CN217520086U

CN217520086U - Duck's claw is pickled and is used material cooling device

Info

Publication number: CN217520086U
Application number: CN202221720799.8U
Authority: CN
Inventors: 吴江英
Original assignee: Sanming Shunyuan Food Co ltd
Current assignee: Sanming Shunyuan Food Co ltd
Priority date: 2022-07-04
Filing date: 2022-07-04
Publication date: 2022-09-30
Anticipated expiration: 2032-07-04

Abstract

The utility model discloses a duck's claw is pickled and is used material cooling device, the on-line screen storage device comprises a base, the top fixedly connected with jar body of base, jar internal storage chamber that is provided with, and the top of jar body is provided with and stores the feed inlet of chamber intercommunication, it is connected with the frame that overturns to store the intracavity rotation, the top of jar body is provided with the output and overturns a center pin top fixed connection's motor, it is provided with the heat exchange tube to store the intracavity, the both ends of heat exchange tube just are located jar external side position and communicate respectively and are provided with connecting pipe one and connecting pipe two, top one side of base is provided with the liquid reserve tank. The utility model discloses in, in cold water transport with in the liquid reserve tank gets into a plurality of heat transfer pipes through the delivery pump, can carry out abundant heat transfer with the material of storage intracavity to in can sending back the liquid reserve tank with the water after the heat transfer through the back flow, can cool down the water after the heat transfer again through setting up of semiconductor refrigeration piece, make it can circulate and carry out the operation of dispelling the heat and use.

Description

Duck's claw is pickled and is used material cooling device

Technical Field

The utility model relates to a duck claw pickles technical field, especially relates to a duck claw pickles and uses material cooling device.

Background

The duck feet are common dietary materials, the manufacturing method of the duck feet is very various, for example, the duck feet can be directly cooked, marinated duck feet can be prepared by matching with marinating materials, pickled duck feet can also be prepared by pickling, and when the duck feet are usually pickled, the pickled materials need to be cooled and cooled, so that a cooling device for the pickled materials of the duck feet has certain requirements;

present duck's claw is pickled and is used material cooling work, most all are single placing in storing the box, blow through wind and carry out cooling operation, such cooling work, not only cooling rate is slow, can only cool off the surface moreover, needs the staff regularly to turn and just can accelerate cooling work, and whole cooling efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a duck claw pickling material cooling device.

In order to achieve the above purpose, the utility model adopts the following technical scheme: a material cooling device for pickling duck claws comprises a base, wherein the top of the base is fixedly connected with a tank body, a storage cavity is arranged in the tank body, the top of the tank body is provided with a feed inlet communicated with the storage cavity, a turnover frame is rotatably connected in the storage cavity, the top of the tank body is provided with a motor of which the output end is fixedly connected with the top of a central shaft of the turnover frame, a heat exchange tube is arranged in the storage cavity, the two ends of the heat exchange tube and the positions at the outer side of the tank body are respectively communicated with a first connecting tube and a second connecting tube, one side of the top of the base is provided with a liquid storage tank, a conveying pump is arranged in the liquid storage tank, a conveying pipe is arranged on the conveying pump, the output end of the conveying pipe is communicated with the first connecting tube, a return pipe is arranged on the second connecting tube, one end of the return pipe is communicated with the liquid storage tank, and a semiconductor refrigerating sheet is fixedly installed on the liquid storage tank, the bottom of the tank body is provided with a discharge port communicated with the bottom of the inner wall of the storage cavity, a collecting box is arranged at the top of the base and below the discharge port, and a controller is arranged on the tank body.

As a further description of the above technical solution:

the heat exchange tube is provided with a plurality ofly, and is a plurality of the heat exchange tube just is located the one end of storing the intracavity and sets up for snakelike.

As a further description of the above technical solution:

the turnover frame is provided with a plurality of turnover rods, and the turnover rods and the heat exchange tubes are arranged in a staggered mode from top to bottom.

As a further description of the above technical solution:

the inner wall of the liquid storage tank is fixedly provided with splitter plates in a staggered manner.

As a further description of the above technical solution:

the refrigerating end of the semiconductor refrigerating sheet is positioned in the liquid storage box.

As a further description of the above technical solution:

and an electromagnetic valve is arranged in the discharge hole and is electrically connected with the controller.

As a further description of the above technical solution:

the model of controller is STM32, be electric connection between motor, delivery pump, the semiconductor refrigeration piece and the controller.

