CN218880113U

CN218880113U - Electroplating device

Info

Publication number: CN218880113U
Application number: CN202122784207.0U
Authority: CN
Inventors: 郭健
Original assignee: Dongguan Dianjin Surface Treatment Co ltd
Current assignee: Dongguan Dianjin Surface Treatment Co ltd
Priority date: 2021-11-12
Filing date: 2021-11-12
Publication date: 2023-04-18
Anticipated expiration: 2031-11-12

Abstract

The utility model provides an electroplating device. The electroplating device comprises an electroplating cylinder, an electroplating anode, an electroplating vibrating disc and an electroplating cathode, wherein the electroplating cylinder is provided with an electroplating tank; the electroplating anode is arranged in the electroplating bath and comprises a first anode and a second anode, the first anode is annularly arranged on the bath wall of the electroplating bath, the plurality of second anodes are circumferentially arranged at intervals along the first anode and are opposite to each other in the radial direction of the first anode, and the second anodes are detachably connected with the first anode; the electroplating vibration disc comprises a cylinder body, the cylinder body is arranged in the first anode, a plurality of second anodes are annularly arranged on the periphery of the cylinder body, a containing groove is formed in the cylinder body, a drainage mesh is arranged on the cylinder body, and the drainage mesh is communicated with the containing groove and the electroplating bath; the electroplating cathode is arranged in the containing groove, and the drainage meshes are matched with the electroplating anode and the electroplating cathode to carry out electroplating on the article to be electroplated. The utility model discloses an electroplating device can solve current electroplating device and appear electroplating film thickness inhomogeneous problem because of structural design is unreasonable easily.

Description

Electroplating device

Technical Field

The utility model relates to the technical field of electroplating, in particular to an electroplating device.

Background

At present, an electroplating device is used for electroplating an article to be electroplated, wherein the electroplating is to plate a layer of metal or alloy on the surface of the article to be electroplated by utilizing the electrolysis principle, and the electroplating can enhance the corrosion resistance and hardness of the article to be electroplated and improve the conductivity, smoothness, heat resistance and the like of the article to be electroplated. At present, the existing electroplating device is unreasonable in structural design, so that the problem of uneven thickness of an electroplated film of an electroplated product can be caused, and the electroplating efficiency and the electroplating quality of a product to be electroplated are influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an electroplating device, which aims to solve the problem that the prior electroplating device is not uniform in thickness of the electroplating film easily due to unreasonable structural design.

In order to achieve the above object, the present invention provides an electroplating apparatus, which comprises:

the electroplating cylinder is provided with an electroplating tank, and the electroplating tank is used for containing electroplating solution;

the electroplating anode is arranged in the electroplating bath and comprises a first anode and a plurality of second anodes, the first anode is annularly arranged on the bath wall of the electroplating bath, the second anodes are distributed at intervals along the circumferential direction of the first anode and are opposite to each other along the radial direction of the first anode, and the second anodes are detachably connected with the first anode;

the electroplating vibration disc is arranged in the electroplating cylinder and comprises a cylinder body, the cylinder body is arranged in the first anode, the second anodes are annularly arranged on the periphery of the cylinder body, an accommodating groove is formed in the cylinder body and is used for accommodating a product to be electroplated, a drainage mesh is arranged on the cylinder body and is communicated with the accommodating groove and the electroplating bath; and

and the electroplating cathode is arranged in the accommodating groove, and the drainage meshes are matched with the electroplating anode and the electroplating cathode to electroplate the product to be electroplated.

In an embodiment, the electroplating tank includes a tank body, an outer contour of the tank body is cylindrically arranged, an inner portion of the tank body is hollow and an upper end of the tank body is provided with an opening to form the electroplating tank, a cross section of the electroplating tank along a horizontal direction is circularly arranged, an outer contour of the first anode is regular polygon arranged, the first anode includes a plurality of frame edges, the frame edges are enclosed to form a regular polygon, and each frame edge is provided with the second anode.

In one embodiment, the first anodes are symmetrically arranged, the second anodes are plate-shaped, the electroplating tank is provided with an axis, and the second anodes are arranged in parallel with the axis.

