CN218884340U - Semiconductor temperature control device - Google Patents
Semiconductor temperature control device Download PDFInfo
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- CN218884340U CN218884340U CN202223092614.6U CN202223092614U CN218884340U CN 218884340 U CN218884340 U CN 218884340U CN 202223092614 U CN202223092614 U CN 202223092614U CN 218884340 U CN218884340 U CN 218884340U
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Abstract
The utility model relates to a temperature control device technical field specifically is a semiconductor temperature control device, including the ceramic plate right side be equipped with the semiconductor hot junction, semiconductor cold junction and semiconductor hot junction clamp are in the ceramic plate inboard, the hot conduction fence clamp is in the semiconductor hot junction outside, semiconductor cold junction and semiconductor hot junction are symmetrical about the axis of ceramic plate, the support is equipped with four, the support below is equipped with the floor, the floor below is equipped with the slipmat, heat exchange module passes through bolted connection on the frame, heat exchange module's axis and frame axis coincide, through the bonding of heat-conducting colloid between heat exchange module and the cold heat transfer board, the capping passes through bolted connection above the frame, the capping below contacts with the ceramic plate, the supporting seat is equipped with four, the fan passageway is equipped with two, the fan passageway is symmetrical about the axis of connector, the motor is installed on the frame; the semiconductor temperature control device has the advantages of high heat conduction efficiency, good effect and easy disassembly and assembly maintenance.
Description
Technical Field
The utility model relates to a temperature control device technical field specifically is a semiconductor temperature control device.
Background
The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. Its advantages are no slide part, limited space, high reliability and no pollution of refrigerant. By using the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, and the aim of refrigeration can be fulfilled.
Most of the prior semiconductor temperature control devices have the problems of low heat transfer efficiency and difficult disassembly and assembly maintenance, and the reason is that the prior semiconductor temperature control devices only use a solid heat conduction mode and have low heat transfer efficiency to the atmosphere, and the prior semiconductor temperature control devices are not provided with a channel for disassembly and assembly maintenance.
Therefore, the utility model provides a semiconductor temperature control device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor temperature control device has the heat conduction efficiency height, and is effectual, and the problem among the prior art has been solved to the advantage of easy dismouting maintenance.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor temperature control device, includes the frame, frame the place ahead is equipped with the display screen, the display screen right side is equipped with control button, the frame below is equipped with the support, the frame right side is equipped with the fan passageway, fan passageway inboard is equipped with the flabellum, fan passageway right side is equipped with the connector, the frame top is equipped with the capping, the frame left side is equipped with heat exchange module, heat exchange module right side is equipped with the cold heat transfer board, cold heat transfer board right side is equipped with cold heat conduction fence, the display screen rear is equipped with control module, the control module rear is equipped with the line module, the flabellum is installed on the fan shaft, the fan shaft is installed on the motor, the motor left side is equipped with the air-out passageway, air-out passageway left side is equipped with heat conduction board, heat conduction board left side is equipped with heat conduction fence, heat conduction fence left side is equipped with the ceramic plate.
Preferably, the inner side of the cold heat conduction fence is provided with a semiconductor cold end, the inner side of the heat conduction fence is provided with a semiconductor hot end, and supporting seats are arranged below the two sides of the semiconductor cold end and the two sides of the semiconductor hot end.
Preferably, the left side of the ceramic plate is provided with a semiconductor cold end, the right side of the ceramic plate is provided with a semiconductor hot end, and the semiconductor cold end and the semiconductor hot end are clamped on the inner side of the ceramic plate.
Preferably, the cold heat conduction fence is clamped on the outer side of the cold end of the semiconductor, the hot heat conduction fence is clamped on the outer side of the hot end of the semiconductor, and the cold end of the semiconductor and the hot end of the semiconductor are symmetrical about the central axis of the ceramic plate.
Preferably, the number of the supports is four, a floor is arranged below the supports, and a non-slip mat is arranged below the floor.
Preferably, the heat exchange module is connected to the frame through a bolt, a central axis of the heat exchange module coincides with a central axis of the frame, and the heat exchange module and the cold heat transfer plate are bonded through a heat-conducting colloid.
Preferably, the capping cover is connected to the upper portion of the frame through bolts, the lower portion of the capping cover is in contact with the ceramic plate, and the number of the supporting seats is four.
