CN218918820U - Wafer position adjusting mechanism - Google Patents
Wafer position adjusting mechanism Download PDFInfo
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- CN218918820U CN218918820U CN202223321995.0U CN202223321995U CN218918820U CN 218918820 U CN218918820 U CN 218918820U CN 202223321995 U CN202223321995 U CN 202223321995U CN 218918820 U CN218918820 U CN 218918820U
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a wafer position adjusting mechanism, which comprises: the y-direction moving mechanism is arranged on the platform; the X-direction moving mechanism is arranged on the y-direction moving mechanism and drives the X-direction moving mechanism to move along the y direction; the wafer is driven to rotate in the circumferential direction by the circumferential rotating mechanism. The wafer position adjusting mechanism is compact in structure, and is suitable for being integrated in a die bonder and other equipment to realize an automatic function.
Description
Technical Field
The utility model belongs to the technical field of wafer conveying, and particularly relates to a wafer position adjusting mechanism.
Background
The wafer is composed of a plurality of cut chips, the chips are generally square, the chips are required to be aligned with the lead frames in the lead frame mounting process, and patent CN112873090A discloses chip position correction equipment for a camera GPU, which is characterized by comprising a lifting table, a first push-pull mechanism, a second push-pull mechanism and a clamping mechanism, wherein the clamping mechanism is used for clamping the chips, the first push-pull mechanism comprises a first motor, a first bracket and a first telescopic member, the first bracket is fixed on the lifting table, the first motor is arranged on the first bracket, and the first telescopic member is movably connected between an output shaft of the first motor and the clamping mechanism; the second push-pull mechanism comprises a second motor, a second support and a second telescopic member, the second support is fixed on the lifting platform, the second motor is mounted on the second support, the second telescopic member is movably connected between an output shaft of the second motor and the clamping mechanism, and when the first motor and/or the second motor are/is started, the first telescopic member and/or the second telescopic member can be driven to move so as to drive the clamping mechanism to move, so that the chip is clamped and loosened. The embodiment of the application can correct the chip position. The technical scheme is complex in structure, and can only adjust the position and angle after the chip is grabbed, so that the position and angle of the chip cannot be adjusted in advance.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art.
Therefore, the utility model provides a wafer position adjusting mechanism which has the advantages of moving a wafer and completing wafer corner adjustment before chip mounting.
According to an embodiment of the utility model, a wafer position adjustment mechanism includes: the y-direction moving mechanism is arranged on the platform; the X-direction moving mechanism is arranged on the Y-direction moving mechanism and drives the X-direction moving mechanism to move along the Y direction; the wafer rotating device comprises a circumferential rotating mechanism, wherein the circumferential rotating mechanism is arranged on the x-direction moving mechanism, the x-direction moving mechanism drives the circumferential rotating mechanism to move along the x-direction, a wafer is arranged on the circumferential rotating mechanism, and the circumferential rotating mechanism drives the wafer to rotate in the circumferential direction.
The utility model has the advantages that the structure is simple, the wafer is driven to move on the xy plane by the y-direction moving mechanism and the x-direction moving mechanism, the wafer is driven to rotate by the circumferential rotating mechanism, the position and the square shape of the wafer are adjusted before the chip is attached to the lead frame, the subsequent attaching precision and attaching efficiency are improved, and meanwhile, the wafer position adjusting mechanism is compact in structure, and is suitable for being integrated in equipment such as a die bonder and the like to realize an automatic function.
According to one embodiment of the present utility model, the y-direction moving mechanism includes: the y-direction linear guide rail is arranged on the platform; the y-direction moving plate is positioned above the platform and is connected with the platform in a sliding manner through the y-direction linear guide rail; and the y-direction linear motor is arranged on the platform, and the output end of the y-direction linear motor is connected with the y-direction moving plate.
According to one embodiment of the utility model, two y-direction photoelectric switches and two y-direction limiting blocks are arranged on the platform, the two y-direction photoelectric switches are oppositely arranged along the y direction, the y-direction photoelectric switches are triggered when the y-direction moving plate moves along the y direction, the two y-direction limiting blocks are oppositely arranged along the y direction, and the y-direction limiting blocks are used for limiting the y-direction moving plate along the y direction.
According to one embodiment of the utility model, the lower surface of the y-direction moving plate is also provided with a magnetic grating ruler arranged along the y-direction, and the platform is provided with a reading head matched with the magnetic grating ruler.
