CN218939603U - Cold and hot composite disc device - Google Patents
Cold and hot composite disc device Download PDFInfo
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- CN218939603U CN218939603U CN202223174021.4U CN202223174021U CN218939603U CN 218939603 U CN218939603 U CN 218939603U CN 202223174021 U CN202223174021 U CN 202223174021U CN 218939603 U CN218939603 U CN 218939603U
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Abstract
The utility model provides a cold and hot composite tray device, which relates to the technical field of heat treatment units of semiconductor equipment and comprises a bottom plate part, wherein an upper cover, a heating tray, pin needles, a SHUTTER lifting assembly and a cold tray are arranged on the upper surface of the bottom plate part, the Pin needles are arranged on the lower surface of the heating tray, and wafers are arranged on the surfaces of the Pin needles. According to the utility model, the bottom plate part, the upper cover, the heating plate, the Pin needle, the SHUTTER lifting assembly, the cold plate and the wafer are arranged, the wafer can be taken and placed through lifting of the Pin needle, the heat preservation effect is achieved by matching the SHUTTER lifting assembly with the upper cover, the wafer is subjected to heat treatment through the heating plate, the wafer is quickly transferred from the heating plate to the cold plate in a sliding manner through the cold plate, and the wafer is quickly cooled.
Description
Technical Field
The utility model relates to the technical field of heat treatment units of semiconductor equipment, in particular to a cold and hot composite disc device.
Background
In the practical use of the semiconductor equipment heat treatment unit, the heating unit and the cooling unit are generally positioned at different positions of the equipment, and when a wafer is required to be cooled after a heating process is finished, the wafer needs to be taken, transferred and placed by a mechanical arm, so that the operation efficiency of the whole equipment is influenced by the wafer conveying time of the mechanical arm and the risk of fragments in the wafer conveying process and needs to be improved.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a cold and hot composite disc device.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a cold and hot compound dish device, includes the bottom plate portion dress, the upper surface of bottom plate portion dress is provided with upper cover, heating plate, pin needle, shiter lifting unit, cold dish, the Pin needle sets up the lower surface at the heating plate, the surface of Pin needle is provided with the wafer, shiter lifting unit and upper cover all overlap and establish the surface at the heating plate, shiter lifting unit laminates with the upper cover mutually, the cold dish inboard is provided with circulating pipe, circulating pipe's inboard is provided with the coolant liquid, cold dish sliding connection is inboard at the top of bottom plate portion dress, the wafer sets up the upper surface at heating plate, cold dish.
In order to realize the heat insulation function of the heat insulation plate, the heat insulation plate is fixedly arranged at the middle position of the inner side of the bottom plate part, the heat insulation plate is arranged on one side of the heating plate, a first air cylinder and a guide rail are arranged on the other side of the heat insulation plate, the first air cylinder and the guide rail are fixedly connected with the bottom plate part, and the cold plate is positioned on the other side of the heat insulation plate.
In order to realize the heat dissipation function of the inside of the bottom plate part, the utility model is improved in that the front end of the bottom plate part is provided with an exhaust port, the exhaust port penetrates to the inner side of the bottom plate part, the rear end of the bottom plate part is fixedly provided with a water pipe interface, and one end of the water pipe interface is provided with a liquid receiving box.
In order to realize the nitrogen filling function for the interior of the SHUTTER lifting assembly, the utility model is improved in that a nitrogen filling interface and an exhaust interface are fixedly arranged at the top end of the upper cover.
In order to realize the overload protection function of the heating plate, the utility model is improved in that the bottom end of the heating plate is provided with a temperature sensor and a temperature control switch.
In order to realize the lifting function of the Pin needle, the improvement of the utility model is that the surface of the Pin needle is provided with a connecting frame which is connected with the inner side of the bottom plate part in a sliding way, the inner side of the bottom plate part is provided with a screw rod stepping motor, and the output end of the screw rod stepping motor is in threaded connection with the connecting frame.
In order to realize the position adjusting function of the cold disc, the utility model is improved in that the inner side of the bottom plate part is provided with a rodless cylinder, and the output end of the rodless cylinder is fixedly connected with the cold disc.
Compared with the prior art, the utility model has the advantages and positive effects that:
according to the utility model, the bottom plate part, the upper cover, the heating plate, the Pin needle, the SHUTTER lifting assembly, the cold plate and the wafer are arranged, the wafer can be taken and placed through lifting of the Pin needle, the heat preservation effect is achieved by matching the SHUTTER lifting assembly with the upper cover, the wafer is subjected to heat treatment through the heating plate, the wafer is quickly transferred from the heating plate to the cold plate in a sliding manner through the cold plate, and the wafer is quickly cooled.
Drawings
FIG. 1 is a schematic diagram of the overall components of a cold and hot composite tray device according to the present utility model;
FIG. 2 is a schematic diagram showing a hidden state of an upper cover and a cold plate of a cold-hot composite plate device according to the present utility model;
fig. 3 is a schematic diagram showing a cold plate advancing state structure of a cold-hot composite plate device according to the present utility model.