In one embodiment, the second anode is a titanium mesh plate, the titanium mesh plate is provided with a plurality of meshes, and the titanium mesh plate is connected with the frame edge through a bolt structure.

In an embodiment, the electroplating device further includes a heating pipe, the heating pipe is spirally arranged around a wall of the electroplating bath, a hollow cavity is formed on the heating pipe, and the barrel is arranged in the hollow cavity.

In one embodiment, the heating pipe comprises a connecting pipe and a spiral pipe, the connecting pipe is connected with the electroplating cylinder, the spiral pipe is formed by sequentially connecting a plurality of spiral coils, and the distance between every two adjacent spiral coils is equal.

In one embodiment, the spiral coil is a round tube, and the distance between the outer walls of the adjacent spiral coils is smaller than the outer diameter of the spiral coil; alternatively, the spacing between the outer walls of adjacent coils is less than half the outer diameter of the coil.

In an embodiment, the electroplating cylinder further comprises a cylinder cover, the cylinder cover comprises a fixed cover body and a movable cover body, the fixed cover body covers the opening, a first mounting hole is formed in the fixed cover body along the axial direction of the cylinder body, the movable cover body covers the first mounting hole, and the downward projection of the movable cover body falls into the electroplating bath.

In an embodiment, a plurality of second mounting holes are formed in the fixed cover body, the second mounting holes are sequentially arranged on the fixed cover body around the first mounting hole at intervals, an anode connecting piece is arranged in each second mounting hole, and the anode connecting piece is connected with the electroplating anode through a lead.

In one embodiment, the electroplating cylinder is provided with a vacuum discharge pipe communicated with the outside and the electroplating bath, the vacuum discharge pipe outside the electroplating cylinder is provided with a vacuum discharge valve, and the vacuum discharge valve is used for controlling the on-off of the vacuum discharge pipe.

The electroplating device of the utility model comprises an electroplating cylinder, an electroplating anode, an electroplating vibration disc and an electroplating cathode, wherein the electroplating cylinder is provided with an electroplating bath, the electroplating anode is arranged in the electroplating bath and comprises a first anode and a second anode, and the second anode is detachably connected with the first anode so as to be convenient for assembling and disassembling the electroplating anode; the first anode is in annular arrangement, the first anode ring is arranged on the groove wall of the electroplating bath, the second anodes are arranged along the circumferential interval of the first anode and are opposite to each other along the radial direction of the first anode, the electroplating vibration disc comprises a cylinder body, the cylinder body is arranged in the first anode, the second anode rings are arranged on the periphery of the cylinder body, the cylinder body is provided with a containing groove, the containing groove is used for containing a product to be electroplated, the cylinder body is provided with a drainage mesh communicated with the containing groove and the electroplating bath, the electroplating cathode is arranged in the containing groove, the drainage mesh is matched with the electroplating anode and the electroplating cathode to be electroplated, the product to be electroplated is arranged, when the product to be electroplated is electroplated, the current can be uniformly distributed on the first anode in annular arrangement, the problem of high and low potential difference on the first anode is avoided, the current can be uniformly distributed on the second anodes due to the fact that the second anodes are arranged along the radial direction of the first anode in a pair, the current is integrally uniformly distributed on the second anodes, the product to be electroplated is arranged between the second anodes, the first anode, the second anode is matched with the second anode, the second anode is uniformly acted on the product to be electroplated, the surface of the product to be electroplated, and the electroplating quality is beneficial to be electroplated. Therefore, the electroplating device is reasonable in structural design and arrangement, and can solve the problem that the thickness of the existing electroplating film is not uniform when an electroplating product is electroplated.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic view of an electroplating apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view of FIG. 1 at A;

FIG. 3 is a schematic cross-sectional view of the structure of FIG. 1;

FIG. 4 is an enlarged view at B in FIG. 3;

FIG. 5 is an enlarged view at C of FIG. 4;

FIG. 6 is a schematic view of a portion of the structure of FIG. 2;

fig. 7 is an enlarged view of fig. 6 at D.

