CN218928258U - Semiconductor material burr-free cutting device - Google Patents
Semiconductor material burr-free cutting device Download PDFInfo
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- CN218928258U CN218928258U CN202223583068.6U CN202223583068U CN218928258U CN 218928258 U CN218928258 U CN 218928258U CN 202223583068 U CN202223583068 U CN 202223583068U CN 218928258 U CN218928258 U CN 218928258U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The utility model discloses a semiconductor material burr-free cutting device in the technical field of semiconductor material processing, which comprises a workbench, a mounting column and a controller, wherein the mounting column is fixedly connected to the right sides of the front side and the rear side of the top of the workbench through bolts, the controller is fixedly connected to the right side of the front side wall of the workbench, a discharging table is fixedly connected to the left side of the top of the workbench, a movable rail is fixedly connected to the upper side of the right side wall of the discharging table through bolts, a movable block is slidably connected to the right side wall of the movable rail, and the mounting block is fixedly connected to the right side wall of the movable block.
Description
Technical Field
The utility model relates to the technical field of semiconductor material processing, in particular to a burr-free cutting device for a semiconductor material.
Background
The semiconductor material is a material with semiconductor performance, can be used for manufacturing electronic materials of semiconductor devices and integrated circuits, and along with the continuous development of the semiconductor material, the application of SiC as a third-generation semiconductor material in the power device and IC industries is more and more widespread, the semiconductor needs to be cut during use, and the whole semiconductor plate is cut during cutting and then is further added after being cut into strip-shaped objects.
The existing semiconductor material cutting equipment cuts the semiconductor material through a cutting piece, burrs are formed on the back surface of the cut semiconductor material, so that the quality of cutting is reduced, the semiconductor material is required to be fixedly processed during cutting, the fixing mode is single, the semiconductor material is clamped and processed through an operation clamp, the operation process is complicated, and the processing efficiency of the semiconductor material is reduced.
Disclosure of Invention
The utility model aims to provide a burr-free cutting device for semiconductor materials, which aims to solve the problems that in the prior art, the existing semiconductor material cutting equipment is used for cutting the semiconductor materials through a cutting sheet, burrs are generated on the back surface of the cut semiconductor materials, the semiconductor materials are required to be fixed and processed during cutting, the fixing mode is single, the semiconductor materials are clamped and processed through an operation clamp, and the operation process is excessively complicated.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor material does not have burr cutting device, includes workstation, erection column and controller, the erection column passes through bolt fixed connection both sides right side around the top of workstation, controller fixed connection is in the preceding lateral wall right side of workstation, the top left side fixedly connected with blowing platform of workstation, the right side wall upside of blowing platform passes through bolt fixedly connected with movable rail, movable rail's right side wall sliding connection has the movable block, movable block's right side wall fixedly connected with erection block, the top fixedly connected with scraper of erection block, movable rail's back lateral wall fixedly connected with mounting panel, the preceding lateral wall right side fixedly connected with first electric putter of mounting panel, the front end fixedly connected with of first electric putter is in movable block's back lateral wall.
As a further description of the above technical solution:
the right side of the top of the discharging table is adhered with an anti-slip pad, and the anti-slip pad is made of silica gel materials.
As a further description of the above technical solution:
the automatic feeding device is characterized in that the supporting plates are fixedly connected to the left sides of the front side and the rear side of the top of the feeding table, a pressing rod is rotationally connected between the upper sides of the inner side walls of the supporting plates, a pressing plate is rotationally connected to the right side of the bottom of the pressing rod, a spring is fixedly connected to the middle of the bottom of the pressing rod, and the bottom end of the spring is fixedly connected to the top of the feeding table.
As a further description of the above technical solution:
the movable sliding rod is fixedly connected between the left side and the right side of the inner side wall of the mounting column, the movable sliding block is slidably connected between the outer side wall of the movable sliding rod, the second electric push rod is fixedly connected with the rear side wall of the movable sliding block, and the rear end of the second electric push rod is fixedly connected to the rear side at the middle of the front side wall of the mounting column.
