CN218917853U - Display device - Google Patents

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Publication number
CN218917853U
CN218917853U CN202320117099.8U CN202320117099U CN218917853U CN 218917853 U CN218917853 U CN 218917853U CN 202320117099 U CN202320117099 U CN 202320117099U CN 218917853 U CN218917853 U CN 218917853U
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China
Prior art keywords
circuit board
flexible circuit
binding
area
substrate
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CN202320117099.8U
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Chinese (zh)
Inventor
樊伟锋
陆敏
王学辉
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InfoVision Optoelectronics Kunshan Co Ltd
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InfoVision Optoelectronics Kunshan Co Ltd
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Abstract

The application discloses a display device, comprising a printed circuit board; the display box comprises a first substrate and a second substrate which are arranged in a stacked manner; the first binding area of the first flexible circuit board is connected with the binding area of the second substrate; the dimming box is laminated with the display box and comprises a third substrate and a fourth substrate which are laminated; the first binding area of the second flexible circuit board is connected with the binding area of the fourth substrate, the second binding area of one flexible circuit board in the first flexible circuit board and the second flexible circuit board is connected with the printed circuit board, and the second binding area of the other flexible circuit board in the first flexible circuit board and the second flexible circuit board is connected with the third binding area of one flexible circuit board so as to be electrically connected with the printed circuit board. The binding area position of the display box or the dimming box does not need to be changed, so that the investment cost and the time cost caused by changing the manufacturing process and the manufacturing tool of the display box or the dimming box are avoided.

Description

Display device
Technical Field
The utility model relates to the technical field of liquid crystal display, in particular to a display device.
Background
The liquid crystal display device has been widely used in various fields due to its advantages of low power consumption, small size, light weight, ultra-thin screen, etc. With the development of technology, the lcd device often combines the Dual Cell (screen folding) technology with the HDR (High Dynamic Range ) rendering technology, so that the display effect of the lcd device approaches or exceeds that of the OLED display device by improving the contrast ratio of the display image.
The Dual Cell (screen folding) technology refers to a method of manufacturing a display device by stacking a display box and a dimming box together. The display box is used for controlling the chromaticity of the image, the dimming box is used for controlling the brightness of the subareas, and one-to-one subarea arrangement is adopted between the display box and the dimming box. In the prior art, the display box is bound with a required printed circuit board through a flexible circuit board to realize electrical connection, and the dimming box is bound with the required printed circuit board through the flexible circuit board to realize electrical connection. This can confuse the routing of the binding portions, which is detrimental to the narrow bezel, ultra-thin screen design of the display device.
Disclosure of Invention
Accordingly, an object of the present utility model is to provide a display device to solve the problems of the prior art.
According to an embodiment of the present utility model, there is provided a display device including: a printed circuit board; the display box comprises a first substrate and a second substrate which are arranged in a stacked manner; the dimming box is laminated with the display box and comprises a third substrate and a fourth substrate which are laminated; wherein, still include:
the first binding area of the first flexible circuit board is connected with the binding area of the second substrate;
the first binding area of the second flexible circuit board is connected with the binding area of the fourth substrate,
the first flexible circuit board is connected with the printed circuit board through a first binding area of one flexible circuit board in the second flexible circuit board, and the first binding area of the other flexible circuit board in the second flexible circuit board is connected with a second binding area of one flexible circuit board in order to be electrically connected with the printed circuit board.
Preferably, the second binding region of the second flexible circuit board is connected with the binding region of the printed circuit board, and the second binding region of the first flexible circuit board is connected with the third binding region of the second flexible circuit board and electrically connected with the binding region of the printed circuit board via the second binding region of the second flexible circuit board.
Preferably, the first binding region and the second binding region of the first flexible circuit board are positioned at two opposite ends of the same surface, and the first binding region and the second binding region of the first flexible circuit board are electrically connected;
the second flexible circuit board comprises a first surface and a second surface deviating from the first surface, a first binding area and a second binding area of the second flexible circuit board are positioned at two opposite end parts of the first surface, a third binding area of the second flexible circuit board is positioned on the second surface, the first binding area and the second binding area of the second flexible circuit board are electrically connected, and the third binding area and the second binding area of the second flexible circuit board are electrically connected.
