heat dissipation assembly 4 may include a heat dissipation plate 41 and a heat radiator 42 stacked in the second installation space, where the heat dissipation plate 41 is attached to the support plate 21, so that the heat dissipation plate 41 is directly attached to the support plate 21, and heat conduction is convenient, and the board 3 is disposed between the heat dissipation plate 41 and the heat radiator 42, and the heat dissipation and the temperature reduction of the board 3 are performed effectively by matching the heat dissipation plate 41 and the heat radiator 42, which is beneficial to improving the operation effect of the board 3 and prolonging the service life; when the heat dissipation plate 41, the board card 3 and the radiator 42 are sequentially installed in the second installation space during installation, when the heat dissipation assembly 4 is matched with different types of board cards 3, the position of the radiator 42 relative to the base 1 in the second installation space is kept unchanged, and the positioning of the radiator 42 in the second installation space can be realized through matching with the support piece or the base, and the positioning mode of the radiator 42 in the second installation space is not particularly limited herein, and will be described in detail below; further, a heat conducting member such as a heat conducting pad, a heat conducting adhesive, a heat conducting sheet, etc. may be added between the board 3 and the heat sink 42.
Further, with reference to fig. 1 to 4, in a specific implementation, the support 2 comprises: a support plate body 21 forming a bottom wall of the second installation space to support placement of the board 3; the support member 2 is mounted in the first mounting space of the base 1 through the elastic sheet structures 22, and the elastic sheet structures 22 can displace along the mounting direction X relative to the base 1.
Specifically, in the technical scheme adopted by the utility model, the structure of the supporting piece 2 mainly comprises: the support plate body 21 and at least one pair of spring plate structures 22 arranged on two opposite sides of the support plate body 21, after the board card 3 is mounted on the support piece 2, the support plate body 21 can play a role in supporting the board card 3, the support plate body 21 can be of a plate-shaped structure which is matched with the board card 3, and the size of the support plate body can be the same as the size of the board card 3 or can be larger than or smaller than the size of the board card 3; at least one pair of spring plate structures 22 and the supporting plate body 21 are enclosed to form a second installation space, the supporting piece 2 can be detachably installed in the first installation space of the base 1 by utilizing the spring plate structures 22, and the spring plate structures 22 can drive the mounting plate body to displace relative to the base 1 along the installation direction X under the acting force along the installation direction X; the number of the spring structures 22 and the length of the spring structures in the first direction Y can be set according to practical situations, the top side of the spring structures 22 can be higher than the top side edge of the first side plate 12 of the base 1, and for convenience of processing, the spring structures 22 and the support plate body 21 can be an integrated structure.
The spring structure 22 may specifically include: the first portion 221 and the second portion 222, where the first portion 221 is disposed corresponding to the first side plate 12 of the base 1, and the second portion 222 is used to connect the first portion 221 and the support plate 21, and a joint position of the first portion 221 and the second portion 222 is in a bending shape, specifically may be in a circular arc shape; the first portion 221 and the second portion 222 may be integrally formed, and elastically deform, i.e. displace, in different directions, and the direction in which the first portion 221 elastically deforms may be the second direction Z, and the direction in which the second portion 222 elastically deforms is at least the mounting direction X; the distance between the two opposite first portions 221 of each pair of elastic structures 22 may be slightly larger than the dimension of the first installation space in the second direction Z, so that after the elastic structures are installed in the first installation space, the elastic deformation of the first portions 221 may be utilized to make the elastic structures press against the first side plate 12 of the base 1, so as to maintain the positions of the elastic structures in the first installation space; the second portions 222 may be disposed obliquely, referring to fig. 2, and as shown in the drawing, the second portions 222 of each pair of spring structures 22 are opposite to each other and are used for connecting the inner ends of the supporting plate bodies 21 to be higher than the outer ends of the first portions 221, so that the supporting plate bodies 21 can be supported to a height spaced from the bottom plate 11 of the base 1, and when a certain pressure is applied to the supporting plate bodies 21 during the mounting of the card 3, the second portions 222 of the spring structures 22 can be deformed to drive the supporting plate bodies 21 to displace in the mounting direction X; the first portion 221 and the support plate 21 may not have a gap in the second direction Z, or as shown in fig. 2, a certain gap may be reserved between the first portion 221 and the support plate 21, so as to increase elasticity; because the second portion 222 generates a certain displacement at the joint position of the first portion 221 and the second portion 222 when the second portion 222 is deformed, in order to avoid interference of the displacement of the base 1 to the position, referring to fig. 3 and fig. 4, the first hollowed-out portion 15 may be disposed at a position of the base 1 corresponding to the joint position of the first portion 221 and the second portion 222, so as to avoid the displacement of the elastic structure; in order to increase the elasticity of the elastic structure, referring to fig. 4, a second hollow portion 223 may be disposed at a joint position of the first portion 221 and the second portion 222, and two ends of the second hollow portion 223 extend to a certain length toward the first portion 221 and the second portion 222, respectively, so as to improve the deformability of the elastic structure.
