CN217047770U - Aluminum-based copper-clad plate with high heat dissipation - Google Patents
Aluminum-based copper-clad plate with high heat dissipation Download PDFInfo
- Publication number
- CN217047770U CN217047770U CN202220441839.9U CN202220441839U CN217047770U CN 217047770 U CN217047770 U CN 217047770U CN 202220441839 U CN202220441839 U CN 202220441839U CN 217047770 U CN217047770 U CN 217047770U
- Authority
- CN
- China
- Prior art keywords
- clad plate
- copper
- aluminum
- heat
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a high radiating aluminium base copper-clad plate, include: the aluminum-copper clad plate is internally provided with a cavity chamber; the heat dissipation mechanism comprises a plurality of heat conduction rods, the top of the aluminum copper-clad plate is provided with an injection hole, the inside of the injection hole is in threaded connection with a sealing bolt, the plurality of heat conduction rods are fixedly connected inside a cavity chamber of the aluminum copper-clad plate in an equidistant arrangement mode, and the inside of each heat conduction rod is provided with a through hole; the utility model discloses during the use, through setting up the cavity in the aluminium copper-clad plate to at the indoor installation a plurality of heat conduction pole of cavity, set up the through-hole on the heat conduction pole, make the aluminium copper-clad plate when meetting the high temperature, the temperature passes through aluminium copper-clad plate conduction to cavity indoor portion, the heat conduction pole of setting up the through-hole can absorb the indoor a large amount of temperatures of cavity, and to the both ends conduction heat dissipation, wherein, operating personnel opens the filling hole through rotating sealed bolt, and through the filling hole to the inside heat dissipation silica gel layer that pours into of cavity.
Description
Technical Field
The utility model relates to an aluminium copper-clad plate technical field specifically is a high radiating aluminium base copper-clad plate.
Background
An aluminum-based copper clad laminate, i.e., an aluminum substrate, is one of raw materials, and is a plate-shaped material prepared by using electronic glass fibers or other reinforcing materials, soaking the electronic glass fibers or other reinforcing materials in resin, single resin and the like as insulating bonding layers, coating copper foils on one surface or two surfaces of the electronic glass fibers or other reinforcing materials and performing hot pressing, and is called a copper-clad laminated aluminum substrate, and is called an aluminum-based copper clad laminate for short.
However, the existing aluminum-based copper-clad plate still has certain problems, the existing aluminum-based copper-clad plate has a single structure, high temperature inside the plate body is easy to remain due to long-term use, heat can not be dissipated timely, external wind heat dissipation or smearing of heat dissipation materials is often needed to be utilized for heat dissipation, the heat dissipation efficiency is low, and the heat dissipation mode is complex.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high radiating aluminium base copper-clad plate to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above purpose, the utility model provides a following technical scheme: a high-heat-dissipation aluminum-based copper-clad plate comprises: an aluminum copper-clad plate and a heat dissipation mechanism;
wherein a cavity chamber is arranged inside the aluminum copper-clad plate;
the heat dissipation mechanism comprises a plurality of heat conduction rods, the injection hole is formed in the top of the aluminum-copper clad plate, the sealing bolt is connected to the inner portion of the injection hole in a threaded mode, the heat conduction rods are arranged at equal intervals and fixedly connected inside a cavity chamber of the aluminum-copper clad plate, the through hole is formed in the heat conduction rods, and the cavity chamber of the aluminum-copper clad plate is filled with a heat dissipation silica gel layer.
Through adopting the technical scheme, the utility model discloses during the use, through a plurality of heat conduction pole of indoor installation of cavity at the aluminium copper-clad plate, set up the through-hole on the heat conduction pole, make the aluminium copper-clad plate when meetting the high temperature, the temperature passes through the aluminium copper-clad plate and conducts to the cavity indoor portion, the heat conduction pole of setting up the through-hole can absorb the indoor a large amount of temperatures of cavity, and to the both ends conduction heat dissipation, wherein, operating personnel pours into the heat dissipation silica gel layer into to the cavity indoor portion through the filling hole, the cladding of heat dissipation silica gel layer is at cavity indoor portion and heat conduction pole outer wall, thereby improve the radiating efficiency.
Preferably, the diameters of the upper end part and the lower end part of the heat conducting rod are larger than that of the middle part of the heat conducting rod.
Through adopting above-mentioned technical scheme, be greater than the filling area that middle part diameter can increase heat dissipation silica gel layer through setting up heat conduction rod upper and lower tip diameter, improve the radiating effect.
Preferably, the top of the aluminum copper-clad plate is fixedly connected with a cover plate, and the cover plate is provided with a plurality of heat dissipation holes.
Through adopting above-mentioned technical scheme, the apron can increase the bulk strength of aluminium copper-clad plate to improve the efficiency that the heat gived off to the outside through the louvre.
Preferably, the bottom of the aluminum copper-clad plate is fixedly connected with a graphene film.
By adopting the technical scheme, the graphene film can improve the heat dissipation effect of the bottom of the aluminum-clad plate.