As a further description of the above technical solution:
the top fixedly connected with servo motor of removal slider, servo motor's power output shaft left end fixedly connected with cutting piece, servo motor's left side wall just is located the outside fixedly connected with protection casing of cutting piece.
As a further description of the above technical solution:
the controller is electrically connected with the first electric push rod, the second electric push rod and the servo motor through wires.
Compared with the prior art, the utility model has the beneficial effects that:
1. this semiconductor material does not have burr cutting device, it rotates to drive the cutting piece through servo motor, second electric putter drives the removal slider simultaneously and removes on removing the slide bar, cut the semiconductor material on the blowing platform, first electric putter drives the movable block after the cutting and removes on removing the track, the movable block passes through the installation piece simultaneously and drives the burr that the scraper produced with semiconductor material bottom cutting and strike off, thereby can make the semiconductor material after the cutting can not appear the condition of burr, improve the quality of semiconductor material processing.
2. This semiconductor material does not have burr cutting device, through the left end of pressing the depression bar, the depression bar is under the support of backing plate, and the right-hand member of depression bar lifts up, drives the clamp plate simultaneously and lifts up, through placing semiconductor material to the blowing bench, loosens the depression bar, and under the effect of spring, the right-hand member of depression bar descends, makes the clamp plate tightly press from both sides semiconductor material between slipmat and clamp plate, can carry out a key with semiconductor material and press from both sides tightly fixedly to can be convenient for the operation more when semiconductor material processing is fixed, also improve the efficiency of semiconductor material processing simultaneously.
Drawings
Fig. 1 is a schematic diagram of a front cross-sectional structure of a semiconductor material burr-free cutting device according to the present utility model;
FIG. 2 is a schematic diagram showing a cross-sectional right-hand view of a semiconductor material burr-free cutting device according to the present utility model;
FIG. 3 is a schematic view of a right-side view of a burr-free cutting device for semiconductor materials according to the present utility model;
in the figure: 100. a work table; 110. a discharging table; 111. an anti-slip pad; 120. a moving track; 121. a moving block; 122. a mounting block; 123. a scraper; 124. a mounting plate; 125. a first electric push rod; 130. a support plate; 131. a compression bar; 132. a pressing plate; 133. a spring; 200. a mounting column; 210. moving the slide bar; 220. moving the slide block; 221. a second electric push rod; 230. a servo motor; 231. cutting the sheet; 232. a protective cover; 300. and a controller.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The utility model provides a burr-free cutting device for semiconductor materials, which is used for removing burrs, improving the processing quality, facilitating the operation and improving the processing efficiency, referring to fig. 1-3, and comprises a workbench 100, a mounting column 200 and a controller 300;
referring to fig. 1-2, a discharging table 110 is fixedly connected to the left side of the top of the workbench 100, the discharging table 110 is used for placing processed semiconductor materials, a moving rail 120 is fixedly connected to the upper side of the right side wall of the discharging table 110 through bolts, the moving rail 120 is used for limiting the movement of a moving block 121, the right side wall of the moving rail 120 is slidably connected with the moving block 121, the moving block 121 is used for driving a mounting block 122 to move, the right side wall of the moving block 121 is fixedly connected with the mounting block 122, the mounting block 122 is used for mounting a scraper 123, the top of the mounting block 122 is fixedly connected with a scraper 123, the scraper 123 is used for removing burrs, the rear side wall of the moving rail 120 is fixedly connected with a mounting plate 124, the mounting plate 124 is used for mounting a first electric push rod 125, the right side of the front side wall of the mounting plate 124 is fixedly connected with the first electric push rod 125, the