CN218883922U - Heat dissipation mechanism of high-power LED lamp - Google Patents
Heat dissipation mechanism of high-power LED lamp Download PDFInfo
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- CN218883922U CN218883922U CN202223467881.7U CN202223467881U CN218883922U CN 218883922 U CN218883922 U CN 218883922U CN 202223467881 U CN202223467881 U CN 202223467881U CN 218883922 U CN218883922 U CN 218883922U
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Abstract
The utility model provides a high-power LED lamps and lanterns heat dissipation mechanism belongs to daily lighting technology field. This kind of high-power LED lamps and lanterns heat dissipation mechanism, including LED lamps and lanterns body, LED lamps and lanterns body includes the shell body, the inside of shell body is provided with cooling body, cooling body includes the heat-conducting plate, the heat-conducting plate sets up in inside one side of shell body, one side of heat-conducting plate is inserted and is equipped with the semiconductor refrigeration piece, the opposite side fixed mounting of heat-conducting plate has the heat pipe, and the heat pipe is the rotatory distribution of circle, one side fixed mounting of heat pipe has the cooler bin, the both ends of heat pipe are equallyd divide do not communicate with each other with the both ends of cooler bin, inside one side fixed mounting of cooler bin has micropump machine, micropump machine's output communicates with each other with the one end of heat pipe, the lamp plate is installed in the inside one side that is close to the semiconductor refrigeration piece of shell body, a plurality of LED lamp pearls are installed to one side of lamp plate, the utility model discloses, can effectively improve the radiating effect of high-power LED lamps and lanterns, and has higher use value.
Description
Technical Field
The utility model relates to a daily lighting technology field particularly, relates to a high-power LED lamps and lanterns heat dissipation mechanism.
Background
Although the LED light source is a cold light source, a certain amount of heat can be generated when the LED light source is electrified, about 80% of electric energy is converted into heat energy when the LED works, 20% of electric energy is converted into light energy, the ambient temperature of the LED chip is in inverse proportion to the light-emitting rate when the LED chip works, the stable working temperature range of the LED is-40-80 ℃, the light-emitting rate is lower when the temperature is higher, and the LED can be damaged when the temperature reaches the highest using temperature of the LED chip.
Publication No.: CN206430067U is a radiator of a high-power LED lamp, which specifically comprises a radiating base, an aluminum substrate and a fan, wherein the radiating base is in a round table shape, two ends of the radiating base are communicated, the radiating base is streamline outside, the radiating structure is designed, the size of the upper part of the radiating base is smaller than that of the lower part of the radiating base, the fan is fixed in the concave part of the radiating base, the lower edge of the fan does not exceed the lower edge of the radiating base, a power supply of the fan is connected into a hole formed in the upper part of the radiating base, when a switch of the LED lamp is turned on, the power supply of the fan is conducted, the fan starts to work, convection of internal air is enhanced, and the heat productivity of the LED lamp is effectively reduced. The aluminum substrate is matched with the lower part of the base in size and is fixed on the base, and the aluminum substrate is mainly used for fixing the LED lamp and conducting heat;
through the mutual cooperation of heat dissipation base and fan among the technical scheme that this scheme recorded, utilize the air convection to improve the radiating effect of high-power LED lamp, but along with the continuous use of high-power LED lamp for the lamp shade and the inside lamp plate of high-power LED lamp all will bear a large amount of heats, only rely on the continuity use that fan and heat dissipation base can't guarantee high-power LED lamp. Therefore, we improve this, and propose a heat dissipation mechanism for high power LED lamp.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the embodiment of the utility model provides a high-power LED lamps and lanterns heat dissipation mechanism specifically realizes through following technical scheme:
the utility model provides a high-power LED lamps and lanterns heat dissipation mechanism, includes LED lamps and lanterns body, LED lamps and lanterns body includes the shell body, the inside of shell body is provided with cooling body, cooling body includes the heat-conducting plate, the heat-conducting plate sets up in inside one side of shell body, one side of heat-conducting plate is inserted and is equipped with the semiconductor refrigeration piece, the opposite side fixed mounting of heat-conducting plate has the heat pipe, just the heat pipe is the spiral rotation distribution, one side fixed mounting of heat pipe has the cooler bin, the both ends of heat pipe are equallyd divide and are communicated with each other with the both ends of cooler bin respectively, inside one side fixed mounting of cooler bin has the micropump machine, the output of micropump machine communicates with each other with the one end of heat pipe, the lamp plate is installed in one side that is close to the semiconductor refrigeration piece to the shell body is inside, a plurality of LED lamp pearls are installed to one side of lamp plate.
