CN218945693U - Packaging test mechanism - Google Patents

Packaging test mechanism Download PDF

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Publication number
CN218945693U
CN218945693U CN202223515397.7U CN202223515397U CN218945693U CN 218945693 U CN218945693 U CN 218945693U CN 202223515397 U CN202223515397 U CN 202223515397U CN 218945693 U CN218945693 U CN 218945693U
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China
Prior art keywords
long frame
packaging
long
rack
slide
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CN202223515397.7U
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Chinese (zh)
Inventor
周建军
许兴波
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Jiangsu Xinfeng Integrated Circuit Co ltd
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Yancheng Xinfeng Microelectronics Co ltd
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Abstract

The utility model discloses a packaging testing mechanism, which comprises a long frame, wherein one side of the top end of the long frame is provided with an FT function testing device, the other side of the FT function testing device is provided with an appearance testing mechanism positioned above the long frame, the inner wall of the other side of the long frame is provided with a motor, and one end of the motor is provided with a screw rod which is movably connected with the inner wall of one end of the long frame; the beneficial effects are as follows: the packaging chips to be tested are placed on the chip placing sheet, the motor can drive the sliding plate to horizontally move, the packaging chips are sequentially subjected to FT function test and appearance detection, when unqualified packaging chips are detected, the electric push rod moves downwards and extrudes the rack below the packaging chips, the chip placing sheet for storing the packaging chips swings downwards, the unqualified packaging chips automatically fall into the corresponding collecting boxes 18, the automatic screening and clearing function is achieved, the unqualified packaging chips do not need to be manually picked out, and the working pressure of workers is greatly reduced.