first electric push rod 125 is used for pushing the moving block 121 for no service, the front end of the first electric push rod 125 is fixedly connected with the rear side wall of the moving block 121, the right side of the top of the discharging table 110 is adhered with an anti-slip pad 111, the anti-slip pad 111 is used for preventing the movement of semiconductor materials, the anti-slip pad 111 is made of silica gel materials, the front side and the rear side of the top of the discharging table 110 are fixedly connected with a supporting plate 130, the supporting plate 130 is used for supporting the rotation of a pressing rod 131, the pressing rod 131 is rotationally connected between the upper sides of the inner side walls of the supporting plate 130, the pressing rod 131 is used for driving a pressing plate 132 to move, the right side of the bottom of the pressing rod 131 is rotationally connected with the pressing plate 132, the pressing plate 132 is used for clamping and fixing the semiconductor materials, the middle of the bottom of the pressing rod 131 is fixedly connected with a spring 133, the bottom of the spring 133 is used for resetting the pressing rod 131, the bottom of the spring 133 is fixedly connected with the top of the discharging table 110, the pressing rod 131 is lifted up under the support of the supporting plate 130 through the left end of the pressing rod 131, meanwhile, the pressing plate 132 is driven to be lifted, the pressing rod 131 is loosened by placing the semiconductor material on the discharging table 110, and the right end of the pressing rod 131 descends under the action of the spring 133, so that the pressing plate 132 firmly clamps the semiconductor material between the anti-slip pad 111 and the pressing plate 132, and the semiconductor material can be clamped and fixed by one key;
in summary, the operation can be more convenient when the semiconductor material is processed and fixed, and meanwhile, the efficiency of the semiconductor material processing is improved.
Referring to fig. 1 to 3 again, a moving slide bar 210 is fixedly connected between the left and right sides of the inner side wall of the mounting column 200, the moving slide bar 210 is used for limiting the movement of the moving slide bar 220, a moving slide block 220 is slidably connected between the outer side walls of the moving slide bar 210, the moving slide block 220 is used for mounting a servo motor 230, the rear side wall of the moving slide block 220 is fixedly connected with a second electric push rod 221, the second electric push rod 221 is used for pushing the moving slide block 220 to move, the rear end of the second electric push rod 221 is fixedly connected to the middle of the front side wall of the rear side mounting column 200, the top of the moving slide block 220 is fixedly connected with a servo motor 230, the servo motor 230 is used for driving a cutting blade 231 to rotate, the left end of a power output shaft of the servo motor 230 is fixedly connected with the cutting blade 231, the cutting blade 231 is used for cutting semiconductor materials, the left side wall of the servo motor 230 is fixedly connected with a protective cover 232 which is positioned on the outer side of the cutting blade 231, the protective cover 232 is used for protecting the cutting process, the mounting column 200 is fixedly connected to the right sides of the front and rear sides of the top of the workbench 100 through bolts, the cutting blade 231 is driven to rotate through the servo motor 230, meanwhile, the second electric push rod 221 drives the movable slide block 220 to move on the movable slide rod 210, the semiconductor materials on the discharging table 110 are cut, the first electric push rod 125 drives the movable block 121 to move on the movable track 120 after cutting, and meanwhile, the movable block 121 drives the scraper 123 through the mounting block 122 to scrape burrs generated by cutting the bottom of the semiconductor materials;
in summary, the cut semiconductor material can be prevented from generating burrs, and the processing quality of the semiconductor material can be improved.
Referring to fig. 1, the controller 300 is electrically connected to the first electric putter 125, the second electric putter 221, and the servo motor 230 through wires, the controller 300 is fixedly connected to the right side of the front sidewall of the workbench 100, and the controller 300 is used for controlling the start and stop of the first electric putter 125, the second electric putter 221, and the servo motor 230.
