CN218876062U

CN218876062U - Be used for EPS cystosepiment production cooling device

Info

Publication number: CN218876062U
Application number: CN202223367662.1U
Authority: CN
Inventors: 何波; 邓兴华; 毛兵
Original assignee: Mianyang Hongsheng New Material Technology Co ltd
Current assignee: Mianyang Hongsheng New Material Technology Co ltd
Priority date: 2022-12-15
Filing date: 2022-12-15
Publication date: 2023-04-18
Anticipated expiration: 2032-12-15

Abstract

The utility model discloses a be used for EPS cystosepiment production cooling device, include the workstation and set up the bed die on the workstation, go up mould, heating element and cooling body, bed die fixed mounting sets up the shaping chamber that the top is the opening structure at the top of workstation on the bed die, and the equal fixed mounting in top four corners of workstation has the stand, and the top fixed mounting of four stands has same roof, and the bottom fixed mounting of roof has the cylinder, and the output shaft fixed mounting of cylinder has the lifter plate, goes up mould fixed mounting and lies in the bed die directly over in the bottom of lifter plate. The utility model relates to a rationally, the practicality is good, can accomplish the back to EPS cystosepiment heat shaping preparation with last mould compound die under the control, directly carry out quick effectual cooling to fashioned EPS cystosepiment, saved operating time, improve work efficiency.

Description

Be used for EPS cystosepiment production cooling device

Technical Field

The utility model relates to a cooling arrangement technical field specifically is a be used for EPS cystosepiment production cooling device.

Background

The EPS foam board is a white object which is formed by heating expandable polystyrene beads containing a volatile liquid foaming agent in a mould after heating and pre-foaming, has the structural characteristics of fine closed pores and the like, and is mainly used for heat insulation of building walls, roofs, composite boards, cold storages, air conditioners, vehicles and ships, floor heating, decoration carving and the like. Among the prior art, need cooperate cooling device to cool down the EPS cystosepiment that makes when producing the EPS cystosepiment to guarantee the cooling design of EPS cystosepiment, current EPS cystosepiment production cooling device can't adjust according to the conveyer belt position when using, need match and install, and it is troublesome to use, has reduced the practicality, and carry the certain unable regulation of interval, bumps when easy to use, influences normal use, and the device installation is locked reversely simultaneously, is not convenient for operate, has reduced work efficiency.

A chinese patent who is directed against above-mentioned problem bulletin number CN215969690U announces is used for EPS cystosepiment production cooling device, including the shell, adjustment mechanism is all installed to the front and back both sides of shell, adjustment mechanism includes square frame, first screw rod, frid and protection pad, the inner wall of square frame is linked together with the outer wall of shell, the inner wall of square frame rotates with the outside of first screw rod and links to each other, the outer wall of first screw rod and the outside threaded connection of frid. This be used for EPS cystosepiment production cooling device, can adjust according to the demand, save the trouble of matcing the installation, convenient to use has improved the practicality, make the interval between the gyro wheel satisfy cystosepiment mould size, then make the inserted bar insert back peg graft with the inner wall bottom of frid, accomplish the rigidity of slide, can the spacing, prevent to carry the bump, ensure normal use, make the square slab drive montant downstream, make the montant bottom peg graft with external connecting plate top, accomplish the installation of device.

Above-mentioned scheme discovers in actual operation, after using the mould of production EPS cystosepiment to EPS cystosepiment thermoforming, need carry the cooling that could carry out EPS cystosepiment to EPS cystosepiment mould, and operating procedure is loaded down with trivial details, has increased operating time, influences work efficiency, for this reason, we propose one kind and be used for EPS cystosepiment production cooling device to be used for solving above-mentioned problem.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a be not enough to prior art, the utility model provides a be used for EPS cystosepiment production cooling device has solved current EPS cystosepiment production cooling device that is used for when using, and is loaded down with trivial details to the cooling operating procedure of the EPS cystosepiment that makes, has increased operating time, influences work efficiency's problem.