Description

Packaging test mechanism
Technical Field
The utility model relates to the technical field of chip package testing, in particular to a package testing mechanism.
Background
LQFP is a thin QFP package, the thickness of the current QFP package is 2.0-3.6mm, and after LQFP is 1mm, the package is convenient to operate and high in reliability, meanwhile, the package is small in external dimension and small in parasitic parameter, and is suitable for high-frequency application and is commonly used for small chips.
At present, after the packaging of the chip is completed, the chip is required to be tested by a testing mechanism to be formally put on the market. The existing chip packaging test mechanism only has the test function, when the chip packaging test mechanism finds that a certain packaged chip (the packaged chip under test) is unqualified, the chip packaging test mechanism generates a signal to prompt a nearby test staff, the unqualified packaged chip is required to be manually extracted by the staff, and the work load of the test staff is greatly increased because the test staff is required to be present at any time.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
The present utility model provides a package testing mechanism to overcome the above-mentioned technical problems of the related art.
For this purpose, the utility model adopts the following specific technical scheme:
the utility model provides a packaging test mechanism, includes long frame, the top one side of long frame is equipped with FT function testing device, FT function testing device's opposite side is equipped with and is located long frame top's appearance testing mechanism, long frame's opposite side inner wall is equipped with the motor, the one end of motor be equipped with long frame one end inner wall swing joint's screw rod, the screw rod cover be equipped with inner wall sliding connection's slide around the long frame, the top of slide is equipped with the opening one of a plurality of equidistance distribution, every the inside of opening one all is equipped with the chip and places the piece, the top of slide is equipped with the opening two of a plurality of equidistance distribution, be equipped with in the opening two extend to in the opening one and with the connecting axle that the piece is placed to the chip, the fixed cover of connecting axle is equipped with the gear, one side of gear be equipped with rather than meshing connection's rack, just the rack with sliding connection about opening two inner wall, every the bottom of spring all is equipped with the spring, the bottom of spring all be equipped with the L type bracing piece that the bottom is connected with the bottom, the bottom of long frame is equipped with a pair of collection mechanism.
Preferably, the appearance testing mechanism comprises a box body positioned above the long frame, an AOI (optical add-on) detection lens is arranged on the inner wall of the top end of the box body, a light source is arranged in the box body, and supporting frames connected with the box body are arranged on the front side and the rear side of the light source.
Preferably, the inside top of box the inside top of FT function testing arrangement all is equipped with electric putter, and two electric putter all with the rack phase-match.
Preferably, the collecting mechanism comprises a long plate positioned below the long frame, a collecting box in threaded connection with the long plate is arranged at the bottom end of the long plate, and the upper end of the collecting box penetrates to the upper side of the long plate.
Preferably, a pair of bolts are arranged at the bottom ends of the two long plates, and the bolts are in threaded connection with the bottom ends of the long frames.
Preferably, one side of the top end of the long frame is provided with an L-shaped sliding column in front-back sliding connection with the long frame, the bottom end of the L-shaped sliding column is provided with a pair of elastic telescopic rods, and the bottom end of each elastic telescopic rod is provided with an extrusion strip.
The beneficial effects of the utility model are as follows:
1. the packaging chips to be tested are placed on the chip placing pieces, the motor can drive the sliding plate to horizontally move, the packaging chips are sequentially subjected to FT function test and appearance detection, when unqualified packaging chips are detected, the electric push rod moves downwards and presses the rack below the packaging chips, so that the chip placing pieces for storing the packaging chips swing downwards, the unqualified packaging chips automatically fall into the corresponding collecting boxes 18, the automatic screening and clearing functions are achieved, unqualified packaging chips do not need to be manually picked out by work, and the working pressure of workers is greatly reduced;
2. through setting up gliding L type around to set up the elastic telescopic link that has the extrusion strip in the below of L type traveller, when placing the encapsulation chip of waiting to test, L type traveller is located one side, can not interfere the installation of encapsulation chip, and when accomodating, slide L type traveller directly over the rack, move down and extrude rectangular, extrude all racks, make all chips place the piece swing downwards, and all fall into subaerial containing box, do not need take out one by one, collection efficiency improves greatly.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a package testing mechanism according to an embodiment of the present utility model;
FIG. 2 is a bottom view of a package testing mechanism according to an embodiment of the present utility model;
fig. 3 is a partial front cross-sectional view of a sled in a package testing mechanism according to an embodiment of the present utility model.
Fig. 4 is a schematic structural diagram of an AOI inspection lens in a package inspection mechanism according to an embodiment of the present utility model.
In the figure:
1. a long frame; 2. FT function testing device; 3. a motor; 4. a screw; 5. a slide plate; 6. an opening I; 7. a chip placement sheet; 8. a connecting shaft; 9. a gear; 10. a rack; 11. a spring; 12. an L-shaped support rod; 13. a case; 14. AOI detection lens; 15. a light source; 16. a support frame; 17. a long plate; 18. a collection box; 19. a bolt; 20. an L-shaped slide column; 21. an elastic telescopic rod; 22. extruding the strip; 23. an electric push rod.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the present utility model, a package testing mechanism is provided.
Embodiment one;