When the device is specifically used, a person skilled in the art presses the left end of the pressing rod 131 when processing and cutting semiconductor materials, the pressing rod 131 is supported by the supporting plate 130, the right end of the pressing rod 131 is lifted, the pressing plate 132 is driven to be lifted, the pressing rod 131 is loosened, under the action of the spring 133, the right end of the pressing rod 131 is lowered, the pressing plate 132 firmly clamps the semiconductor materials between the anti-slip pad 111 and the pressing plate 132, the semiconductor materials can be clamped and fixed by one key, the controller 300 is used for starting the first electric push rod 125, the second electric push rod 221 and the servo motor 230, the servo motor 230 drives the cutting blade 231 to rotate, meanwhile, the second electric push rod 221 drives the movable slide block 220 to move on the movable slide bar 210, the semiconductor materials on the discharging table 110 are cut, the first electric push rod 125 drives the movable block 121 to move on the movable rail 120 after cutting, and meanwhile the movable block 121 drives the scraper 123 to scrape burrs generated by cutting the bottom of the semiconductor materials through the mounting block 122, and the cutting of the semiconductor materials is completed.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. A semiconductor material burr-free cutting device, characterized in that: including workstation (100), erection column (200) and controller (300), erection column (200) are in through bolt fixed connection both sides right side around the top of workstation (100), controller (300) fixedly connected with is in preceding lateral wall right side of workstation (100), the top left side fixedly connected with blowing platform (110) of workstation (100), the right side wall upside of blowing platform (110) is through bolt fixedly connected with movable rail (120), the right side wall sliding connection of movable rail (120) has movable block (121), the right side wall fixedly connected with installation piece (122) of movable block (121), the top fixedly connected with scraper (123) of installation piece (122), the rear side wall fixedly connected with mounting panel (124) of movable rail (120), the front side wall right side fixedly connected with first electric putter (125) of mounting panel (124), the front end fixedly connected with of first electric putter (125) is in the rear side wall of movable block (121).
2. A semiconductor material burr-free cutting apparatus according to claim 1, wherein: the right side of the top of the discharging table (110) is adhered with an anti-slip pad (111), and the anti-slip pad (111) is made of silica gel materials.
3. A semiconductor material burr-free cutting apparatus according to claim 1, wherein: the automatic feeding device is characterized in that support plates (130) are fixedly connected to the left sides of the front side and the rear side of the top of the feeding table (110), compression bars (131) are rotationally connected between the upper sides of the inner side walls of the support plates (130), compression plates (132) are rotationally connected to the right sides of the bottoms of the compression bars (131), springs (133) are fixedly connected to the middle of the bottoms of the compression bars (131), and the bottoms of the springs (133) are fixedly connected to the top of the feeding table (110).
4. A semiconductor material burr-free cutting apparatus according to claim 1, wherein: the movable sliding rod (210) is fixedly connected between the left side and the right side of the inner side wall of the mounting column (200), the movable sliding block (220) is slidably connected between the outer side wall of the movable sliding rod (210), the second electric push rod (221) is fixedly connected with the rear side wall of the movable sliding block (220), and the rear end of the second electric push rod (221) is fixedly connected to the rear side at the middle position of the front side wall of the mounting column (200).
5. A semiconductor material burr-free cutting apparatus according to claim 4, wherein: the top fixedly connected with servo motor (230) of removal slider (220), power output shaft left end fixedly connected with cutting piece (231) of servo motor (230), the left side wall of servo motor (230) just is located outside fixedly connected with protection casing (232) of cutting piece (231).
6. A semiconductor material burr-free cutting apparatus according to claim 1, wherein: the controller (300) is electrically connected with the first electric push rod (125), the second electric push rod (221) and the servo motor (230) through wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223583068.6U CN218928258U (en) | 2022-12-30 | 2022-12-30 | Semiconductor material burr-free cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223583068.6U CN218928258U (en) | 2022-12-30 | 2022-12-30 | Semiconductor material burr-free cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218928258U true CN218928258U (en) | 2023-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223583068.6U Active CN218928258U (en) | 2022-12-30 | 2022-12-30 | Semiconductor material burr-free cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218928258U (en) |
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- 2022-12-30 CN CN202223583068.6U patent/CN218928258U/en active Active
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