(II) technical scheme

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a be used for EPS cystosepiment production cooling device, includes the workstation and sets up bed die, goes up mould, heating element and cooling body on the workstation, bed die fixed mounting sets up the shaping chamber that the top is the opening structure at the top of workstation on the bed die, and the equal fixed mounting in top four corners of workstation has the stand, and the top fixed mounting of four stands has same roof, and the bottom fixed mounting of roof has the cylinder, and the output shaft fixed mounting of cylinder has the lifter plate, goes up mould fixed mounting and lies in the bed die directly over in the bottom of lifter plate, sets up the first cooling chamber that lies in shaping chamber below in the bed die, has seted up second cooling chamber in the last mould.

Preferably, heating element includes four electric heating plates, has seted up back style of calligraphy heating chamber in the bed die, and four equal fixed mounting of electric heating plate are back style of calligraphy heating intracavity and are back style of calligraphy and arrange.

Preferably, the cooling mechanism comprises a water tank, a water pump, a water outlet pipe, a water inlet branch pipe, a water inlet hose, a water inlet pipe joint, a water return header pipe, a water return branch pipe and a water suction pipe, wherein the water tank is fixedly installed at the bottom of the workbench, cooling water is stored in the water tank, the water pump is fixedly installed on the outer wall of the right side of the water tank, one end of the water suction pipe is fixedly connected with the suction end of the water pump, one end of the water suction pipe, which is far away from the water pump, extends into the water tank, one end of the water outlet pipe is fixedly connected with the discharge end of the water pump, one end of the water outlet pipe, which is far away from the water pump, penetrates through the workbench and is located on the right side of the lower die, the water inlet branch pipe is fixedly installed on the right side of the lower die, the water return branch pipe is fixedly installed on the left side of the upper die, the water inlet pipe joint and the water return pipe joint are both communicated with the second cooling cavity, the top end of the water inlet pipe joint is fixedly connected with one end of the water inlet pipe joint, the water return pipe is fixedly installed on the right side of the water tank, and one end of the water return pipe joint is connected with the water return header pipe, and one end of the water return pipe joint, and one end of the water return pipe is fixedly installed on the left side of the water return pipe.

Preferably, the cooling mechanism further comprises a semiconductor refrigerator, the semiconductor refrigerator is fixedly installed at the bottom of the water tank, and a refrigerating end of the semiconductor refrigerator extends into the water tank.

Preferably, a residue placing hole is formed in the inner wall of the left side of the water tank, and a plug is installed in the residue placing hole through internal threads.

Preferably, an L-shaped water adding pipe is fixedly mounted on the front side wall of the water tank, and an end cover is mounted at the top end of the L-shaped water adding pipe in a threaded mode.

Preferably, a plurality of first heat conduction columns are fixedly mounted in the first cooling cavity, are arranged in an equidistant array, a plurality of second heat conduction columns are fixedly mounted in the second cooling cavity, and are arranged in an equidistant array.

Preferably, two vertical guide rods are fixedly mounted at the top of the workbench, the two vertical guide rods are symmetrically arranged on two sides of the lower die, the top ends of the two vertical guide rods are fixedly connected with the bottom of the top plate, and the lifting plate is sleeved on the two vertical guide rods in a sliding manner.

(III) advantageous effects

The utility model provides a be used for EPS cystosepiment production cooling device. The method has the following beneficial effects:

(1) This a be used for EPS cystosepiment production cooling device, through putting into the shaping intracavity to the raw materials of preparation EPS cystosepiment, utilize the steerable bed die of cylinder, go up the compound die and the drawing of patterns of mould, accomplish the back at the compound die, through utilizing the heating element who comprises four electric heating board combinations, can carry out comprehensive even heating to the raw materials of preparation EPS cystosepiment, can make EPS cystosepiment in the shaping intracavity.

(2) This a be used for EPS cystosepiment production cooling device, through utilizing by the water tank, a water pump, the outlet pipe, the branch pipe of intaking, the hose of intaking, the coupling of intaking, the return pipe coupling, the return pipe hose, the return water house steward, the return pipe branch pipe, the cooling body that absorbs water pipe and semiconductor refrigerator combination constitute, can directly carry out quick effectual cooling to the EPS cystosepiment that makes, and the operating time has been saved, and the work efficiency is improved, solved current EPS cystosepiment production cooling device that is used for when using, it is loaded down with trivial details to the cooling operating procedure of the EPS cystosepiment that makes, and the operating time is increased, and the problem of work efficiency is influenced.

