CN218896617U

CN218896617U - Monocrystalline silicon wafer transfer box

Info

Publication number: CN218896617U
Application number: CN202222290918.7U
Authority: CN
Inventors: 黄娜; 庄志伟
Original assignee: Weifang Yineng Photovoltaic Technology Co ltd
Current assignee: Weifang Yineng Photovoltaic Technology Co ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2023-04-21
Anticipated expiration: 2032-08-30

Abstract

The utility model relates to the technical field of silicon wafer processing equipment, in particular to a monocrystalline silicon wafer transfer box, which is characterized in that: the middle plate is arranged on the upper portion of the bottom plate, the tray is arranged on the upper portion of the middle plate, the middle plate comprises a plate body four, square center holes are formed in the centers of the plate body four, a first connecting hole is formed in each of four corners of the center holes of the plate body four, a first weight reduction groove is formed in each of four side faces of the plate body four, a third connecting groove is formed in each of two sides of the first weight reduction groove, the connecting grooves are used for installing vertical baffle assemblies, and two connecting grooves four which are arranged in parallel are formed in the bottoms of the plate body four.

Description

Monocrystalline silicon wafer transfer box

Technical Field

The utility model relates to the technical field of silicon wafer processing equipment, in particular to a monocrystalline silicon wafer transfer box.

Background

In the production process of the solar cell, the silicon wafer needs to be subjected to a plurality of processing procedures, and a large number of transfer storage boxes are required to be used in the procedure transfer or transportation process, so that the silicon wafer can be scraped with the transfer boxes in the transportation and storage process of the silicon wafer, and the silicon wafer is damaged.

Disclosure of Invention

The utility model provides a monocrystalline silicon wafer transfer box.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a monocrystalline silicon piece transfer box which characterized in that: the middle plate is arranged on the upper portion of the bottom plate, the tray is arranged on the upper portion of the middle plate, the middle plate comprises a plate body four, square center holes are formed in the centers of the plate body four, a first connecting hole is formed in each of four corners of the center holes of the plate body four, a first weight reduction groove is formed in each of four side faces of the plate body four, a third connecting groove is formed in each of two sides of the first weight reduction groove, the connecting grooves are used for installing vertical baffle assemblies, and two connecting grooves four which are arranged in parallel are formed in the bottoms of the plate body four.

Further, the first connecting hole is arranged in the second connecting groove.

Furthermore, the vertical baffle assembly comprises a vertical plate, wherein two rotating wheels which are arranged in parallel are arranged on the vertical plate, and a conveying belt is lapped between the two rotating wheels.

Further, the bottom of the vertical plate is provided with a connecting hole IV for connecting the middle plate.

Further, the bottom of the vertical plate is provided with a mounting groove.

Furthermore, the vertical plate is two parallel rod bodies, two rotations capable of rotating around respective axes are arranged between the two rod bodies, and a mounting groove is formed between the two rod bodies

Still further, the bottom plate includes plate body one, plate body two, plate body three, plate body one upper portion is provided with plate body two, plate body one lower part is provided with plate body three, be provided with a plurality of through-holes on the bottom plate, plate body two upper portion is provided with two parallel arrangement's connecting portion, is provided with a spread groove one on every connecting portion.

Further, the tray comprises a plate body five, wherein a weight reduction groove two is formed in each of four side faces of the plate body five, and a connecting hole four is formed in each of two sides of the weight reduction groove two of the side face of the plate body five.

Still further, be provided with a plurality of connecting holes III on the plate body five, connect Kong Sanbao and draw together circular hole portion and rectangular hole portion, circular hole portion and rectangular hole portion are linked together, connecting hole III is circular on the plate body five and arranges.

The beneficial effects are that: according to the utility model, the rotating wheel and the conveying belt are arranged on the vertical baffle component, so that after the edge part of the monocrystalline silicon wafer is contacted with the conveying belt when the monocrystalline silicon wafer is taken out from or put into the transfer box, the conveying belt can buffer the monocrystalline silicon wafer, and the friction between the monocrystalline silicon wafer and the conveying belt is reduced when the monocrystalline silicon wafer is taken out.

Drawings

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a top view of FIG. 1 in accordance with the present utility model;

FIG. 3 is a bottom view of FIG. 1 of the present utility model;

FIG. 4 is a perspective view of the base plate of FIG. 1 in accordance with the present utility model;

FIG. 5 is a second perspective view of the base plate of FIG. 1 according to the present utility model;

FIG. 6 is a perspective view of the intermediate plate of FIG. 1 in accordance with the present utility model;

FIG. 7 is a second perspective view of the intermediate plate of FIG. 1 in accordance with the present utility model;

FIG. 8 is a front view of FIG. 7 in accordance with the present utility model;

FIG. 9 is a perspective view of the tray of FIG. 1 according to the present utility model;

FIG. 10 is a top view of FIG. 9 in accordance with the present utility model;

FIG. 11 is a perspective view of the neutral section assembly of FIG. 1 in accordance with the present utility model;

FIG. 12 is a front view of FIG. 11 in accordance with the present utility model;

fig. 13 is a left side view of fig. 11 in accordance with the present utility model.

