CN218936299U

CN218936299U - Low-attenuation semiconductor light-emitting module

Info

Publication number: CN218936299U
Application number: CN202221626278.6U
Authority: CN
Inventors: 田在文
Original assignee: Jiangsu Yifu Construction Group Co ltd
Current assignee: Suzhou Lingrui Bochuang Precision Machinery Technology Co.,Ltd.
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2023-04-28
Anticipated expiration: 2032-06-27

Abstract

The utility model discloses a low-attenuation semiconductor light-emitting module, which comprises a lamp shade, a base plate and an LED light source packaged on the base plate, wherein a radiating bottom plate is attached to the upper end of the base plate, the bottom edge of the radiating bottom plate is fixedly connected with the lamp shade, a plurality of big fins and small fins are arranged at the top of the radiating bottom plate in a staggered manner, the radiating area of the big fins is larger than that of the small fins, a cooling water pipe is wound between the big fins and the small fins, a water pump and a water tank are fixedly connected to the top of the radiating bottom plate, a water inlet pipe is fixedly connected to the input end of the water pump, the other end of the water inlet pipe is communicated with the water tank, the output end of the water pump is fixedly connected with the cooling water pipe, the other end of the cooling water pipe is communicated with the water tank, and a plurality of second radiating assemblies are arranged on the water inlet pipe. The heat dissipation effect is improved, the light attenuation degree is reduced, and the service life of the semiconductor light-emitting module is prolonged.

Description

Low-attenuation semiconductor light-emitting module

Technical Field

The utility model relates to the technical field of semiconductor light-emitting modules, in particular to a low-attenuation semiconductor light-emitting module.

Background

The semiconductor lighting is an emerging lighting technology, the basic device is a light-emitting diode, and is a semiconductor solid light-emitting device, which uses a solid semiconductor chip as a light-emitting material, and photon emission is caused by the fact that excessive energy is emitted through carrier recombination in the semiconductor, so that red, yellow, blue, green, cyan, orange, purple and white light is directly emitted. Semiconductor lighting products are lighting fixtures manufactured using LEDs as light sources. The semiconductor lighting has the remarkable characteristics of high efficiency, energy conservation, environmental protection, easy maintenance and the like, is an effective way for realizing energy conservation and emission reduction, and has gradually become a revolution of another lighting source after an incandescent lamp and a fluorescent lamp in the lighting history.

The service life of the existing LED lamp is not as long as expected, the main reason is that the LED product has light attenuation, the most critical reason is that the LED product has light attenuation, and although a plurality of manufacturers do not pay attention to the heat dissipation problem in secondary products, the light attenuation degree of the secondary LED products is higher than that of the LED products with attention to heat dissipation in long-term use.

The LED lamp is very easy to generate heat when using, and the LED lamp is in high-temperature working state for a long time, easily causes the ageing of inside components and parts, and the light attenuation degree is serious, influences life.

Disclosure of Invention

The present utility model is directed to a low-attenuation semiconductor light emitting module, which solves the above-mentioned problems.

In order to solve the technical problems, the utility model provides the following technical scheme: the utility model provides a low attenuation semiconductor light emitting module, includes lamp shade, base plate and encapsulation in LED light source on the base plate, the base plate upper end is attached with radiating bottom plate, radiating bottom plate bottom edge and lamp shade fixed connection, radiating bottom plate top is crisscross to be provided with a plurality of big fins and little fins, big fin's heat radiating area is greater than little fin's heat radiating area, the winding has condenser tube between big fin and the little fin, radiating bottom plate top rigid coupling has water pump and water tank, the water pump input rigid coupling has the inlet tube, the inlet tube other end and water tank intercommunication, the water pump output with condenser tube rigid coupling, the condenser tube other end and water tank intercommunication, be equipped with a plurality of second cooling assembly on the inlet tube.

The second heat dissipation assembly comprises a driving impeller arranged in the water inlet pipe, the driving impeller is connected with a rotating shaft penetrating through the wall of the water inlet pipe, the rotating shaft is connected with the water inlet pipe through a bearing, a sealing ring clung to the bearing is arranged in the wall of the water inlet pipe, and the other end of the rotating shaft is fixedly sleeved with fan blades.

The outer surface of the water tank is provided with a plurality of cooling fins.

The big fins and the small fins are arranged in parallel.