as shown in fig. 1-4, the package testing mechanism according to the embodiment of the utility model comprises a long frame 1, wherein one side of the top end of the long frame 1 is provided with a FT function testing device 2, the other side of the FT function testing device 2 is provided with an appearance testing mechanism positioned above the long frame 1, the inner wall of the other side of the long frame 1 is provided with a motor 3, one end of the motor 3 is provided with a screw 4 movably connected with the inner wall of one end of the long frame 1, the screw 4 is sleeved with a sliding plate 5 slidably connected with the front inner wall and the rear inner wall of the long frame 1, the top end of the sliding plate 5 is provided with a plurality of openings I6 which are distributed at equal intervals, each opening I6 is internally provided with a chip placing sheet 7, the top end of the sliding plate 5 is provided with a plurality of openings II which are distributed at equal intervals, the openings II are internally provided with a connecting shaft 8 which extends into the openings I6 and is connected with the chip placing sheet 7, one side of the connecting shaft 8 is fixedly sleeved with a gear 9, one side of the gear 9 is provided with a rack 10 which is in meshed connection with the rack 10, the bottom end of each rack 10 is vertically slidably connected with the opening II, the bottom end of each rack 10 is provided with a spring 11, the bottom end of the spring 11 is provided with an L-shaped supporting rod 12 connected with the bottom end of the long frame 1, and the bottom end 1 is provided with a pair of the rack collecting mechanism.
Embodiment two;
as shown in fig. 1-4, according to the package testing mechanism of the embodiment of the utility model, the appearance testing mechanism comprises a box 13 positioned above a long frame 1, an AOI detection lens 14 is arranged on the inner wall of the top end of the box 13, the surface flatness and appearance of a package chip can be checked, defects are found, a light source 15 is arranged in the box 13, the light source is provided and is staggered with the AOI detection lens 14, the brightness in the box 13 is improved, good auxiliary effect is achieved for the detection of the AOI detection lens 14, supporting frames 16 connected with the box 13 are arranged on the front side and the rear side of the light source 15, the effect of fixing and supporting the light source 15 is achieved, an electric push rod 23 is arranged on the inner top end of the box 13 and the inner top end of the FT function testing device 2, the two electric push rods 23 are matched with a rack 10, the electric push rod 23 can press the rack 10 to move downwards, and the electric push rod 23 and a driving source.
Embodiment three;
as shown in fig. 1-4, according to the package testing mechanism of the embodiment of the utility model, the collection mechanism comprises a long plate 17 positioned below a long frame 1, the bottom end of the long plate 17 is provided with a collection box 18 in threaded connection with the long plate, the upper end of the collection box 18 penetrates to the upper side of the long plate 17, a good collection effect is achieved on unqualified package chips, meanwhile, the collection box 18 is convenient to disassemble and assemble, the use is simple and convenient, the bottom ends of the two long plates 17 are provided with a pair of bolts 19, the bolts 19 are in threaded connection with the bottom ends of the long frame 1, the firmness of the long plate 17 after installation can be improved, and the long plate 17 is convenient to replace.
Fourth embodiment;
as shown in fig. 1-4, according to the package testing mechanism of the embodiment of the present utility model, an L-shaped slide column 20 slidably connected to the top end of the long frame 1 is provided at one side of the top end of the long frame, a pair of elastic telescopic rods 21 are provided at the bottom end of the L-shaped slide column 20, and an extrusion strip 22 is provided at the bottom end of the elastic telescopic rods 21, after the test is completed, the L-shaped slide column 20 is slid, so that the extrusion strip 22 is located right above the rack 10, and the extrusion strip 22 is pressed downward to press the rack 10, so that all the chip placing pieces 7 can be simultaneously driven to swing downward, thereby rapidly realizing the collection of chips (placing the chip storage box on the ground).
In order to facilitate understanding of the above technical solutions of the present utility model, the following describes in detail the working principle or operation manner of the present utility model in the actual process.
When the packaging chip to be tested is placed in practical application, the L-shaped slide column 20 is positioned on one side, the mounting of the packaging chip cannot be interfered, the packaging chip to be tested is placed on the chip placement sheet 7 in the opening I6, the motor 3 rotates positively, the screw 4 rotates positively, the sliding plate 5 is driven to move horizontally, the packaging chip sequentially carries out FT function test and appearance detection, when the unqualified packaging chip is detected, the electric push rod 23 moves downwards and extrudes the rack 10 below, the rack 10 drives the gear 9 to rotate, the gear 9 drives the connecting shaft 8 to rotate, the connecting shaft 8 drives the chip placement sheet 7 to swing downwards, the unqualified packaging chip is separated from the inclined chip placement sheet 7 and finally falls into the collecting box 18, thereby the packaging chip to be tested has the function of automatic screening and clearing, the unqualified packaging chip is not required to be manually picked out, the working pressure of a worker is greatly reduced, the motor 3 rotates reversely after all the tests are completed, the sliding plate 5 moves backwards and resets, the L-shaped slide column 20 is slid to the position right above the rack 10, the extrusion strip 22 is moved downwards, the two elastic telescopic rods 21 stretch elastically, all the extrusion strips 10 move the packaging chips downwards, all the packaging chips are required to be extruded by the whole packaging chip placement sheet 7 are required to be placed in the collecting box, all the packaging chip is required to be greatly and the packaging efficiency is greatly improved, and the packaging efficiency of all packaging chips are required to be greatly to be placed by the packaging and can be greatly and the packaging and can be taken out by all packaging and can be directly and directly subjected to the packaging by a packaging machine.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (6)