When different types of boards 3 are installed, the boards 3 with smaller sizes in the installation direction X can be arranged without causing displacement of the supporting piece 2, and when the different types of boards 3 are used as single-sided solid state disks and double-sided solid state disks with different thicknesses, the boards can be arranged, when the single-sided solid state disks are installed, after the boards 3 and the radiating components 4 are placed, the positions of the radiating components 4 just correspond to the installation positions of the boards, and when the double-sided solid state disks with larger thickness are installed, after the boards 3 and the radiating components 4 are placed, the radiating components 4 need to be pressed along the installation direction X to generate certain displacement along the installation direction X so as to be capable of moving to the installation positions of the radiating components, and in the process, the elastic sheet structures 22 generate displacement along the second direction Z; therefore, the distance between the support plate body 21 and the mounting position of the heat sink 42 in the mounting direction X without displacement of the support 2 can be set as needed.
Further, referring to fig. 2 to fig. 4, in a specific implementation, the base 1 is provided with a first limiting structure 14 corresponding to the elastic piece structure 22, the elastic piece structure 22 is provided with a first limiting portion 2211 corresponding to the first limiting structure 14, and the first limiting structure 14 and the first limiting portion 2211 cooperate to limit a direction and a displacement amount of the support 2 relative to the base 1.
Specifically, in order to realize the positioning of the elastic piece structure 22 in the first installation space of the base 1, in the technical scheme adopted by the utility model, a first limiting structure 14 can be arranged on the first side plate 12 of the base 1, a first limiting part 2211 corresponding to and matched with the first limiting structure 14 is correspondingly arranged on the first part 221 of the elastic piece structure 22, and when the elastic piece structure 22 is installed in the first installation space, the positioning of the elastic piece assembly in the first installation space can be realized through the matching of the first limiting structure 14 and the first limiting part 2211; the first limiting structure 14 may be two first limiting protrusions disposed at intervals on the surface of the first side plate 12 facing the first installation space, where the two first limiting protrusions are located on one side of the first side plate 12 away from the bottom plate 11, and the first limiting portion 2211 may be a first limiting groove formed by the first portion 221 of the elastic sheet structure 22 corresponding to the two limiting protrusions; when the elastic sheet structure 22 is mounted in the first mounting space, referring to fig. 2, as shown in the figure, the first limiting protrusion is just located in the corresponding first limiting groove, so that the displacement of the support 2 relative to the base 1 in the mounting direction X and the first direction Y can be limited, and under the action of the elastic force of the elastic sheet structure 22, the first portion 221 of the elastic sheet structure 22 abuts against the corresponding first side plate 12, so that the displacement of the support 2 relative to the base 1 in the second direction Z can be further limited, and the positioning reliability of the support 2 can be improved; when the support 2 is disassembled, each pair of elastic sheet structures 22 is deformed towards one side facing the first installation space, so that the first limiting protrusions are separated from the first limiting grooves, and the support 2 can be disassembled conveniently.
Further, referring to fig. 1, 3 and 4, in the embodiment, the base 1 or the spring structure 22 is provided with a second limiting structure 2212 corresponding to the radiator 42, the radiator 42 is provided with a second limiting portion 421 corresponding to the second limiting structure 2212, and the first limiting structure 14 and the second limiting portion 421 cooperate to maintain the relative positions of the radiator 42 and the base 1 and the supporting member 2.