The reference numbers indicate:

reference numerals	Name(s)	Reference numerals	Name (R)
				10	Electroplating device	220	A second anode
100	Electroplating cylinder	230	Fixing piece
				110	Cylinder body	300	Electroplating vibration disc
111	Electroplating bath	310	Barrel body
				120	Cylinder cover	311	Containing groove
121	Fixed cover body	320	Connecting rod
				1211	First mounting hole	400	Electroplating cathode
1212	Second mounting hole	500	Heating tube
				122	Movable cover body	510	Connecting pipe
200	Electroplating anode	520	Spiral tube
				210	A first anode	600	Anode connecting piece
211	Frame edge	700	Clamping part

The purpose of the present invention is to provide a novel and improved method and apparatus for operating a computer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front, and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indication is changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides an electroplating device.

Referring to fig. 1 to 4, in an embodiment of the electroplating apparatus 10 of the present invention, the electroplating apparatus 10 includes an electroplating cylinder 100, an electroplating anode 200, an electroplating vibration plate 300 and an electroplating cathode 400, the electroplating cylinder 100 is formed with an electroplating tank 111, and the electroplating tank 111 is used for containing electroplating solution; the electroplating anode 200 is disposed in the electroplating bath 111, the electroplating anode 200 includes a first anode 210 and a second anode 220, the first anode 210 is annularly disposed on a wall of the electroplating bath 111, a plurality of second anodes 220 are provided, the plurality of second anodes 220 are circumferentially spaced along the first anode 210 and are opposite to each other along a radial direction of the first anode 210, and the second anodes 220 are detachably connected with the first anode 210; the electroplating vibration disc 300 is arranged in the electroplating cylinder 100, the electroplating vibration disc 300 comprises a cylinder body 310, the cylinder body 310 is arranged in the first anode 210, the plurality of second anodes 220 are annularly arranged on the periphery of the cylinder body 310, an accommodating groove 311 is formed in the cylinder body 310, the accommodating groove 311 is used for accommodating a product to be electroplated, a drainage mesh is arranged on the cylinder body 310, and the drainage mesh is communicated with the accommodating groove 311 and the electroplating tank 111; the electroplating cathode 400 is arranged in the containing groove 311, and the drainage meshes are matched with the electroplating anode 200 and the electroplating cathode 400 to be used for electroplating the product to be electroplated.

Specifically, the plating cylinder 100 is provided with an inlet through which a plating solution can be supplied into the plating tank 111 of the plating cylinder 100; the plating cylinder 100 is also provided with a drain port which allows the used plating solution to be discharged to the outside, so as to facilitate replacement of the plating solution. Electroplating device 10 still is equipped with the controller, and the controller can be the PLC controller, and the PLC controller is connected with the power electricity, and the PLC controller is connected with electroplating positive pole 200 and electroplating negative pole 400 electricity respectively to make electroplating positive pole 200 and electroplating negative pole 400 can carry out the electrolytic reaction to the plating solution, and then make the cation of the metal of preplating in the plating solution come out at the surface deposition of treating the electroplating article, and then the realization is treated the electroplating of electroplating article.

Further, the first anode 210 is disposed annularly and is disposed annularly on a wall of the electroplating tank 111, that is, the first anode 210 is formed with a receiving cavity, the plurality of second anodes 220 are disposed at intervals along a circumferential direction of the first anode 210 and are opposite to each other along a radial direction of the first anode 210, so that the plurality of second anodes 220 are uniformly disposed on the first anode 210, and thus, when the electroplating apparatus 10 works, the current of the annularly disposed first anode 210 can be uniformly distributed, thereby avoiding a situation that the first anode 210 is disposed in a bar shape, two currents are high and the middle current is low, that is, avoiding a situation that the first anode 210 has a non-uniform current distribution and a potential difference, the current distribution is non-uniform and the potential difference occurs, which easily causes a non-uniform thickness of an electroplating film of an article to be electroplated, and affects electroplating efficiency and electroplating quality. It can be seen that the current distribution on the electroplating anode 200 is uniform by arranging the first anode 210 in a ring shape and uniformly distributing the second anode 220 on the first anode 210.