1. The utility model provides a packaging test mechanism, its characterized in that, including long frame (1), the top one side of long frame (1) is equipped with FT function testing device (2), the opposite side of FT function testing device (2) is equipped with and is located the appearance test mechanism of long frame (1) top, the opposite side inner wall of long frame (1) is equipped with motor (3), the one end of motor (3) be equipped with long frame (1) one end inner wall swing joint's screw rod (4), screw rod (4) cover be equipped with inner wall sliding connection's slide (5) around long frame (1), the top of slide (5) is equipped with opening one (6) of a plurality of equidistance distribution, every opening one's (6) inside all is equipped with chip placing plate (7), the top of slide (5) is equipped with a plurality of equidistance distribution's opening two, be equipped with in the opening two extend to in opening one (6) and with connecting axle (8) that chip placing plate (7) are connected, connecting axle (8) fixed cover be equipped with gear (9), the top of slide (6) is equipped with rack (10) and rack (10) are equipped with on one side of each of the rack (10), the bottom of spring (11) all be equipped with L type bracing piece (12) that slide (5) bottom is connected, the bottom of long frame (1) is equipped with a pair of collection mechanism.
2. The packaging and testing mechanism according to claim 1, wherein the appearance testing mechanism comprises a box body (13) located above the long frame (1), an AOI detection lens (14) is arranged on the inner wall of the top end of the box body (13), a light source (15) is arranged in the box body (13), and supporting frames (16) connected with the box body (13) are arranged on the front side and the rear side of the light source (15).
3. A packaging and testing mechanism according to claim 2, wherein the inner top end of the box body (13) and the inner top end of the FT function testing device (2) are respectively provided with an electric push rod (23), and the two electric push rods (23) are respectively matched with the rack (10).
4. A package testing mechanism according to claim 1, characterized in that the collecting mechanism comprises a long plate (17) located below the long frame (1), a collecting box (18) in threaded connection with the bottom end of the long plate (17) is arranged, and the upper end of the collecting box (18) penetrates to the upper side of the long plate (17).
5. A package testing mechanism according to claim 4, wherein a pair of bolts (19) are provided at the bottom ends of both long plates (17), and the bolts (19) are screwed to the bottom ends of the long frames (1).
6. The packaging and testing mechanism according to claim 1, wherein an L-shaped slide column (20) in sliding connection with the long frame (1) is arranged on one side of the top end of the long frame, a pair of elastic telescopic rods (21) are arranged at the bottom end of the L-shaped slide column (20), and an extrusion strip (22) is arranged at the bottom end of the elastic telescopic rods (21).
CN202223515397.7U 2022-12-28 2022-12-28 Packaging test mechanism Active CN218945693U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223515397.7U CN218945693U (en) 2022-12-28 2022-12-28 Packaging test mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223515397.7U CN218945693U (en) 2022-12-28 2022-12-28 Packaging test mechanism

Publications (1)

Publication Number Publication Date
CN218945693U true CN218945693U (en) 2023-05-02

Family

ID=86102491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223515397.7U Active CN218945693U (en) 2022-12-28 2022-12-28 Packaging test mechanism

Country Status (1)

Country Link
CN (1) CN218945693U (en)

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GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20240814

Address after: 224015 Zhangzhuang Street, Yandu District, Yancheng City, Jiangsu Province, China. Kangzhuang Avenue Shuangchuang Park Complex 1 # Factory Building

Patentee after: Jiangsu Xinfeng integrated circuit Co.,Ltd.

Country or region after: China

Address before: Room 1601, 16th Floor, Innovation Center, Yanlong Street, Yandu District, Yancheng City, Jiangsu Province, 224002 (D)

Patentee before: YANCHENG XINFENG MICROELECTRONICS Co.,Ltd.

Country or region before: China