CN218855496U

CN218855496U - Semiconductor element shearing device

Info

Publication number: CN218855496U
Application number: CN202223241929.2U
Authority: CN
Inventors: 施锦源; 刘兴波; 郭聪球
Original assignee: Shenzhen Xinzhantong Electronics Co ltd
Current assignee: Shenzhen Xinzhantong Electronics Co ltd
Priority date: 2022-12-03
Filing date: 2022-12-03
Publication date: 2023-04-14
Anticipated expiration: 2032-12-03

Abstract

The utility model relates to a semiconductor element shearing mechanism, it includes base, back shaft and presses the subassembly, the base includes the mounting panel, the top of mounting panel is provided with places the board, the middle part of placing the board has seted up the standing groove, the cell wall of standing groove is for cuting the wall, the both sides of cuting the wall have been seted up and have been dodged the groove, the one end of base is provided with the axle bed, the back shaft sets up in the axle bed, it sets up to press the subassembly the back shaft, press the subassembly to include upper strata and lower seat, the upper strata is provided with the driving medium, the driving medium includes the connecting axle and presses the press handle, the connecting axle passes the upper strata in order with will lower seat links together, press the press handle setting the side of upper strata, lower seat is including the press, press the bottom of press the press with place the board butt. The semiconductor element cutting device has the effect of cutting the poor semiconductor element.

Description

Semiconductor element shearing device

Technical Field

The application relates to the field of electronic elements, in particular to a semiconductor element shearing device.

Background

In the process of manufacturing the IC, a process step is that a platy semiconductor element is cut into one semiconductor element by a cutting machine, a shell is injected in the production process of the semiconductor element, and when the injected shell is not uniform enough or has defects, the shell is put into the cutting machine together for cutting, so that defective products can be mixed in the semiconductor element and are difficult to select.

In the related art, defects that defective products are difficult to pick exist.

SUMMERY OF THE UTILITY MODEL

In order to prevent defective products from entering the market and to cut off defective semiconductor elements, the present application provides a semiconductor element cutting device.

The semiconductor element shearing device provided by the application adopts the following technical scheme:

the utility model provides a semiconductor element shearing mechanism, includes base, back shaft and presses the subassembly, the base includes the mounting panel, the top of mounting panel is provided with places the board, the standing groove has been seted up at the middle part of placing the board, the cell wall of standing groove is for shearing the wall, the both sides of shearing the wall have been seted up and have been dodged the groove, the one end of base is provided with the axle bed, the back shaft sets up in the axle bed, press the subassembly setting and be in the back shaft, it includes upper seat and lower seat to press the subassembly, the upper seat is provided with the driving medium, the driving medium includes the connecting axle and presses the press handle, the connecting axle passes the upper seat in order with will lower seat links together, press the handle setting and be in the side of upper seat, lower seat is including pressing the pressure piece, the bottom of pressing the piece with place the board butt.

By adopting the technical scheme, the produced semiconductor element is inspected and then a defective semiconductor element is found, the whole plate-shaped semiconductor element is placed on the placing plate, the single defective semiconductor element is placed in the placing groove at the moment, the shearing wall surrounds the edge of the defective semiconductor element, furthermore, the pressing handle rotates downwards to press the connecting shaft downwards, the upper seat moves downwards and presses the lower seat downwards through the connecting shaft, the pressing piece of the lower seat abuts against the top surface of the defective semiconductor element, so that the edge of the defective semiconductor element is sheared by the shearing wall, and the defective semiconductor element is sheared out of the whole plate-shaped semiconductor element.

Preferably, the driving medium still includes torsion shaft and connecting rod, the torsion shaft is connected perpendicularly press the one end of handle, the torsion shaft runs through the setting in the seat of honour side, the connecting rod sets up at the seat of honour top, the connecting rod cover is equipped with the answer spring, the one end of connecting axle is provided with the connection piece perpendicularly, the connection piece with lower seat fixed connection.

Through adopting above-mentioned technical scheme, press handle drive torsion shaft rotation and drive the seat of honour and remove downwards with pressing down by the hand, it is further, wear to establish the connecting axle downstream in the seat of honour and press down the seat in order to drive the connection piece, at the in-process that removes, the connecting rod moves down and compresses the answer spring, the operation is accomplished the back connecting rod and is pressed the handle and can be resumeed initial position under the effect of answer spring, the continuity of shearing mechanism in the use has been improved.

Preferably, the pressing piece comprises an upper plate and a lower plate, a plurality of connecting columns are arranged between the upper plate and the lower plate, and first buffer springs are sleeved on the connecting columns.

