CN218918874U - Circuit substrate and packaging structure - Google Patents
Circuit substrate and packaging structure Download PDFInfo
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- CN218918874U CN218918874U CN202223148260.2U CN202223148260U CN218918874U CN 218918874 U CN218918874 U CN 218918874U CN 202223148260 U CN202223148260 U CN 202223148260U CN 218918874 U CN218918874 U CN 218918874U
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Abstract
The utility model provides a circuit substrate and a packaging structure. The insulating protection layer is arranged on the substrate. The electrical connection structure comprises an opening and a conductive post. The open pore is formed in the insulating protection layer, and the open pore is provided with a narrow caliber section and a wide caliber section which are connected. The narrow caliber section is between the base plate and the wide caliber section. The conductive posts include associated heads and feet. The width of the head is larger than the width of the foot, and the foot fills the narrow aperture section of the opening. The wall surface of the wide caliber section of the open hole is separated from the conductive column by a preset distance to form a solder accommodating area.
Description
Technical Field
The present utility model relates to a circuit substrate and a packaging structure, and more particularly to a circuit substrate and a packaging structure with improved reliability.
Background
With the evolution of semiconductor packaging technology, different packaging types of semiconductor devices have been developed, such as Wire bonding (wirebond), flip chip (flip chip), or hybrid (hybrid), and the like.
Currently, in a flip-chip package structure, conductive pillars are formed on a substrate, and the conductive pillars are bonded to electrical connection points (e.g., metal pads) of a bare chip by solder. However, as the distribution density of the wafer in the package structure increases, the size of the conductive pillars is smaller, and the interval between two adjacent conductive pillars is shorter, so that the reliability of the existing package structure is problematic. Further, since the interval between adjacent conductive posts becomes shorter, there is a possibility that adjacent solders (e.g., solder balls) are easily connected together due to excessive solder or misalignment, forming a solder bridge (solder bridge), thereby causing a problem of short circuit of the device. Existing solutions mainly utilize solder resist, but the increased thickness due to the formation of the solder resist is detrimental to improving the wafer distribution density. Further, the contact area between the small-sized conductive post and the solder is insufficient to cause a concern about the bonding strength.
Disclosure of Invention
In view of the above, the present utility model provides a circuit substrate and a packaging structure, which are helpful for solving the problems of short circuit and insufficient bonding strength between soldering materials.
The circuit substrate disclosed by the utility model comprises a substrate, an insulating protection layer and at least one electric connection structure. The insulating protection layer is arranged on the substrate. The electrical connection structure comprises an opening and a conductive post. The open pore is formed in the insulating protection layer, and the open pore is provided with a narrow caliber section and a wide caliber section which are connected. The narrow caliber section is between the base plate and the wide caliber section. The conductive posts include associated heads and feet. The width of the head is larger than the width of the foot, and the foot fills the narrow aperture section of the opening. The wall surface of the wide caliber section of the open hole is separated from the conductive column by a preset distance to form a solder accommodating area.
In the circuit substrate, the head portion may be located in the wide-caliber section. The hole wall surface of the wide caliber section can be separated from the head by a preset interval to form a solder accommodating area.
In the circuit substrate, the opening of the wide-caliber section may be located on the upper surface of the insulating protection layer away from the substrate. The top surface of the head portion remote from the foot portion may be aligned with the opening of the wide bore section.
In the circuit substrate, at least a portion of the head portion may be located outside the opening. A portion of the foot may be located within the wide bore section. The hole wall surface of the wide caliber section can be separated from the foot part positioned in the wide caliber section by a preset interval to form a solder accommodating area.
In the circuit substrate, the opening of the wide-caliber section may be located on the upper surface of the insulating protection layer away from the substrate. The head portion may protrude from the opening of the wide bore section out of the aperture.
In the circuit substrate, the head and part of the foot can be located in the wide caliber section. The hole wall surface of the wide caliber section can be separated from the head and the foot part positioned in the wide caliber section by a preset interval to form a solder accommodating area.
In the circuit substrate, the opening of the wide-caliber section may be located on the upper surface of the insulating protection layer away from the substrate. The top surface of the head portion remote from the foot portion may be aligned with the opening of the wide bore section.