The beneficial effect of adopting above-mentioned further scheme is, through the internally mounted heat-conducting plate at the shell body, and insert and establish the semiconductor refrigeration piece in one side of heat-conducting plate, utilize the refrigerated principle of cold junction in the work of semiconductor refrigeration piece, cool down the lamp plate, and the inside temperature of shell body, and along with the refrigeration of semiconductor refrigeration piece cold junction, the temperature that its hot junction gived off cools down through the heat pipe, further improve the refrigeration effect of semiconductor refrigeration piece cold junction, the heat pipe communicates with each other with the cooler bin, utilize the micropump machine of cooler bin internally mounted, replace the coolant liquid that the inside packing of cooler bin with the coolant liquid that the inside packing of heat pipe, and then make coolant liquid circulate and flow between heat pipe and cooler bin, and then give off the heat of semiconductor refrigeration piece and heat-conducting plate transmission, and then reduce the inside temperature of shell body and the temperature of lamp plate.
Furthermore, a plurality of heat dissipation fins are fixedly mounted on one side of the outer shell, and a cooling mechanism is arranged on one side of each heat dissipation fin.
Adopt above-mentioned further scheme's beneficial effect to be, further improve the heat dissipation cooling effect to the outer casing.
Further, cooling mechanism includes a pair of mounting groove, and is a pair of the mounting groove is seted up respectively in a plurality of heat radiation fins's both ends, the equal fixed mounting in inside of mounting groove has the heat dissipation fan.
Adopt above-mentioned further scheme's beneficial effect to be, through the installation heat dissipation fan, cool down to the inside of outer casing.
Further, the inside one side of heat dissipation fan is equal fixed mounting has the motor, one side output pot head of motor is equipped with the flabellum.
Adopt above-mentioned further scheme's beneficial effect is, through the installation motor, drive the flabellum rotation when making its work.
Furthermore, a plurality of air holes are formed in the upper end and the lower end of one side of the outer shell, and the air holes are symmetrically formed among the plurality of radiating fins.
Adopt above-mentioned further scheme's beneficial effect to be, through the installation gas pocket, make things convenient for the inside circulation of air of shell body, discharge steam.
Further, the heat conducting plate, the radiating fins and the heat conducting pipe are made of brass.
Adopt above-mentioned further scheme's beneficial effect to be, through setting up heat-conducting plate, heat radiation fins and heat pipe into brass, utilize the characteristic of brass, improve the heat conduction effect, further improve the heat exchange efficiency to the shell body is inside.
Furthermore, the cooling box and the heat conduction pipe are both filled with cooling liquid, and the cooling liquid is glycol type coolant.
The cooling liquid has the beneficial effect that the cooling liquid has good cooling effect by setting the cooling liquid as the glycol type cooling agent.
Further, one side of the outer shell is embedded with a lampshade, and the lampshade is made of glass.
Adopt above-mentioned further scheme's beneficial effect to be, through setting up the lamp shade into the glass material, make it have good light transmissivity and high temperature resistant effect.
Furthermore, one side of the shell body is rotatably connected with a support, and a groove is formed in the center of one side of the support.
The beneficial effect who adopts above-mentioned further scheme is that, through rotating linking bridge, make it to support the outer casing, the person of facilitating the use uses, through seting up the recess in one side center department of support, the person of facilitating the use utilizes the recess to hang up LED lamps and lanterns body.