Drawings

FIG. 1 is a schematic view of the three-dimensional structure of the present invention;

FIG. 2 is a schematic sectional view of the main view of the present invention;

fig. 3 is an enlarged schematic view of a portion a in fig. 2.

In the figure: 1. a work table; 2. a lower die; 3. an upper die; 4. a column; 5. a top plate; 6. a cylinder; 7. a lifting plate; 8. a molding cavity; 9. a first cooling chamber; 10. a second cooling chamber; 11. a water tank; 12. a water pump; 13. a water outlet pipe; 14. a water inlet branch pipe; 15. a water inlet hose; 16. a water inlet pipe joint; 17. a backwater pipe joint; 18. a return water hose; 19. a water return main pipe; 20. a return water branch pipe; 21. a suction pipe; 22. a semiconductor refrigerator; 23. a first thermally conductive post; 24. a second thermally conductive post; 25. a square-shaped heating cavity; 26. an electrical heating plate; 27. a vertical guide rod; 28. a plug; 29. an L-shaped water adding pipe; 30. and (4) end covers.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the present invention, and in addition, in the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

As shown in fig. 1-3, the utility model provides a technical solution: the utility model provides a be used for EPS cystosepiment production cooling device, includes workstation 1 and sets up bed die 2, last mould 3, heating element and the cooling body on workstation 1, wherein:

the lower die 2 is fixedly arranged at the top of the workbench 1, the lower die 2 is provided with a forming cavity 8 with an opening structure at the top, the forming cavity 8 is used for storing and containing raw materials for producing EPS foam boards so as to be convenient for heating and forming the raw materials to prepare the EPS foam boards, it is required to be explained that the lower die 2 and the upper die 3 are both made of stainless steel materials, four corners at the top of the workbench 1 are fixedly provided with stand columns 4, the top ends of the four stand columns 4 are fixedly provided with a same top plate 5, the top plate 5 can be stably supported at a proper height position above the workbench 1 by utilizing the four stand columns 4, the bottom of the top plate 5 is fixedly provided with a cylinder 6, the top plate 5 is convenient to install and fix the cylinder 6, an output shaft end of the cylinder 6 is fixedly provided with a lifting plate 7, the upper die 3 is fixedly arranged at the bottom of the lifting plate 7 and is positioned right above the lower die 2, the cylinder 6 is used for controlling the lifting plate 7 and the upper die 3 to ascend or descend, further, the lower die 2 and the upper die 3 can be conveniently controlled to be matched and demoulded, a first cooling cavity 9 positioned below the forming cavity 8 is formed in the lower die 2, a second cooling cavity 10 is formed in the upper die 3, and the first cooling cavity 9 and the second cooling cavity 10 are arranged to facilitate the entry of cooling water, so that the formed EPS foam board can be cooled by utilizing the flowing of the cooling water in the first cooling cavity 9 and the second cooling cavity 10, a plurality of first heat conduction columns 23 are fixedly arranged in the first cooling cavity 9, the plurality of first heat conduction columns 23 are arranged in an equidistant array, a plurality of second heat conduction columns 24 are fixedly arranged in the second cooling cavity 10, the plurality of second heat conduction columns 24 are arranged in an equidistant array, and by arranging the plurality of first heat conduction columns 23, when the cooling water flows in the first cooling cavity 9, the heat can be more effectively transferred into the cooling water, through setting up a plurality of second heat conduction posts 24 for when the cooling water flows in second cooling chamber 10, can be more effective transmit heat to the cooling water. In this embodiment, it should be noted that the plurality of first heat-conducting pillars 23 and the plurality of second heat-conducting pillars 24 are made of aluminum alloy, copper alloy or stainless steel material with good heat conductivity.