Preferably, there are two fan channels, the fan channels are symmetrical about a central axis of the connector, and the motor is mounted on the frame.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model has reasonable structural design, is a semiconductor temperature control device, which comprises a frame, a display screen is arranged in front of the frame, a control button is arranged on the right side of the display screen, a bracket is arranged below the frame, a fan channel is arranged on the right side of the frame, fan blades are arranged on the inner side of the fan channel, a connector is arranged on the right side of the fan channel, a sealing cover is arranged above the frame, a heat exchange module is arranged on the left side of the frame, a cold heat transfer plate is arranged on the right side of the cold heat transfer plate, a cold heat conduction fence is arranged on the right side of the cold heat transfer plate, a control module is arranged behind the display screen, a connecting line module is arranged behind the control module, the fan blades are arranged on a fan shaft, the fan shaft is arranged on a motor, an air outlet channel is arranged on the left side of the motor, a heat conduction plate is arranged on the left side of the air outlet channel, a heat conduction plate is arranged on the left side of the heat conduction fence, a ceramic plate is arranged on the left side of the heat conduction fence, which is beneficial to ensuring the rationality of the device and protecting the safety of a user, the inner side of the cold heat conduction fence is provided with a semiconductor cold end, the inner side of the heat conduction fence is provided with a semiconductor hot end, supporting seats are arranged below the two sides of the semiconductor cold end and the semiconductor hot end, the left side of the ceramic plate is provided with the semiconductor cold end, the right side of the ceramic plate is provided with the semiconductor hot end, the semiconductor cold end and the semiconductor hot end are clamped inside the ceramic plate, the cold heat conduction fence is clamped outside the semiconductor cold end, the heat conduction fence is clamped outside the semiconductor hot end, the semiconductor cold end and the semiconductor hot end are symmetrical about the central axis of the ceramic plate, the heat transfer efficiency of the device is improved, four supports are arranged, a floor is arranged below each support, a non-slip mat is arranged below each floor, a heat exchange module is connected to a frame through bolts, the central axis of each heat exchange module is superposed with the central axis of the frame, the heat exchange module is bonded with the cold heat transfer plate through heat conduction glue, and a top sealing cover is connected to the upper side of the frame through bolts, the top sealing cover below contacts with the ceramic plate, and the supporting seat is equipped with four, and the fan passageway is equipped with two, and the fan passageway is symmetrical about the axis of connector, and the motor is installed on the frame, is favorable to carrying out inspection and maintenance to the device, conveniently carries out the dismouting and changes.
Drawings
Fig. 1 is an overall schematic view of a semiconductor temperature control device according to the present invention;
fig. 2 is a schematic top view of a semiconductor temperature control device according to the present invention;
FIG. 3 is a schematic front sectional view of a semiconductor temperature control device according to the present invention;
fig. 4 is a schematic side view of the semiconductor temperature control device of the present invention.
In the figure: 1. a frame; 2. a support; 3. a display screen; 4. a control button; 5. a fan channel; 6. a fan blade; 7. a connector; 8. a capping cover; 9. a cold heat conducting fence; 10. a heat exchange module; 11. a cold heat transfer plate; 12. a control module; 13. a wiring module; 14. a heat transfer plate; 15. a thermally conductive barrier; 16. a fan shaft; 17. a motor; 18. an air outlet channel; 19. a semiconductor hot end; 20. a ceramic plate; 21. a semiconductor cold end; 22. a supporting seat; 23. coating a floor; 24. provided is a non-slip mat.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Example 1:
referring to fig. 1-4, a semiconductor temperature control device comprises a frame 1, a display screen 3 is arranged in front of the frame 1, a control button 4 is arranged on the right side of the display screen 3, a support 2 is arranged below the frame 1, a fan channel 5 is arranged on the right side of the frame 1, fan blades 6 are arranged on the inner side of the fan channel 5, a connector 7 is arranged on the right side of the fan channel 5, a seal cover 8 is arranged above the frame 1, a heat exchange module 10 is arranged on the left side of the frame 1, a cold heat transfer plate 11 is arranged on the right side of the heat exchange module 10, a cold heat conduction fence 9 is arranged on the right side of the cold heat transfer plate 11, a control module 12 is arranged behind the display screen 3, a connecting wire module 13 is arranged behind the control module 12, the fan blades 6 are arranged on a fan shaft 16, the fan shaft 16 is arranged on a motor 17, an air outlet channel 18 is arranged on the left side of the motor 17, a heat conduction plate 14 is arranged on the left side of the air outlet channel 18, a heat conduction fence 15 is arranged on the left side of the heat conduction plate 14, and a heat conduction fence 15 is arranged on the left side of the heat conduction fence 15, a ceramic plate 20 is arranged on the left side of the heat conduction fence 15, which is beneficial to ensuring the rationality of the ceramic plate device and protecting the safety of the user;