Specifically, in order to realize the positioning of the radiator 42 in the second installation space, in the technical scheme adopted by the utility model, a second limiting structure 2212 can be arranged on the first side plate 12 of the base 1 or the first part 221 of the elastic sheet structure 22, and a second limiting part 421 corresponding to and matched with the second limiting structure 2212 is correspondingly arranged on the radiator 42, and when the radiator 42 is installed in the second installation space of the elastic structure, the positioning of the radiator 42 in the second installation space can be realized through the matching of the second limiting structure 2212 and the second limiting part 421; taking the example that the second limiting structure 2212 is arranged on the first portion 221 of the elastic sheet structure 22, the first limiting structure 14 may be a second limiting groove arranged on the first portion 221, the second limiting portion 421 may be a second limiting protrusion arranged on an edge of the radiator 42 extending along the first direction Y and extending along the second direction Z, and the position of the second limiting protrusion corresponds to the position of the second limiting groove and is adapted to the position of the second limiting protrusion; when the radiator 42 is mounted in the second mounting space, the second limiting protrusion is just located in the corresponding second limiting groove, so that the relative positions of the radiator 42, the support 2 and the base 1 can be limited, and the mounting and positioning effects on the radiator 42 and the board card 3 are improved.
Example two
Referring to fig. 5, a second embodiment of the present utility model provides an electronic device, which includes: a main board 5 provided with at least one interface structure 6; the board card 3 module can be plugged with the interface structure 6 to be connected to the motherboard 5.
Specifically, the electronic device provided in this embodiment may be, but is not limited to, a chassis, a motherboard 5 is disposed in the electronic device, and at least one interface structure 6 is disposed on the motherboard 5 to implement installation and connection of at least one board 3, and the board 3 module can implement installation and heat dissipation compatibility of boards 3 of different types, where the board 3 may be, but is not limited to, a solid state disk, and may be, in particular, a single-sided solid state disk, or may be a double-sided solid state disk, and the board 3 of the board 3 module can be connected to the motherboard 5 through structural plugging.
Further, referring to fig. 6 to fig. 8, in addition to implementing positioning of the board 3 module on the motherboard 5 through connection of the board 3 and the interface structure 6, in order to further improve reliability of positioning of the board 3 module on the motherboard 5, in the technical scheme adopted by the present utility model, the electronic device further includes: an elastic movable member 727 for fixing the board 3 module, which is disposed on the main board 5 at a distance from the interface structure 6 in the first direction Y, and the distance is adapted to the dimension of the board 3 module in the first direction Y; the elastic movable member 727 includes: the fixing member 71, the movable member 72 and the elastic member 73, wherein the fixing member 71 is mounted on the main board 5, and can be detachably connected by a clamping connection or the like, and the fixing member 71 is not particularly limited herein, and has a housing structure that can be provided with a third accommodating space, and the top side of the fixing member 71 is provided with an opening communicated with the third mounting space and includes a back board 712 located at a side far from the interface structure 6; the movable member 72 may be provided as a cover structure, slidably connected to the fixed member 71 and capable of closing the opening, and a surface of the movable member 72 facing away from the main board 5 is a force application surface, on which a plurality of anti-slip protrusions or anti-slip grooves extending in the second direction Z may be provided along the first direction Y; in order to limit the sliding track of the movable member 72 relative to the fixed member 71, sliding grooves 711 extending along the first direction Y may be correspondingly formed on two opposite side walls of the fixed member 71 in the second direction Z, and sliding protruding portions 721 may be respectively disposed at two opposite ends of the movable member 72 in the second direction Z, where the sliding protruding portions 721 may slide reciprocally in the corresponding sliding grooves 711 along the first direction Y; the elastic member 73 may be a spring, and the elastic expansion direction of the elastic member 73 is the first direction Y, and the elastic member 73 is located in the third installation space, and one end of the elastic member is mounted on the back plate 712 of the fixed member 71, and the other end of the elastic member is mounted on one end of the movable member 72 close to the interface structure 6.