Preferably, an insulating layer is bonded to the bottom of the graphene film.
Through adopting above-mentioned technical scheme, the insulating layer can play the effect of separation electric current between the graphite alkene membrane, avoids people direct contact electric current to lead to electrocuteeing the injury.
Preferably, the heat dissipation holes are arranged at equal intervals.
Through adopting above-mentioned technical scheme, the louvre of equidistance arrangement can improve heat radiating area.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses during the use, through a plurality of heat conduction pole of indoor installation of cavity at the aluminium copper-clad plate, set up the through-hole on the heat conduction pole, make the aluminium copper-clad plate when meetting high temperature, the temperature passes through aluminium copper-clad plate conduction to the cavity indoor portion, the heat conduction pole of setting up the through-hole can absorb the indoor a large amount of temperatures of cavity, and to both ends conduction heat dissipation, wherein, operating personnel injects the heat dissipation silica gel layer to the cavity indoor portion through the injection hole, the cladding of heat dissipation silica gel layer is at cavity indoor portion and heat conduction pole outer wall, thereby improve the radiating efficiency, make this device possess higher radiating effect.
Drawings
FIG. 1 is a schematic structural view of a high heat dissipation aluminum-based copper-clad plate of the present invention;
FIG. 2 is a schematic view showing the cross-sectional structure of an aluminum-clad plate in the high-heat-dissipation aluminum-based copper-clad plate of the present invention;
fig. 3 is the structural schematic diagram of the heat conducting rod in the high heat dissipation aluminum-based copper-clad plate of the utility model.
In the figure: 1. a cover plate; 2. heat dissipation holes; 3. an aluminum copper clad laminate; 4. a graphene film; 5. an insulating layer; 6. a sealing plug; 7. an injection hole; 8. a heat dissipation silica gel layer; 9. a heat conducting rod; 10. a through hole; 11. a hollow chamber.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a high-heat-dissipation aluminum-based copper-clad plate comprises: aluminum copper clad plate 3 and heat dissipation mechanism.
As shown in fig. 1-3, a hollow chamber 11 is formed inside the aluminum copper clad laminate 3.
Wherein, as shown in fig. 1-3, the heat dissipation mechanism includes a plurality of heat conduction pole 9, and the filling hole 7 has been seted up at the top of aluminium copper- clad plate 3, and 6 threaded connection of sealing bolt are in the inside of filling hole 7, and a plurality of heat conduction pole 9 of fixed connection of 11 inside equidistance arrangements of cavity of aluminium copper-clad plate 3, through-hole 10 has been seted up to the inside of heat conduction pole 9, and 11 intussuseptions in the cavity of aluminium copper-clad plate 3 are filled with heat dissipation silica gel layer 8.
As shown in fig. 1 to 3, in order to increase the filling area of the heat dissipation silica gel layer 8 and improve the heat dissipation effect, the diameters of the upper and lower end portions of the heat conduction rod 9 are larger than the diameter of the middle portion.
As shown in fig. 1-2, in order to increase the overall strength of the aluminum-clad plate 3 and improve the efficiency of heat dissipation to the outside, the top of the aluminum-clad plate 3 is fixedly connected with a cover plate 1, and the cover plate 1 is provided with a plurality of heat dissipation holes 2.
As shown in fig. 1-2, in order to improve the heat dissipation effect of the bottom of the aluminum-copper clad plate 3, the graphene film 4 is fixedly connected to the bottom of the aluminum-copper clad plate 3, and meanwhile, in order to play a role in blocking current between the graphene films 4 and avoid electric shock and injury caused by direct current contact of people, an insulating layer 5 is bonded to the bottom of the graphene film 4.
As shown in fig. 1-2, in order to increase the heat dissipation area of the heat dissipation holes 2, the heat dissipation holes 2 are arranged at equal intervals.
According to the technical scheme, the working steps of the scheme are summarized and carded: the utility model discloses during the use, through set up plenum chamber 11 in aluminium copper-clad plate 3, and install a plurality of heat conduction pole 9 in plenum chamber 11, set up through-hole 10 on the heat conduction pole 9, make aluminium copper-clad plate 3 when meetting the high temperature, the temperature passes through aluminium copper-clad plate 3 and conducts to plenum chamber 11 inside, the heat conduction pole 9 of setting up through-hole 10 can absorb a large amount of temperatures in the plenum chamber 11, and to both ends conduction heat dissipation, wherein, operating personnel opens injection hole 7 through rotating sealed bolt 6, and through injection hole 7 to 11 inside injection heat dissipation silica gel layer 8 of plenum chamber, 8 cladding of heat dissipation silica gel layer are at 11 inside and the 9 outer walls of heat conduction pole of plenum chamber, thereby improve the radiating efficiency, make this device possess higher radiating effect.