Preferably, the first flexible circuit board further comprises a tearing prevention area, and the tearing prevention area is located between the first binding area and the second binding area of the first flexible circuit board and is close to the second binding area.
Preferably, the second flexible circuit board further comprises a tearing prevention area, wherein the tearing prevention area is located on the second face and located on one side, away from the printed circuit board, of the third binding area.
Preferably, the tear-resistant region includes a plurality of metal patterns, the metal patterns being of a "ten" or "x" type.
Preferably, the projection of the third binding area of the second flexible circuit board on the first surface overlaps with the second binding area of the second flexible circuit board or is located between the first binding area and the second binding area of the second flexible circuit board.
Preferably, the number of the golden fingers of the first binding area of the first flexible circuit board is equal to the number of the golden fingers of the first binding area of the second flexible circuit board, the number of the golden fingers of the first binding area of the first flexible circuit board is equal to the number of the golden fingers of the second binding area of the first flexible circuit board, the number of the golden fingers of the third binding area of the second flexible circuit board is equal to the number of the golden fingers of the second binding area of the second flexible circuit board is equal to the number of the golden fingers of the first binding area of the second flexible circuit board or the number of the golden fingers of the third binding area of the second flexible circuit board, or the sum of the numbers of the golden fingers of the first binding area of the second flexible circuit board and the third binding area of the second flexible circuit board.
Preferably, the third binding area of the second flexible circuit board is electrically connected with the second binding area of the second flexible circuit board via a conductive through hole on the protective layer between the first face and the second face.
Preferably, the first substrate includes RGB color resists, the third substrate does not include RGB color resists, and a vertical projection of the bonding region of the second substrate coincides with the bonding region of the fourth substrate.
The display device provided by the utility model integrates the control circuits required by the display box and the dimming box on the same printed circuit board, thereby being beneficial to the thin screen design and the narrow frame design of the display device. In addition, the dimming box is connected with the printed circuit board through one flexible circuit board, and the display box is electrically connected with the printed circuit board through the last flexible circuit board through the other flexible circuit board, so that the circuit area of the printed circuit board is reduced (only a binding area is required to be arranged in one area), meanwhile, the position of the binding area of the display box or the dimming box is not required to be changed, and the input cost and the time cost caused by changing the manufacturing process and the manufacturing tool of the display box or the dimming box are avoided. In addition, the mode can more flexibly enable the upper liquid crystal box to be attached to the lower liquid crystal box in the attaching process of the display box and the dimming box, so that the stability of the display device is improved, and a new thought is provided for the binding mode of other structures in the display device.
Drawings
The above and other objects, features and advantages of the present utility model will become more apparent from the following description of embodiments of the present utility model with reference to the accompanying drawings.
Fig. 1 shows a schematic view of a display device according to a first embodiment of the utility model.
Fig. 2 shows an enlarged schematic view at a in fig. 1.
Fig. 3 shows a partial view of the first flexible circuit board of fig. 1.
Fig. 4 shows a partial view of a second flexible circuit board of fig. 1.
Fig. 5 shows a partial view of another second flexible circuit board of fig. 1.
Fig. 6 shows a schematic diagram of a display device according to a second embodiment of the utility model.
Fig. 7 shows a schematic diagram of a display device according to a third embodiment of the present utility model.
Fig. 8 shows a schematic diagram of a display device according to a fourth embodiment of the present utility model.
Fig. 9 shows a schematic diagram of a display device according to a fifth embodiment of the present utility model.
Detailed Description
The present utility model is described below based on examples, but the present utility model is not limited to only these examples. In the following detailed description of the present utility model, certain specific details are set forth in detail. The present utility model will be fully understood by those skilled in the art without the details described herein. Well-known methods, procedures, flows, components and circuits have not been described in detail so as not to obscure the nature of the utility model.
It should be understood that the words "comprise," "comprising," and the like throughout the specification and claims are to be interpreted in an inclusive rather than an exclusive or exhaustive sense unless the context clearly requires otherwise; that is, it is the meaning of "including but not limited to". The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Furthermore, in the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
Example 1
Fig. 1 shows a schematic view of a display device according to a first embodiment of the utility model. Fig. 2 shows an enlarged schematic view at a in fig. 1. Fig. 3 shows a partial view of the first flexible circuit board of fig. 1. Fig. 4 shows a partial view of a second flexible circuit board of fig. 1. Fig. 5 shows a partial view of another second flexible circuit board of fig. 1.