In the circuit substrate, the conductive posts may include copper or titanium copper between the head and the foot.
In the circuit substrate, the number of conductive posts in the opening may be single.
In the circuit substrate, the conductive posts can be completely accommodated in the openings.
The package structure disclosed by the utility model comprises a circuit substrate, a chip and solder. The circuit substrate comprises a substrate, an insulating protection layer and at least one electric connection structure. The insulating protection layer is arranged on the substrate. The electrical connection structure comprises an opening and a conductive post. The open pore is formed in the insulating protection layer, and the open pore is provided with a narrow caliber section and a wide caliber section which are connected. The narrow caliber section is between the base plate and the wide caliber section. The conductive column is arranged in the open hole and fills up the narrow aperture section of the open hole. The wall surface of the wide caliber section of the open hole is separated from the conductive column by a preset distance to form a solder accommodating area. The wafer has an electrical connection facing the circuit substrate. The solder electrically connects the conductive post with the electrical connection portion, and a portion of the solder is located in the solder accommodating region.
In the foregoing package structure, the width of the electrical connection portion may be greater than the width of the conductive pillar.
In the foregoing package structure, the number of the electrical connection structures may be plural. The openings of the electric connection structures can be formed on the insulating protection layer in a spacing way.
In the foregoing package structure, the length of the conductive pillar of the electrical connection structure located in the central region of the substrate may be smaller than the length of the conductive pillar of the electrical connection structure located in the edge region of the substrate.
According to the circuit substrate and the packaging structure disclosed by the utility model, the circuit substrate comprises the opening formed in the insulating protection layer and the conductive column accommodated in the opening. The open hole is provided with a wide caliber section which is separated from the conductive column by a preset distance, and a solder accommodating area is formed between the conductive column and the hole wall surface of the wide caliber section. The solder receiving area allows liquid or paste solder to flow into the inside of the wide caliber section, while helping to prevent the solder from flowing along the upper surface of the insulating protective layer to form a tin bridge with the solder provided to the adjacent other conductive post. Thereby, the problem of short circuit due to the excessive solder supply can be avoided.
In addition, the conductive posts may include a wider head portion and a narrower foot portion. Besides contacting the top surface of the head of the conductive post, the solder flowing into the wide caliber section can contact the side surface of the head, the bottom surface of the head or the side surface of the foot, so that the contact area of the solder and the conductive post is greatly increased, more interface metal coform (Intermetallic compound, IMC) can be generated, and the bonding strength is further improved.
The foregoing description of the utility model and the following description of embodiments are provided to illustrate and explain the principles of the utility model and to provide further explanation of the utility model as claimed.
Drawings
Fig. 1 is a schematic view of a circuit substrate according to an embodiment of the utility model.
Fig. 2 is an enlarged partial schematic view of the circuit substrate of fig. 1.
Fig. 3 is a schematic diagram of a package structure including the circuit substrate of fig. 1.
Fig. 4 is a schematic view of a package structure including a circuit substrate according to another embodiment of the utility model.
Fig. 5 is a schematic view of a package structure including a circuit substrate according to another embodiment of the utility model.
Fig. 6 is a schematic diagram of a package structure according to an embodiment of the utility model.
Fig. 7 is an enlarged partial schematic view of the package structure of fig. 6.
Detailed Description
Referring to fig. 1 and 2, fig. 1 is a schematic diagram of a circuit substrate according to an embodiment of the utility model, and fig. 2 is a partial enlarged schematic diagram of the circuit substrate of fig. 1. In the present embodiment, the circuit substrate 1 includes a substrate 10, an insulating protection layer 20, and an electrical connection structure 30.
The substrate 10 may be a plate made of bakelite, fiberglass, or epoxy. An insulating protection layer 20 and a circuit layer (not shown) may be formed on a surface of the substrate 10 (e.g., an upper surface of the substrate 10 in fig. 1). The insulating protection layer 20 may be a dielectric material layer disposed on the surface of the substrate 10 to cover the circuit layer.
The electrical connection structure 30 includes an opening 310 and a conductive post 320. The opening 310 is formed in the insulating protection layer 20, and the opening 310 has a narrow caliber section 311 and a wide caliber section 312 connected. The narrow bore section 311 is interposed between the substrate 10 and the wide bore section 312.