According to one embodiment of the present utility model, the x-direction moving mechanism includes: the x-direction linear guide rail is arranged on the y-direction moving plate; the X-direction moving plate is positioned above the y-direction moving plate, and the X-direction moving plate and the y-direction moving plate are connected in a sliding manner through the X-direction linear guide rail; the X-direction linear motor is arranged on the Y-direction moving plate, and the output end of the X-direction linear motor is connected with the X-direction moving plate.
According to one embodiment of the utility model, two x-direction photoelectric switches and two x-direction limiting blocks are arranged on the y-direction moving plate, the two x-direction photoelectric switches are oppositely arranged, the x-direction photoelectric switches are triggered when the x-direction moving plate moves along the x-direction, the two x-direction limiting blocks are oppositely arranged, and the x-direction limiting blocks are used for limiting the x-direction moving plate in the x-direction.
According to one embodiment of the present utility model, the circumferential rotation mechanism includes: the rollers are uniformly arranged on the x-direction moving plate along the circumferential direction; the driving ring is arranged on the outer sides of the plurality of rollers and is in rolling connection with the rollers; the synchronous belt is in transmission connection with the driving ring; the motor is arranged on the x-direction moving plate, and the output end of the motor is in transmission connection with the synchronous belt; the encoder is arranged on the x-direction moving plate and is in transmission connection with the synchronous belt.
According to one embodiment of the utility model, the inner peripheral surface of the driving ring is provided with an annular groove matched with the roller, and the outer peripheral surface of the driving ring is provided with teeth matched with the synchronous belt.
According to one embodiment of the utility model, a tensioning adjusting block is slidably arranged on the x-direction moving plate, a tensioning bearing is arranged on the tensioning adjusting block, the tensioning bearing is in rolling connection with the synchronous belt, and the tensioning bearing is close to or far away from the synchronous belt by moving the tensioning adjusting block so as to change the tensioning degree of the synchronous belt; the X-direction moving plate is further provided with a circumferential photoelectric switch, the driving ring can trigger the circumferential photoelectric switch when rotating, and the circumferential photoelectric switch is positioned at the zero position of the driving ring.
According to one embodiment of the utility model, the feeding rod is arranged on the x-direction moving plate and is positioned on one side of the circumferential rotating mechanism, feeding photoelectricity is arranged in the middle of the feeding rod, feeding guide blocks are arranged at two ends of the feeding rod, and the feeding guide blocks are used for guiding wafers in the conveying process.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
In order to make the above objects, features and advantages of the present utility model more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
The foregoing and/or additional aspects and advantages of the present utility model will become apparent and may be readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the y-direction moving mechanism;
FIG. 3 is a schematic view of the structure of the x-direction moving mechanism;
FIG. 4 is a schematic structural view of the circumferential rotation mechanism;
FIG. 5 is a schematic view of the structure of the roller;
FIG. 6 is a schematic cross-sectional structural view of the drive ring;
FIG. 7 is a partial schematic structural view of the drive ring;
reference numerals:
the platform 40, the y-direction moving mechanism 44, the x-direction moving mechanism 45, the circumferential rotating mechanism 46, the y-direction linear guide 441, the y-direction linear motor 442, the y-direction moving plate 443, the y-direction photoelectric switch 444, the y-direction limiting block 445, the x-direction linear guide 451, the x-direction linear motor 452, the x-direction moving plate 453, the x-direction photoelectric switch 454, the x-direction limiting block 455, the roller 461, the driving ring 462, the timing belt 463, the motor 464, the encoder 465, the tension bearing 466, the tension adjusting block 467, the circumferential photoelectric switch 468, the feeding rod 4531, the feeding guide 4532, and the feeding photoelectric 4533.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model. Furthermore, features defining "first", "second" may include one or more such features, either explicitly or implicitly. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The wafer position adjustment mechanism according to the embodiment of the present utility model is specifically described below with reference to the drawings.
As shown in fig. 1 to 7, a wafer position adjustment mechanism according to an embodiment of the present utility model includes: a y-direction moving mechanism 44, an x-direction moving mechanism 45 and a circumferential rotating mechanism 46, the y-direction moving mechanism 44 being mounted on the platform 40; the x-direction moving mechanism 45 is arranged on the y-direction moving mechanism 44, and the y-direction moving mechanism 44 drives the x-direction moving mechanism 45 to move along the y-direction; the circumferential rotation mechanism 46 is mounted on the x-direction moving mechanism 45, the x-direction moving mechanism 45 drives the circumferential rotation mechanism 46 to move along the x-direction, the wafer is mounted on the circumferential rotation mechanism 46, and the circumferential rotation mechanism 46 drives the wafer to rotate in the circumferential direction.