As shown in fig. 1, the display device of the present embodiment includes a display case 100 and a dimming case 200 disposed to be stacked on each other, a printed circuit board 300 located in a non-display area and having a vertical projection that does not overlap the display case 100 and the dimming case 200, and a first flexible circuit board 150 and a second flexible circuit board 250.
The display box 100 is disposed above the dimming box 200, the display box 100 is used for controlling the image chromaticity of the display device, and the dimming box 200 is used for controlling the partition brightness of the display device. The display cell 100 is for example a liquid crystal cell, the light regulating cell 200 is for example a liquid crystal cell, a self-luminescent display array (e.g. OLED display, micro LED display), preferably the light regulating cell 200 is also a liquid crystal cell. Note that, the display box 100 may be disposed below the dimming box 200.
Further, the display case 100 includes a first substrate 110 and a second substrate 120 stacked, and a first liquid crystal layer (not shown) between the first substrate 110 and the second substrate 120. The first substrate 110 is a color film substrate including RGB color resists, and the second substrate 120 is an array substrate including a plurality of thin film transistors arranged in an array. The second substrate 120 is provided with a bonding region at a side facing the first liquid crystal layer. Further, the second substrate 120 is formed with a plurality of pixel units (not shown) on a side facing the first liquid crystal layer by a plurality of scan lines (not shown) and a plurality of data lines (not shown) which are insulated from each other and cross each other, and each pixel unit is provided with a pixel electrode and a thin film transistor, and the pixel electrode is electrically connected to the data lines through the thin film transistor. The second substrate 120 is further provided with a common electrode at a side facing the first liquid crystal layer, the common electrode being located at a different layer from the pixel electrode and insulated by an insulating layer. Preferably, the common electrode is a planar electrode disposed over the entire surface, and the pixel electrode is a block electrode or a slit electrode disposed over the entire surface within each pixel unit. The bonding area of the second substrate 120 is at least connected to the scan lines and the data lines.
Further, the dimming cartridge 200 includes a third substrate 210 and a fourth substrate 220 stacked, and a second liquid crystal layer (not shown) between the third substrate 210 and the fourth substrate 220. The third substrate 210 is a color film substrate that does not include RGB color resists, and the fourth substrate 220 is an array substrate including a plurality of thin film transistors arranged in an array. The fourth substrate 220 is provided with a bonding region at a side facing the second liquid crystal layer. Further, the fourth substrate 220 is formed with a plurality of pixel units (not shown) on a side facing the second liquid crystal layer by a plurality of scan lines (not shown) and a plurality of data lines (not shown) which are insulated from each other and cross each other, and each pixel unit is provided with a pixel electrode and a thin film transistor, and the pixel electrode is electrically connected to the data lines through the thin film transistor. The fourth substrate 220 is further provided with a common electrode at a side facing the second liquid crystal layer, the common electrode being located at a different layer from the pixel electrode and insulated by an insulating layer. Preferably, the common electrode is a planar electrode disposed over the entire surface, and the pixel electrode is a block electrode or a slit electrode disposed over the entire surface within each pixel unit. The bonding area of the fourth substrate 220 is at least connected to the scan lines and the data lines.
Further, the display device further includes a first polarizer 510 disposed over the first substrate 110, a second polarizer 520 disposed between the second substrate 120 and the third substrate 210, and a third polarizer 530 disposed over the third substrate 210.
It should be noted that, in order to make the process of manufacturing the display device simple and the cost lower, the second substrate 220 and the fourth substrate 240 are generally obtained by using the same manufacturing process. I.e. the perpendicular projection of the bonding area of the second substrate 120 coincides with the bonding area of the fourth substrate 220. Namely, the binding areas connected to the flexible circuit board in the display case 100 and the dimming case 200 which are stacked are located at the same position.