The utility model has the advantages that: the utility model discloses a high-power LED lamps and lanterns heat dissipation mechanism that above-mentioned design obtained, this kind of high-power LED lamps and lanterns heat dissipation mechanism, through the internally mounted heat-conducting plate at the shell body, and insert in one side of heat-conducting plate and establish the semiconductor refrigeration piece, the refrigerated principle of cold junction when utilizing the work of semiconductor refrigeration piece, cool down to the lamp plate, and reduce the inside temperature of shell body, along with the refrigeration of semiconductor refrigeration piece cold junction, the temperature that its hot junction gived off is cooled down through the heat pipe, further improve the refrigeration effect of semiconductor refrigeration piece cold junction, the heat pipe communicates with each other with the cooler bin, utilize the micropump machine of cooler bin internally mounted, replace the coolant liquid of the inside packing of cooler bin with the coolant liquid of the inside packing of heat pipe, and then make coolant liquid circulation flow between heat pipe and cooler bin, and then give off the heat of semiconductor refrigeration piece and heat-conducting plate transmission, and then reduce the temperature of the inside temperature of shell body and the temperature of lamp plate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a three-dimensional structure of a heat dissipation mechanism of a high-power LED lamp provided by the present invention;
fig. 2 is a schematic diagram of a three-dimensional structure of a heat dissipation mechanism of a high-power LED lamp provided by the present invention;
fig. 3 is a schematic three-dimensional structure diagram of a heat dissipation mechanism of a high-power LED lamp provided by the present invention;
fig. 4 is a schematic side sectional view of a heat dissipation mechanism of a high-power LED lamp provided by the present invention;
fig. 5 is a schematic front section view of a cooling box of a heat dissipation mechanism of a high-power LED lamp provided by the present invention.
In the figure: 100. an LED lamp body; 1001. an outer housing; 1002. a support; 1003. heat dissipation fins; 1004. a lamp panel; 1005. LED lamp beads; 1006. a groove; 1007. air holes; 1008. a lamp shade; 200. a cooling mechanism; 2001. mounting grooves; 2002. a heat dissipation fan; 2003. a motor; 2004. a fan blade; 300. a cooling mechanism; 3001. a heat conducting plate; 3002. a semiconductor refrigeration sheet; 3003. a heat conducting pipe; 3004. a cooling tank; 3005. a micro pump machine.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model relates to a high-power LED lamps and lanterns heat dissipation mechanism's embodiment one
The utility model provides a following technical scheme: as shown in fig. 1-5, a heat dissipation mechanism for a high power LED lamp comprises an LED lamp body 100, the LED lamp body 100 includes an outer housing 1001, a cooling mechanism 300 is disposed inside the outer housing 1001, the cooling mechanism 300 includes a heat conducting plate 3001, the heat conducting plate 3001 is disposed on one side of the outer housing 1001, a semiconductor refrigerating plate 3002 is inserted into one side of the heat conducting plate 3001, a heat conducting pipe 3003 is fixedly mounted on the other side of the heat conducting plate 3001, the heat conducting pipe 3003 is spirally distributed, a cooling box 3004 is fixedly mounted on one side of the heat conducting pipe 3003, two ends of the heat conducting pipe 3003 are equally divided into two ends respectively communicating with two ends of the cooling box 3004, a micro-pump 3005 is fixedly mounted on one side of the inner portion of the cooling box 3004, an output end of the micro-pump 3005 communicates with one end of the heat conducting pipe 3003, a lamp panel 1004 is mounted inside the outer housing 1001 on one side close to the semiconductor plate 3002, a plurality of LED lamp beads 1005 are installed on one side of the lamp panel 1004, a heat conducting plate 3001 is installed inside the outer shell 1001, a semiconductor refrigerating sheet 3002 is inserted on one side of the heat conducting plate 3001, the lamp panel 1004 is cooled by utilizing the principle of cold end refrigeration when the semiconductor refrigerating sheet 3002 works, the temperature inside the outer shell 1001 is reduced, the temperature emitted from the hot end of the semiconductor refrigerating sheet 3002 is reduced by the heat conducting pipe 3003 along with the refrigeration of the cold end of the semiconductor refrigerating sheet 3002, the refrigerating effect of the cold end of the semiconductor refrigerating sheet 3002 is further improved, the heat conducting pipe 3003 is communicated with the cooling box 3004, a micropump 3005 installed inside the cooling box 3004 is utilized to replace the cooling liquid filled inside the cooling box 3004 with the cooling liquid filled inside the heat conducting pipe 3003, so that the cooling liquid circularly flows between the heat conducting pipe 3003 and the cooling box 3004, and further the heat transferred by the semiconductor refrigerating sheet 3003 and the heat conducting plate 3001 is emitted, thereby reducing the temperature inside the outer housing 1001 and the temperature of the lamp panel 1004.
