CN218860632U - High-temperature-resistant high-viscosity double-sided adhesive tape - Google Patents
High-temperature-resistant high-viscosity double-sided adhesive tape Download PDFInfo
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- CN218860632U CN218860632U CN202222870631.1U CN202222870631U CN218860632U CN 218860632 U CN218860632 U CN 218860632U CN 202222870631 U CN202222870631 U CN 202222870631U CN 218860632 U CN218860632 U CN 218860632U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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- Y02E60/10—Energy storage using batteries
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Abstract
The utility model discloses a high temperature resistant high viscidity double-sided tape, it includes that first release paper layer, first high temperature resistant adhesive layer, first heat-conducting layer, substrate layer, second heat-conducting layer, the high temperature resistant adhesive layer of second and second release paper layer, the substrate layer is equipped with anti-deformation structure, buffer structure and heat conduction structure, first heat-conducting layer is equipped with heat radiation structure, first heat-conducting layer and second heat-conducting layer all are equipped with high temperature resistant contact structure, first high temperature resistant adhesive layer and the high temperature resistant adhesive layer of second all are equipped with the grid structure. The utility model realizes the integration of high heat conduction and heat dissipation, buffer protection and deformation resistance, and better protects devices; constitute dual additional strengthening through setting up anti-deformation structure, improve the attached vertical and horizontal holding power of high temperature resistant high viscosity double-sided tape to prevent to lead to attached area to enlarge or reduce the condition of deformation to appear because of the change of temperature, guarantee the attached effect of high temperature resistant high viscosity double-sided tape, thereby guarantee subsequent high temperature resistant and heat conduction's nature.
Description
Technical Field
The utility model relates to a double-sided tape's technical field, concretely relates to high temperature resistant high viscosity double-sided tape.
Background
With the development of electronic products, in order to facilitate the installation of components, most of the conventional heat-conducting double-sided tapes are adhered by double-sided tapes, and the conventional common heat-conducting double-sided tape is a double-sided tape formed by coating acrylic acid adhesive mixed with alumina powder or boron nitride powder on two sides by using glass fiber cloth as a substrate carrier; the heat-conducting performance of the heat-conducting adhesive prepared on two sides is relatively limited, so that the actual heat-conducting efficiency of the prepared finished heat-conducting double-sided tape is low, the basic heat-conducting coefficient can reach 0.4K (W/mk) which is a limit, the heat-conducting effect of the actual use occasion is very little, and the direct contact area of the existing double-sided tape and the outside is small, which can cause low heat conductivity of a pasted scene, poor heat dissipation performance, abnormal high temperature of the pasted scene and even the risk of burning a working device due to high temperature; the existing double-sided adhesive tape can only provide deformation resistance through a base material of the double-sided adhesive tape, has poor deformation resistance, is easily influenced by temperature to increase or reduce deformation, influences the problem of attachment area, influences the covering effect, and influences the heat conduction and the adhesion performance; the adhesive surface of the adhesive layer of the existing double-sided adhesive tape has no positioning structure, the adhesive on the adhesive surface is possibly in a fluid state due to temperature, and the adhesive surface moves towards one end due to the influence of the self weight of the adhesive, so that the subsequent adhesive performance and effect are influenced, and the adhesive life is easy to stick; the existing double-sided tape has poor buffering performance and heavy weight, so that the application range of the double-sided tape is limited to a certain extent.
SUMMERY OF THE UTILITY MODEL
The utility model provides a high-temperature resistant high-viscosity double-sided adhesive tape aiming at the defects of the prior art.
The utility model discloses a realize that the technical scheme that above-mentioned purpose adopted is:
the utility model provides a high temperature resistant high viscidity double-sided sticky tape, high temperature resistant high viscidity double-sided sticky tape includes that first release paper layer, first high temperature resistant adhesive layer, first heat-conducting layer, substrate layer, second heat-conducting layer, the high temperature resistant adhesive layer of second and second release paper layer, the substrate layer is equipped with anti-deformation structure, buffer structure and heat conduction structure, the one end of heat conduction structure with first heat-conducting layer is connected, the other end of heat conduction structure with the second heat-conducting layer is connected, first heat-conducting layer is equipped with heat radiation structure, first heat-conducting layer and second heat-conducting layer all are equipped with contact structure, first high temperature resistant adhesive layer and the high temperature resistant adhesive layer of second all are equipped with the grid structure.
