CN218857452U

CN218857452U - IC packaging mold

Info

Publication number: CN218857452U
Application number: CN202223591143.3U
Authority: CN
Inventors: 钟旭光; 夏广清; 邹梦丹; 洪进; 胡豪成
Original assignee: Suzhou Yinaite Electronic Industry Co ltd
Current assignee: Suzhou Yinaite Electronic Industry Co ltd
Priority date: 2022-12-29
Filing date: 2022-12-29
Publication date: 2023-04-14
Anticipated expiration: 2032-12-29

Abstract

The utility model discloses a IC packaging mold, comprising a base plate, water pump top position runs through and fixedly connected with water pipe, the water pipe other end runs through and the fan-shaped nozzle of fixedly connected with, two conveying external diameter of axle intermediate position all runs through and fixedly connected with transfer roller, two all be provided with the conveyer belt on the transfer roller, two the cylinder output all is provided with the telescopic link, two the equal fixedly connected with splint of the telescopic link other end. The utility model discloses in, first motor drives conveying axle and transfer roller and rotates, and the transfer roller drives the conveyer belt and rotates and convey the IC product between two splint, and the cylinder drives telescopic link and splint and merges and start the second motor after pressing from both sides the IC product tightly, and the second motor drives the lead screw and rotates, makes the vice actuating cylinder of nut remove right, puts down the IC product above the lower bolster, and after the use, the washing liquid suction of water pump in with the water tank, leads to pipe entering fan nozzle, washs the device through fan nozzle.

Description

IC packaging mold

Technical Field

The utility model relates to a IC packaging mold technical field especially relates to an IC packaging mold.

Background

IC package is a package for installing semiconductor IC chip, which not only plays the role of installing, fixing, sealing, protecting chip and enhancing electrothermal performance, but also is connected to the pins of package shell by wires through the contacts on the chip, and these pins are connected to other devices by the wires on the printed circuit board, thus realizing the connection of internal chip and external circuit.

The existing IC packaging mould can not automatically convey the IC product when packaging the IC product, so that the production efficiency is greatly reduced, the IC packaging mould needs to be cleaned after being used, but the existing IC packaging equipment does not have a cleaning device.

Disclosure of Invention

The utility model aims at solving the defects existing in the prior art and providing an IC packaging mold.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a IC packaging mold, includes the bottom plate, bottom plate top right side fixedly connected with water tank, water tank top position runs through and fixedly connected with water pump, water pump top position runs through and fixedly connected with water pipe, two stands of the equal fixedly connected with in both ends position around the bottom plate top, four the equal fixedly connected with roof in stand top position, roof top position fixedly connected with pneumatic cylinder, pneumatic cylinder bottom position is provided with the hydraulic stem, the equal fixedly connected with curb plate in both ends position around the bottom plate top left side, two all run through and the swivelling joint has the conveying axle around the curb plate between both ends, two conveying axle external diameter intermediate position all runs through and fixedly connected with transfer roller, two all be provided with the conveyer belt on the transfer roller, the equal fixedly connected with fixed plate in intermediate position is close to both ends around the bottom plate top, two equal fixedly connected with second motor in fixed plate right side top position, two the equal fixedly connected with lead screw of second motor output external diameter right side position all runs through and bolted connection has the nut pair, two the equal fixedly connected with cylinder in nut pair top position, two the cylinder output all is provided with the telescopic link, two the equal fixedly connected with splint of the telescopic link other end.

As further description of the technical scheme, a lower template is fixedly connected to the center of the top of the bottom plate.

As further description of the technical scheme, the bottom of the hydraulic rod is fixedly connected with an upper template.

As further description of the technical scheme, a first motor is fixedly connected to the left side position of the front end of the side plate at the front end, and the output end of the first motor is fixedly connected with the conveying shaft.

As a further description of the above technical solution, the two screw rods penetrate through and are rotatably connected with the fixing plate.

As further description of the above technical solution, the water pipe and the top plate are penetrated and fixedly connected.