In the process of plugging the board card 3 module and the interface structure 6, the movable piece 72 can be forced to displace to the side deviating from the interface structure 6 so as to avoid the board card 3 module, and in the process, the elastic piece 73 is in a compressed state; after the board card 3 module is spliced with the interface structure 6, the acting force applied to the movable piece 72 is removed, the elastic piece 73 releases energy accumulated in the compression process to be automatically switched to a non-compression state, and drives the movable piece 72 to displace to the side close to the interface structure 6 until the movable piece returns to the initial position, at this time, the end part of the pressing end 722 of the movable piece 72 close to the interface structure 6 protrudes outwards from the fixed piece 71 and presses and holds the board card 3 module; specifically, the heat sink 42 may be provided with a avoiding groove 422 corresponding to the pressing end 722 of the movable member 72, and the height of the surface of the pressing end 722 facing the motherboard 5 is flush with the height of the upper surface of the board 3, so that the pressing end 722 of the movable member 72 is pressed against the board 3, as shown in fig. 5.
It should be noted that, in the description of the present specification, the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model; the terms "coupled," "mounted," "secured," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a board module, its characterized in that includes:
a base having a first installation space;
the support piece is arranged in the first installation space;
wherein, the support piece can take place the displacement along the installation direction in the first installation space to assemble different grade type integrated circuit board.
2. The board card module of claim 1, wherein,
the support has a second installation space for accommodating the board, and the board module further includes:
and the heat dissipation assembly is arranged in the second installation space and is used for dissipating heat of the board card.
3. The board card module of claim 2, wherein,
the support includes:
a support plate body forming a bottom wall of the second installation space to support placement of the board;
the support piece is installed in the first installation space of the base through the elastic piece structure, and the elastic piece structure can relatively displace along the installation direction relative to the base.
4. The board card module of claim 3, wherein,
the heat dissipation assembly comprises a heat dissipation plate and a radiator which are stacked in the second installation space;
the heat dissipation plate is attached to the support plate body, and the board card is arranged between the heat dissipation plate and the radiator.
5. The board card module of claim 4, wherein,
the base corresponds the shell fragment structure is provided with first limit structure, the shell fragment structure corresponds first limit structure is provided with first limit part, first limit structure with first limit part cooperation can restrict support piece is relative the direction and the displacement volume that the base produced the displacement.
6. The board card module of claim 1, wherein,
the base corresponds the interface end of integrated circuit board is provided with first opening, under the board assembly to the board module, the interface end of integrated circuit board can pass through first opening stretches out first installation space to with the corresponding interface structure grafting that sets up on the mainboard.
7. The board card module of claim 5, wherein,
the base or the elastic sheet structure is provided with a second limiting structure corresponding to the radiator, the radiator is provided with a second limiting part corresponding to the second limiting structure, and the relative positions of the radiator, the base and the supporting piece can be maintained by matching the first limiting structure with the second limiting part.
8. An electronic device, comprising:
the mainboard is provided with at least one interface structure;
the board card module of any of claims 1-7, capable of plugging with the interface structure to connect to the motherboard.
9. The electronic device of claim 8, further comprising:
elastic movable piece for fixing the integrated circuit board module, elastic movable piece includes: the fixing piece is arranged on the main board and located on one side, away from the interface structure, of the board card module, the opposite ends of the elastic piece in the elastic expansion direction of the elastic piece are respectively connected with the movable piece and the fixing piece, the movable piece can move relative to the fixing piece, and the movable piece is pressed and held in the board card module under the condition that the board card module is inserted into the interface structure.
10. The electronic device of claim 9, wherein the electronic device comprises a memory device,
the inside of the fixed piece is provided with a third installation space and comprises a back plate, the movable piece is slidably installed in the opening of the third installation space, which is away from the main plate, the elastic piece is installed in the third installation space, one end of the elastic piece is connected with the back plate, and the other end of the elastic piece is connected with the movable piece;
in the process of inserting the board card module and the interface structure, the movable piece is displaced back to the interface structure, and the elastic piece is in a compressed state;
under the condition that the board card module is spliced with the interface structure, the elastic piece is switched from the compressed state to the non-compressed state, and the movable piece is driven to move towards the interface structure until being pressed and held on the board card module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221928406.2U CN218957134U (en) | 2022-07-25 | 2022-07-25 | Board card module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221928406.2U CN218957134U (en) | 2022-07-25 | 2022-07-25 | Board card module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218957134U true CN218957134U (en) | 2023-05-02 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221928406.2U Active CN218957134U (en) | 2022-07-25 | 2022-07-25 | Board card module and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN218957134U (en) |
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2022
- 2022-07-25 CN CN202221928406.2U patent/CN218957134U/en active Active
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