Embodiment two of high-power LED lamp heat dissipation mechanism
Referring to fig. 1 to 4, a plurality of heat dissipation fins 1003 are fixedly mounted on one side of an outer housing 1001, a cooling mechanism 200 is disposed on one side of the heat dissipation fins 1003, the cooling mechanism 200 includes a pair of mounting grooves 2001, the pair of mounting grooves 2001 are respectively disposed at two ends of the plurality of heat dissipation fins 1003, heat dissipation fans 2002 are fixedly mounted inside the mounting grooves 2001, motors 2003 are fixedly mounted on one sides of the heat dissipation fans 2002, fan blades 2004 are sleeved on output ends of one sides of the motors 2003, a plurality of air holes 1007 are respectively disposed at upper and lower ends of one side of the outer housing 1001, the air holes 1007 are symmetrically disposed between the plurality of heat dissipation fins 1003, the fan blades 2004 can be driven to rotate by the motors 2003 mounted inside the heat dissipation fans 2002, cold air is blown into the inner portion of the outer housing 1001 through acceleration of the fan blades 2004, so that a heat dissipation effect inside the outer housing 1001 is improved, and air blown in can be discharged from the air holes 1007 through the symmetrically disposed air holes 1007, so that hot air inside the outer housing 1001 can be blown out conveniently.
Embodiment three of the heat dissipation mechanism of the high-power LED lamp
Referring to fig. 1 to 5, the heat conducting plate 3001, the heat dissipating fins 1003 and the heat conducting pipe 3003 are made of brass, the cooling fluid is filled in the cooling box 3004 and the heat conducting pipe 3003, the cooling fluid is an ethylene glycol type coolant, the lampshade 1008 is embedded in one side of the housing 1001, the lampshade 1008 is made of glass, one side of the housing 1001 is rotatably connected with the bracket 1002, the groove 1006 is formed in the center of one side of the bracket 1002, the heat conducting plate 3001, the heat dissipating fins 1003 and the heat conducting pipe 3003 are made of brass, the heat conducting effect is improved by utilizing the characteristics of the brass, the heat exchange efficiency of the heat conducting plate to the inside of the housing 1001 is further improved, the cooling fluid is made of the ethylene glycol type coolant, the cooling fluid has a good cooling effect, the heat conducting plate 3001, the heat dissipating fins 1003 and the heat conducting pipe 3003 are made of brass by rotating the connecting bracket 1002, the use of a user is facilitated, the groove 1006 is formed in the center of one side of the bracket 1002, the user can hang the LED lamp body 100 by utilizing the groove 1006, and the lamp 1008 is made of glass, so that the lamp has a good light transmittance and a high temperature resistant effect.
Specifically, the working principle of the heat dissipation mechanism of the high-power LED lamp is as follows: when the LED lamp is used, firstly, the bracket 1002 is rotated to adjust the angle of the bracket to support the outer shell 1001, when the LED lamp body 100 is used, the lamp panel 1004 drives the lamp bead 1005 to emit light for illumination, when the lamp bead 1005 continuously emits light, the temperature inside the outer shell 1001 and the temperature of the lamp panel 1004 gradually rise, at the moment, the semiconductor refrigerating sheet 3002 and the heat dissipation fan 2002 simultaneously start to operate, the lamp panel 1004 is cooled by utilizing the principle that the cold end of the semiconductor refrigerating sheet 3002 works, the temperature inside the outer shell 1001 is reduced, the temperature emitted by the hot end of the semiconductor refrigerating sheet 3002 is cooled by the heat conduction pipe 3003 along with the refrigeration of the cold end of the semiconductor refrigerating sheet 3002, the refrigerating effect of the cold end of the semiconductor refrigerating sheet 3002 is further improved, the heat conduction pipe 3003 is communicated with the cooling box 3004, and the micro pump 3005 arranged inside the cooling box 3004 is utilized, replace the inside coolant liquid of filling of cooler bin 3004 with the inside coolant liquid of filling of heat pipe 3003, and then make the coolant liquid circulate and flow between heat pipe 3003 and cooler bin 3004, and then give off the heat of semiconductor refrigeration piece 3003 and heat-conducting plate 3001 transmission, and then reduce the inside temperature of shell body 1001 and the temperature of lamp plate 1004, and meanwhile, the motor 2003 of heat dissipation fan 2002 internally mounted can drive flabellum 2004 and rotate, it is rotatory through flabellum 2004, the air blows in the inside of shell body 1001 through the accelerated formation cold wind of flabellum 2004, and then improve the inside radiating effect of shell body 1001, and through the gas pocket 1007 that the symmetry was seted up, make the air current of blowing in can discharge from gas pocket 1007, and then be convenient for blow off the inside steam of shell body 1001.