Further, be equipped with storage tank 311 in barrel 310, storage tank 311 is used for the dress to treat the electroplating article, electroplating cathode 400 locates in storage tank 311, the periphery of barrel 310 is located to a plurality of second positive poles 220 ring, first positive pole 210's holding intracavity is located to barrel 310 promptly, so set up, make the electric current of electroplating on the positive pole 200 can be even act on electroplating cathode 400, can be even act on treating the electroplating article in barrel 310 promptly, thereby ensured to treat that the electroplating film on electroplating article surface is thick even, the while still is favorable to improving electroplating efficiency and improving electroplating quality. It will be appreciated that the drain mesh communicates between the inside of the cylinder body 310 and the outside of the cylinder body 310, so that the plating liquid can pass from the accommodation tank 311 into the plating tank 111, thereby completing the exchange of the plating liquid in the cylinder body 310.

Further, the first anode 210 and the second anode 220 may be connected by a clamping structure, or may be connected by a bolt structure, which is not limited herein. The electroplating cathode 400 may be in the shape of a strip, a block, or other shapes, and is not limited herein. Electroplating vibration dish 300 still includes connecting rod 320 and vibration dish, barrel 310 is equipped with the opening towards one side of vibration dish, barrel 310 is the cavity setting in order to form storage tank 311, the one end of connecting rod 320 stretches into and with the interior wall connection of barrel 310 from the opening, the other end of connecting rod 320 is located outside barrel 310 and is connected with the vibration dish, the vibration dish can be driven by the driving piece and drive the waiting of electroplating article vibration in the barrel 310, the driving piece can be the vibrator, certainly can also be for other mechanisms, do not do the injecture specifically here, through the vibration of drive electroplating vibration dish, it is more even to be favorable to waiting the electroplating film thickness of electroplating article, it is better to electroplate the effect.

The electroplating device 10 of the utility model comprises an electroplating cylinder 100, an electroplating anode 200, an electroplating vibration disc 300 and an electroplating cathode 400, wherein the electroplating cylinder 100 is provided with an electroplating bath 111, the electroplating anode 200 is arranged in the electroplating bath 111, the electroplating anode 200 comprises a first anode 210 and a second anode 220, and the second anode 220 is detachably connected with the first anode 210 so as to be convenient for assembling and disassembling the electroplating anode 200; the first anode 210 is annularly arranged, the first anode 210 is annularly arranged on the wall of the electroplating bath 111, the second anodes 220 are circumferentially arranged at intervals along the first anode 210 and are opposite to each other along the radial direction of the first anode 210, the electroplating vibration disc 300 comprises a cylinder body 310, the cylinder body 310 is arranged in the first anode 210, the second anodes 220 are annularly arranged on the periphery of the cylinder body 310, the cylinder body 310 is provided with a containing groove 311, the containing groove 311 is used for containing a product to be electroplated, the cylinder body 310 is provided with a water drainage mesh, the water drainage mesh is communicated with the containing groove 311 and the electroplating bath 111, the electroplating cathode 400 is arranged in the containing groove 311, the water drainage mesh is matched with the electroplating anode 200 and the electroplating cathode 400 to be electroplated, the electroplating product to be electroplated is arranged in such a way that when the product to be electroplated is electroplated, the current can be uniformly distributed on the first anode 210 which is annularly arranged, the problem of high-low potential difference of the current on the first anode 210 is avoided, and the second anodes 220 are oppositely arranged along the radial direction of the first anode 210, so that the current is uniformly distributed on the second anodes 220, and the second anodes 220 are uniformly distributed, and the electroplating quality of the electroplating product to be electroplated is improved, and the electroplating film thickness of the electroplating product to be electroplated. Therefore, the electroplating device 10 is reasonable in structural design and arrangement, and can solve the problem that the thickness of the existing electroplating film is not uniform when an article to be electroplated is electroplated.

Referring to fig. 4 to 7, in an embodiment, the plating cylinder 100 includes a cylinder body 110, an outer contour of the cylinder body 110 is disposed in a cylindrical shape, an inner portion of the cylinder body 110 is disposed in a hollow shape, an upper end of the cylinder body is provided with an opening to form the plating tank 111, a cross section of the plating tank 111 along a horizontal direction is disposed in a circular shape, an outer contour of the first anode 210 is disposed in a regular polygon shape, the first anode 210 includes a plurality of frame edges 211, the plurality of frame edges 211 are enclosed to form the regular polygon shape, and each of the frame edges 211 is provided with the second anode 220.