The circuit substrate 1 of the present embodiment may include a plurality of electrical connection structures 30, but the number of electrical connection structures 30 is not limited to a plurality of electrical connection structures. In addition, the electrical connection structures 30 may be arranged at a fixed pitch to form the electrical connection structures 30 arranged in an array, but the electrical connection structures 30 of the present utility model are not limited to the array. In addition, the number of conductive posts 320 located within the aperture 310 may be only a single.
The conductive post 320 includes a head 321 and a foot 322 connected thereto. The width of the head 321 is greater than the width of the foot 322. The foot 322 fills the narrow aperture section 311 of the aperture 310. The hole wall 3121 of the wide-caliber section 312 of the opening 310 is spaced apart from the conductive pillar 320 by a predetermined distance D to form a solder receiving area 330. The conductive post 320 is fully received within the opening 310. Specifically, the opening 3122 of the wide caliber section 312 is located on a surface of the insulating protection layer 20 away from the substrate 10 (such as an upper surface of the insulating protection layer 20 in fig. 2), and the top surface 3211 of the head 321 away from the foot 322 is aligned with the opening 3122 of the wide caliber section 312, that is, the head 321 is integrally accommodated in the wide caliber section 312. The hole wall 3121 of the wide-caliber section 312 is spaced apart from the head 321 by a predetermined distance D to form a solder receiving area 330.
Specifically, in addition to the structure in which the head 321 is entirely accommodated in the wide-caliber section 312, the head 321 and the metal layer 323 of the conductive post 320a may completely protrude from the opening 310 (as shown in fig. 4), or a part of the head or the metal layer of the conductive post may protrude from the opening, and another part thereof may be located in the opening.
In the present embodiment, the conductive post 320 may further include a metal layer 323 between the head 321 and the foot 322. Specifically, the head 321 and the foot 322 may be copper layers, and the metal layer 323 may be copper or titanium copper, but the presence of the metal layer 323 is not intended to limit the present utility model. The conductive pillars in other embodiments may not include the metal layer.
The electrical connection structure 30 in the present embodiment can be manufactured by the following method. First, the foot portion 322 of the conductive pillar 320 is formed on the substrate 10. Next, an insulating protection layer 20 is formed on the substrate 10 to cover the leg portion 322. Next, a portion of the insulating protection layer 20 is removed to form a wide caliber section 312 of the opening 310. Then, a metal layer 323 and a head 321 are formed on the leg 322.
Fig. 3 is a schematic diagram of a package structure including the circuit substrate of fig. 1. In the present embodiment, the package structure 2 may be a flip-chip package structure, which includes the circuit substrate 1, the die 40 and the solder 50 in fig. 1. The wafer 40 may be a bare wafer including a semiconductor layer 410 and electrical connections 420. The electrical connection part 420 may be an ohmic contact region formed on a surface of the semiconductor layer 410 (e.g., a lower surface of the semiconductor layer 410 in fig. 3), and the electrical connection part 420 faces the electrical connection structure 30 of the wiring substrate 1. The solder 50 may be solder paste, which electrically connects the conductive post 320 with the electrical connection 420, and a portion of the solder 50 is located in the solder receiving region 330. Specifically, a liquid or paste solder 50 is provided on the top surface 3211 of the head 321 of the conductive post 320, and then the electrical connection 420 of the wafer 40 is brought into contact with the solder 50, so that the wafer 40 is bonded with the conductive post 320 by the solder 50.
The solder receiving area 330 formed between the conductive post 320 and the opening 310 allows the liquid or paste solder 50 to flow inside the wide caliber section 312 of the opening 310 while helping to prevent the solder 50 from flowing along the upper surface of the insulating protective layer 20 to form a tin bridge with the solder 50 provided to the adjacent other conductive post 320. In addition, the solder 50 contacts the top surface 3211 of the head 321 of the conductive post 320, and the solder 50 flowing into the wide-diameter section 312 contacts the side surface of the head 321, so that the contact area between the solder 50 and the conductive post 320 can be greatly increased, and more interface metal coextrudate can be generated, thereby contributing to an increase in bonding strength.