Further improvement is made, first heat-conducting layer sets up the top of substrate layer, the second heat-conducting layer sets up the below of substrate layer, first high temperature resistant adhesive layer sets up the top of first heat-conducting layer, first release paper layer sets up the top of first high temperature resistant adhesive layer, the high temperature resistant adhesive layer of second sets up the below of second heat-conducting layer, the second is in from the setting of release paper layer the below of second adhesive layer, the substrate layer is one kind in PET film, PVC film, PI film, the TPU film.
The improved structure is characterized in that the thickness of the base material layer is 1-5mm, the base material layer is provided with a plurality of groups of through hole groups, the through hole groups are arranged on the base material layer in an array mode, and the through hole groups are formed by a plurality of through holes.
The heat conducting structure comprises a plurality of heat conducting silica gel columns, the heat conducting silica gel columns are respectively arranged in the through holes, the outer side surfaces of the heat conducting silica gel columns are tightly attached to the inner side surfaces of the through holes, one end of each heat conducting silica gel column is connected with the first heat conducting layer, and the other end of each heat conducting silica gel column is connected with the second heat conducting layer.
The anti-deformation structure comprises a grid reinforcing structure I and a grid reinforcing structure II, wherein the grid reinforcing structure I is arranged on the upper surface of the base material layer, the grid reinforcing structure II is arranged on the lower surface of the base material layer, and the grid reinforcing structure I and the grid reinforcing structure II are composed of a plurality of transverse reinforcing ribs and a plurality of longitudinal reinforcing ribs.
The improved structure comprises a plurality of buffer bag cavities, and equal intervals are arranged between the buffer bag cavities.
Further improvement is made, the thickness of first heat-conducting layer and second heat-conducting layer is 0.5-3mm, contact structure all includes many heat conduction silica gel contact sand grips, many the heat conduction silica gel contact sand grip is arranged with the mode of array, the coefficient of heat conductivity of first heat-conducting layer and second heat-conducting layer is 0.8-1.4K (W/mk), be equipped with equidistant one between heat conduction silica gel contact sand grip and the heat conduction silica gel contact sand grip.
The heat dissipation structure comprises a plurality of heat dissipation slotted holes, the plurality of heat dissipation slotted holes are respectively arranged on the first heat conduction layer, and the plurality of heat dissipation slotted holes are of prismatic hole structures.
The grid structure comprises a plurality of grid strips, the grid strips are arranged on the equal intervals respectively, and the grid strips are formed by a plurality of frame grids respectively.
The improvement is further made, first high temperature resistant adhesive layer and the high temperature resistant adhesive layer of second all include a plurality of viscose parts, and are a plurality of the viscose part sets up respectively in the frame check, the viscose part all is equipped with pastes the face, paste the face with the plane parallel of heat conduction silica gel contact sand grip.
The utility model has the advantages that: the utility model discloses a set up first heat-conducting layer, heat conduction structure and second heat-conducting layer and be used for improving heat conductivility, be used for improving the direct contact area between first heat-conducting layer and second heat-conducting layer and the attached device through setting up contact structure, improve heat conduction effect and heat dispersion, and can provide the higher heat conduction efficiency of the device that is attached, make the device send the heat of getting and can lead away more fast, avoid the lamp pearl to burn out because of the heat gathering, better protection device; the heat dissipation structure with the prism hole structure is used for increasing the heat dissipation area, so that heat can be quickly dissipated from the heat dissipation groove holes, and the heat dissipation efficiency and effect are improved; the grid reinforcing structure I and the grid reinforcing structure II 91 form a double reinforcing structure, so that the longitudinal and transverse supporting force for attaching the high-temperature-resistant high-viscosity double-sided adhesive tape is greatly improved, the condition that the attaching area of the high-temperature-resistant high-viscosity double-sided adhesive tape is enlarged or reduced and deformed due to the change of temperature is prevented, the attaching effect of the high-temperature-resistant high-viscosity double-sided adhesive tape is ensured, and the subsequent high-temperature-resistant and heat-conducting performances are ensured; the buffer bag cavity is used for providing a buffer space, so that the high-temperature-resistant high-viscosity double-sided adhesive tape has buffer performance, provides buffer protection, and can reduce the whole weight of the high-temperature-resistant high-viscosity double-sided adhesive tape, so that the high-temperature-resistant high-viscosity double-sided adhesive tape is lighter and lighter, the adhesion effect and the service life are improved, and the use range of the high-temperature-resistant high-viscosity double-sided adhesive tape is enlarged; be used for guaranteeing through setting up grid structure that the adhesive part can not lead to the adhesive skew to appear because of the influence of temperature and adhesive dead weight, guarantee the adhesion performance of the face of pasting of each point on first high temperature resistant adhesive layer and the high temperature resistant adhesive layer of second, make the part of being pasted difficult for droing because of vibrations high temperature attenuation, guarantee adhesion effect and life-span.
