CN218887141U

CN218887141U - Novel quartz wafer processing with carrying a set tool

Info

Publication number: CN218887141U
Application number: CN202222059065.6U
Authority: CN
Inventors: 徐杭飞; 周铁成
Original assignee: Hongxing Technology Group Co ltd
Current assignee: Hongxing Technology Group Co ltd
Priority date: 2022-08-05
Filing date: 2022-08-05
Publication date: 2023-04-18
Anticipated expiration: 2032-08-05

Abstract

The utility model discloses a novel quartz wafer processing with carrying a set tool relates to quartz wafer processing technology field, a plurality of station district on the mounting panel and locating the mounting panel, and a plurality of station district is the rectangle array, and a plurality of station district arranges for 31 rows 24 lines, wherein, the maximum length in each station district is 1mm, and the maximum width in each station district is 2mm, and the interval between two adjacent station districts in each line is 3mm, and the interval in two adjacent station districts in each line is 4mm. The utility model discloses in improve through quantity, distribution mode and the structure to the station area on the year dish tool, in the middle of the function of machine platform, can not change the original structure of machine platform, not only have and play the same production effect with former tool, and for former tool (480 station tool), the utility model provides a year dish tool (744 station) can reduce 40% manual operation and trade a set time.

Description

Novel quartz wafer processing with carrying a set tool

Technical Field

The utility model relates to quartz wafer processing technology field especially involves a novel quartz wafer processing with carrying a set tool.

Background

In the production process of the existing 3225-specification quartz crystal oscillator, particularly in the processes of dispensing, fine adjustment, pre-welding, sealing and the like, used carrier disc jigs are 480-station jigs; the tool stations adopt the same array subsections, the centers of the tool stations are superposed, the edges of the tools are provided with positioning pin holes which can be used in a mutually matched way, and the tool switching between the two processes can be realized through a specific tool; however, the existing jig has large station spacing and small number of stations, so that the jig is low in utilization rate, and the manual operation tray changing time and the running speed of the machine can be increased.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a novel quartz wafer processing with carrying a set tool for solve above-mentioned technical problem.

The utility model adopts the technical scheme as follows:

the utility model provides a novel quartz wafer processing is with carrying a set tool, includes the mounting panel and locates a plurality of station district on the mounting panel, and a plurality of the station district is the rectangle array, and is a plurality of the station district arranges for 31 rows 24 lines, wherein, each the maximum length in station district is 1mm, each the maximum width in station district is 2mm, adjacent two in each line interval between the station district is 3mm, adjacent two in each row the interval in station district is 4mm.

Preferably, both sides of the mounting plate are provided with at least one mounting hole for mounting the positioning pin.

Preferably, each station area comprises a material placing area, four corners of the material placing area are respectively provided with a material placing avoiding hole, each material placing avoiding hole is respectively provided with an air hole at the outer side, and two sides of the material placing area are respectively provided with a material clamping avoiding groove.

Preferably, each station area comprises a material placing area, the middle of the material placing area is provided with an air hole, and four included angle positions of the material placing area are respectively provided with a material clamping avoiding groove and a material placing avoiding hole.

Preferably, each station area comprises a material placing area, the middle of the material placing area is provided with an air hole, four included angle positions of the material placing area are respectively provided with a material placing avoiding hole, and two sides of the material placing area are respectively provided with a material clamping avoiding groove.

The technical scheme has the following advantages or beneficial effects:

the utility model discloses in improve through quantity, distribution mode and the structure to the station area on the year dish tool, in the middle of the function of machine platform, can not change the original structure of machine platform, not only have and play the same production effect with former tool, and for former tool (480 station tool), the utility model provides a year dish tool (744 station) can reduce 40% manual operation and trade a set time.

Drawings

Fig. 1 is a schematic structural view of a novel tray jig for quartz wafer processing of the present invention;

FIG. 2 is a first schematic structural view of a station area according to the present invention;

FIG. 3 is a second schematic structural view of the station area of the present invention;

fig. 4 is a third schematic structural diagram of the station area of the present invention.

In the figure: 1. mounting a plate; 2. mounting holes; 3. a station area; 31. a material discharge area; 32. discharging and avoiding holes; 33. air holes; 34. the material is clamped to avoid the groove.