In other words, the y-direction moving mechanism 44 and the x-direction moving mechanism 45 in the wafer position adjusting mechanism are mainly used for adjusting the positions of the chips on the horizontal plane, when one chip above the chip ejecting device 47 is gripped away for mounting, the other chip needs to be moved above the chip ejecting device 47 through the combined action of the y-direction moving mechanism 44 and the x-direction moving mechanism 45, the circumferential rotating mechanism 46 is used for controlling the rotation angle of the chip, the chip is generally square, the chip and the lead frame need to keep corresponding angles to complete mounting, and the angle of the chip can be adjusted through the circumferential rotating mechanism 46.
On this basis, the y-direction moving mechanism 44 includes: the y-direction linear guide 441, the y-direction moving plate 443 and the y-direction linear motor 442, and the y-direction linear guide 441 is arranged on the platform 40; the y-direction moving plate 443 is positioned above the platform 40, and the y-direction moving plate 443 is slidably connected with the platform 40 through a y-direction linear guide rail 441; the y-direction linear motor 442 is mounted on the platform 40, and an output end of the y-direction linear motor 442 is connected to the y-direction moving plate 443. The number of the y-direction linear guides 441 is preferably two, and the y-direction linear motor 442 is located between the two y-direction linear guides 441, so that the stability of the y-direction moving plate 443 during movement can be improved.
Further, two y-direction photoelectric switches 444 and two y-direction limiting blocks 445 are installed on the platform 40, the two y-direction photoelectric switches 444 are oppositely arranged along the y-direction, when the y-direction moving plate 443 moves along the y-direction, the y-direction photoelectric switches 444 are triggered, the two y-direction limiting blocks 445 are oppositely arranged along the y-direction, and the y-direction limiting blocks 445 are used for limiting the y-direction moving plate 443 along the y-direction.
Further, a magnetic grating disposed along the y-direction is also mounted on the lower surface of the y-direction moving plate 443, and a reading head is mounted on the stage 40 in cooperation with the magnetic grating. This allows accurate measurement of the distance of movement of the y-moving plate 443, facilitating accurate positioning.
On the basis, the x-direction moving mechanism 45 includes: an x-direction linear guide 451, an x-direction moving plate 453, and an x-direction linear motor 452, the x-direction linear guide 451 being provided on the y-direction moving plate 443; the x-direction moving plate 453 is located above the y-direction moving plate 443, and the x-direction moving plate 453 and the y-direction moving plate 443 are slidably connected through the x-direction linear guide 451; the x-direction linear motor 452 is mounted on the y-direction moving plate 443, and an output end of the x-direction linear motor 452 is connected to the x-direction moving plate 453.
The number of the x-direction linear guides 451 is preferably two, and the x-direction linear motor 452 is located between the two x-direction linear guides 451, so that stability when the x-direction moving plate 453 moves can be improved.
According to one embodiment of the present utility model, two x-direction photoelectric switches 454 and two x-direction limiting blocks 455 are installed on the y-direction moving plate 443, the two x-direction photoelectric switches 454 are oppositely arranged, when the x-direction moving plate 453 moves along the x-direction, the x-direction photoelectric switches 454 are triggered, the two x-direction limiting blocks 455 are oppositely arranged, and the x-direction limiting blocks 455 are used for limiting the x-direction moving plate 453 in the x-direction. Of course, the y-direction moving plate 443 and the x-direction moving plate 453 may be provided with a magnetic scale and a reading head, respectively, to measure accuracy during movement.
On this basis, the circumferential rotation mechanism 46 includes: a plurality of rollers 461, a driving ring 462, a primary timing belt 463, a motor 464, and an encoder 465, the plurality of rollers 461 being uniformly arranged on the x-direction moving plate 453 in the circumferential direction; the driving ring 462 is arranged at the outer side of the plurality of rollers 461, and the driving ring 462 is connected with the rollers 461 in a rolling way; the first synchronous belt 463 is in transmission connection with the driving ring 462; the motor 464 is arranged on the x-direction moving plate 453, and the output end of the motor 464 is in transmission connection with the first synchronous belt 463; the encoder 465 is mounted on the x-direction moving plate 453, and the encoder 465 is drivingly connected to the first timing belt 463.
Further, an annular groove matched with the roller 461 is formed on the inner circumferential surface of the driving ring 462, the cross section of the annular groove is in a V shape, and teeth matched with the first synchronous belt 463 are formed on the outer circumferential surface of the driving ring 462.