The utility model discloses following beneficial effect has:

this duck claw is pickled and is used material cooling device, carry the cold water in with the liquid reserve tank through the delivery pump and get into in a plurality of heat exchange tubes, can carry out abundant heat transfer with the material of storing the intracavity, and can send back the water after the heat transfer to the liquid reserve tank in through the back flow, water after the heat transfer can be cooled down again through the setting of semiconductor refrigeration piece, make it can circulate and carry out the heat dissipation operation and use, motor through setting up, the cooperation setting of the frame structure that turns, can be convenient and stable turn the operation to the material, can realize thermal quick dispersing, also guarantee the abundant contact heat transfer of material and heat exchange tube simultaneously, can effectively promote the cooling rate and the efficiency of material, whole structural connection is stable, and is simple and convenient to operate, can realize the quick cooling work to the material, effectively promote cooling efficiency.

Drawings

FIG. 1 is a schematic view of the overall structure of a device for cooling a material for pickling duck feet, which is provided by the present invention;

FIG. 2 is a front view of the device for cooling the materials for pickling duck feet provided by the present invention;

fig. 3 is the utility model provides a duck claw is pickled and is used material cooling device's heat exchange tube structure plan view.

Illustration of the drawings:

1. a base; 2. a tank body; 3. a storage chamber; 4. a feed inlet; 5. turning over the frame; 6. a motor; 7. a heat exchange pipe; 8. a first connecting pipe; 9. a second connecting pipe; 10. a liquid storage tank; 11. a delivery pump; 12. a delivery pipe; 13. a return pipe; 14. a flow distribution plate; 15. a semiconductor refrigerating sheet; 16. a discharge port; 17. an electromagnetic valve; 18. a collection box; 19. and a controller.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Referring to fig. 1-3, the present invention provides an embodiment: a material cooling device for pickling duck claws comprises a base 1, wherein the top of the base 1 is fixedly connected with a tank body 2, a storage cavity 3 is arranged in the tank body 2, the top of the tank body 2 is provided with a feed inlet 4 communicated with the storage cavity 3, the storage cavity 3 is rotationally connected with a turning frame 5, the top of the tank body 2 is provided with a motor 6 of which the output end is fixedly connected with the top of a central shaft of the turning frame 5, a heat exchange tube 7 is arranged in the storage cavity 3, two ends of the heat exchange tube 7 and the positions positioned outside the tank body 2 are respectively communicated with a first connecting tube 8 and a second connecting tube 9, one side of the top of the base 1 is provided with a liquid storage tank 10, a conveying pump 11 is arranged in the liquid storage tank 10, a conveying pipe 12 is arranged on the conveying pump 11, the output end of the conveying pipe 12 is communicated with the first connecting tube 8, a return pipe 13 is arranged on the second connecting tube 9, one end of the return pipe 13 is communicated into the liquid storage tank 10, and a semiconductor refrigerating sheet 15 is fixedly arranged on the liquid storage tank 10, the bottom of the tank body 2 is provided with a discharge hole 16 communicated with the bottom of the inner wall of the storage cavity 3, a collecting box 18 is arranged at the top of the base 1 and below the discharge hole 16, and a controller 19 is arranged on the tank body 2.

In the further scheme, heat exchange tube 7 is provided with a plurality ofly, and a plurality of heat exchange tubes 7 just are located the one end of storing chamber 3 and set up for snakelike, and the evenly distributed of a plurality of heat exchange tubes 7 is in storing chamber 3, can be abundant with store the material in the chamber 3 and carry out abundant contact to can realize abundant heat transfer operation, accelerate the cooling of material, snakelike heat exchange tube 7 can guarantee that cold water can fully flow in the heat exchange tube 7 of storing chamber 3, carries out abundant heat transfer operation.

In the further scheme, be provided with a plurality of turning bars on the frame 5 that turns, the position of a plurality of turning bars and a plurality of heat exchange tubes 7 is by the crisscross setting from the top down, and the setting of turning frame 5 can carry out the operation of evenly stably turning to the material to can accelerate thermal diffusion, can effectively promote the cooling rate of material, can make whole structure can the steady operation with the crisscross setting of heat exchange tubes 7 moreover, the condition that mutual hindrance can not appear.

In the further scheme, the crisscross fixed mounting of inner wall of liquid reserve tank 10 has flow distribution plate 14, and flow distribution plate 14's setting can play a guide effect to the water that gets into in the liquid reserve tank 10 after the heat transfer, avoids direct and the cold water mixing of below, influences follow-up cold water and carries the work of cooling down, realizes the stable separation effect of cold and hot rivers.

