CN218927206U - Integrated circuit chip packaging device - Google Patents

Abstract

The utility model relates to the technical field of chip packaging, in particular to an integrated circuit chip packaging device which comprises an upper mounting seat and a lower mounting seat which are arranged vertically and oppositely, a plurality of connecting columns used for connecting the upper mounting seat and the lower mounting seat, a sliding plate which is connected to the connecting columns in an up-down sliding manner, a lifting driving component used for driving the sliding plate to ascend or descend along the connecting columns, a polishing component and a dust removing component which are arranged on the sliding plate, and a fixing plate which is fixed on the connecting columns, wherein the sliding plate and the fixing plate are arranged vertically and oppositely, a plurality of limiting through holes are vertically formed in the fixing plate, and a limiting block and a discharging driving component used for driving the limiting block to ascend or descend along the limiting through holes are connected in a sliding manner in the limiting through holes; the utility model can prevent polishing dust from influencing the thinning of the chip, can also prevent the deflection of the hydraulic rod in the telescopic process, and improves the whole packaging quality of the chip.

Description

Integrated circuit chip packaging device

Technical Field

The utility model relates to the technical field of chip packaging, in particular to an integrated circuit chip packaging device.

Background

The packaging process flow of an integrated circuit chip can be generally divided into two parts, the process steps between molding technologies are called front-end operation, the process steps after molding are called back-end operation, and the chip packaging comprises the steps of silicon chip thinning, silicon chip cutting, chip mounting, chip interconnection, molding technology, deburring, rib cutting molding, soldering and coding, and the like, so that the final thickness of the chip must be reduced to 30 μm or even below in order to stack bare chips, and therefore, the thickness of the chip needs to be processed by a thinning device. However, in the conventional device, when the thickness of the chip is processed, a slight vibration is generated during the operation of the device, and therefore the chip may be detached from the device due to the vibration, which may affect the thinning of the chip.

The current chinese patent of authorizing the bulletin number CN210129487U discloses an integrated circuit chip packaging hardware, which comprises a fixed base, the top outer wall of fixing base is fixed with four dead levers, and the top outer wall of four dead levers all is fixed with the roof, one side of roof bottom outer wall is fixed with the hydraulic stem, and the bottom outer wall of hydraulic stem is fixed with the backup pad, the bottom outer wall of backup pad is fixed with the second motor, and the one end of second motor output shaft is fixed with the mill, one side of fixing base top outer wall is connected with the dwang through the bearing, and the top outer wall of dwang is fixed with the rolling disc, the both sides of rolling disc top outer wall all are fixed with the fixed column. The friction force between the chip and the device can be increased, the chip is prevented from falling off the device due to vibration to affect the thinning of the chip, the thickness of the chip thinning can be adjusted, the chip can be conveniently taken out from the device after processing is completed, and the working efficiency of the device can be conveniently improved.

However, in practical application, the scheme has the following problems: because a large amount of polishing dust can appear in the process of polishing, untimely cleaning can cause the influence to the thinning of chip, in addition, because the flexible in-process of hydraulic rod is in basically no outside fixed or unidirectional simple fixed state, the in-process of polishing is moved down to the second motor when the hydraulic rod drive is more easily to appear the skew to the contact face of polishing of mill and chip makes the holistic encapsulation quality of chip decline.

Disclosure of Invention

The utility model aims to overcome the defects, and provides the integrated circuit chip packaging device which can prevent polishing dust from influencing the thinning of a chip, prevent the deviation in the telescopic process of a hydraulic rod and improve the overall packaging quality of the chip.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides an integrated circuit chip packaging hardware, includes upper mounting seat and lower mount pad just right setting from top to bottom for connect many spliced poles that upper mounting seat and lower mount pad adopted, upper and lower sliding connection is in slide on the spliced pole is used for the drive the slide rises or descends the lift drive assembly that adopts along the spliced pole, installs polishing assembly and dust removal subassembly on the slide, and fixes fixed plate on the spliced pole, slide and fixed plate just set up from top to bottom, a plurality of spacing through-holes have been vertically seted up on the fixed plate, sliding connection has the stopper in the spacing through-hole and is used for the drive the stopper is followed spacing through-hole rises or descends the ejection of compact drive assembly that adopts.

Further, the lifting driving assembly is a lifting driving air cylinder fixed in the upper mounting seat, and a piston rod head of the lifting driving air cylinder vertically extends downwards to be in driving connection with the sliding plate.

Further, the polishing assembly comprises a polishing motor fixed in the sliding plate, and an output shaft of the polishing motor vertically extends downwards to be connected with a polishing disc in a driving mode.

Further, the dust removal subassembly is including around the many dust branch pipes that polish the motor setting, the bottom of dust branch pipe extends to the slide below is connected with the infundibulate dust removal dust absorption head, many the top of dust branch pipe all communicates annular connecting pipe, the end of giving vent to anger of annular connecting pipe is connected with the negative pressure and is responsible for, the negative pressure is responsible for keeping away from the one end of annular connecting pipe is connected with vacuum cleaner, the big mouth end of infundibulate dust removal dust absorption head sets up downwards.