It should be noted that specific model specifications of the motor 2003, the semiconductor chilling plate 3002 and the micro pump 3005 of the high-power LED lamp heat dissipation mechanism need to be determined by type selection according to actual specifications of the device, and a specific type selection calculation method adopts the prior art in the field, so detailed description is omitted.
The power supply and the principle of the motor 2003, the semiconductor cooling plate 3002 and the micropump 3005 of the heat dissipation mechanism of the high-power LED lamp are clear to those skilled in the art and will not be described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. The utility model provides a high-power LED lamps and lanterns heat dissipation mechanism, a serial communication port, including LED lamps and lanterns body (100), LED lamps and lanterns body (100) includes shell body (1001), the inside of shell body (1001) is provided with cooling mechanism (300), cooling mechanism (300) include heat-conducting plate (3001), heat-conducting plate (3001) set up in inside one side of shell body (1001), one side of heat-conducting plate (3001) is inserted and is equipped with semiconductor refrigeration piece (3002), the opposite side fixed mounting of heat-conducting plate (3001) has heat pipe (3003), just heat pipe (3003) are to circle to rotate the distribution, one side fixed mounting of heat pipe (3003) has cooler bin (3004), the both ends of heat pipe (3003) are equallyd divide and are respectively communicated with the both ends of cooler bin (3004), inside one side fixed mounting of cooler bin (3004) has micropump machine (3005), the output of micropump machine (3005) communicates with each other with the one end of heat pipe (3003), the inside one side of being close to one side of semiconductor refrigeration piece (3002) of shell body (1001) installs a plurality of lamp plate (1004).
2. The heat dissipation mechanism of a high power LED lamp as claimed in claim 1, wherein a plurality of heat dissipation fins (1003) are fixedly installed on one side of the outer housing (1001), and a cooling mechanism (200) is installed on one side of the heat dissipation fins (1003).
3. The heat dissipation mechanism of a high-power LED lamp according to claim 2, wherein the cooling mechanism (200) comprises a pair of mounting grooves (2001), the pair of mounting grooves (2001) are respectively formed at two ends of the plurality of heat dissipation fins (1003), and the inside of each mounting groove (2001) is fixedly provided with the heat dissipation fan (2002).
4. The heat dissipation mechanism for the high-power LED lamp as claimed in claim 3, wherein a motor (2003) is fixedly mounted on each side of the inside of the heat dissipation fan (2002), and fan blades (2004) are sleeved on an output end of one side of the motor (2003).
5. The heat dissipation mechanism of claim 4, wherein the upper end and the lower end of one side of the outer housing (1001) are both provided with a plurality of air holes (1007), and the plurality of air holes (1007) are symmetrically arranged between the plurality of heat dissipation fins (1003).
6. The heat dissipation mechanism for high power LED lamp as claimed in claim 1, wherein the heat conducting plate (3001), the heat dissipating fins (1003) and the heat conducting pipe (3003) are brass.
7. The heat dissipation mechanism for high power LED lamp as claimed in claim 1, wherein the cooling box (3004) and the heat pipe (3003) are both filled with a coolant, and the coolant is a glycol-type coolant.
8. The heat dissipation mechanism of a high-power LED lamp as claimed in claim 1, wherein a lampshade (1008) is embedded in one side of the outer housing (1001), and the lampshade (1008) is made of glass.
9. The heat dissipation mechanism for the high-power LED lamp according to claim 1, wherein a bracket (1002) is rotatably connected to one side of the outer housing (1001), and a groove (1006) is formed in the center of one side of the bracket (1002).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223467881.7U CN218883922U (en) | 2022-12-23 | 2022-12-23 | Heat dissipation mechanism of high-power LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223467881.7U CN218883922U (en) | 2022-12-23 | 2022-12-23 | Heat dissipation mechanism of high-power LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218883922U true CN218883922U (en) | 2023-04-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223467881.7U Active CN218883922U (en) | 2022-12-23 | 2022-12-23 | Heat dissipation mechanism of high-power LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218883922U (en) |
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- 2022-12-23 CN CN202223467881.7U patent/CN218883922U/en active Active
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