The printed circuit board 300 integrates therein the driving circuits required for the display box 100 and the driving circuits required for the dimming box 200. The first bonding region of the first flexible circuit board 150 is connected with the bonding region of the second substrate 120. The first bonding area of the second flexible circuit board 250 is connected with the bonding area of the fourth substrate 220. The second bonding area of one of the first flexible circuit board 150 and the second flexible circuit board 250 is connected with the printed circuit board 300, and the second bonding area of the other of the first flexible circuit board 150 and the second flexible circuit board 250 is connected with the third bonding area of the one of the flexible circuit boards to achieve electrical connection with the printed circuit board 300.
Illustratively, the second bonding area of the second flexible circuit board 250 is connected with the bonding area of the printed circuit board 300, and the second bonding area of the first flexible circuit board 150 is connected with the third bonding area of the second flexible circuit board 250 and electrically connected with the bonding area of the printed circuit board 300 via the second bonding area of the second flexible circuit board 250.
Further, as shown in fig. 2, the structure of the electrical connection between the first flexible circuit board 150 and the second flexible circuit board 250 and the printed circuit board 300 will be described in detail. The first flexible circuit board 150 includes a first protective layer 151, a second protective layer 153, and a metal layer 152 therebetween, which are stacked. The first protection layer 151 covers the metal layer 152, the second protection layer 153 covers a portion of the metal layer 152, and the exposed portion of the metal layer 152 serves as a second binding region of the first flexible circuit board 150. The second flexible circuit board 250 includes a first protective layer 251, a first metal layer 252, a second protective layer 253, a second metal layer 254, and a third protective layer 255 that are stacked. Wherein, the first protection layer 251 covers a portion of the first metal layer 252, and the exposed portion of the surface of the first metal layer 252 serves as a third binding region of the second flexible circuit board 250. The third protective layer 255 covers a portion of the second metal layer 254, and the exposed portion of the second metal layer 254 surface serves as a second binding region of the second flexible circuit board 250. The third protective layer 253 isolates the second metal layer 254 from the first metal layer 253, and a conductive via 256 is provided in the third protective layer 253 to electrically connect the second bonding area and the third bonding area in the second flexible circuit board 250. Wherein the conductive vias 256 are filled with a conductive metal. Further, the second bonding area of the first flexible circuit board 150 and the third bonding area of the second flexible circuit board 250 are bonded and connected by the conductive adhesive 400. The second bonding region of the second flexible circuit board 250 is bonded to the bonding region of the printed circuit board 300, for example, by conductive adhesive (not shown). In this embodiment, the vertical projection of the third binding area of the second flexible circuit board 250 overlaps the second binding area of the second flexible circuit board 250.
Further, with reference to fig. 3, (a) is a bottom view of the first flexible circuit board 150, (b) is a perspective view of the first flexible circuit board 150, and (c) is a top view of the first flexible circuit board 150. The first binding region 1521 and the second binding region 1522 of the first flexible circuit board 150 are located at two opposite end portions of the same surface (the surface of the metal layer 152 exposed by the second protective layer 153), and the first binding region 1521 and the second binding region 1522 of the first flexible circuit board are electrically connected.
Further, referring to fig. 4, (a) is a bottom view of the second flexible circuit board 250, (b) is a perspective view of the second flexible circuit board 250, and (c) is a top view of the second flexible circuit board 250. The second flexible circuit board 250 includes a first face (a surface of the second metal layer 254 exposed by the third protective layer 255) and a second face (a surface of the first metal layer 252 exposed by the first protective layer 251) facing away from the first face, the first bonding region 2541 and the second bonding region 2542 of the second flexible circuit board 250 are located at two opposite ends of the first face (a surface of the second metal layer 254 exposed by the third protective layer 255), and the third bonding region 2523 of the second flexible circuit board 250 is located at the second face. The first bonding region 2541 and the second bonding region 2542 of the second flexible circuit board 250 are located on the same metal layer to be electrically connected, and the third bonding region 2523 and the second bonding region 2542 of the second flexible circuit board 250 are electrically connected through conductive vias 256 provided in the second protection layer 253 between the first face and the second face.