Legend description:
1. a bottom plate part is arranged; 2. an upper cover; 3. a heating plate; 4. pin needles; 5. a shitter lifting assembly; 6. a cold plate; 7. a wafer; 8. a heat insulating plate; 9. a liquid receiving box; 10. a water pipe interface; 11. a screw rod stepping motor; 12. a first air cylinder; 13. a guide rail; 14. an air suction port; 15. an exhaust interface; 16. a nitrogen-filled interface; 17. a rodless cylinder.
Detailed Description
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
Example 1
Referring to fig. 1-3, the present utility model provides a technical solution: a cold and hot composite disc device comprises a bottom plate part 1, wherein the bottom plate part 1 is a frame of the whole device, the rest parts are arranged on the frame, an upper cover 2, a heating disc 3, a Pin needle 4, a shitter lifting assembly 5 and a cold disc 6 are arranged on the upper surface of the bottom plate part 1, the Pin needle 4 is arranged on the lower surface of the heating disc 3, a wafer 7 is arranged on the surface of the Pin needle 4, when the wafer 7 is taken and placed, the wafer 7 is lifted and placed through the lifting of the Pin needle 4, the shitter lifting assembly 5 and the upper cover 2 are sleeved on the outer surface of the heating disc 3, the shitter lifting assembly 5 is attached to the upper cover 2, when the heating disc 3 works, the shitter lifting assembly 5 is lifted, the wafer 7 is wrapped together with the upper cover 2, the heat preservation effect is achieved, a nitrogen filling interface 16 and a nitrogen discharging interface 15 are fixedly arranged on the top end of the upper cover 2, when the shitter lifting assembly 5 starts to heat the wafer 7, by charging nitrogen into the SHUTER lifting assembly 5, the wafer 7 is isolated from air, photoresist on the surface of the wafer 7 is prevented from being oxidized, redundant gas can be pumped away through the exhaust interface 15, the temperature of the surface of the wafer 7 is controlled, a circulating water pipe is arranged on the inner side of the cold plate 6, cooling liquid is arranged on the inner side of the circulating water pipe, the cold plate 6 is slidingly connected on the inner side of the top end of the bottom plate part 1, the wafer 7 is arranged on the upper surfaces of the heating plate 3 and the cold plate 6, cooling circulating water is led into the cold plate 6, and can move back and forth, when the working flow of the heating plate 3 is finished, the SHUTER lifting assembly 5 is lowered, the Pin needle 4 is lifted to jack up the wafer 7, the cold plate 6 is moved to the right above the heating plate 3, the Pin needle 4 is lowered to place the wafer 7 on the cold plate 6, the wafer 7 is rapidly cooled, a rodless cylinder 17 is arranged on the inner side of the bottom plate part 1, the output end of the rodless cylinder 17 is fixedly connected with the cold plate 6, the cold plate 6 can be moved back and forth by the rodless cylinder 17, and when moved to the forefront, the cold plate 6 coincides with the heating plate 3 in the vertical direction.
Referring to fig. 2-3, the heat insulation board 8 is fixedly installed at the middle position of the inner side of the bottom plate part 1, the heat insulation board 8 is arranged at one side of the heating plate 3, a first-size air cylinder 12 and a guide rail 13 are arranged at the other side of the heat insulation board 8, the cold plate 6 is positioned at the other side of the heat insulation board 8, the heat insulation board 8 can separate the heat insulation board 6, the first-size air cylinder 12, the guide rail 13 and other elements which are not heat-resistant from the heating plate 3, the front end of the bottom plate part 1 is provided with an air suction opening 14, the air suction opening 14 penetrates to the inner side of the bottom plate part 1, the air suction opening 14 can be connected with an air suction fan, redundant heat around the heating plate 3 is extracted, a water pipe interface 10 is fixedly installed at the rear end of the bottom plate part 1, one end of the water pipe interface 10 is provided with a liquid receiving box 9, the liquid receiving box 9 can be connected with a small amount of condensed water generated on the water pipe interface 10, the bottom end of the heating plate 3 is provided with a temperature sensor and a temperature control switch, the surface temperature can be accurately controlled through the temperature sensor and the temperature control switch, so that the surface temperature can be protected, a surface connection frame of a Pin needle 4 is provided with the surface of the heat insulation board, a motor is connected with the bottom plate, a motor connection frame 1 is connected with the bottom plate 11 through the temperature control switch, the lead screw 11 is connected with the lead screw 11, and the lead screw 11 is further connected with the inner side of the lead screw 11 by a stepping motor, and the lead screw 11, the lead screw is connected with the lead screw 4 by any screw, and the lead screw 4 is further connected with the lead screw with the stepping screw, and can achieve the function.