To sum up: the utility model discloses during the use, through installing a plurality of heat conduction pole 9 in the cavity 11 at aluminum-clad plate 3, set up through-hole 10 on the heat conduction pole 9, make aluminum-clad plate 3 when meetting the high temperature, the temperature passes through aluminum-clad plate 3 conduction to cavity 11 inside, set up a large amount of temperatures in cavity 11 can be absorbed to the heat conduction pole 9 of through-hole 10, and to the heat dissipation of both ends conduction, wherein, operating personnel passes through injection hole 7 to 11 inside injection heat dissipation silica gel layers 8 of cavity, 8 cladding of heat dissipation silica gel layers are at 11 inside and the 9 outer walls of heat conduction pole of cavity, thereby improve the radiating efficiency, make this device possess higher radiating effect.
The part not involved in the utility model is the same as the prior art or can be realized by adopting the prior art. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high radiating aluminium base copper-clad plate which characterized in that includes:
the aluminum-clad plate (3), wherein a cavity (11) is arranged inside the aluminum-clad plate (3);
the heat dissipation mechanism, the heat dissipation mechanism includes a plurality of heat conduction pole (9), injection hole (7) have been seted up at the top of aluminium copper-clad plate (3), the inside threaded connection of injection hole (7) has sealing bolt (6), the fixed connection that a plurality of heat conduction pole (9) equidistance was arranged is inside cavity room (11) of aluminium copper-clad plate (3), through-hole (10) have been seted up to the inside of heat conduction pole (9), cavity room (11) intussuseption of aluminium copper-clad plate (3) is filled with heat dissipation silica gel layer (8).
2. The high-heat-dissipation aluminum-based copper-clad plate according to claim 1, characterized in that: the diameters of the upper end part and the lower end part of the heat conducting rod (9) are larger than that of the middle part.
3. The aluminum-based copper-clad plate with high heat dissipation according to claim 1, characterized in that: the top of the aluminum copper clad plate (3) is fixedly connected with a cover plate (1), and a plurality of heat dissipation holes (2) are formed in the cover plate (1).
4. The high-heat-dissipation aluminum-based copper-clad plate according to claim 3, characterized in that: the bottom of the aluminum copper-clad plate (3) is fixedly connected with a graphene film (4).
5. The high-heat-dissipation aluminum-based copper-clad plate according to claim 4, characterized in that: an insulating layer (5) is bonded to the bottom of the graphene film (4).
6. The high-heat-dissipation aluminum-based copper-clad plate according to claim 3, characterized in that: the heat dissipation holes (2) are arranged at equal intervals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220441839.9U CN217047770U (en) | 2022-03-02 | 2022-03-02 | Aluminum-based copper-clad plate with high heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220441839.9U CN217047770U (en) | 2022-03-02 | 2022-03-02 | Aluminum-based copper-clad plate with high heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217047770U true CN217047770U (en) | 2022-07-26 |
Family
ID=82486854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220441839.9U Active CN217047770U (en) | 2022-03-02 | 2022-03-02 | Aluminum-based copper-clad plate with high heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217047770U (en) |
-
2022
- 2022-03-02 CN CN202220441839.9U patent/CN217047770U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2014117541A1 (en) | Photovoltaic component module for building | |
| CN217047770U (en) | Aluminum-based copper-clad plate with high heat dissipation | |
| CN211546404U (en) | Heat conduction silica gel sheet | |
| CN109587940B (en) | High-heat-dissipation aluminum-based copper-clad plate | |
| CN211764030U (en) | Heat aging resistance polyethylene terephthalate film | |
| CN207704101U (en) | A kind of optical cable fiber-dividing box | |
| EP4300658A1 (en) | Composite temperature control board and battery pack | |
| CN213564758U (en) | High-efficient heat conduction composite silica gel piece of car battery | |
| CN209626057U (en) | A kind of dedicated aluminium insulation board of patch type alminium electrolytic condenser shell | |
| CN221551715U (en) | High-compression-resistance electrolytic capacitor | |
| CN214835883U (en) | Energy-saving door and window with radiation-resistant fireproof low-E glass | |
| CN215367863U (en) | Novel prefabricated GRC composite member | |
| CN220700580U (en) | Heat-insulating aluminum honeycomb plate | |
| CN212954982U (en) | High-toughness ultrathin heat-conducting silica gel gasket | |
| CN218277594U (en) | Composite heat-conducting silica gel gasket | |
| CN218257168U (en) | Aluminum foil composite heat-conducting silica gel sheet | |
| CN217377780U (en) | Wear-resisting type heat conduction silicon rubber piece | |
| CN220156926U (en) | Multilayer composite heat conduction gasket | |
| CN207398156U (en) | A kind of solar panel | |
| CN214927744U (en) | High-heat-dissipation aluminum-based copper-clad plate | |
| CN213353767U (en) | High-heat-resistance CEM-3 copper-clad plate | |
| CN213485196U (en) | Communicating type heat-conductive heating cable | |
| CN212161174U (en) | LED display screen glass curtain wall | |
| CN213583754U (en) | Heat conduction gasket structure | |
| CN217983315U (en) | Diode chip structure of low-power consumption |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |