CN220959181U - Semiconductor refrigeration structure and electronic ice container - Google Patents
Semiconductor refrigeration structure and electronic ice container Download PDFInfo
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- CN220959181U CN220959181U CN202321392343.8U CN202321392343U CN220959181U CN 220959181 U CN220959181 U CN 220959181U CN 202321392343 U CN202321392343 U CN 202321392343U CN 220959181 U CN220959181 U CN 220959181U
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 66
- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 238
- 230000007246 mechanism Effects 0.000 claims abstract description 83
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 238000004321 preservation Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 13
- 238000009413 insulation Methods 0.000 claims description 11
- 210000002268 wool Anatomy 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 229920000742 Cotton Polymers 0.000 description 6
- 241000219146 Gossypium Species 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000035622 drinking Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a semiconductor refrigeration structure and an electronic ice container, which have the technical scheme that: the semiconductor refrigeration structure comprises a cold water tank for storing pure water; a circulating water inlet is arranged on the cold water tank; the refrigerating mechanism is used for cooling the pure water in the cold water tank; one end of the refrigerating mechanism is arranged at one side of the cold water tank, and the other end of the refrigerating mechanism is positioned in the cold water tank; the diversion mechanism is used for controlling the water flow output state of the refrigeration water tank; one end of the flow guiding mechanism is connected with the cold water tank, and the other end of the flow guiding mechanism is connected with the circulating water inlet; the electronic ice liner comprises a heat dissipation mechanism for dissipating heat of the refrigeration mechanism; one end of the heat dissipation mechanism is connected with the cold water tank, and the other end of the heat dissipation mechanism is abutted with the refrigeration semiconductor; the heat preservation mechanism is used for preserving heat of the cold water tank; the heat preservation mechanism is sleeved on the outer side of the cold water tank, and the utility model has the advantages of improving the refrigerating efficiency by accelerating the water temperature transmission efficiency through circulating refrigeration.
Description
Technical Field
The utility model relates to the technical field of refrigeration of water purifiers, in particular to a semiconductor refrigeration structure and an electronic ice container.
Background
The electronic ice liner is a heart of a semiconductor electronic refrigeration drinking equipment machine (the drinking equipment can be a water dispenser or a water purifier and the like), and is an important component for determining the refrigeration performance of the water dispenser.
The utility model patent application number is CN200620014333.0, and a common electronic ice container structure is disclosed in Chinese patent application entitled "electronic ice container of water dispenser", which is used for manufacturing cold water in a conventional manner, however, in the above structure, the cold water is directly output from a water outlet channel after being manufactured, the refrigeration mode is single, and the refrigeration efficiency has a certain lifting space, so that the improvement is needed.
Disclosure of utility model
Aiming at the defects in the prior art, the utility model aims to provide a semiconductor refrigeration structure and an electronic ice container, which have the advantages of improving the refrigeration efficiency by accelerating the water temperature transmission efficiency through circulating refrigeration.
The first technical purpose of the utility model is realized by the following technical proposal: a semiconductor refrigeration structure comprising: a cold water tank for storing pure water; a circulating water inlet is formed in the cold water tank; the refrigerating mechanism is used for cooling the pure water in the cold water tank; one end of the refrigeration mechanism is arranged at one side of the cold water tank, and the other end of the refrigeration mechanism is positioned in the cold water tank; the diversion mechanism is used for controlling the water flow output state of the cold water tank; one end of the flow guiding mechanism is connected with the cold water tank, and the other end of the flow guiding mechanism is connected with the circulating water inlet.
In one embodiment of the foregoing technical solution, the flow guiding mechanism includes: a water outlet pipe, a water suction pump and a circulating water pump; the water outlet pipe is arranged at the bottom of the cold water tank; one end of the water suction pump is connected with the water outlet pipe, and the other end of the water suction pump is connected with an external water purifier; one end of the circulating water pump is connected with the water suction pump, and the other end of the circulating water pump is connected with the circulating water inlet.