The number of the golden fingers of the first binding region of the first flexible circuit board 150 is equal to that of the second binding region of the first flexible circuit board 150, and the number of the golden fingers of the third binding region of the second flexible circuit board 250 is equal to that of the second binding region of the first flexible circuit board 150. In this embodiment, the display box 100 and the dimming box 200 have the same resolution, so the number of golden fingers in the first binding region of the first flexible circuit board 150 is equal to that in the first binding region of the second flexible circuit board 250, that is, the number of golden fingers in the third binding region of the second flexible circuit board 250 is equal to that in the first binding region of the second flexible circuit board 250. And the first flexible circuit board 150 and the second flexible circuit board 250 receive the driving signals from the printed circuit board 300 using the same channel, so that the number of the golden fingers of the second bonding area of the second flexible circuit board 250 is equal to the number of the golden fingers of the first bonding area of the second flexible circuit board 250 or the third bonding area of the second flexible circuit board 250.
In another embodiment, in conjunction with fig. 5, (a) is a bottom view of another second flexible circuit board 350, (b) is a perspective view of the second flexible circuit board 350, and (c) is a top view of the second flexible circuit board 350. The second flexible circuit board 350 changes only the number of gold fingers of the second bonding region based on the second flexible circuit board 250. The second flexible circuit board 350 includes a first face (a surface of the second metal layer exposed by the third protective layer 355) and a second face (a surface of the first metal layer exposed by the first protective layer 351) facing away from the first face, and the first bonding region 3541 and the second bonding region 3542 of the second flexible circuit board 350 are located at two opposite ends of the first face, and the third bonding region 3523 of the second flexible circuit board 350 is located at the second face. The first bonding region 3541 and the second bonding region 3542 of the second flexible circuit board 350 are located at the same metal layer to be electrically connected, and the third bonding region 3523 and the second bonding region 3542 of the second flexible circuit board 350 are electrically connected via conductive vias provided in the second protective layer between the first face and the second face.
That is, when the first flexible circuit board 150 and the second flexible circuit board 350 receive the driving signals from the printed circuit board 300 using different channels, the number of the golden fingers of the second bonding area of the second flexible circuit board 350 is the sum of the number of the golden fingers of the first bonding area of the second flexible circuit board 350 and the third bonding area of the second flexible circuit board 350. Correspondingly, the width of the binding area of the second flexible circuit board 350 with the printed circuit board 300 is, for example, larger than the width of the binding area with the dimming box 200.
Further, in the first embodiment, the first flexible circuit board 150 further includes a tear-proof region 1523, and the tear-proof region 1523 is located between the first bonding region and the second bonding region of the first flexible circuit board 150 and is close to the second bonding region. The tear-proof region 1523 is covered with the second protective layer 153 and the first protective layer 151, and includes a plurality of metal patterns, for example, a "ten" type or a "x" type. The second flexible circuit board 250 further includes a tear-proof region 2524, the tear-proof region 2524 is covered by the second protective layer 253 and the first protective layer 251, and includes a plurality of metal patterns, for example, a "ten" or "x" shape, and the tear-proof region 2524 is located at a side of the third binding region 2523 remote from the printed circuit board 300. The second flexible circuit board 350 further includes a tear-proof region 3524, the tear-proof region 3524 is covered by the second protective layer and the first protective layer 351, and includes a plurality of metal patterns, for example, a "ten" type or an "x" type, and the tear-proof region 3524 is located at a side of the third binding region 3523 remote from the printed circuit board 300.
In this embodiment, the binding areas between the first flexible circuit board and the second flexible circuit board and between the printed circuit boards are at least partially overlapped, so that stability of the display device is improved.
Example two
Fig. 6 shows a schematic diagram of a display device according to a second embodiment of the utility model.
As shown in fig. 6, the display device of the second embodiment is different from the display device of the first embodiment in that the vertical projection of the third bonding area of the second flexible circuit board 550 in the second embodiment is located between the first bonding area and the second bonding area of the second flexible circuit board 550, that is, the vertical projection of the third bonding area of the second flexible circuit board 550 in the second embodiment does not overlap with the second bonding area of the second flexible circuit board 550. Correspondingly, referring to fig. 2, 3, 4, and 5, the first flexible circuit board 450 has the same structure as the first flexible circuit board 150. The second flexible circuit board 450 has the same structure as the second flexible circuit board 250 or the second flexible circuit board 350 except that the position of the third bonding region is changed.
In this embodiment, the binding areas between the first flexible circuit board and the second flexible circuit board and between the printed circuit boards do not overlap, and on the basis of improving the stability of the display device, the connection strength of the flexible circuit boards is further improved.