Further, the ejection of compact drive assembly is in including sliding connection the flitch on the spliced pole, fix ejection of compact electric telescopic handle in the lower mount pad, the flitch set up in under the fixed plate, the bottom of stopper is worn out behind the spacing through-hole, connect the flitch.

Further, an anti-slip coating is arranged in the limiting through hole, and the anti-slip coating is arranged close to the top end of the limiting through hole.

Further, one side of lower mount pad is provided with the controller, lift drive assembly, polishing subassembly, dust removal subassembly and ejection of compact drive assembly all electric connection the controller.

The beneficial effects of the utility model are as follows:

in practical application, the chip is placed on the limiting block in the limiting through hole, the lifting driving assembly drives the sliding plate to descend along the connecting column, the chip is polished and thinned through the polishing assembly, dust generated in the polishing and thinning process is pumped away through the dust removing assembly, and after polishing and thinning are completed, the discharging driving assembly drives the limiting block to drive the chip to ascend, so that the polished and thinned chip can be taken out; the utility model can prevent polishing dust from influencing the thinning of the chip, can also prevent the deflection of the hydraulic rod in the telescopic process, and improves the whole packaging quality of the chip.

Drawings

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a cross-sectional view of the present utility model;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

reference numerals: an upper mounting seat 1; a lower mounting base 2; a connecting column 21; a slide plate 3; a lift drive assembly 4; a grinding assembly 5; a grinding motor 51; polishing disc 52; a dust removal assembly 6; a dust removing branch pipe 61; a funnel-shaped dust removal and collection head 62; a ring-shaped connection pipe 63; a negative pressure main pipe 64; a fixing plate 7; a limit through hole 71; an anti-slip coating 711; a limiting block 8; a discharge drive assembly 9; a discharge plate 91; a discharging electric telescopic rod 92; a controller 10.

Detailed Description

As shown in fig. 1, fig. 2 and fig. 3, an integrated circuit chip packaging device comprises an upper mounting seat 1 and a lower mounting seat 2 which are arranged vertically and opposite to each other, a plurality of connecting columns 21 used for connecting the upper mounting seat 1 and the lower mounting seat 2, a sliding plate 3 which is connected to the connecting columns 21 in an up-down sliding manner, a lifting driving component 4 used for driving the sliding plate 3 to ascend or descend along the connecting columns 21, a polishing component 5 and a dedusting component 6 which are arranged on the sliding plate 3, and a fixing plate 7 which is fixed on the connecting columns 21, wherein the sliding plate 3 and the fixing plate 7 are arranged vertically and opposite to each other, a plurality of limiting through holes 71 are vertically formed in the fixing plate 7, and a limiting block 8 and a discharging driving component 9 used for driving the limiting block 8 to ascend or descend along the limiting through holes 71 are connected in a sliding manner in the limiting through holes 71.

When the chip is used, the chip is placed on the limiting block 8 in the limiting through hole 71, the lifting driving assembly 4 drives the sliding plate 3 to descend along the connecting column 21, the chip is polished and thinned through the polishing assembly 5, dust generated in the polishing and thinning process is pumped away through the dust removing assembly 6, and after polishing and thinning are finished, the chip is driven to ascend by driving the limiting block 8 through the discharging driving assembly 9, so that the polished and thinned chip can be taken out; the utility model can prevent polishing dust from influencing the thinning of the chip, can also prevent the deflection of the hydraulic rod in the telescopic process, and improves the whole packaging quality of the chip.

As shown in fig. 1, 2 and 3, the lifting driving assembly 4 is a lifting driving cylinder fixed in the upper mounting seat 1, and a rod head of the lifting driving cylinder vertically extends downwards to be in driving connection with the sliding plate 3; in the embodiment, the piston rod head of the lifting driving cylinder stretches out and draws back, the driving sliding plate 3 ascends or descends along the connecting column 21, the deviation of the hydraulic rod in the stretching process is prevented, and the whole packaging quality of the chip is improved.

As shown in fig. 1, 2 and 3, the polishing assembly 5 comprises a polishing motor 51 fixed in the sliding plate 3, and a polishing disc 52 is connected to an output shaft of the polishing motor 51 in a vertically downward extending driving manner; in this embodiment, after the lifting driving assembly 4 drives the sliding plate 3 to slide downwards, the polishing motor 51 drives the polishing disc 52 to rotate, so as to polish and thin the chip.