Foretell heating element is used for carrying out the even heating to the raw materials of the production EPS cystosepiment in the shaping chamber 8, heating element includes four electric heating plate 26, style of calligraphy heating chamber 25 has been seted up back in the bed die 2, four equal fixed mounting of electric heating plate 26 are back style of calligraphy heating chamber 25 in and are back style of calligraphy and arrange, the setting of back style of calligraphy heating chamber 25, it is convenient fixed to the installation of four electric heating plate 26, utilize four electric heating plate 26, can heat the shaping processing to the raw materials of the production EPS cystosepiment of shaping chamber 8 internal storage, it is required to explain, four electric heating plate 26 all adopt on the market can purchase or the constant temperature electric heating plate that has suitable heating temperature of mill customization, arrange through being back style of calligraphy to four electric heating plate 26, make the heating to the raw materials more comprehensive even.

The cooling mechanism is used for cooling and treating the formed EPS foam plate, and comprises a water tank 11, a water pump 12, a water outlet pipe 13, a water inlet branch pipe 14, a water inlet hose 15, a water inlet pipe joint 16, a water return pipe joint 17, a water return hose 18, a water return header pipe 19, a water return branch pipe 20, a water suction pipe 21 and a semiconductor refrigerator 22, wherein the water tank 11 is fixedly arranged at the bottom of a workbench 1, the water tank 11 is filled with cooling water, the water tank 11 is used for storing the cooling water, the water pump 12 is fixedly arranged on the outer wall of the right side of the water tank 11, the water pump 12 is used for conveying the cooling water in the water tank 11, one end of the water suction pipe 21 is fixedly connected with the suction end of the water pump 12, one end, far away from the water pump 12, of the water suction pipe 21 extends into the water tank 11, one end of the water outlet pipe 13 is fixedly connected with the discharge end of the water pump 12, one end, far away from the water outlet pipe 13, penetrates through the workbench 1 and is positioned on the right side of a lower die 2, the water inlet branch pipe 14 is fixedly arranged on the right side of the lower die 2, the water return branch pipe 20 is fixedly arranged on the left side of the lower die 2, the water inlet branch pipe 14 and the water return branch pipe 20 are both communicated with the first cooling cavity 9, the right end of the water inlet branch pipe 14 is fixedly connected and communicated with the water outlet pipe 13, the bottom end of the water inlet hose 15 is fixedly connected with one end of the water outlet pipe 13, which is far away from the water pump 12, the water inlet pipe joint 16 is fixedly arranged on the right side of the upper die 3, the water return pipe joint 17 is fixedly arranged on the left side of the upper die 3, the water inlet pipe joint 16 and the water return pipe joint 17 are both communicated with the second cooling cavity 10, the top end of the water inlet hose 15 is fixedly connected with the water inlet pipe joint 16, the top end of the water return hose 18 is fixedly connected with the water return pipe joint 17, the water return main pipe 19 is fixedly arranged on the left side of the water tank 11, one end of the water return main pipe 19, which is far away from the water tank 11, penetrates through the workbench 1, the bottom end of the water return hose 18 is fixedly connected with one end of the water return main pipe 19 far away from the water tank 11, the left end of the water return branch pipe 20 is fixedly connected and communicated with the water return main pipe 19, the semiconductor refrigerator 22 is fixedly installed at the bottom of the water tank 11, the refrigerating end of the semiconductor refrigerator 22 extends into the water tank 11, and the semiconductor refrigerator 22 is used for cooling the cooling water in the water tank 11 so as to be convenient for recycling of the cooling water.