Detailed Description

The technical solutions of the present invention will be described more clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the indicated orientation or positional relationship thereof is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, but does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" as appearing herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

FIG. 1 is a schematic structural view of a novel tray jig for quartz wafer processing according to the present invention; fig. 2 is a first schematic structural view of a station area according to the present invention; fig. 3 is a second structural schematic diagram of the station area of the present invention; fig. 4 is a third schematic structural diagram of the station area of the present invention. Referring to fig. 1 to 4, a preferred embodiment of the present invention is shown, which illustrates a novel tray fixture for processing a quartz wafer, including a mounting plate 1 and a plurality of station areas 3 disposed on the mounting plate 1, wherein the station areas 3 are rectangular arrays, and the station areas 3 are arranged in 31 rows and 24 columns, wherein the maximum length of each station area 3 is 1mm, the maximum width of each station area 3 is 2mm, the distance between two adjacent station areas 3 in each row is 3mm, and the distance between two adjacent station areas 3 in each column is 4mm. In this embodiment, referring to fig. 1, a total of 744 station areas 3 are provided on the mounting board 1, and the 744 station areas 3 are arranged in 31 rows and 24 rows, and the two station areas 3 in each row or each column have the same structure, the same pitch, and the same size. The utility model provides a carrier disc tool is 744 station tool, for the 480 station tools among the prior art, the utility model provides an 744 station tool station interval is less, the station number is more, and evenly intensive respectively, can improve the utilization ratio of tool, can reduce the functioning speed of manual operation trade a set time and board.

Further, as a preferred embodiment, at least one mounting hole 2 for mounting a positioning pin is formed on both sides of the mounting plate 1. In this embodiment, be equipped with the locating pin in mounting hole 2, can the field application in processes such as some glue, fine setting, seal welding.

Further, as a preferred embodiment, each station area 3 includes a material placing area 31, four corners of the material placing area 31 are respectively provided with a material placing avoiding hole 32, an outer side of each material placing avoiding hole 32 is respectively provided with an air hole 33, and two sides of the material placing area 31 are respectively provided with a material clamping avoiding groove 34. Referring to fig. 2, what fig. 2 shows is that the utility model provides a station district 3's first structure, it mainly uses on the point gum plate in the process of gluing, when should glue on the point gum plate, five equal or different mounting holes 2 in aperture have all been seted up to each side in the both sides of mounting panel 1 for the same size of adaptation or not unidimensional locating pin, and fix on the point gum plate through the locating pin.

Further, as a preferred embodiment, each station area 3 includes a material placing area 31, an air hole 33 is formed in the middle of the material placing area 31, and a material clamping avoiding groove 34 and a material placing avoiding hole 32 are respectively formed at four included angles of the material placing area 31. Referring to fig. 3, fig. 3 shows a second structure of a station area 3, which is mainly applied to a sealing pad in a sealing process, where only one mounting hole 2 is provided on each of two sides of a mounting board 1, and the mounting board 1 is fixed on the sealing pad by a positioning pin penetrating through the mounting hole 2.

Further, as a preferred embodiment, each station area 3 includes a material placing area 31, an air hole 33 is formed in the middle of the material placing area 31, material placing avoiding holes 32 are formed in four included angle positions of the material placing area 31, and material clamping avoiding grooves 34 are formed in two sides of the material placing area 31. Referring to fig. 4, fig. 4 shows a third structure of the station area 3, which is mainly applied to a fine adjustment plate in a fine adjustment process, and at this time, three mounting holes 2 having the same or different apertures are formed in each of two sides of the mounting plate 1, and used for mounting positioning pins, and the mounting pins are fixed on the fine adjustment plate through the positioning pins.

The arranged material placing area 31 is an area where a product is placed when the product is processed in each process, and the arranged material placing avoiding holes 32 can prevent the product from being blocked obliquely when the material is placed, or prevent the product from colliding with corners when the material is taken, so that the product can be protected. The air holes 33 can prevent the product and the jig from being attached or difficult to take materials due to vacuum, so that the air holes 33 are reserved; the air holes 33 are arranged through the mounting plate 1, and the material-discharging avoiding holes 32 may or may not be arranged through the mounting plate 1. The material clamping avoiding groove 34 is arranged, so that the tweezers are required to be used for discharging during manual operation, the interference of the tweezers and the discharging area 31 can be avoided, and the product can be conveniently and smoothly placed in the discharging area 31. The material placing area 31 is slightly recessed from the inner side of the mounting plate 1 on the mounting plate 1, and the material placing area 31 may be a shallow groove. The depths of the material placing avoiding holes 32, the air holes 33 and the material clamping avoiding grooves 34 are all larger than the depth of the material placing area 31.