The present invention will be further described with reference to the accompanying drawings and the following detailed description.
Drawings
FIG. 1 is a schematic view of the entire structure of the high temperature resistant and high viscosity double-sided tape of this embodiment;
FIG. 2 is an exploded view of the high temperature and high viscosity double-sided adhesive tape of the present embodiment;
fig. 3 is a schematic top view of the first high temperature resistant adhesive layer and the first heat conductive layer of the present embodiment;
fig. 4 is a schematic top view of the second high temperature resistant adhesive layer and the second heat conductive layer of the present embodiment;
fig. 5 is a schematic structural diagram of the substrate layer in the embodiment;
fig. 6 is a schematic cross-sectional view of fig. 5.
Detailed Description
The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.
In the embodiment, referring to fig. 1 to 6 of the drawings, a high temperature resistant and high viscosity double-sided tape 1 includes a first release paper layer 2, a first high temperature resistant adhesive layer 3, a first heat conduction layer 4, a substrate layer 5, a second heat conduction layer 6, a second high temperature resistant adhesive layer 7 and a second release paper layer 8, the substrate layer 5 is provided with a deformation resistant structure 9, a buffer structure 10 and a heat conduction structure 11, one end of the heat conduction structure 11 is connected to the first heat conduction layer 4, the other end of the heat conduction structure 11 is connected to the second heat conduction layer 6, the first heat conduction layer 4 is provided with a heat dissipation structure 12, the first heat conduction layer 4 and the second heat conduction layer 6 are both provided with a contact structure 13, the first high temperature resistant adhesive layer 3, the first heat conduction layer 4, the substrate layer 5, the second heat conduction layer 6, the second high temperature resistant adhesive layer 7 and the second release paper layer 8 are all bonded together through a mesh structure 14.
First heat-conducting layer 4 sets up the top of substrate layer 5, second heat-conducting layer 6 sets up the below of substrate layer 5, first high temperature resistant adhesive layer 3 sets up the top of first heat-conducting layer 4, first release paper layer 2 sets up the top of first high temperature resistant adhesive layer 3, second high temperature resistant adhesive layer 7 sets up the below of second heat-conducting layer 6, the second is in from the setting of type paper layer 8 the below of second high temperature resistant adhesive layer 7, substrate layer 5 is one kind in PET film, PVC film, PI film, the TPU film, first release paper layer 2 and second are from type paper layer 8 and are the isolation layer, and it is used for the isolation, tears it when needs use from it and can remember nature adhesion and use.
The thickness of substrate layer 5 is 1-5mm, substrate layer 5 is equipped with multiunit through-hole group 50, multiunit through-hole group 50 sets up with the mode of array on the substrate layer 5, the multiunit through-hole group 50 comprises a plurality of through-holes, heat conduction structure 11 includes many heat conduction silica gel columns, many the heat conduction silica gel columns set up respectively in the through-hole, the lateral surface of heat conduction silica gel column with the medial surface of through-hole closely laminates, the one end of heat conduction silica gel column with first heat-conducting layer 4 is connected, the other end of heat conduction silica gel column with second heat-conducting layer 6 is connected, heat conduction structure 11 is used for providing the heat conduction passageway to make the direct contact between first heat-conducting layer 4 and the second heat-conducting layer 6, thereby improve heat conduction efficiency and radiating effect.