In one embodiment, the circulating water inlet is located above the water outlet pipe.
In one embodiment, the refrigeration mechanism includes: the refrigerating semiconductor comprises a supporting frame, a refrigerating semiconductor and a semiconductor temperature-conducting sheet; the support frame is arranged on the cold water tank; one end of the semiconductor temperature-conducting piece is arranged on the supporting frame, and the other end of the semiconductor temperature-conducting piece is positioned in the cold water tank; the refrigeration semiconductor is arranged on the supporting frame and connected with the semiconductor temperature-conducting sheet.
In one embodiment of the above technical solution, a double-water-level floating ball capable of sensing different water-level heights is provided in the cold water tank.
The second technical purpose of the utility model is realized by the following technical proposal: an electronic ice container, includes semiconductor refrigeration structure, still includes: the heat dissipation mechanism is used for dissipating heat of the refrigerating mechanism; one end of the heat dissipation mechanism is connected with the cold water tank, and the other end of the heat dissipation mechanism is abutted with the refrigeration semiconductor; the heat preservation mechanism is used for preserving heat of the cold water tank; the heat preservation mechanism is sleeved on the outer side of the cold water tank.
Optionally, the heat dissipation mechanism includes: a bracket, a radiating fin and a radiating fan; the bracket is arranged on one side of the cold water tank; one end of the radiating fin is arranged on the bracket, and the other end of the radiating fin is abutted against the refrigeration semiconductor; the cooling fan is arranged on the bracket.
Optionally, the heat preservation mechanism is a plurality of heat preservation pearl cottons which can be mutually embedded.
In summary, the utility model has the following beneficial effects:
1. The semiconductor refrigeration structure is provided with the diversion mechanism capable of controlling the water flow output state of the refrigeration water tank, so that cold water output by the cold water tank can be pumped into the cold water tank again for circulating refrigeration after passing through the diversion mechanism, thereby accelerating the water temperature transmission efficiency in the cold water tank and improving the structure refrigeration efficiency.
2. The electronic ice liner comprises a semiconductor refrigeration structure, a heat dissipation mechanism and a heat preservation mechanism, wherein the heat dissipation mechanism can dissipate heat of the semiconductor refrigeration structure in operation, heat accumulation outside the structure is prevented, and the heat preservation mechanism is sleeved outside the cold water tank, so that the heat preservation time of the cold water tank can be prolonged.
Drawings
FIG. 1 is a schematic view of the internal structure of a semiconductor refrigeration structure according to the present utility model;
FIG. 2 is a schematic diagram of the structure of the electronic ice container according to the present utility model;
FIG. 3 is a schematic diagram of a heat dissipation mechanism according to the present utility model;
Fig. 4 is a schematic structural view of the heat insulation mechanism of the present utility model.
In the figure: 1. a cold water tank; 11. a circulating water inlet; 2. a refrigeration mechanism; 21. a support frame; 22. a refrigerating semiconductor; 23. a semiconductor temperature-conducting sheet; 3. a diversion mechanism; 31. a water outlet pipe; 32. a water pump; 33. a circulating water pump; 4. a double-water-level floating ball; 5. a heat dissipation mechanism; 51. a bracket; 52. a heat sink; 53. a heat radiation fan; 6. and a heat preservation mechanism.
Detailed Description
In order that the objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature. The terms "vertical," "horizontal," "left," "right," "up," "down," and the like are used for descriptive purposes only and are not to indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.
The present utility model will be described in detail below with reference to the accompanying drawings and examples.
Example 1
As shown in fig. 1, the present embodiment provides a semiconductor refrigeration structure, including: a cold water tank 1 for storing pure water; a circulating water inlet 11 is arranged on the cold water tank 1; a refrigerating mechanism 2 for cooling the pure water in the cold water tank 1; one end of the refrigeration mechanism 2 is arranged at one side of the cold water tank 1, and the other end of the refrigeration mechanism 2 is positioned in the cold water tank 1; a diversion mechanism 3 for controlling the water flow output state of the cold water tank 1; one end of the flow guiding mechanism 3 is connected with the cold water tank 1, and the other end of the flow guiding mechanism 3 is connected with the circulating water inlet 11.