The following description is only the way of the station area 3 of the disc loading jig of the present invention, and does not limit the protection scope of the present invention.

In this embodiment, the maximum length of the station area 3 is 1mm, the maximum width of the station area 3 is 2mm, the transverse interval is 3mm, and the longitudinal interval is 4mm. And the station is divided into a plurality of working stations, and the working interaction of the jig, the mechanical arm of each working station, the movement device and the induction device is calculated on the premise that the working stations are compatible with the working stations, so that specific data of 1mm, 2mm, 3mm and 4mm are obtained.

In this embodiment, in the fine tuning process of the wafer by the fine tuning machine, the ion gun emits ions to bombard the wafer to achieve the purpose of ion etching, the maximum width of the station area 3 can be obtained by accelerating the gate width of the ion gun to 2mm, the maximum length of the station area 3 can be obtained by the limit working position of the fine tuning machine to 1mm, and the number of station arrays can be obtained as 31 (the number of single fine tuning) × 24 (the maximum station length/the length of a single base) according to the number of single fine tuning wafers and the size of the base of the fine tuning machine.

In this embodiment, the tray-carrying jig of the present invention can be divided into a dispensing jig (corresponding to fig. 2), a trimming jig (corresponding to fig. 4) and a sealing jig (corresponding to fig. 3) in detail according to different processes. Except the above standards, the trimming machine calculates the size of the outer frame of the trimming jig (the size of the mounting plate 1) through the size of the original trimming tray of the machine table, and determines the position of the mounting hole 2 of the positioning pin of the trimming jig through the position of the positioning pin carried by the trimming tray. Besides the above standards, the dispenser can obtain the outer dimension range (the dimension of the mounting plate 1) of the jig by referring to the dimension of the original dispensing clip, the maximum length of the jig is obtained through the limit value of the feeding inductor, and the mounting hole 2 which is used for mounting the positioning pin and has the same position with the fine adjustment plate is reserved in the marginal blank area to be matched with the special switching plate so as to achieve the purpose of jig switching. Seal and weld the board as the example, the original size of seal and weld the board can satisfy the utility model discloses a station arrangement, nevertheless because other tool size changes, need cooperate the central locating pin that has the same position in order to reach the purpose of switching the tool.

In this embodiment, taking the dispenser as an example, the receiving cartridge clip of the dispenser can load 10 jigs, the original 480-station jig is manually changed for 22 times/station every day, and the former is changed for 14 times/station after 744 stations, so that the tray changing time of manual operation is reduced by 40%.

The above description is only an example of the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and those skilled in the art should be able to realize the equivalent alternatives and obvious variations of the present invention.

Claims

1. The utility model provides a novel quartz wafer processing is with carrying a set tool, its characterized in that includes the mounting panel and locates a plurality of station district on the mounting panel, and a plurality of the station district is the rectangle array, and is a plurality of the station district is arranged and is 31 lines 24, wherein, each the maximum length in station district is 1mm, each the maximum width in station district is 2mm, adjacent two in each line interval between the station district is 3mm, adjacent two in each line the interval in station district is 4mm.

2. The novel carrier plate jig for processing the quartz wafers as claimed in claim 1, wherein both sides of the mounting plate are provided with at least one mounting hole for mounting a positioning pin.

3. The novel carrying tray jig for processing the quartz wafers as claimed in claim 1, wherein each of the station areas comprises a material placing area, four corners of the material placing area are respectively provided with a material placing avoiding hole, an air hole is respectively arranged outside each of the material placing avoiding holes, and two sides of the material placing area are respectively provided with a material clamping avoiding groove.

4. The novel carrier plate jig for processing the quartz wafers as claimed in claim 3, wherein each station area comprises a material placing area, the middle part of the material placing area is provided with an air hole, and four included angle positions of the material placing area are respectively provided with a material clamping avoiding groove and one material placing avoiding hole.

5. The novel carrier plate jig for processing the quartz wafers as claimed in claim 1, wherein each station area comprises a material placing area, the middle of the material placing area is provided with an air hole, each of four included angle positions of the material placing area is provided with a material placing avoiding hole, and two sides of the material placing area are respectively provided with a material clamping avoiding groove.