The pallet comprises a bottom plate 1, a middle plate 2, a pallet 3 and a vertical baffle 4;

a first plate body 101, a second plate body 102, a third plate body 103, a through hole 104, a connecting part 105 and a connecting groove 106;

a plate body IV, a weight reduction groove IV 202, a central hole 203, a connecting groove II 204, a connecting hole IV, a connecting groove III 206, a connecting hole IV 207 and a connecting groove IV;

301 plate body five, 302 weight reduction groove two, 303 connecting hole three, 304 connecting hole four;

401 vertical plates, 402 rotating wheels, 403 conveying belts, 404 mounting grooves and 405 connecting holes;

Detailed Description

Referring to fig. 1-13, a monocrystalline silicon wafer transfer box comprises a bottom plate 1, a middle plate 2 is arranged on the upper portion of the bottom plate, a tray 3 is arranged on the upper portion of the middle plate, the middle plate comprises a plate body four 201, square central holes 203 are formed in the centers of the plate body four 201, a first connecting hole 205 is formed in each of four corners of the central holes 203 on the upper portion of the plate body four 201, a first weight reducing groove 202 is formed in each of four side faces of the plate body four 201, a third connecting groove 206 is formed in each of two sides of the first weight reducing groove 202 on the side face of the body four 201, a second connecting hole 207 is formed in the third connecting hole 303, the connecting grooves are used for installing a vertical baffle assembly 4, and two connecting grooves four 208 which are arranged in parallel are formed in the bottom of the plate body four 201. The first connecting hole 205 is disposed in the second connecting slot 204.

The vertical baffle assembly 4 comprises a vertical plate 401, two rotating wheels 402 which are arranged in parallel are arranged on the vertical plate 401, a conveying belt 403 is lapped between the two rotating wheels 402, and a connecting hole IV 304 for connecting the middle plate is formed in the bottom of the vertical plate. The riser bottom is provided with a mounting slot 404. The vertical plate is two parallel rod bodies, and two rotating wheels capable of rotating around respective axes are arranged between the two rod bodies. A mounting slot 404 is formed between the two rods.

The bottom plate 1 comprises a first plate body 101, a second plate body 102 and a third plate body 103, wherein the second plate body 102 is arranged on the upper portion of the first plate body 101, the third plate body 103 is arranged on the lower portion of the first plate body 101, a plurality of through holes are formed in the bottom plate, two parallel connection portions 105 are arranged on the upper portion of the second plate body 102, and a first connection groove 106 is formed in each connection portion 105. The tray comprises a plate body five 301, wherein a weight-reducing groove two 302 is respectively arranged on four side surfaces of the plate body five 301, and a connecting hole four 304 is respectively arranged on two sides of the weight-reducing groove two 301 on the side surface of the plate body five 301. The plate body five 301 is provided with a plurality of connecting holes three 303, the connecting holes three 303 comprise round hole parts and strip hole parts, the round hole parts are communicated with the strip hole parts, and the connecting holes three 303 are circularly distributed on the plate body five.

During connection, a first connecting hole on the middle plate is internally provided with a bolt, one end of the bolt is provided with a first connecting groove of the connecting part on the bottom plate, the connecting part on the bottom plate is arranged in a fourth connecting groove at the bottom of the middle plate, the bottom of the vertical baffle component is arranged in a third connecting groove on the middle plate, and the fourth connecting hole at the bottom of the vertical baffle component is connected with a second connecting hole on the middle plate through the bolt. According to the utility model, the rotating wheel and the conveying belt are arranged on the vertical baffle component, so that after the edge part of the monocrystalline silicon wafer is contacted with the conveying belt when the monocrystalline silicon wafer is taken out from or put into the transfer box, the conveying belt can buffer the monocrystalline silicon wafer, and the friction between the monocrystalline silicon wafer and the conveying belt is reduced when the monocrystalline silicon wafer is taken out.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a monocrystalline silicon piece transfer box which characterized in that: the middle plate is arranged on the upper portion of the bottom plate, the tray is arranged on the upper portion of the middle plate, the middle plate comprises a plate body four, square center holes are formed in the centers of the plate body four, a first connecting hole is formed in each of four corners of the center holes of the plate body four, a first weight reduction groove is formed in each of four side faces of the plate body four, a third connecting groove is formed in each of two sides of the side face of the plate body four and the first weight reduction groove, the connecting grooves are used for installing vertical baffle assemblies, and two connecting grooves four which are arranged in parallel are formed in the bottoms of the plate body four.

2. The monocrystalline silicon wafer transfer cassette of claim 1, wherein: the first connecting hole is arranged in the second connecting groove.

3. The monocrystalline silicon wafer transfer cassette of claim 1, wherein: the vertical baffle assembly comprises a vertical plate, two rotating wheels which are arranged in parallel are arranged on the vertical plate, and a conveying belt is lapped between the two rotating wheels.

4. A single crystal silicon wafer transfer cassette according to claim 3, wherein: the bottom of the vertical plate is provided with a connecting hole IV for connecting the middle plate.

5. A single crystal silicon wafer transfer cassette according to claim 3, wherein: the bottom of the vertical plate is provided with a mounting groove.

6. A single crystal silicon wafer transfer cassette according to claim 3, wherein: the vertical plate is two parallel rod bodies, two rotations capable of rotating around respective axes are arranged between the two rod bodies, and a mounting groove is formed between the two rod bodies.

7. The monocrystalline silicon wafer transfer cassette of claim 1, wherein: the bottom plate comprises a first plate body, a second plate body and a third plate body, wherein the second plate body is arranged on the upper portion of the first plate body, the third plate body is arranged on the lower portion of the first plate body, a plurality of through holes are formed in the bottom plate, two connecting portions which are arranged in parallel are arranged on the upper portion of the second plate body, and a first connecting groove is formed in each connecting portion.

8. The monocrystalline silicon wafer transfer cassette of claim 1, wherein: the tray comprises a plate body five, wherein a weight reduction groove two is formed in each of four side faces of the plate body five, and a connecting hole four is formed in each of two sides of the weight reduction groove two of the side face of the plate body five.

9. The monocrystalline silicon wafer transfer cassette of claim 8, wherein: the plate body five is provided with a plurality of connecting holes III, the connection Kong Sanbao comprises a round hole part and a strip hole part, the round hole part is communicated with the strip hole part, and the connecting holes III are circularly distributed on the plate body five.