Through the structure, the cooling device for producing the EPS foam board, provided by the utility model, can directly and effectively cool the formed EPS foam board after the lower die 2 and the upper die 3 are controlled to complete the heating forming of the EPS foam board, thereby saving the working time and improving the working efficiency, when in specific operation, the raw materials for manufacturing the EPS foam board are put into the forming cavity 8, then the cylinder 6 is started to work, the cylinder 6 drives the lifting plate 7 and the upper die 3 to vertically move downwards, so that the upper die 3 and the lower die 2 can be controlled to precisely close the die, after the die closing is completed, the four electric heating plates 26 are opened to run, the heat generated by the four electric heating plates 26 is utilized to comprehensively and uniformly heat the raw materials in the forming cavity 8, the EPS foam board can be manufactured in the forming cavity 8, after the forming of the EPS foam board is completed, the four electric heating plates 26 are firstly closed, then the water pump 12 and the semiconductor refrigerator 22 are started to operate, by utilizing the operation of the water pump 12, the cooling water in the water tank 11 can be conveyed in two ways, so that a part of the cooling water enters the first cooling cavity 9, the other part of the cooling water enters the second cooling cavity 10, the cooling water entering the first cooling cavity 9 is discharged through the water return branch pipe 20, the cooling water entering the second cooling cavity 10 is discharged through the water return pipe joint 17 and the water return hose 18, and finally the cooling water flows back into the water tank 11, and the formed EPS foam board can be cooled by matching with the heat transfer effect of the first heat conduction columns 23 in the flowing process of the cooling water in the second cooling cavity 10 and matching with the heat transfer effect of the second heat conduction columns 24, and then can carry out the cooling of rapid cooling to fashioned EPS cystosepiment, utilize semiconductor refrigerator 22 can cool down the cooling water that flows back to in the water tank 11, after the cooling is accomplished, stop water pump 12 and the operation of semiconductor refrigerator 22, restart cylinder 6 resets, cylinder 6 drives lifter plate 7 and last mould 3 vertical upward movement and returns the normal position gradually, can control mould 3 and bed die 2 and carry out the drawing of patterns, alright take out the cooled EPS cystosepiment, according to above-mentioned operating procedure, can continue to produce the preparation to next EPS cystosepiment.

In this embodiment, a residue placing hole is formed in the inner wall of the left side of the water tank 11, a plug 28 is installed in the residue placing hole through an internal thread, and the residue placing hole and the plug 28 are arranged to facilitate discharging of cooling water in the water tank 11.

In this embodiment, the L-shaped water feeding pipe 29 is fixedly installed on the front side wall of the water tank 11, the end cover 30 is installed at the top end of the L-shaped water feeding pipe 29 in a threaded manner, and the L-shaped water feeding pipe 29 and the end cover 30 are utilized to supplement cooling water into the water tank 11, so that the cooling water in the water tank 11 can be replaced conveniently.

In this embodiment, the top fixed mounting of workstation 1 has two vertical guide rods 27, two vertical guide rods 27 symmetry set up the both sides at bed die 2, the top of two vertical guide rods 27 all with the bottom fixed connection of roof 5, lifter plate 7 slip cap is established on two vertical guide rods 27, utilize two vertical guide rods 27, can lead to the direction of motion of lifter plate 7 and last mould 3, make lifter plate 7 and last mould 3 can steady vertical lift, guarantee the accurate compound die of last mould 3 and bed die 2.

In this embodiment, a multi-control switch is fixedly installed at a suitable position on the workbench 1, the air cylinder 6, the water pump 12, the semiconductor refrigerator 22, the four electric heating plates 26 and the multi-control switch are electrically connected with an external power line through a wire in sequence to form a loop, the multi-control switch can control the start and stop and reset of the air cylinder 6, can also control the start and stop of the water pump 12 and the semiconductor refrigerator 22 respectively, and can also control the start and stop of the four electric heating plates 26.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a be used for EPS cystosepiment production cooling device which characterized in that: including workstation (1) and the bed die (2) of setting on workstation (1), go up mould (3), heating element and cooling body, bed die (2) fixed mounting be in the top of workstation (1), set up shaping chamber (8) that the top is the opening structure on bed die (2), the equal fixed mounting in top four corners of workstation (1) has stand (4), four the top fixed mounting of stand (4) has same roof (5), the bottom fixed mounting of roof (5) has cylinder (6), the output shaft fixed mounting of cylinder (6) has lifter plate (7), it is in to go up mould (3) fixed mounting the bottom of lifter plate (7) and be located directly over bed die (2), set up first cooling chamber (9) that are located shaping chamber (8) below in bed die (2), seted up second cooling chamber (10) in last mould (3).