In this embodiment, the number of the rollers 461 is preferably eight, each roller 461 is clamped in an annular groove on the inner peripheral surface of the driving ring 462 and is in rolling connection with the annular groove, and the rollers 461 support the driving ring 462 on one hand, so that the driving ring 462 is suspended on the x-direction moving plate 453, and meanwhile, the stability of the driving ring 462 during rotation can be ensured; the first timing belt 463 drives the entire drive ring 462 to rotate by meshing with the teeth; and the encoder 465 rotates following the timing belt 463 to precisely detect the rotation angle of the driving ring 462.
Further, a tensioning adjusting block 467 is slidably arranged on the x-direction moving plate 453, a tensioning bearing 466 is mounted on the tensioning adjusting block 467, the tensioning bearing 466 is in rolling connection with the first synchronous belt 463, and the tensioning bearing 466 is close to or far from the first synchronous belt 463 by moving the tensioning adjusting block 467 so as to change the tensioning degree of the first synchronous belt 463; the x-direction moving plate 453 is further provided with a circumferential photoelectric switch 468, and the driving ring 462 can trigger the circumferential photoelectric switch 468 when rotating, and the circumferential photoelectric switch 468 is in a zero position of the driving ring 462.
It should be noted that the output ends of the driving ring 462, the encoder 465 and the motor 464 are all engaged with the inner surface of the first timing belt 463 to complete synchronous transmission, and the tensioning bearing 466 is attached to the outer surface of the first timing belt 463, so as to complete the tensioning effect on the first timing belt 463.
According to one embodiment of the utility model, a feeding rod 4531 is mounted on the x-direction moving plate 453, the feeding rod 4531 is located at one side of the circumferential rotation mechanism 46, a feeding photoelectric 4533 is arranged in the middle of the feeding rod 4531, feeding guide blocks 4532 are arranged at two ends of the feeding rod 4531, and the feeding guide blocks 4532 are used for guiding wafers in the conveying process. That is, during the wafer loading process, the wafer is guided by the feeding guide block 4532, so that the wafer can be conveniently moved horizontally into the wafer expanding mechanism 48, and the feeding photoelectric 4533 detects whether the wafer passes through.
The wafer position adjusting mechanism is simple and compact in structure, the wafer is driven to horizontally move in the xy plane by the circumferential rotating mechanism 46, and the wafer can be rotated circumferentially, so that the wafer is positioned and adjusted in angle, and alignment operation with the lead frame is facilitated during subsequent mounting. The wafer is driven to move on the xy plane by the y-direction moving mechanism 44 and the x-direction moving mechanism 45, and is driven to rotate by the circumferential rotating mechanism 46, so that the position and the square of the wafer are adjusted before the chip is attached to the lead frame, the subsequent attaching efficiency is improved, and meanwhile, the wafer position adjusting mechanism is compact in structure and suitable for being integrated in equipment such as a die bonder to realize an automatic function.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A wafer position adjustment mechanism, comprising:
a y-direction movement mechanism (44), the y-direction movement mechanism (44) being mounted on the platform (40);
the X-direction moving mechanism (45), the X-direction moving mechanism (45) is arranged on the Y-direction moving mechanism (44), and the Y-direction moving mechanism (44) drives the X-direction moving mechanism (45) to move along the Y-direction;
the wafer rotating device comprises a circumferential rotating mechanism (46), wherein the circumferential rotating mechanism (46) is arranged on an x-direction moving mechanism (45), the x-direction moving mechanism (45) drives the circumferential rotating mechanism (46) to move along the x-direction, a wafer is arranged on the circumferential rotating mechanism (46), and the circumferential rotating mechanism (46) drives the wafer to rotate in the circumferential direction.
2. The wafer position adjustment mechanism according to claim 1, wherein the y-direction movement mechanism (44) comprises:
a y-direction linear guide (441), wherein the y-direction linear guide (441) is arranged on the platform (40);
the y-direction moving plate (443), the y-direction moving plate (443) is positioned above the platform (40), and the y-direction moving plate (443) is slidably connected with the platform (40) through the y-direction linear guide rail (441);
and the y-direction linear motor (442), the y-direction linear motor (442) is arranged on the platform (40), and the output end of the y-direction linear motor (442) is connected with the y-direction moving plate (443).