the inner side of the cold heat conduction fence 9 is provided with a semiconductor cold end 21, the inner side of the heat conduction fence 15 is provided with a semiconductor hot end 19, a support seat 22 is arranged below the two sides of the semiconductor cold end 21 and the semiconductor hot end 19, the left side of the ceramic plate 20 is provided with the semiconductor cold end 21, the right side of the ceramic plate 20 is provided with the semiconductor hot end 19, the semiconductor cold end 21 and the semiconductor hot end 19 are clamped on the inner side of the ceramic plate 20, the cold heat conduction fence 9 is clamped on the outer side of the semiconductor cold end 21, the heat conduction fence 15 is clamped on the outer side of the semiconductor hot end 19, and the semiconductor cold end 21 and the semiconductor hot end 19 are symmetrical about the central axis of the ceramic plate 20, so that the heat transfer efficiency of the device is improved;
The working principle is as follows: the utility model relates to a semiconductor temperature control device, during the use, at first place the device on the plane that needs used, through 4 starting drive of control button, through 3 viewing device operating condition of display screen, blow to heat transfer plate 14 through flabellum 6, with higher speed heat transfer plate 14's cooling process for semiconductor hot junction 19 and semiconductor cold junction 21 reach the temperature that needs fast, and capping lid 8 conveniently carries out the dismouting change through the bolt mounting on frame 1.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, it will be obvious to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A semiconductor temperature control device comprises a frame (1), and is characterized in that: the solar heat-transfer plate is characterized in that a display screen (3) is arranged in front of a frame (1), a control button (4) is arranged on the right side of the display screen (3), a support (2) is arranged below the frame (1), a fan channel (5) is arranged on the right side of the frame (1), fan blades (6) are arranged on the inner side of the fan channel (5), a connector (7) is arranged on the right side of the fan channel (5), a sealing cover (8) is arranged above the frame (1), a heat exchange module (10) is arranged on the left side of the frame (1), a cold heat transfer plate (11) is arranged on the right side of the heat exchange module (10), a cold and heat-conducting fence (9) is arranged on the right side of the cold and heat transfer plate (11), a control module (12) is arranged behind the display screen (3), a connecting wire module (13) is arranged behind the control module (12), the fan blades (6) are arranged on a fan shaft (16), the fan shaft (16) is arranged on a motor (17), an air outlet channel (18) is arranged on the left side of the motor (17), a heat-conducting plate (14) is arranged on the left side of the air outlet channel (18), a heat-conducting plate (14), a heat-conducting plate (15) is arranged on the left side of the heat-conducting plate (15), and a ceramic plate (20).
2. A semiconductor temperature control device according to claim 1, characterized in that: the semiconductor cold end (21) is arranged on the inner side of the cold heat conduction fence (9), the semiconductor hot end (19) is arranged on the inner side of the hot heat conduction fence (15), and supporting seats (22) are arranged below the two sides of the semiconductor cold end (21) and the semiconductor hot end (19).
3. The semiconductor temperature control device according to claim 1, wherein: the semiconductor cold end (21) is arranged on the left side of the ceramic plate (20), the semiconductor hot end (19) is arranged on the right side of the ceramic plate (20), and the semiconductor cold end (21) and the semiconductor hot end (19) are clamped on the inner side of the ceramic plate (20).
4. A semiconductor temperature control device according to claim 1, characterized in that: the cold heat conduction fence (9) is clamped outside the semiconductor cold end (21), the hot heat conduction fence (15) is clamped outside the semiconductor hot end (19), and the semiconductor cold end (21) and the semiconductor hot end (19) are symmetrical about the central axis of the ceramic plate (20).
5. The semiconductor temperature control device according to claim 1, wherein: the number of the supports (2) is four, a floor (23) is arranged below the supports (2), and anti-skid pads (24) are arranged below the floor (23).
6. The semiconductor temperature control device according to claim 1, wherein: the heat exchange module (10) is connected to the frame (1) through bolts, the central axis of the heat exchange module (10) coincides with the central axis of the frame (1), and the heat exchange module (10) and the cold heat transfer plate (11) are bonded through heat-conducting colloid.
7. A semiconductor temperature control device according to claim 2, characterized in that: the capping (8) is connected above the frame (1) through bolts, the capping (8) is in contact with the ceramic plate (20) below, and the supporting seat (22) is provided with four.
8. A semiconductor temperature control device according to claim 1, characterized in that: fan passageway (5) are equipped with two, fan passageway (5) are symmetrical about the axis of connector (7), motor (17) are installed on frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223092614.6U CN218884340U (en) | 2022-11-17 | 2022-11-17 | Semiconductor temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223092614.6U CN218884340U (en) | 2022-11-17 | 2022-11-17 | Semiconductor temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218884340U true CN218884340U (en) | 2023-04-18 |
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ID=85956103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223092614.6U Active CN218884340U (en) | 2022-11-17 | 2022-11-17 | Semiconductor temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218884340U (en) |
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2022
- 2022-11-17 CN CN202223092614.6U patent/CN218884340U/en active Active
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