In the further scheme, the refrigeration end of semiconductor refrigeration piece 15 is located inside liquid reserve tank 10, and the refrigeration end of semiconductor refrigeration piece 15 can carry out cooling work to the water to can conveniently cool down the water after the heat transfer, make material cooling work can circulate and go on, semiconductor refrigeration piece 15 can be provided with a plurality ofly according to the demand.

In the further scheme, an electromagnetic valve 17 is arranged in the discharge port 16, the electromagnetic valve 17 is electrically connected with the controller 19, and the discharge port 16 can facilitate the discharge of the material after the cooling is completed.

In the further scheme, the model of controller 19 is STM32, is electric connection between motor 6, delivery pump 11, semiconductor refrigeration piece 15 and the controller 19, and the setting of controller 19 can guarantee that whole structure can convenient control operation use.

The working principle is as follows: when the material cooling device for pickling duck claws is used, materials to be cooled are poured into the storage cavity 3 through the feed inlet 4, the conveying pump 11 is started, cold water is conveyed into the conveying pipe 12 by the conveying pump 11 and respectively enters the plurality of heat exchange pipes 7 after entering the first connecting pipe 8, the cold water in the heat exchange pipes 7 is contacted with the materials for heat exchange, the cooling work of the materials can be realized, the water after heat exchange enters the second connecting pipe 9 and returns to the liquid storage tank 10 through the return pipe 13, the water after heat exchange is cooled through the semiconductor refrigerating fins 15, therefore, the circulating heat exchange operation can be carried out, the rapid cooling of the materials is realized, the motor 6 is started during the cooling process, the turnover frame 5 is driven by the motor 6 to turn over the materials, the rapid heat dissipation can be realized, meanwhile, the sufficient contact heat exchange between the materials and the heat exchange pipes 7 is also ensured, and the cooling speed and the cooling efficiency of the materials can be effectively improved, after cooling, the electromagnetic valve 17 is opened to discharge the cooled material through the discharge port 16.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a duck's claw is pickled and is used material cooling device, includes base (1), its characterized in that: the top of the base (1) is fixedly connected with a tank body (2), a storage cavity (3) is arranged in the tank body (2), a feed inlet (4) communicated with the storage cavity (3) is arranged at the top of the tank body (2), a turnover frame (5) is rotationally connected in the storage cavity (3), a motor (6) with an output end fixedly connected with the top of a central shaft of the turnover frame (5) is arranged at the top of the tank body (2), a heat exchange tube (7) is arranged in the storage cavity (3), two ends of the heat exchange tube (7) are respectively communicated with a first connecting tube (8) and a second connecting tube (9) at positions outside the tank body (2), a liquid storage tank (10) is arranged on one side of the top of the base (1), a conveying pump (11) is arranged in the liquid storage tank (10), a conveying pipe (12) is arranged on the conveying pump (11), and the output end of the conveying pipe (12) is communicated with the first connecting tube (8), be provided with back flow pipe (13) on connecting pipe two (9), the one end of back flow pipe (13) communicates in liquid reserve tank (10), fixed mounting has semiconductor refrigeration piece (15) on liquid reserve tank (10), the bottom of the jar body (2) is provided with and stores discharge gate (16) of chamber (3) inner wall bottom intercommunication, the top of base (1) just is located discharge gate (16) below position and is provided with collecting box (18), be provided with controller (19) on the jar body (2).

2. The device for cooling the material for pickling duck feet as claimed in claim 1, wherein: the heat exchange tubes (7) are arranged in a plurality of numbers, and one ends of the heat exchange tubes (7) which are positioned in the storage cavity (3) are arranged in a snake shape.

3. The device for cooling the material for pickling duck feet as claimed in claim 2, wherein: the turnover frame (5) is provided with a plurality of turnover rods, and the turnover rods and the heat exchange tubes (7) are arranged in a staggered mode from top to bottom.

4. The device for cooling the material for pickling duck feet as claimed in claim 1, wherein: the inner wall of the liquid storage tank (10) is fixedly provided with splitter plates (14) in a staggered manner.

5. The device for cooling the material for pickling duck feet as claimed in claim 1, wherein: the refrigerating end of the semiconductor refrigerating sheet (15) is positioned in the liquid storage box (10).

6. The device for cooling the material for pickling duck feet as claimed in claim 1, wherein: an electromagnetic valve (17) is arranged in the discharge hole (16), and the electromagnetic valve (17) is electrically connected with the controller (19).

7. The device for cooling the materials for pickling duck feet as claimed in claim 1, wherein: the model of controller (19) is STM32, be electric connection between motor (6), delivery pump (11), semiconductor refrigeration piece (15) and controller (19).