It can be understood that, the outer contour of the cylinder body 110 is cylindrical, when the cylinder body 110 is vacuumized, the external pressure can act on the outer wall of the cylinder body 110, and the circular outer wall is favorable for dispersing the pressure, so that the pressure applied to the outer peripheral wall is the same, the cylinder body 110 is uniformly stressed and is not easy to break, and the bearing strength of the cylinder body 110 is improved. The cylinder body 110 can be an integral structure, no welding gap exists on the cylinder body 110, the problem of deformation or fracture caused by the welding gap is avoided, and the reliability of the electroplating cylinder 100 is improved.

Further, the first anode 210 is disposed in a regular polygon shape, and each frame edge 211 is disposed with a second anode 220, such that the plurality of second anodes 220 can be uniformly disposed on the first anode 210, and the current on the electroplating anode 200 as a whole can be uniformly distributed. And, a plurality of frame borders 211 of first anode 210 enclose and close and form regular polygon, when installing a plurality of second anodes 220, only need to install a second anode 220 respectively in the preset position of every frame border 211, can make a plurality of second anodes 220 even distribution on first anode 210, so ensured that the electric current on electroplating anode 200 can evenly distributed, still make things convenient for the inspection simultaneously, the condition of second anode 220 neglected loading or misloading has been avoided taking place, the convenience and the reliability of second anode 220 installation have been improved, the structure of electroplating anode 200 has been optimized, the stability of electroplating anode 200 has been ensured.

In an embodiment, the first anodes 210 are symmetrically disposed, the second anodes 220 are disposed in a plate shape, the plating tank 111 is formed with an axis, and the second anodes 220 are disposed parallel to the axis. So set up for electroplating anode 200 is whole to be the symmetry setting, and two liang of relative and parallel arrangement of second anode 220 make when a plurality of second anodes 220 act on the plating solution, the plating solution can evenly flow between a plurality of second anodes 220, and the periphery of barrel 310 is located to the even ring of a plurality of second anodes 220, ensures the electroplating film thickness homogeneous of waiting to electroplate the article in the barrel 310, has improved electroplating device 10's reliability.

Further, the outer contour of the cylinder 310 is cylindrical, the cross section of the accommodating groove 311 along the radial direction is circular, and the axis of the cylinder 310 coincides with the axis formed by the electroplating tank 111, so that the distances between the second anodes 220 and the axis of the cylinder 310 are the same, and the distances between the frame edges 211 and the axis of the cylinder 310 are the same, so that the current on the electroplating anode 200 can uniformly act on the to-be-electroplated product in the cylinder 310, thereby ensuring the uniformity of the thickness of the electroplating film of the to-be-electroplated product in the cylinder 310, and improving the reliability of the electroplating device 10.

In an embodiment, the second anode 220 is a titanium mesh plate, the titanium mesh plate is provided with a plurality of meshes, and the titanium mesh plate is connected with the frame edge 211 through a bolt structure. It will be appreciated that titanium mesh has better corrosion resistance and stability. In this embodiment, be equipped with mounting 230 on the titanium otter board, mounting 230 passes through welded fastening with the titanium otter board, is equipped with first spiro union hole on the mounting 230, is equipped with the second spiro union hole on the frame limit 211, passes first spiro union hole and second spiro union hole in proper order through adopting the bolt and links together mounting 230 and frame limit 211, so sets up for the connected mode of titanium otter board and frame limit 211 is simple, and easily operation is favorable to improving the installation effectiveness of second positive pole 220. Of course, when the second anode 220 needs to be replaced or maintained, the bolts can be directly detached for replacement or maintenance, and the operation is simple and easy to implement.

Referring to fig. 4 to fig. 6, in an embodiment, the electroplating apparatus 10 further includes a heating tube 500, the heating tube 500 is spirally disposed around a groove wall of the electroplating tank 111, a hollow cavity is formed in the heating tube 500, and the cylinder 310 is disposed in the hollow cavity.