As shown in fig. 1, 2 and 3, the dust removing assembly 6 includes a plurality of dust removing branch pipes 61 disposed around the polishing motor 51, a funnel-shaped dust removing and sucking head 62 is connected to the bottom end of the dust removing branch pipe 61 extending below the slide plate 3, the top ends of the plurality of dust removing branch pipes 61 are all communicated with an annular connecting pipe 63, an air outlet end of the annular connecting pipe 63 is connected with a negative pressure main pipe 64, one end of the negative pressure main pipe 64 away from the annular connecting pipe 63 is connected with a vacuum cleaner, and a large mouth end of the funnel-shaped dust removing and sucking head 62 is disposed downwards; in this embodiment, the vacuum cleaner pumps away dust generated in the polishing and thinning process through the negative pressure main pipe 64, the annular connecting pipe 63, the dust removing branch pipe 61 and the funnel-shaped dust removing and sucking head 62, so as to prevent polishing dust from affecting the thinning of the chip.

As shown in fig. 1, 2 and 3, the discharging driving assembly 9 includes a discharging plate 91 slidably connected to the connecting post 21, a discharging electric telescopic rod 92 fixed in the lower mounting seat 2, the discharging plate 91 is disposed directly below the fixing plate 7, and the bottom end of the limiting block 8 penetrates through the limiting through hole 71 and is connected to the discharging plate 91; in this embodiment, after polishing and thinning are completed, the discharging plate 91 is driven to rise along the connecting post 21 by the discharging electric telescopic rod 92, so that the chip in the limiting through hole 71 can be pushed out.

As shown in fig. 1, 2 and 3, an anti-slip coating 711 is disposed in the limiting through hole 71, and the anti-slip coating 711 is disposed near the top end of the limiting through hole 71; in this embodiment, the anti-slip coating 711 can effectively prevent the chip from slipping during the polishing and thinning process.

As shown in fig. 1, 2 and 3, a controller 10 is disposed on one side of the lower mounting seat 2, and the lifting driving assembly 4, the polishing assembly 5, the dust removing assembly 6 and the discharging driving assembly 9 are all electrically connected with the controller 10; in this embodiment, through the controllable lift drive assembly 4 of controller, the subassembly 5 of polishing, dust removal subassembly 6 and ejection of compact drive assembly 9, degree of automation is higher.

The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the scope of the utility model as defined in the accompanying claims.

Claims (7)

1. An integrated circuit chip packaging apparatus, characterized in that: including last mount pad (1) and lower mount pad (2) that just set up from top to bottom, be used for connecting many spliced poles (21) that go up mount pad (1) and lower mount pad (2) adopted, upper and lower sliding connection is in slide (3) on spliced pole (21) are used for the drive slide (3) are along lifting drive subassembly (4) that spliced pole (21) rise or descend adoption, install polishing subassembly (5) and dust removal subassembly (6) on slide (3), and fix fixed plate (7) on spliced pole (21), slide (3) and fixed plate (7) are just set up from top to bottom, a plurality of spacing through-holes (71) have been vertically seted up on fixed plate (7), sliding connection has stopper (8) and are used for the drive in spacing through-hole (71) are followed ejection of compact drive subassembly (9) that rise or descend adoption.

2. An integrated circuit chip package apparatus according to claim 1, wherein: the lifting driving assembly (4) is a lifting driving cylinder fixed in the upper mounting seat (1), and a piston rod head of the lifting driving cylinder vertically extends downwards to be in driving connection with the sliding plate (3).

3. An integrated circuit chip package apparatus according to claim 1, wherein: the polishing assembly (5) comprises a polishing motor (51) fixed in the sliding plate (3), and a polishing disc (52) is connected with an output shaft of the polishing motor (51) in a vertically downward extending driving mode.

4. An integrated circuit chip package apparatus according to claim 3, wherein: the dust removal assembly (6) comprises a plurality of dust removal branch pipes (61) which are arranged around the polishing motor (51), the bottom ends of the dust removal branch pipes (61) extend to the lower side of the sliding plate (3) and are connected with funnel-shaped dust removal dust collection heads (62), the top ends of the dust removal branch pipes (61) are communicated with annular connecting pipes (63), the air outlet ends of the annular connecting pipes (63) are connected with negative pressure main pipes (64), one ends, far away from the annular connecting pipes (63), of the negative pressure main pipes (64) are connected with vacuum cleaners, and the large mouth ends of the funnel-shaped dust removal dust collection heads (62) are downwards arranged.

5. An integrated circuit chip package apparatus according to claim 1, wherein: the discharging driving assembly (9) comprises a discharging plate (91) which is connected to the connecting column (21) in a sliding mode, a discharging electric telescopic rod (92) which is fixed in the lower mounting seat (2) is arranged below the fixing plate (7), and the bottom end of the limiting block (8) penetrates out of the limiting through hole (71) and is connected with the discharging plate (91).

6. An integrated circuit chip package apparatus according to claim 1, wherein: an anti-slip coating (711) is arranged in the limiting through hole (71), and the anti-slip coating (711) is arranged close to the top end of the limiting through hole (71).

7. An integrated circuit chip package apparatus according to claim 1, wherein: one side of the lower mounting seat (2) is provided with a controller (10), and the lifting driving assembly (4), the polishing assembly (5), the dust removing assembly (6) and the discharging driving assembly (9) are electrically connected with the controller (10).

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