Working principle: when the wafer 7 is taken and placed, the lead screw stepping motor 11 is operated to apply force to the connecting frame and then the Pin needle 4, so that the lifting function of the Pin needle 4 is achieved, the wafer 7 can be hovered at any height, the wafer 7 is lifted and put down through the lifting of the Pin needle 4, the shitter lifting assembly 5 is attached to the upper cover 2, when the heating disc 3 works, the shitter lifting assembly 5 is lifted to wrap the wafer 7 together with the upper cover 2, the heat preservation effect is achieved, when the shitter lifting assembly 5 is lifted, the heating disc 3 starts to heat the wafer 7, the nitrogen is flushed into the shitter lifting assembly 5 to isolate the wafer 7 from air, the photoresist on the surface of the wafer 7 is prevented from being oxidized, meanwhile, the redundant air can be pumped away through the exhaust interface 15, the temperature of the surface of the wafer 7 is controlled, the cooling circulating water is led into the cold disc 6, and can move forwards and backwards, when the working flow of the heating disc 3 is completed, the shitter lifting assembly 5 is lifted, the wafer 7 is lifted up by the Pin needle 4, the wafer 7 is lifted through the rodless cylinder 17, the wafer 7 is rapidly moved upwards to the position right above the Pin needle 7, and the wafer 7 is placed on the cold disc 6.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical matter of the present utility model will still fall within the protection scope of the technical solution of the present utility model.
Claims (7)
1. A cold and hot composite tray device, comprising a bottom plate part (1), characterized in that: the utility model discloses a refrigerator, including bottom plate portion dress (1), upper cover (2), heating plate (3), pin needle (4), shitter lifting unit (5), cold dish (6), pin needle (4) set up the lower surface at heating plate (3), the surface of Pin needle (4) is provided with wafer (7), the surface at heating plate (3) is all established to shitter lifting unit (5) and upper cover (2), shitter lifting unit (5) laminating mutually with upper cover (2), cold dish (6) inboard is provided with circulating water pipe, circulating water pipe's inboard is provided with the coolant liquid, cold dish (6) sliding connection is inboard at the top of bottom plate portion dress (1), wafer (7) set up the upper surface at heating plate (3), cold dish (6).
2. The cold and hot composite plate device according to claim 1, wherein: the heat insulation plate (8) is fixedly mounted at the middle position of the inner side of the bottom plate part (1), the heat insulation plate (8) is arranged on one side of the heating plate (3), a first air cylinder (12) and a guide rail (13) are arranged on the other side of the heat insulation plate (8), the first air cylinder (12) and the guide rail (13) are fixedly connected with the bottom plate part (1), and the cold plate (6) is located on the other side of the heat insulation plate (8).
3. The cold and hot composite plate device according to claim 1, wherein: the front end of the bottom plate part (1) is provided with an exhaust opening (14), the exhaust opening (14) penetrates through the inner side of the bottom plate part (1), the rear end of the bottom plate part (1) is fixedly provided with a water pipe connector (10), and one end of the water pipe connector (10) is provided with a liquid receiving box (9).
4. The cold and hot composite plate device according to claim 1, wherein: the top end of the upper cover (2) is fixedly provided with a nitrogen charging interface (16) and an exhaust interface (15).
5. The cold and hot composite plate device according to claim 1, wherein: the bottom of the heating plate (3) is provided with a temperature sensor and a temperature control switch.
6. The cold and hot composite plate device according to claim 1, wherein: the surface of Pin needle (4) is equipped with the link, link sliding connection is in the inboard of bottom plate portion dress (1), lead screw step motor (11) are equipped with to the inboard of bottom plate portion dress (1), the output and the link threaded connection of lead screw step motor (11).
7. The cold and hot composite plate device according to claim 1, wherein: the inner side of the bottom plate part (1) is provided with a rodless cylinder (17), and the output end of the rodless cylinder (17) is fixedly connected with the cold disc (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223174021.4U CN218939603U (en) | 2022-11-29 | 2022-11-29 | Cold and hot composite disc device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223174021.4U CN218939603U (en) | 2022-11-29 | 2022-11-29 | Cold and hot composite disc device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218939603U true CN218939603U (en) | 2023-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223174021.4U Active CN218939603U (en) | 2022-11-29 | 2022-11-29 | Cold and hot composite disc device |
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| CN (1) | CN218939603U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504686A (en) * | 2023-06-28 | 2023-07-28 | 北京中科科美科技股份有限公司 | Semiconductor heating plate based on liquid uniform temperature control |
-
2022
- 2022-11-29 CN CN202223174021.4U patent/CN218939603U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116504686A (en) * | 2023-06-28 | 2023-07-28 | 北京中科科美科技股份有限公司 | Semiconductor heating plate based on liquid uniform temperature control |
| CN116504686B (en) * | 2023-06-28 | 2023-10-20 | 北京中科科美科技股份有限公司 | Semiconductor heating plate based on liquid uniform temperature control |
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