It can be understood that, the plating solution when using, needs to carry out heat treatment to satisfy different electroplating conditions, the heating pipe 500 of this scheme is the heliciform setting, for current linear type, the heating pipe 500 of this scheme increases with the area of contact of plating solution, has increased heat transfer area promptly, thereby is favorable to improving heating efficiency. And, in the heating pipe 500 was located to barrel 310, when heating pipe 500 began work, the plating solution around heating pipe 500 can be quick heated, and the plating solution around barrel 310 can be quick heated promptly, and spiral helicine heating pipe 500 has ensured the homogeneity of plating solution heating, and in the use, spiral helicine heating pipe 500 can shorten heating time, is favorable to energy saving consumption.

Further, the heating tube 500 may be heated by an electrical heating method, and at this time, the heating tube 500 is made of a conductive material; the heating pipe 500 may also be heated by steam, and at this time, the heating pipe 500 is provided with a steam inlet and a steam outlet to facilitate the entry and discharge of steam; of course, the heating tube 500 may also be heated by other methods, and is not limited herein.

In one embodiment, the heating pipe 500 includes a connection pipe 510 and a spiral pipe 520, the connection pipe 510 is connected to the plating cylinder 100, and the spiral pipe 520 is formed by connecting a plurality of spiral turns in sequence, and the adjacent spiral turns have the same distance therebetween. It can be understood that, the interval between adjacent helicoidal is equal for heating pipe 500's structure is even, and then can carry out even heating to the plating solution, thereby is favorable to guaranteeing to wait to electroplate the thick homogeneity of article electroplate film, has improved heating pipe 500's reliability.

In one embodiment, the spiral coil is a round tube, and the distance between the outer walls of the adjacent spiral coils is smaller than the outer diameter of the spiral coil; alternatively, the spacing between the outer walls of adjacent coils is less than half the outer diameter of the coil. It will be appreciated that by defining the spacing between the outer walls of adjacent coils, the size of the heating tube 500 can be defined, thereby enabling control of the heating efficiency of the heating tube 500. When the volume of the plating bath 111 is large, the technical scheme that the distance between the outer walls of the adjacent spiral coils is smaller than the outer diameter of the spiral coils can be selected, so that the heating efficiency of the heating pipe 500 is ensured, the material consumption of the heating pipe 500 is reduced, and the cost can be saved. When the volume of the plating tank 111 is small, the technical scheme that the distance between the outer walls of the adjacent spiral coils is smaller than half of the outer diameter of the spiral coils can be selected, and the heating pipe 500 of the scheme has a compact structure and high heating efficiency. The above two technical solutions can be selected according to actual needs and effects, and are not specifically limited herein.

In one embodiment, the heating tube 500 is made of an electrically conductive material, such as, but not limited to: cadmium-nickel alloy, or iron-cadmium-nickel, or iron-chromium-aluminum alloy.

Referring to fig. 2 to 4, in an embodiment, the plating cylinder 100 further includes a cylinder cover 120, the cylinder cover 120 includes a fixed cover 121 and a movable cover 122, the fixed cover 121 covers the opening, a first mounting hole 1211 is disposed on the fixed cover 121 along an axial direction of the cylinder body 110, the movable cover 122 covers the first mounting hole 1211, and a downward projection of the movable cover 122 falls into the plating tank 111.

It is understood that the first mounting hole 1211 is used for mounting the movable cover 122, and the first mounting hole 1211 may have a circular shape, a square shape, or other shapes, and is not limited herein. In this embodiment, the first mounting hole 1211 is circular, a downward projection of the movable lid 122 falls into the plating vessel 111, and a cross section of the plating vessel 111 along the radial direction of the cylinder body 110 is circular, i.e., a diameter of the first mounting hole 1211 is smaller than a diameter of the plating vessel 111. So set up for movable cover body 122's volume is less, when needing to open cylinder cap 120, need not to open whole cylinder cap 120, and need not to remove fixed lid 121, only need remove the less movable cover body 122 of volume can, and then convenient operation, avoided plating bath 111 great along the radial cross section of jar body 110 and lead to that cylinder cap 120 is bulky, weight is heavier and open inconvenient problem, improved the convenience of opening plating jar 100.