In addition, in the two embodiments, the display device integrates the control circuits required by the display box and the dimming box on the same printed circuit board, which is beneficial to the thin screen design and the narrow frame design of the display device. In addition, the dimming box is connected with the printed circuit board through one flexible circuit board, and the display box is electrically connected with the printed circuit board through the last flexible circuit board through the other flexible circuit board, so that the circuit area of the printed circuit board is reduced (only a binding area is required to be arranged in one area), meanwhile, the position of the binding area of the display box or the dimming box is not required to be changed, and the development cost and the time cost caused by changing the manufacturing process and the manufacturing tool of the display box or the dimming box are avoided.
Example III
Fig. 7 shows a schematic diagram of a display device according to a third embodiment of the present utility model.
As shown in fig. 7, a process flow for preparing the display device in the first and second embodiments is shown. The bonding area of the second substrate 120 in the display case 100 and the first bonding area of the first flexible circuit board are bonded to prepare the first display panel 600. Binding the binding region of the fourth substrate 220 in the dimming box 200 with the first binding region of the second flexible circuit board, and binding the second binding region of the second flexible circuit board with the binding region of the printed circuit board to prepare the second display panel 700. And then binding the second binding region of the first flexible circuit board of the first display panel 600 with the third binding region of the second flexible circuit board of the second display panel 700 by adopting a first binding process Bonding1 so as to attach the first display panel 600 and the second display panel 700 to obtain the display panel 800. The backlight module is then attached to the display panel 800 to prepare the display devices of the first and second embodiments. The first polarizer, the second polarizer, and the third polarizer in the display device are formed, for example, before the first display panel 600 and the second display panel 700 are manufactured. Wherein the positions of the display box 100 and the dimming box 200 may be interchanged.
Example IV
Fig. 8 shows a schematic diagram of a display device according to a fourth embodiment of the present utility model.
As shown in fig. 8, the display device of the fourth embodiment is different from the display device of the first embodiment in that the second bonding area of the first flexible circuit board 650 is directly connected to the printed circuit board 400, and the bonding area of the first flexible circuit board 650 connected to the printed circuit board 400 is different from the bonding area of the second flexible circuit board 750 connected to the printed circuit board 400. I.e. the printed circuit board 400 needs to be provided with at least two binding areas for making electrical connection with the dimming box 200 and the display box 100, respectively. Accordingly, referring to fig. 2, 3, 4, and 5, the first flexible circuit board 650 has the same structure as the first flexible circuit board 150. The second flexible circuit board 750 is, for example, the same structure as the first flexible circuit board 150.
The display device of the embodiment integrates the control circuits required by the display box and the dimming box on the same printed circuit board, thereby being beneficial to the thin screen design and the narrow frame design of the display device. In addition, the binding area position of the display box or the dimming box does not need to be changed, so that development cost and time cost caused by changing the manufacturing process and manufacturing tool of the display box or the dimming box are avoided.
Example five
Fig. 9 shows a schematic diagram of a display device according to a fifth embodiment of the present utility model.
As shown in fig. 9, a process flow for producing the display device in the third embodiment is shown. The bonding area of the second substrate 120 in the display case 100 and the first bonding area of the first flexible circuit board are bonded to prepare the first display panel 600. Binding the binding region of the fourth substrate 220 in the dimming box 200 with the first binding region of the second flexible circuit board, and binding the second binding region of the second flexible circuit board with one binding region of the printed circuit board to prepare the second display panel 700. And then binding the second binding region of the first flexible circuit board of the first display panel 600 with the other binding region of the printed circuit board of the second display panel 700 by adopting a second binding process Bonding2 so as to attach the first display panel 600 and the second display panel 700 to obtain the display panel 900. And then attaching the backlight module to the display panel 900 to prepare the display device in the third embodiment. The first polarizer, the second polarizer, and the third polarizer in the display device are formed, for example, before the first display panel 600 and the second display panel 700 are manufactured. Wherein the positions of the display box 100 and the dimming box 200 may be interchanged.