Fig. 4 is a schematic view of a package structure including a circuit substrate according to another embodiment of the utility model. The main difference between the present embodiment and the embodiment of fig. 3 is the electrical connection structure 30a of the circuit substrate 1a of the package structure 2 a. The electrical connection structure 30a includes an opening 310 and a conductive post 320a.
At least a portion of the head 321 of the conductive post 320a is located outside the aperture 310. A portion of the leg portion 322 of the conductive post 320a is located in the wide-caliber section 312, and the hole wall 3121 of the wide-caliber section 312 is spaced apart from the portion of the leg portion 322 located in the wide-caliber section 312 by a predetermined distance D to form the solder receiving area 330. The head 321 and the metal layer 323 of the conductive post 320a protrude completely from the opening 310. The solder 50 electrically connects the conductive post 320a with the electrical connection 420 of the die 40, and a portion of the solder 50 is located in the solder receiving region 330. Specifically, a liquid or paste solder 50 is provided on the top surface 3211 of the head 321 of the conductive post 320a, and then the electrical connection 420 of the wafer 40 is brought into contact with the solder 50, so that the wafer 40 is bonded with the conductive post 320a by the solder 50. The solder receiving area 330 formed between the conductive post 320a and the aperture 310 allows the liquid or paste solder 50 to flow into the wide bore section 312 of the aperture 310. In addition, the solder 50 flowing into the wide-caliber section 312 can be in contact with the side surface of the foot 322, so that the contact area between the solder 50 and the conductive post 320a is greatly increased, more interface metal coextrudate can be generated, and the bonding strength is further improved.
Fig. 5 is a schematic view of a package structure including a circuit substrate according to another embodiment of the utility model. The main difference between the present embodiment and the embodiment of fig. 3 is the electrical connection structure 30b of the circuit substrate 1b of the package structure 2 b. The electrical connection structure 30b includes an opening 310 and a conductive post 320b.
The head 321 of the conductive post 320b is integrally received with the metal layer 323 within the wide bore section 312. The head 321 and a portion of the leg 322 of the conductive post 320b are located in the wide-caliber section 312, and the hole wall 3121 of the wide-caliber section 312 is separated from the head 321 and the portion of the leg 322 located in the wide-caliber section 312 by a predetermined distance to form a solder receiving area 330. The preset distance in this embodiment is not a single value, and includes at least a first preset distance D1 between the hole wall 3121 and the head 321, and a second preset distance D2 between the hole wall 3121 and the foot 322, wherein the second preset distance D2 is greater than the first preset distance D1.
The solder 50 electrically connects the conductive post 320b with the electrical connection 420 of the die 40, and a portion of the solder 50 is located in the solder receiving region 330. Specifically, a liquid or paste solder 50 is provided on the top surface 3211 of the head 321 of the conductive post 320b, and then the electrical connection 420 of the wafer 40 is brought into contact with the solder 50, so that the wafer 40 is bonded with the conductive post 320b by the solder 50. The solder receiving area 330 formed between the conductive post 320b and the aperture 310 allows the liquid or paste solder 50 to flow into the wide bore section 312 of the aperture 310. In addition, the solder 50 flowing into the wide-caliber section 312 can also contact the side surface of the head 321 and the side surface of the foot 322, so that the contact area between the solder 50 and the conductive post 320b can be greatly increased, more interface metal coexists can be generated, and the bonding strength can be further improved.
Referring to fig. 6 and 7, fig. 6 is a schematic diagram of a package structure according to an embodiment of the utility model, and fig. 7 is a partially enlarged schematic diagram of the package structure of fig. 6. In the present embodiment, the package structure 3 may be a flip-chip package structure, which includes a circuit substrate 1c, a die 40 and a solder 50. The main difference between the present embodiment and the embodiment of fig. 3 is the electrical connection structure 30c of the circuit substrate 1 c. The electrical connection structure 30c includes an opening 310 and a conductive post 320c.
The conductive post 320c may be a metal post having a single diameter. A portion of the conductive post 320c fills the narrow bore section 311 of the aperture 310 and the remainder of the conductive post 320c is received within the wide bore section 312. The hole wall 3121 of the wide-caliber section 312 is spaced apart from the conductive pillar 320c by a predetermined distance D to form a solder receiving area 330.