3. The wafer position adjustment mechanism according to claim 2, wherein two y-direction photoelectric switches (444) and two y-direction limiting blocks (445) are mounted on the platform (40), the two y-direction photoelectric switches (444) are oppositely arranged along the y-direction, the y-direction moving plate (443) triggers the y-direction photoelectric switches (444) when moving along the y-direction, the two y-direction limiting blocks (445) are oppositely arranged along the y-direction, and the y-direction limiting blocks (445) are used for limiting the y-direction moving plate (443) along the y-direction.
4. The wafer position adjustment mechanism of claim 2, wherein a magnetic grating disposed along the y-direction is further mounted on the lower surface of the y-direction moving plate (443), and a reading head is mounted on the stage (40) in cooperation with the magnetic grating.
5. Wafer position adjustment mechanism according to claim 2, characterized in that the x-direction movement mechanism (45) comprises:
an x-direction linear guide (451), wherein the x-direction linear guide (451) is provided on the y-direction moving plate (443);
an x-direction moving plate (453), wherein the x-direction moving plate (453) is positioned above the y-direction moving plate (443), and the x-direction moving plate (453) and the y-direction moving plate (443) are connected in a sliding manner through the x-direction linear guide rail (451);
and the X-direction linear motor (452), the X-direction linear motor (452) is arranged on the Y-direction moving plate (443), and the output end of the X-direction linear motor (452) is connected with the X-direction moving plate (453).
6. The wafer position adjustment mechanism according to claim 5, wherein two x-direction photoelectric switches (454) and two x-direction limiting blocks (455) are mounted on the y-direction moving plate (443), the two x-direction photoelectric switches (454) are oppositely disposed, the x-direction moving plate (453) triggers the x-direction photoelectric switches (454) when moving in the x-direction, the two x-direction limiting blocks (455) are oppositely disposed, and the x-direction limiting blocks (455) are used for limiting the x-direction moving plate (453) in the x-direction.
7. The wafer position adjustment mechanism according to claim 5, wherein the circumferential rotation mechanism (46) comprises:
a plurality of rollers (461), wherein the plurality of rollers (461) are uniformly arranged on the x-direction moving plate (453) along the circumferential direction;
a driving ring (462), wherein the driving ring (462) is arranged at the outer side of the plurality of rollers (461), and the driving ring (462) is in rolling connection with the rollers (461);
a timing belt (463), the timing belt (463) being in driving connection with the drive ring (462);
a motor (464), wherein the motor (464) is arranged on the x-direction moving plate (453), and the output end of the motor (464) is in transmission connection with the synchronous belt (463);
and the encoder (465) is arranged on the x-direction moving plate (453), and the encoder (465) is in transmission connection with the synchronous belt (463).
8. The wafer position adjustment mechanism according to claim 7, wherein an annular groove that mates with the roller (461) is provided on an inner peripheral surface of the drive ring (462), and teeth that mates with the timing belt (463) are provided on an outer peripheral surface of the drive ring (462).
9. The wafer position adjustment mechanism according to claim 7, wherein a tension adjustment block (467) is slidably provided on the x-direction moving plate (453), a tension bearing (466) is mounted on the tension adjustment block (467), the tension bearing (466) is in rolling connection with the timing belt (463), and the tension bearing (466) is moved closer to or farther from the timing belt (463) by moving the tension adjustment block (467) to change the degree of tension of the timing belt (463); the X-direction moving plate (453) is further provided with a circumferential photoelectric switch (468), the driving ring (462) can trigger the circumferential photoelectric switch (468) when rotating, and the circumferential photoelectric switch (468) is positioned at the zeroing position of the driving ring (462).
10. The wafer position adjustment mechanism according to claim 5, wherein a feeding rod (4531) is mounted on the x-direction moving plate (453), the feeding rod (4531) is located at one side of the circumferential rotation mechanism (46), a feeding photoelectric device (4533) is disposed in the middle of the feeding rod (4531), feeding guide blocks (4532) are disposed at two ends of the feeding rod (4531), and the feeding guide blocks (4532) are used for guiding wafers in the conveying process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223321995.0U CN218918820U (en) | 2022-12-12 | 2022-12-12 | Wafer position adjusting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223321995.0U CN218918820U (en) | 2022-12-12 | 2022-12-12 | Wafer position adjusting mechanism |
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| Publication Number | Publication Date |
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| CN218918820U true CN218918820U (en) | 2023-04-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202223321995.0U Active CN218918820U (en) | 2022-12-12 | 2022-12-12 | Wafer position adjusting mechanism |
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| Country | Link |
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| CN (1) | CN218918820U (en) |
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- 2022-12-12 CN CN202223321995.0U patent/CN218918820U/en active Active
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