In an embodiment, a plurality of second mounting holes 1212 are formed in the fixed cover 121, the second mounting holes 1212 are sequentially spaced around the periphery of the first mounting hole 1211 on the fixed cover 121, an anode connector 600 is disposed in the second mounting holes 1212, and the anode connector 600 is connected to the plating anode 200 through a wire. It can be understood that, because the movable cover 122 can move, the fixed cover 121 cannot move, and by providing the second mounting hole 1212 on the fixed cover 121, when the movable cover 122 is moved, the fixed cover 121 does not move and does not affect the second mounting hole 1212, so that the anode connector 600 does not move along with the movement of the movable cover 122, and the stability of the installation of the anode connector 600 is ensured. The one end of positive pole connecting piece 600 is passed through the wire and is connected with electroplating positive pole 200, and the other end of positive pole connecting piece 600 is used for being connected with the power positive pole, so sets up, conveniently connects electroplating positive pole 200, has improved cylinder cap 120's suitability.

In one embodiment, the fixed cover 121 is made of a transparent material. So set up, can directly see jar body 110 through fixed lid 121, when treating that the article of electroplating stretches into the electroplating solution in the electroplating jar 100 in electroplate in, the staff can see through the electroplating condition of fixed lid 121 direct observation jar body 110, and then the staff of being convenient for knows the state of electroplating, has improved the suitability of electroplating jar 100.

In an embodiment, the cylinder head 120 further includes a sealing ring disposed on a sidewall of the first mounting hole 1211, so that the sealing ring can seal a gap between the fixed cover 121 and the movable cover 122. It can be understood that, by providing the sealing ring, when the movable cover 122 covers the fixed cover 121, the movable cover and the fixed cover can be kept sealed, so that the sealing performance of the plating cylinder 100 is better, and the reliability of the plating cylinder 100 is improved.

In one embodiment, a groove is formed on a side of the fixed cover 121 facing the cylinder body 110, and a downward projection of the groove falls into the plating tank 111. By providing the groove, the weight of the fixed cover 121 can be reduced, that is, the material usage of the fixed cover 121 is reduced, which is beneficial to reducing the production cost of the fixed cover 121.

In one embodiment, the fixed cover 121 includes a first cover and a second cover, the groove is disposed on the second cover, the first mounting hole 1211 is disposed on the first cover, and the first cover and the second cover are detachably connected. The first cover body and the second cover body may be connected through a bolt structure, or may be connected through a buckle structure, which is not limited herein. The second mounting hole 1212 is disposed on the first cover, and a downward projection of the second mounting hole 1212 falls into the groove. In this embodiment, a third mounting hole is formed in the first cover body, a fourth mounting hole is formed in the second cover body, and screws sequentially penetrate through the third mounting hole and the fourth mounting hole, so that the first cover body and the second cover body can be fixedly connected, and the first cover body and the second cover body are simple in mounting mode and easy to operate.

In an embodiment, a fifth mounting hole is formed on the movable cover 122, and the fifth mounting hole is used for mounting the clamping member 700. By connecting the clamping member 700 with the movable cover 122, the movable cover 122 can be clamped conveniently, and the plating tank 100 can be opened or closed easily.

In one embodiment, a liquid level sensor is mounted on an inner sidewall of the plating tank 111. It is understood that the liquid level sensor is electrically connected to the controller, and the liquid level sensor is configured to monitor a liquid level of the plating solution in the plating tank 111, and when the liquid level of the plating solution reaches a detection position of the liquid level sensor, it indicates that the liquid level of the plating solution in the plating tank 111 is maintained at a normal water level; when the liquid level of the plating solution is higher or lower than the detection position of the liquid level sensor, the liquid level sensor sends a signal to the controller to remind the operator of the abnormal situation of the liquid level in the plating tank 111. With this arrangement, the applicability of the plating apparatus 10 is improved.