In the embodiment, the cold water tank 1 is arranged in a water purifier, pure water is input into the cold water tank by the water purifier, the refrigerating mechanism 2 is arranged at the outer side of the cold water tank 1, the refrigerating end of the refrigerating mechanism 2 is positioned in the cold water tank 1, and the refrigerating mechanism 2 can cool the pure water in the cold water tank 1 and change the pure water into cold water when working;
The cold water tank 1 is provided with the circulating water inlet 11, the bottom of cold water tank 1 is provided with guiding mechanism 3, inside the cold water tank is connected to guiding mechanism 3's one end, circulating water inlet 11 is connected to the other end, guiding mechanism 3 makes cold water tank 1 have two kinds of refrigeration state, first is the cold water output end department of directly exporting the water purifier with cold water in the cold water tank 1, reach cold water output effect, the second is in making the cold water in the cold water tank 1 flow back to the cold water tank 1 again behind the circulating water inlet 11, make the temperature transmission efficiency of cold water tank 1 accelerate, thereby improve the refrigeration efficiency of structure.
Further, the diversion mechanism 3 includes: a water outlet pipe 31, a water suction pump 32 and a circulating water pump 33; the water outlet pipe 31 is arranged at the bottom of the cold water tank 1; one end of the water pump 32 is connected with the water outlet pipe 31, and the other end of the water pump 32 is connected with an external water purifier; one end of the circulating water pump 33 is connected with the water suction pump, and the other end of the circulating water pump 33 is connected with the circulating water inlet 11.
In this embodiment, the water outlet pipe 31 is a two-way pipe (the two-way pipe has one input end and two output ends), the input end of the water outlet pipe 31 is connected with the cold water tank 1, the two output ends of the water outlet pipe 31 are respectively connected with the water suction pump 32 and the circulating water pump 33, wherein the water suction pump 32 is connected with an external water purifier, and the circulating water pump 33 is connected with the circulating water inlet 11; the deflector mechanism 3 has two operating states:
① When the water suction pump 32 is started and the circulating water pump 33 is closed, cold water in the cold water tank 1 is directly output to an external water purifier through the water suction pump 32, so that cold water output is completed;
② When the water suction pump 32 is closed and the circulating water pump 33 is opened, cold water in the cold water tank 1 flows back into the cold water tank 1 again after passing through the water outlet pipe 31 and the circulating water pump 33, so that the cold water tank 1 is subjected to circulating refrigeration, the water temperature transmission efficiency in the cold water tank 1 is improved (the water tank is suitable for the condition of rapid refrigeration of a small amount of water), and rapid refrigeration is achieved.
Further, the circulating water inlet 11 is located above the water outlet pipe 31.
In this embodiment, the circulating water inlet 11 is located above the water outlet pipe 31, so that cold water in the cold water tank 1 can flow back into the cold water tank 1 again through the water outlet pipe 31 and the circulating water pump 33 and is located at the upper layer of the liquid surface, thereby improving the water temperature transmission efficiency in the cold water tank 1.
Further, the refrigeration mechanism 2 includes: a support frame 21, a refrigeration semiconductor 22 and a semiconductor temperature-conducting plate 23; the support frame 21 is arranged on the cold water tank 1; one end of the semiconductor temperature-conducting piece 23 is arranged on the supporting frame 21, and the other end of the semiconductor temperature-conducting piece 23 is positioned in the cold water tank 1; the refrigerating semiconductor 22 is mounted on the supporting frame 21 and is connected with the semiconductor temperature-conducting plate 23.
In this embodiment, the support frame 21 is mounted on the cold water tank 1, the semiconductor temperature-conducting plate 23 is mounted on the support frame 21, the cooling output end of the semiconductor temperature-conducting plate 23 passes through the side wall of the cold water tank 1 and then is located in the cold water tank 1, the cooling output end of the semiconductor temperature-conducting plate 23 is completely immersed in pure water in the cold water tank 1, the refrigeration semiconductor 22 is mounted on the support frame 21 and connected with the semiconductor temperature-conducting plate 23, and the refrigeration semiconductor 22 can transmit low temperature into the water in the cold water tank 1 through the semiconductor temperature-conducting plate 23 during operation, so that the cooling and refrigerating effects are achieved.
Further, a double-water-level floating ball 4 capable of sensing different water level heights is arranged in the cold water tank 1.
In this embodiment, the cold water tank 1 is internally provided with the double-water-level floating ball 4, and the double-water-level floating ball 4 can sense water levels at different heights in the cold water tank 1, so that refrigeration at different water levels can be accurately controlled, and when rapid refrigeration is required, a low water level can be selected, so that the structure can refrigerate a small amount of water more rapidly.
Example two
As shown in fig. 2 to 4, this embodiment provides an electronic ice container, including a semiconductor refrigeration structure, further including: a heat dissipation mechanism 5 for dissipating heat from the refrigeration mechanism 2; one end of the heat dissipation mechanism 5 is connected with the cold water tank 1, and the other end of the heat dissipation mechanism 5 is abutted against the refrigeration semiconductor 22; the heat preservation mechanism 6 is used for preserving heat of the cold water tank 1; the heat preservation mechanism 6 is sleeved on the outer side of the cold water tank 1
In the embodiment, the heat dissipation mechanism 5 is installed at the outer side of the cold water tank 1 and is abutted against the refrigerating semiconductor 22, and the heat dissipation mechanism 5 can dissipate heat of the refrigerating semiconductor 22 during operation and reduce temperature, so that heat accumulation during operation of the refrigerating mechanism 2 is prevented; the heat preservation mechanism 6 is sleeved on the outer side of the cold water tank 1, so that the heat preservation effect of the cold water tank 1 can be improved, and the heat preservation time of the cold water tank 1 can be prolonged.
Further, the heat dissipation mechanism 5 includes: a bracket 51, a heat sink 52, and a heat dissipation fan 53; the bracket 51 is installed at one side of the cold water tank 1; one end of the heat sink 52 is mounted on the bracket 51, and the other end of the heat sink 52 abuts against the refrigeration semiconductor 22; the heat radiation fan 53 is mounted on the bracket 51.
In the present embodiment, the bracket 51 is installed on the side of the cold water tank 1 near the cooling semiconductor 22, and the cooling fin 52 and the cooling fan 53 are provided with two groups corresponding to the number of the cooling semiconductors 22; one end of the radiating fin 52 is arranged on the bracket 51, and the other end is abutted against the refrigerating semiconductor 22 at the corresponding position, so that heat generated when the refrigerating semiconductor 22 works can be transferred to the radiating fin 52; the heat radiation fan 53 is mounted on the bracket 51 in correspondence with the position of the heat radiation fin 52 (see fig. 2 and 3), so that the high temperature generated by the refrigerating semiconductor 22 is blown to the outside of the apparatus by the heat radiation fan 53 after passing through the heat radiation fin 52, thereby achieving the heat radiation effect of the apparatus.
Further, the heat preservation mechanism 6 is a plurality of heat preservation pearl cottons which can be mutually embedded.
In this embodiment, the heat insulation mechanism 6 is composed of two heat insulation pearl cottons which can be mutually embedded (see fig. 4, the heat insulation of the pearl cottons is in the prior art), and the cold water tank is clamped inside a heat insulation cavity formed between the two heat insulation pearl cottons after the two heat insulation pearl cottons are embedded, so that the heat insulation effect on the cold water tank is achieved, and the cold water heat insulation time of the cold water tank is increased.
The semiconductor refrigeration structure and the electronic ice container have the advantages that the water temperature transmission efficiency can be quickened through circulation refrigeration, so that the refrigeration efficiency is improved.
The above description is only a preferred embodiment of the present utility model, and the protection scope of the present utility model is not limited to the above examples, and all technical solutions belonging to the concept of the present utility model belong to the protection scope of the present utility model. It should be noted that modifications and adaptations to the present utility model may occur to one skilled in the art without departing from the principles of the present utility model and are intended to be within the scope of the present utility model.
Claims (8)
1. A semiconductor refrigeration structure, comprising:
a cold water tank for storing pure water; a circulating water inlet is formed in the cold water tank;
The refrigerating mechanism is used for cooling the pure water in the cold water tank; one end of the refrigeration mechanism is arranged at one side of the cold water tank, and the other end of the refrigeration mechanism is positioned in the cold water tank;
The diversion mechanism is used for controlling the water flow output state of the cold water tank; one end of the flow guiding mechanism is connected with the cold water tank, and the other end of the flow guiding mechanism is connected with the circulating water inlet.
2. The semiconductor refrigeration structure of claim 1, wherein the flow directing mechanism comprises: a water outlet pipe, a water suction pump and a circulating water pump; the water outlet pipe is arranged at the bottom of the cold water tank; one end of the water suction pump is connected with the water outlet pipe, and the other end of the water suction pump is connected with an external water purifier; one end of the circulating water pump is connected with the water suction pump, and the other end of the circulating water pump is connected with the circulating water inlet.
3. The semiconductor refrigeration structure according to claim 2, wherein the circulating water inlet is located above the water outlet pipe.
4. A semiconductor refrigeration structure as recited in claim 3 wherein said refrigeration mechanism comprises: the refrigerating semiconductor comprises a supporting frame, a refrigerating semiconductor and a semiconductor temperature-conducting sheet; the support frame is arranged on the cold water tank; one end of the semiconductor temperature-conducting piece is arranged on the supporting frame, and the other end of the semiconductor temperature-conducting piece is positioned in the cold water tank; the refrigeration semiconductor is arranged on the supporting frame and connected with the semiconductor temperature-conducting sheet.
5. The semiconductor refrigeration structure according to claim 4, wherein a double water level floating ball capable of sensing different water level heights is provided in the cold water tank.
6. An electronic ice container comprising the semiconductor refrigeration structure of claim 4 or 5, further comprising:
The heat dissipation mechanism is used for dissipating heat of the refrigerating mechanism; one end of the heat dissipation mechanism is connected with the cold water tank, and the other end of the heat dissipation mechanism is abutted with the refrigeration semiconductor;
the heat preservation mechanism is used for preserving heat of the cold water tank; the heat preservation mechanism is sleeved on the outer side of the cold water tank.
7. The electronic ice container of claim 6, wherein said heat dissipation mechanism comprises: a bracket, a radiating fin and a radiating fan; the bracket is arranged on one side of the cold water tank; one end of the radiating fin is arranged on the bracket, and the other end of the radiating fin is abutted against the refrigeration semiconductor; the cooling fan is arranged on the bracket.
8. The electronic ice container of claim 7, wherein said thermal insulation means is a plurality of mutually engageable thermal insulation pearl wool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321392343.8U CN220959181U (en) | 2023-06-01 | 2023-06-01 | Semiconductor refrigeration structure and electronic ice container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321392343.8U CN220959181U (en) | 2023-06-01 | 2023-06-01 | Semiconductor refrigeration structure and electronic ice container |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220959181U true CN220959181U (en) | 2024-05-14 |
Family
ID=90982514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321392343.8U Active CN220959181U (en) | 2023-06-01 | 2023-06-01 | Semiconductor refrigeration structure and electronic ice container |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220959181U (en) |
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2023
- 2023-06-01 CN CN202321392343.8U patent/CN220959181U/en active Active
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