It should be noted that, in the display device provided in the first embodiment and the second embodiment of the present application, only one flexible circuit board is bound and connected with the printed circuit board, and the other flexible circuit board can be electrically connected with the printed circuit board by binding with the flexible circuit board. The mode can more flexibly enable the upper liquid crystal box to be attached to the lower liquid crystal box in the preparation process of attaching the display box to the dimming box, so that the stability of the display device is improved, and a new thought is provided for the binding mode of other structures in the display device.
Finally, it should be noted that: embodiments in accordance with the present utility model, as described above, are not intended to be exhaustive or to limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model and various modifications as are suited to the particular use contemplated. The utility model is limited only by the claims and the full scope and equivalents thereof.

Claims (10)

1. A display device, comprising: a printed circuit board; the display box comprises a first substrate and a second substrate which are arranged in a stacked manner; the dimming box is laminated with the display box and comprises a third substrate and a fourth substrate which are laminated; characterized by further comprising:
the first binding area of the first flexible circuit board is connected with the binding area of the second substrate;
the first binding area of the second flexible circuit board is connected with the binding area of the fourth substrate,
the first flexible circuit board is connected with the printed circuit board through a first binding area of one flexible circuit board in the second flexible circuit board, and the first binding area of the other flexible circuit board in the second flexible circuit board is connected with a second binding area of one flexible circuit board in order to be electrically connected with the printed circuit board.
2. The display device of claim 1, wherein the second bonding area of the second flexible circuit board is connected to the bonding area of the printed circuit board, and the second bonding area of the first flexible circuit board is connected to the third bonding area of the second flexible circuit board and electrically connected to the bonding area of the printed circuit board via the second bonding area of the second flexible circuit board.
3. The display device of claim 2, wherein the display device comprises a display device,
the first binding region and the second binding region of the first flexible circuit board are positioned at two opposite end parts of the same surface, and the first binding region and the second binding region of the first flexible circuit board are electrically connected;
the second flexible circuit board comprises a first surface and a second surface deviating from the first surface, a first binding area and a second binding area of the second flexible circuit board are positioned at two opposite end parts of the first surface, a third binding area of the second flexible circuit board is positioned on the second surface, the first binding area and the second binding area of the second flexible circuit board are electrically connected, and the third binding area and the second binding area of the second flexible circuit board are electrically connected.
4. The display device of claim 3, wherein the first flexible circuit board further comprises a tear resistant region between and proximate to the first and second binding regions of the first flexible circuit board.
5. The display device of claim 3, wherein the second flexible circuit board further comprises a tear-resistant region located on the second side and on a side of the third binding region remote from the printed circuit board.
6. The display device according to claim 4 or 5, wherein the tear-resistant region includes a plurality of metal patterns, the metal patterns being of a "ten" type or a "x" type.
7. A display device as claimed in claim 3, characterized in that the projection of the third binding area of the second flexible circuit board on the first side overlaps with or is located between the first binding area and the second binding area of the second flexible circuit board.
8. The display device of claim 3, wherein the number of fingers of the first bonding area of the first flexible circuit board is equal to the number of fingers of the first bonding area of the second flexible circuit board, the number of fingers of the first bonding area of the first flexible circuit board is equal to the number of fingers of the second bonding area of the first flexible circuit board, the number of fingers of the third bonding area of the second flexible circuit board is equal to the number of fingers of the second bonding area of the first flexible circuit board, the number of fingers of the second bonding area of the second flexible circuit board is equal to the number of fingers of the first bonding area of the second flexible circuit board or the number of fingers of the third bonding area of the second flexible circuit board, or the sum of the numbers of fingers of the first bonding area of the second flexible circuit board and the third bonding area of the second flexible circuit board.
9. A display device according to claim 3, wherein the third bonding area of the second flexible circuit board is electrically connected to the second bonding area of the second flexible circuit board via a conductive via on the protective layer between the first and second faces.
10. The display device of claim 1, wherein the first substrate includes RGB color resists, the third substrate does not include RGB color resists, and a vertical projection of the bonding region of the second substrate coincides with the bonding region of the fourth substrate.
CN202320117099.8U 2023-01-17 2023-01-17 Display device Active CN218917853U (en)

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CN202320117099.8U CN218917853U (en) 2023-01-17 2023-01-17 Display device

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CN202320117099.8U CN218917853U (en) 2023-01-17 2023-01-17 Display device

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