2. The cooling device for EPS foam board production according to claim 1, characterized in that: heating element includes four electric heating plate (26), seted up back style of calligraphy heating chamber (25) in bed die (2), four the equal fixed mounting in electric heating plate (26) is back in style of calligraphy heating chamber (25) and be back the style of calligraphy and arrange.

3. The cooling device for EPS foam board production according to claim 1, characterized in that: the cooling mechanism comprises a water tank (11), a water pump (12), a water outlet pipe (13), a water inlet branch pipe (14), a water inlet hose (15), a water inlet pipe joint (16), a water return pipe joint (17), a water return hose (18), a water return main pipe (19), a water return branch pipe (20) and a water suction pipe (21), wherein the water tank (11) is fixedly installed at the bottom of the workbench (1), cooling water is stored in the water tank (11), the water pump (12) is fixedly installed on the outer wall of the right side of the water tank (11), one end of the water suction pipe (21) is fixedly connected with the suction end of the water pump (12), one end, far away from the water pump (12), of the water suction pipe (21) extends into the water tank (11), one end of the water outlet pipe (13) is fixedly connected with the discharge end of the water pump (12), one end, far away from the water pump (12), of the water outlet pipe (13) penetrates through the workbench (1) and is positioned at the right side of the lower mold (2), the water inlet branch pipe (14) is fixedly installed at the right side of the lower mold (2), the water return branch pipe (14) is fixedly connected with the water inlet branch pipe (9), and the left side of the water inlet pipe (14) and the water inlet pipe (9) is communicated with the water inlet pipe (9), the bottom of intake hose (15) with the one end fixed connection of water pump (12) is kept away from in outlet pipe (13), intake pipe joint (16) fixed mounting be in the right side of last mould (3), return water pipe joint (17) fixed mounting be in the left side of last mould (3), intake pipe joint (16) with return water pipe joint (17) all with second cooling chamber (10) are linked together, the top of intake hose (15) with intake pipe joint (16) fixed connection, the top of return water hose (18) with return water pipe joint (17) fixed connection, return water main (19) fixed mounting be in the left side of water tank (11), the one end of return water main (19) extends to in water tank (11), the one end that water tank (11) were kept away from to return water main (19) runs through workstation (1), the bottom of return water hose (18) with the one end fixed connection of water tank (11) is kept away from to main (19), the left end of return water branch pipe (20) with return water main (19) fixed connection and return water main are linked together.

4. A cooling device for EPS foam board production according to claim 3, characterized in that: the cooling mechanism further comprises a semiconductor refrigerator (22), the semiconductor refrigerator (22) is fixedly installed at the bottom of the water tank (11), and a refrigerating end of the semiconductor refrigerator (22) extends into the water tank (11).

5. A cooling device for EPS foam board production according to claim 3, characterized in that: and a residue placing hole is formed in the inner wall of the left side of the water tank (11), and a plug (28) is mounted in the residue placing hole in an internal thread mode.

6. A cooling device for EPS foam board production according to claim 3, characterized in that: the water tank is characterized in that an L-shaped water adding pipe (29) is fixedly mounted on the front side wall of the water tank (11), and an end cover (30) is mounted on the top end of the L-shaped water adding pipe (29) in a threaded mode.

7. The cooling device for EPS foam board production according to claim 1, characterized in that: a plurality of first heat conduction columns (23) are fixedly mounted in the first cooling cavity (9), the first heat conduction columns (23) are arranged in an equidistant array mode, a plurality of second heat conduction columns (24) are fixedly mounted in the second cooling cavity (10), and the second heat conduction columns (24) are arranged in an equidistant array mode.

8. The cooling device for EPS foam board production according to claim 1, characterized in that: two vertical guide rods (27) are fixedly mounted at the top of the workbench (1), the two vertical guide rods (27) are symmetrically arranged on two sides of the lower die (2), the top ends of the two vertical guide rods (27) are fixedly connected with the bottom of the top plate (5), and the two vertical guide rods (27) are sleeved with the lifting plate (7) in a sliding manner.