The wafer 40 may be a bare wafer including a semiconductor layer 410 and electrical connections 420. The electrical connection 420 may be a metal pad formed on a surface of the semiconductor layer 410 (e.g., a lower surface of the semiconductor layer 410 in fig. 6), and the electrical connection 420 faces the electrical connection structure 30c. The width of the electrical connection 420 may be greater than the width of the conductive post 320c. The solder 50 electrically connects the conductive post 320c with the electrical connection 420, and a portion of the solder 50 is located in the solder receiving area 330. Specifically, a liquid or paste solder 50 is provided on the top surface 3211 of the conductive post 320c, and then the electrical connection 420 of the wafer 40 is brought into contact with the solder 50, so that the wafer 40 is bonded to the conductive post 320c by the solder 50. The solder receiving area 330 formed between the conductive post 320c and the aperture 310 allows the liquid or paste solder 50 to flow into the wide bore section 312 of the aperture 310. In addition, the solder 50 can also contact the side surface of the conductive post 320c, so that the contact area between the solder 50 and the conductive post 320c can be greatly increased, more interface metal coextrudate can be generated, and the bonding strength can be further improved.
In the present embodiment, the wiring substrate 1c includes a plurality of electrical connection structures 30c. The openings 310 of the electrical connection structures 30c are formed in the insulating protection layer 20 in a spaced-apart arrangement, and only a single conductive post 320c may be received in each of the openings 310. For adjacent two of the electrical connection structures 30c, the conductive posts 320c are different in length, and the conductive posts 320c protrude through the openings 310 by different lengths. Specifically, as shown in fig. 6, the conductive pillar 320c of the electrical connection structure 30c located in the central area of the substrate 10 has the shortest length L1, and the conductive pillar 320c is completely contained in the opening 310 without protruding out of the opening 310. The conductive pillar 320c of the electrical connection structure 30c between the center region and the edge region of the substrate 10 has a length L2 that is the next shortest, and a portion of the conductive pillar 320c protrudes out of the opening 310 to have a length s1. The conductive pillar 320c located at the edge region of the substrate 10 has a longest length L3, and a portion of the conductive pillar 320c protrudes out of the opening 310 to have a length s2, wherein the length s2 is greater than the length s1.
In the package structure 3, the bonding yield between the die 40 and the conductive pillars 320c may be reduced due to warpage of the circuit substrate 1 c. Thus, in actual processing, a larger amount of solder 50 is provided to the electrical connection structure 30c near the center region. In this embodiment, the conductive pillars 320c of the electrical connection structure 30c near the center region are shorter than the conductive pillars 320c of the electrical connection structure 30c near the edge region, thereby helping to avoid the risk of tin bridge formation due to the provision of excess solder 50 to the electrical connection structure 30c near the center region.
In summary, according to the circuit substrate and the package structure disclosed by the utility model, the circuit substrate comprises the opening formed in the insulating protection layer and the conductive post accommodated in the opening. The open hole is provided with a wide caliber section which is separated from the conductive column by a preset distance, and a solder accommodating area is formed between the conductive column and the hole wall surface of the wide caliber section. The solder receiving area allows liquid or paste solder to flow into the inside of the wide caliber section, while helping to prevent the solder from flowing along the upper surface of the insulating protective layer to form a tin bridge with the solder provided to the adjacent other conductive post. Thereby, the problem of short circuit due to the excessive solder supply can be avoided.
In addition, the conductive posts may include a wider head portion and a narrower foot portion. Besides contacting with the top surface of the head part of the conductive column, the solder flowing into the wide caliber section can contact with the side surface of the head part, the bottom surface of the head part or the side surface of the foot part, so that the contact area of the solder and the conductive column is greatly increased, more interface metal coform can be generated, and the bonding strength is further improved.
[ symbolic description ]
1. 1a, 1b, 1c circuit board
2. 2a, 2b, 3: packaging structure
10 substrate
20 insulating protective layer
30. 30a, 30b, 30c, electrical connection structure
310, open pore
311, narrow aperture section:
312, wide caliber section:
3121 pore wall surface
3122 opening
320. 320a, 320b, 320c: conductive posts
321 head portion
3211 top surface
322 foot portion
323 metal layer
330 solder receiving area
40 wafer
410 semiconductor layer
420 electrical connection
50 solder
D, preset interval
D1 first preset distance
D2, a second preset interval
W is width
L1, L2, L3 length
s1 and s2, and the length.