The anti-deformation structure 9 includes grid additional strengthening one 90 and grid additional strengthening two 91, grid additional strengthening one 90 sets up the upper surface of substrate layer 5, grid additional strengthening two 91 set up the lower surface of substrate layer 5, grid additional strengthening one 90 and grid additional strengthening two 91 constitute by many horizontal strengthening ribs and many vertical strengthening ribs, anti-deformation structure 9 is used for guaranteeing the anti-deformability after high temperature resistant high viscosity double-sided tape 1 pastes, constitutes dual additional strengthening through setting up grid additional strengthening one 90 and grid additional strengthening two 91, improves the vertical and horizontal holding power that high temperature resistant high viscosity double-sided tape 1 is attached greatly to prevent that high temperature resistant high viscosity double-sided tape 1 from leading to the condition that attached area enlarges or reduces the deformation because of the change of temperature and appearing, guarantee the attached effect of high temperature resistant high viscosity double-sided tape 1 to guarantee subsequent high temperature resistant and heat conduction's performance.
The thickness of first heat-conducting layer 4 and second heat-conducting layer 6 is 0.5-3mm, contact structure 13 all includes many heat conduction silica gel contact sand grips, many heat conduction silica gel contact sand grip arranges with the mode of array, the coefficient of heat conductivity of first heat-conducting layer 4 and second heat-conducting layer 6 is 0.8-1.4K (W/mk), it is equidistant one to be equipped with between heat conduction silica gel contact sand grip and the heat conduction silica gel contact sand grip, contact structure 13 is used for improving first heat-conducting layer 4 and second heat-conducting layer 6 and by the direct contact area between the attached product to improve heat conduction effect and heat dispersion.
The heat dissipation structure 12 includes a plurality of heat dissipation slots, the plurality of heat dissipation slots are respectively disposed on the first heat conduction layer 4, the plurality of heat dissipation slots are prism-shaped hole structures, and the prism-shaped hole structures are used for increasing the heat dissipation area, so that heat can be quickly dissipated from the heat dissipation slots, and the heat dissipation efficiency and the heat dissipation effect are improved.
The utility model discloses a set up first heat-conducting layer, heat conduction structure and second heat-conducting layer and be used for improving the heat conductivility, through setting up the direct contact area that contact structure is used for improving between first heat-conducting layer and second heat-conducting layer and the attached device, improve heat conduction effect and heat dispersion, and can provide the higher heat conduction efficiency of attached device, make the device send the heat and can lead out faster, avoid the lamp pearl to burn out because of the heat gathering, better protection device; the heat dissipation structure with the prism hole structure is used for increasing the heat dissipation area, so that heat can be quickly dissipated from the heat dissipation groove holes, and the heat dissipation efficiency and effect are improved; the grid reinforcing structure I and the grid reinforcing structure II form a double reinforcing structure, so that the longitudinal and transverse supporting force for attaching the high-temperature-resistant and high-viscosity double-sided adhesive tape is greatly improved, the condition that the attaching area of the high-temperature-resistant and high-viscosity double-sided adhesive tape is enlarged or reduced and deformed due to the change of temperature is prevented, the attaching effect of the high-temperature-resistant and high-viscosity double-sided adhesive tape is ensured, and the subsequent high-temperature-resistant and heat-conducting performances are ensured; the buffer bag cavity is used for providing a buffer space, so that the high-temperature-resistant high-viscosity double-sided adhesive tape has buffer performance, provides buffer protection, and can reduce the whole weight of the high-temperature-resistant high-viscosity double-sided adhesive tape, so that the high-temperature-resistant high-viscosity double-sided adhesive tape is lighter and lighter, the adhesion effect and the service life are improved, and the use range of the high-temperature-resistant high-viscosity double-sided adhesive tape is enlarged; be used for guaranteeing through setting up grid structure that the adhesive part can not lead to the adhesive skew to appear because of the influence of temperature and adhesive dead weight, guarantee the adhesion performance of the face of pasting of each point on first high temperature resistant adhesive layer and the high temperature resistant adhesive layer of second, make the part of being pasted difficult for droing because of vibrations high temperature attenuation, guarantee adhesion effect and life-span.
The utility model discloses be not limited to above-mentioned embodiment, adopt with the same or similar structure or device of the above-mentioned embodiment of the utility model, and the other that obtain is used for high temperature resistant high viscosity double sticky tape, all is within the protection scope of the utility model.