As further description of the above technical solution, the other end of the water pipe penetrates and is fixedly connected with a fan-shaped nozzle.

As a further description of the above technical solution, the top positions of the two fixing plates are both penetrated and provided with a rotating groove.

The utility model discloses following beneficial effect has:

the utility model discloses in, first motor drives conveying axle and transfer roller and rotates, the transfer roller drives the conveyer belt and rotates and convey the IC product between two splint, the cylinder drives telescopic link and splint and merges and start the second motor after pressing from both sides the IC product tight, the second motor drives the lead screw and rotates, make the nut secondary drive cylinder remove right, put down the IC product to the lower bolster top, automatically, carry the IC product, the process time has been saved greatly, after the use, the water pump is with the washing liquid suction in the water tank, lead to pipe gets into fan nozzle, wash the device through fan nozzle.

Drawings

Fig. 1 is a perspective view of an IC package mold according to the present invention;

fig. 2 is a left side view of an IC package mold according to the present invention;

fig. 3 is a structural view of a fixing plate of an IC package mold according to the present invention.

Illustration of the drawings:

1. a base plate; 2. a side plate; 3. a fixing plate; 4. a lower template; 5. a column; 6. a water tank; 7. a water pump; 8. a fan-shaped nozzle; 9. a water pipe; 10. a hydraulic cylinder; 11. a top plate; 12. a hydraulic lever; 13. mounting a template; 14. a first motor; 15. a transfer shaft; 16. a conveying roller; 17. a conveyor belt; 18. a second motor; 19. a nut pair; 20. a screw rod; 21. a cylinder; 22. a telescopic rod; 23. a splint; 24. a rotating trough.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-3, the present invention provides an embodiment: an IC packaging mold comprises a bottom plate 1, a water tank 6 is fixedly connected to the right side of the top of the bottom plate 1, a cleaning solution is placed in the water tank 6, a water pump 7 is penetrated and fixedly connected to the top of the water tank 6, a water pipe 9 is penetrated and fixedly connected to the top of the water pump 7, two upright posts 5 are fixedly connected to the front and rear ends of the top of the bottom plate 1, a top plate 11 is fixedly connected to the top of the four upright posts 5, a hydraulic cylinder 10 is fixedly connected to the top of the top plate 11, a hydraulic rod 12 is arranged at the bottom of the hydraulic cylinder 10, the hydraulic rod 12 and an upper mold plate 13 are driven by the hydraulic cylinder 10 to move downwards to package an IC product, side plates 2 are fixedly connected to the front and rear ends of the left side of the top of the bottom plate 1, a conveying shaft 15 is penetrated and rotatably connected between the front and rear ends of the two

side plates

2, 15 external diameter intermediate positions of two conveying shafts all run through and fixedly connected with transfer roller 16, all be provided with conveyer belt 17 on two transfer rollers 16, both ends are close to the equal fixedly connected with fixed plate 3 of intermediate position around the 1 top of bottom plate, the equal fixedly connected with second motor 18 of 3 right side top positions in two places fixed plate, the equal fixedly connected with lead screw 20 of two second motor 18 outputs, the equal running through of two 20 external diameter right side positions of lead screw has the nut vice 19, second motor 18 drives lead screw 20 and rotates, make the vice 19 drive cylinder 21 of nut remove right, the equal fixedly connected with cylinder 21 of the vice 19 top positions of two nuts, two cylinder 21 outputs all are provided with telescopic link 22, the equal fixedly connected with splint 23 of two telescopic link 22 other ends, cylinder 21 drives telescopic link 22 and splint 23 merge and press from both sides the IC product tightly.

Bottom plate 1 top central point puts fixedly connected with

lower bolster

4, 12 bottom fixedly connected with cope match-plate pattern 13 of hydraulic stem, merge through lower bolster 4 and cope match-plate pattern 13 and encapsulate the IC, 2 front end left side fixedly connected with first motors 14 of front end curb plate, 14 output of first motor and 15 fixed connection of conveying axle, first motor 14 drives conveying axle 15 and conveying roller 16 and rotates, conveying roller 16 drives conveyer belt 17 and rotates, run through and rotate the connection between two lead screws 20 and the fixed plate 3, run through and fixed connection between water pipe 9 and the roof 11, the water pipe 9 other end runs through and fixedly connected with fan nozzle 8, wash the device through

fan nozzle

8, 3 top positions of two fixed plates all run through and are provided with the swivelling chute 24.