Claims (14)
1. A circuit substrate, comprising:
a substrate;
an insulating protective layer disposed on the substrate; and
at least one electrical connection structure comprising:
the opening is formed in the insulating protective layer and is provided with a narrow-caliber section and a wide-caliber section which are connected, and the narrow-caliber section is arranged between the substrate and the wide-caliber section; and
the conductive column comprises a head part and a foot part which are connected, the width of the head part is larger than that of the foot part, and the foot part fills the narrow-caliber section of the opening;
the hole wall surface of the wide caliber section of the open hole is separated from the conductive column by a preset distance to form a solder accommodating area.
2. The circuit board of claim 1, wherein the head is located in the wide-caliber section, and the hole wall surface of the wide-caliber section is spaced from the head by the predetermined distance to form the solder accommodating region.
3. The circuit board of claim 2, wherein the opening of the wide-caliber section is located on the upper surface of the insulating protection layer away from the substrate, and the top surface of the head portion away from the foot portion is aligned with the opening of the wide-caliber section.
4. The circuit board of claim 1, wherein at least a portion of the head is located outside the opening, a portion of the foot is located in the wide-caliber section, and the hole wall of the wide-caliber section is spaced from the foot in the wide-caliber section by the predetermined distance to form the solder receiving area.
5. The circuit board of claim 4, wherein the opening of the wide-caliber section is located on the upper surface of the insulating protection layer away from the substrate, and the head protrudes from the opening of the wide-caliber section.
6. The circuit board of claim 1, wherein the head and a portion of the foot are located in the wide-caliber section, and the hole wall of the wide-caliber section is spaced from the head and the foot in the wide-caliber section by the predetermined distance to form the solder receiving area.
7. The circuit board of claim 6, wherein the opening of the wide-caliber section is located on the upper surface of the insulating protection layer away from the substrate, and the top surface of the head portion away from the foot portion is aligned with the opening of the wide-caliber section.
8. The circuit substrate of claim 1, wherein the conductive posts comprise copper or titanium copper between the header and the footer.
9. The circuit substrate of claim 1, wherein the number of conductive posts within the opening is a single.
10. The circuit substrate of claim 1, wherein the conductive posts are fully received in the openings.
11. A package structure, comprising:
a circuit substrate, comprising:
a substrate;
an insulating protective layer disposed on the substrate; and
at least one electric connection structure, including open pore and conductive column, the open pore is formed in the insulating protective layer, the open pore has connected narrow aperture section and wide aperture section, and the narrow aperture section is between the base plate and the wide aperture section, the conductive column is set up in the open pore and fills up the narrow aperture section of the open pore, the hole wall surface of the wide aperture section of the open pore is separated from the conductive column by the preset interval to form the solder accommodation area;
a wafer having an electrical connection portion facing the wiring substrate; and
and the solder is used for electrically connecting the conductive column with the electric connection part, and a part of the solder is positioned in the solder accommodating area.
12. The package structure of claim 11, wherein the electrical connection portion has a width greater than a width of the conductive post.
13. The package structure of claim 11, wherein the at least one electrical connection structure is plural in number, and the openings of the electrical connection structures are formed in the insulating protection layer in a spaced-apart arrangement.
14. The package structure of claim 13, wherein the conductive pillars of the electrical connection structure in the central region of the substrate have a length less than the conductive pillars of the electrical connection structure in the edge region of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223148260.2U CN218918874U (en) | 2022-11-25 | 2022-11-25 | Circuit substrate and packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223148260.2U CN218918874U (en) | 2022-11-25 | 2022-11-25 | Circuit substrate and packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218918874U true CN218918874U (en) | 2023-04-25 |
Family
ID=86045076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223148260.2U Active CN218918874U (en) | 2022-11-25 | 2022-11-25 | Circuit substrate and packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218918874U (en) |
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2022
- 2022-11-25 CN CN202223148260.2U patent/CN218918874U/en active Active
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