Claims (10)
1. The utility model provides a high temperature resistant high viscidity double-sided tape which characterized in that: high temperature resistant high viscidity double-sided tape includes that first from type paper layer, first high temperature resistant adhesive layer, first heat-conducting layer, substrate layer, second heat-conducting layer, the high temperature resistant adhesive layer of second and second from the type paper layer, the substrate layer is equipped with anti-deformation structure, buffer structure and heat conduction structure, heat conduction structure's one end with first heat-conducting layer is connected, heat conduction structure's the other end with the second heat-conducting layer is connected, first heat-conducting layer is equipped with heat radiation structure, first heat-conducting layer and second heat-conducting layer all are equipped with the contact structure, first high temperature resistant adhesive layer reaches and the high temperature resistant adhesive layer of second all is equipped with the lattice construction.
2. The high temperature resistant high tack double sided tape of claim 1, wherein: first heat-conducting layer sets up the top of substrate layer, the second heat-conducting layer sets up the below of substrate layer, first high temperature resistant adhesive layer sets up the top of first heat-conducting layer, first release paper layer sets up the top of first high temperature resistant adhesive layer, the high temperature resistant adhesive layer of second sets up the below of second heat-conducting layer, the second is in from the setting of release paper layer the below of the high temperature resistant adhesive layer of second, the substrate layer is one kind in PET film, PVC film, PI film, the TPU film.
3. The double-sided adhesive tape of claim 2, wherein: the thickness of the substrate layer is 1-5mm, the substrate layer is provided with a plurality of groups of through holes, the through holes are arranged on the substrate layer in an array mode, and the through holes are formed by a plurality of through holes.
4. The high temperature resistant high tack double sided tape of claim 3, wherein: the heat conduction structure comprises a plurality of heat conduction silica gel columns, the heat conduction silica gel columns are respectively arranged in the through holes, the outer side surfaces of the heat conduction silica gel columns are tightly attached to the inner side surfaces of the through holes, one end of each heat conduction silica gel column is connected with the first heat conduction layer, and the other end of each heat conduction silica gel column is connected with the second heat conduction layer.
5. The high temperature resistant high tack double sided tape of claim 4, wherein: the anti-deformation structure comprises a grid reinforcing structure I and a grid reinforcing structure II, wherein the grid reinforcing structure I is arranged on the upper surface of the base material layer, the grid reinforcing structure II is arranged on the lower surface of the base material layer, and the grid reinforcing structure I and the grid reinforcing structure II are composed of a plurality of transverse reinforcing ribs and a plurality of longitudinal reinforcing ribs.
6. The high temperature resistant high tack double sided tape of claim 5, wherein: the buffer structure comprises a plurality of buffer bag cavities, and equal intervals are arranged between the buffer bag cavities.
7. The high temperature resistant high tack double sided tape of claim 6, wherein: the thickness of first heat-conducting layer and second heat-conducting layer is 0.5-3mm, contact structure all includes many heat conduction silica gel contact sand grips, many the heat conduction silica gel contact sand grip is arranged with the mode of array, the coefficient of heat conductivity of first heat-conducting layer and second heat-conducting layer is 0.8-1.4K (W/mk), be equipped with equal interval one between heat conduction silica gel contact sand grip and the heat conduction silica gel contact sand grip.
8. The double-sided adhesive tape with high temperature and viscosity resistance as claimed in claim 7, wherein: the heat dissipation structure comprises a plurality of heat dissipation slotted holes, the heat dissipation slotted holes are respectively formed in the first heat conduction layer, and the heat dissipation slotted holes are of prismatic hole structures.
9. The double-sided adhesive tape of claim 8, wherein: the grid structure comprises a plurality of grid strips, the grid strips are arranged on the equal intervals respectively, and the grid strips are formed by a plurality of frame grids respectively.
10. The high temperature resistant high tack double sided tape of claim 9, wherein: first high temperature resistant adhesive layer and second high temperature resistant adhesive layer all include a plurality of adhesive part, and are a plurality of the adhesive part sets up respectively in the frame check, the adhesive part all is equipped with pastes the face, paste the face with the plane of heat conduction silica gel contact sand grip is parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222870631.1U CN218860632U (en) | 2022-10-28 | 2022-10-28 | High-temperature-resistant high-viscosity double-sided adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222870631.1U CN218860632U (en) | 2022-10-28 | 2022-10-28 | High-temperature-resistant high-viscosity double-sided adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218860632U true CN218860632U (en) | 2023-04-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222870631.1U Active CN218860632U (en) | 2022-10-28 | 2022-10-28 | High-temperature-resistant high-viscosity double-sided adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218860632U (en) |
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2022
- 2022-10-28 CN CN202222870631.1U patent/CN218860632U/en active Active
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