The working principle is as follows: the utility model discloses when using, at first start first motor 14, first motor 14 drives conveying axle 15 and rotates, conveying axle 15 drives the transfer roller 16 and rotates, transfer roller 16 drives conveyer belt 17 and rotates and conveys the IC product between two splint 23, then actuating cylinder 21, cylinder 21 drives telescopic link 22 and splint 23 and closes and start second motor 18 after pressing from both sides the IC product tightly, second motor 18 drives lead screw 20 and rotates, make the vice 19 drive cylinder 21 of nut remove right, put down the IC product to 4 tops of lower bolster, it encapsulates the IC product to drive hydraulic stem 12 and cope match-plate pattern 13 downstream through pneumatic cylinder 10, after the use, through the washing liquid suction of water pump 7 in with water tank 6, water pipe 9 gets into fan-shaped nozzle 8, wash the device through fan-shaped nozzle 8.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions on some technical features, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of the present invention.

Claims

1. An IC package mold comprising a base plate (1), characterized in that: the water tank (6) is fixedly connected to the right side of the top of the bottom plate (1), the water pump (7) is fixedly connected to the top of the water tank (6) in a penetrating manner, the water pipe (9) is fixedly connected to the top of the water pump (7) in a penetrating manner, the two columns (5) are fixedly connected to the front end and the rear end of the top of the bottom plate (1) respectively, the top of the four columns (5) is fixedly connected with the top plate (11) respectively, the hydraulic cylinder (10) is fixedly connected to the top of the top plate (11), the hydraulic rod (12) is arranged at the bottom of the hydraulic cylinder (10), the side plates (2) are fixedly connected to the front end and the rear end of the left side of the top of the bottom plate (1) respectively, the conveying shafts (15) are respectively connected between the front end and the rear end of each side plate (2) in a penetrating and rotating mode, the middle positions of the outer diameters of the two conveying shafts (15) are respectively connected with conveying rollers (16) in a penetrating and fixed mode, conveying belts (17) are respectively arranged on the two conveying rollers (16), the front end and the rear end of the top of the bottom plate (1) close to the middle positions are respectively and fixedly connected with a fixed plate (3), the top positions of the right sides of the two fixed plates (3) are respectively and fixedly connected with second motors (18), the output ends of the two second motors (18) are respectively and fixedly connected with screw rods (20), the positions of the right sides of the outer diameters of the two screw rods (20) are respectively connected with nut pairs (19) in a penetrating and bolt mode, two equal fixedly connected with cylinder (21) in nut pair (19) top position, two cylinder (21) output all is provided with telescopic link (22), two equal fixedly connected with splint (23) of telescopic link (22) other end.

2. The IC package mold of claim 1, wherein: the center of the top of the bottom plate (1) is fixedly connected with a lower template (4).

3. The IC package mold of claim 1, wherein: the bottom of the hydraulic rod (12) is fixedly connected with an upper template (13).

4. The IC package mold of claim 1, wherein: the front end curb plate (2) front end left side position fixedly connected with first motor (14), first motor (14) output and conveying axle (15) fixed connection.

5. The IC package mold of claim 1, wherein: the two screw rods (20) are connected with the fixing plate (3) in a penetrating and rotating mode.

6. The IC package mold of claim 1, wherein: the water pipe (9) is fixedly connected with the top plate (11) in a penetrating manner.

7. The IC package mold of claim 1, wherein: the other end of the water pipe (9) penetrates through and is fixedly connected with a fan-shaped nozzle (8).

8. The IC package mold of claim 1, wherein: the top parts of the two fixing plates (3) penetrate through and are provided with rotating grooves (24).