Compared with the prior art, the utility model has the following beneficial effects:

1. according to the utility model, the large fins and the small fins are arranged, so that the heat dissipation area of the large fins is larger than that of the small fins, and the air flow among the fins is accelerated;

2. a cooling water pipe is wound between the big fins and the small fins, and when the cooling water flows in the cooling water pipe, the big fins and the small fins are subjected to water cooling and heat dissipation, so that the heat dissipation fin can better dissipate heat of the semiconductor light-emitting module;

3. through setting up second radiating element, water flows in the inlet tube, makes to drive the impeller rotatory, drives the impeller and drives the flabellum rotatory through the pivot, can accelerate the air flow, has improved the radiating effect, has reduced the light decay degree, has improved the life of semiconductor light emitting module.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a top view of the present utility model;

FIG. 2 is a cross-sectional view of the present utility model;

FIG. 3 is a partial cross-sectional view of the inlet tube of the present utility model;

fig. 4 is an enlarged view of the utility model at a in fig. 1.

In the figure: the LED lamp comprises a lamp shade 1, a substrate 2, an LED light source 3, a heat dissipation bottom plate 4, a big fin 5, a small fin 6, a water pump 7, a water tank 8, a water inlet pipe 9, a cooling water pipe 10, an impeller 11, a rotating shaft 12, a bearing 13, a sealing ring 14, a fan blade 15 and a heat dissipation fin 16.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a low attenuation semiconductor light emitting module, including lamp shade 1, base plate 2 and encapsulation LED light source 3 on base plate 2, the upper end of base plate 2 is attached and is had radiating bottom plate 4, radiating bottom plate 4 bottom edge and lamp shade 1 fixed connection, radiating bottom plate 4 top is crisscross to be provided with a plurality of big fins 5 and little fins 6, the radiating area of big fins 5 is greater than the radiating area of little fins 6, be favorable to accelerating the air flow between each fin, twining between big fins 5 and little fins 6 has cooling water pipe 10, when cooling water flows in cooling water pipe 10, carry out water-cooling heat dissipation to big fins 5 and little fins 6, thereby make the better semiconductor light emitting module of fin dispel the heat, radiating bottom plate 4 top rigid coupling has water pump 7 and water tank 8, water pump 7 input rigid coupling has inlet tube 9, the other end and water tank 8 intercommunication of inlet tube 9, water pump 7 output and cooling water pipe 10 rigid coupling, the other end and water tank 8 intercommunication, be equipped with a plurality of second cooling components on the inlet tube 9.

The second heat dissipation assembly comprises a driving impeller 11 arranged in the water inlet pipe 9, the driving impeller 11 is connected with a rotating shaft 12 penetrating through the pipe wall of the water inlet pipe 9, the rotating shaft 12 is connected with the water inlet pipe 9 through a bearing 13, a sealing ring 14 clung to the bearing 13 is arranged in the pipe wall of the water inlet pipe 9, and the other end of the rotating shaft 12 is fixedly sleeved with a fan blade 15. The water flows in the water inlet pipe 9, so that the impeller 11 is driven to rotate, the impeller 11 is driven to rotate through the rotating shaft 12, the fan blades 15 are driven to rotate, the air flow can be accelerated, the heat dissipation effect is improved, the light attenuation degree is reduced, and the service life of the semiconductor light-emitting module is prolonged.

The outer surface of the water tank 8 is provided with a plurality of cooling fins 16 which can cool the water in the water tank 8.

The big fins 5 and the small fins 6 are arranged in parallel.

The foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a low attenuation semiconductor light emitting module, includes lamp shade (1), base plate (2) and encapsulation in LED light source (3) on base plate (2), its characterized in that: the utility model discloses a radiating device, including base plate (2), radiating bottom plate (4) bottom edge and lamp shade (1) fixed connection, radiating bottom plate (4) top is crisscross to be provided with a plurality of big fins (5) and little fin (6), the radiating area of big fins (5) is greater than the radiating area of little fin (6), twine between big fins (5) and little fin (6) has condenser tube (10), radiating bottom plate (4) top rigid coupling has water pump (7) and water tank (8), water pump (7) input rigid coupling has inlet tube (9), the inlet tube (9) other end and water tank (8) intercommunication, water pump (7) output with condenser tube (10) rigid coupling, condenser tube (10) other end and water tank (8) intercommunication, be equipped with a plurality of second cooling module on inlet tube (9).

2. The low-attenuation semiconductor light emitting module of claim 1, wherein: the second heat dissipation assembly comprises a driving impeller (11) arranged in the water inlet pipe (9), the driving impeller (11) is connected with a rotating shaft (12) penetrating through the pipe wall of the water inlet pipe (9), the rotating shaft (12) is connected with the water inlet pipe (9) through a bearing (13), a sealing ring (14) tightly attached to the bearing (13) is arranged in the pipe wall of the water inlet pipe (9), and a fan blade (15) is fixedly sleeved at the other end of the rotating shaft (12).

3. The low-attenuation semiconductor light emitting module of claim 1, wherein: the outer surface of the water tank (8) is provided with a plurality of cooling fins (16).

4. The low-attenuation semiconductor light emitting module of claim 1, wherein: the big fins (5) and the small fins (6) are arranged in parallel.