In an embodiment, the plating cylinder 100 is provided with a vacuum discharge pipe for communicating the outside with the plating tank 111, and the vacuum discharge pipe located outside the plating cylinder 100 is provided with a vacuum discharge valve for controlling on/off of the vacuum discharge pipe. It will be appreciated that the vacuum exhaust valve is an electrically controlled valve, and the vacuum exhaust valve is electrically connected to the controller. After the electroplating of the article to be electroplated in the electroplating bath 111 is finished, the controller controls the vacuum discharge valve to be opened, so that the pressure in the electroplating bath 111 is kept consistent with the external pressure, and the article to be electroplated is conveniently taken out. Of course, the electroplating apparatus 10 further includes a vacuum pump, the vacuum pump is disposed outside the electroplating cylinder 100, the electroplating cylinder 100 is provided with a vacuum pumping tube communicated with the electroplating tank 111, and the vacuum pumping tube is connected to the vacuum pump, so that the vacuum pump can vacuum the electroplating tank 111, and further can vacuum-plate the article to be electroplated.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. An electroplating apparatus, comprising:

an electroplating cylinder, wherein an electroplating bath is formed in the electroplating cylinder and is used for containing electroplating solution;

the electroplating vibration disc is arranged in the electroplating cylinder and comprises a cylinder body, the cylinder body is arranged in the first anode, the second anodes are annularly arranged at the periphery of the cylinder body, a containing groove is formed in the cylinder body and used for containing a product to be electroplated, and a drainage mesh hole is formed in the cylinder body and communicated with the containing groove and the electroplating tank; and

2. The electroplating apparatus as claimed in claim 1, wherein the electroplating cylinder comprises a cylinder body, the outer contour of the cylinder body is cylindrical, the interior of the cylinder body is hollow and has an opening at the upper end thereof to form the electroplating bath, the electroplating bath has a circular cross section along the horizontal direction, the outer contour of the first anode is regular polygon, the first anode comprises a plurality of frame edges, the frame edges are enclosed to form a regular polygon, and each frame edge is provided with one of the second anodes.

3. The plating apparatus as recited in claim 2, wherein said first anodes are symmetrically arranged and said second anodes are plate-shaped, and wherein said plating tank is formed with an axis and said second anodes are arranged in parallel with said axis.

4. The electroplating apparatus as claimed in claim 2, wherein the second anode is a titanium mesh plate, the titanium mesh plate is provided with a plurality of meshes, and the titanium mesh plate is connected with the frame edge through a bolt structure.

5. The electroplating apparatus of claim 1, further comprising a heating tube disposed helically around a wall of the electroplating tank, wherein the heating tube defines a hollow cavity, and wherein the barrel is disposed within the hollow cavity.

6. The plating apparatus as recited in claim 5, wherein said heating pipe comprises a connecting pipe and a spiral pipe, said connecting pipe being connected to said plating cylinder, said spiral pipe being formed by a plurality of spiral turns being connected in series, and a distance between adjacent ones of said spiral turns being equal.

7. The electroplating apparatus of claim 6, wherein the coil is a round tube, and the spacing between the outer walls of adjacent coils is less than the outer diameter of the coil; alternatively, the spacing between the outer walls of adjacent coils is less than half the outer diameter of the coil.

8. The electroplating apparatus as claimed in claim 2, wherein the electroplating tank further comprises a cylinder cover, the cylinder cover comprises a fixed cover and a movable cover, the fixed cover covers the opening, the fixed cover is provided with a first mounting hole along the axial direction of the tank body, the movable cover covers the first mounting hole, and the downward projection of the movable cover falls into the electroplating tank.

9. The plating apparatus as recited in claim 8, wherein a plurality of second mounting holes are provided in said fixed cover, said plurality of second mounting holes being provided in said fixed cover at intervals in order around a circumference of said first mounting hole, an anode connecting member being provided in said second mounting hole, said anode connecting member being connected to said plating anode via a wire.

10. The plating apparatus as recited in claim 1, wherein a vacuum discharge pipe for communicating the outside with the plating tank is provided on the plating cylinder, and a vacuum discharge valve for controlling on/off of the vacuum discharge pipe is provided on the vacuum discharge pipe located outside the plating cylinder.