Through adopting above-mentioned technical scheme, the top of pressing piece is the upper plate and with the fixed connection of being connected of seat of honour, the upper plate is provided with a plurality of spliced poles in order to connect the hypoplastron, and the cover is equipped with first buffer spring on the spliced pole, the hypoplastron at the pressing piece is to the in-process that semiconductor component was pressed, the hypoplastron can have great pressure to semiconductor component, set up a plurality of spliced poles between upper plate and hypoplastron, and the cover is established first buffer spring on the spliced pole, it can be compressed and produce deformation to push down in-process first buffer spring, it gradually pushes down in order to alleviate hypoplastron to semiconductor component's sudden pressure to convert the direct of hypoplastron to semiconductor component down, prevent that semiconductor component from receiving great pressure and receiving destruction in a time quantum.

Preferably, the mounting panel is provided with the buffering subassembly, the mounting hole has been seted up to the mounting panel, the buffering subassembly includes the buffering axle, the buffering axle sets up perpendicularly in the mounting hole, the buffering axle sleeve is equipped with the buffering axle sleeve, the buffering axle sleeve is equipped with second buffer spring, the buffer hole has been seted up to the lower seat, the other end of buffering axle passes the buffer hole.

Through adopting above-mentioned technical scheme, the below of lower seat is provided with the buffering regulating part, the buffering axle passes in the buffering hole of lower seat, and the epaxial cover of buffering is equipped with second buffer spring, the in-process that lower seat moved down, the bottom of lower seat lasts the buffering axle sleeve in the buffering subassembly that pushes down, buffering axle sleeve pushes down second buffer spring, second buffer spring takes place deformation, cushion the process of pushing down, the life of extension machine, after the lower seat is accomplished and is pushed down the operation, second buffer spring upwards replies initial condition and will apply ascending elasticity to the lower seat, so that the lower seat replies initial position.

Preferably, the inner wall of the buffering shaft sleeve is provided with a plurality of buffering grooves, the buffering shaft is provided with a plurality of buffering protrusions, and the buffering protrusions are arranged in the buffering grooves.

Through adopting above-mentioned technical scheme, buffering arch and buffering recess cooperation, it is down to press down when the seat, the buffering arch can be continuous to come out from round buffering recess and enter into the buffering recess of last round to this is continuous cushions, and in continuous entering into new buffering recess, the seat down can have slight shake, conduct and press the handle in can the shake feel exist, so that the process of pushing down can have more direct sense organ feedback, improved and used and felt.

Preferably, the upper seat is provided with a rounded corner.

Through adopting above-mentioned technical scheme, in the use, the in-process of pushing down the handle, user's head is closer to the seat of honour to at the in-process of exerting force, user's health can be driven by the health at the in-process head of exerting force, and user's head is close to the seat of honour more, and the seat of honour sets up the radius angle and prevents that user's head from colliding with the seat of honour and be injured, has improved shearing mechanism's security.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the whole plate-shaped semiconductor element is placed on the placing plate, a single poor semiconductor element is placed in the placing groove at the moment, the shearing wall surrounds the edge of the poor semiconductor element, further, the pressing handle rotates downwards to press the connecting shaft downwards, the upper seat moves downwards and presses the lower seat downwards through the connecting shaft, the pressing piece of the lower seat abuts against the top surface of the poor semiconductor element, so that the edge of the poor semiconductor element is sheared by the shearing wall, and the poor semiconductor element is sheared from the whole plate-shaped semiconductor element;

2. the connecting shaft penetrating through the upper seat moves downwards to drive the connecting sheet to press the lower seat downwards, the connecting rod moves downwards and compresses the return spring in the moving process, and the connecting rod and the pressing handle can return to the initial position under the action of the return spring after the operation is finished, so that the continuity of the shearing device in the using process is improved;

3. user's health can be driven by the health at the in-process head of having an effect, and user's head is close to the seat of honour more, and the seat of honour sets up the radius angle and prevents that user's head from colliding with the seat of honour and be injured, has improved shearing mechanism's security.

Drawings

Fig. 1 is a schematic view of the overall structure of a shearing apparatus.

Fig. 2 is a partially enlarged view of a in fig. 1.

Description of reference numerals: 1. a base; 11. a shaft seat; 12. mounting a plate; 13. placing the plate; 131. an avoidance groove; 132. a placement groove; 133. a shear wall; 2. a buffer assembly; 21. a buffer sleeve; 22. a buffer shaft; 23. a second buffer spring; 3. a support shaft; 4. a pressing assembly; 41. a transmission member; 411. a pressing handle; 412. a torsion shaft; 413. a connecting rod; 414. a return spring; 415. a connecting shaft; 416. connecting sheets; 42. an upper seat; 421. a shaft hole is penetrated; 43. a lower seat; 431. a buffer hole; 432. a connecting plate; 433. a pressing member; 4331. an upper plate; 4332. connecting columns; 4333. a first buffer spring; 4334. a lower plate.

Detailed Description

The present application is described in further detail below with reference to figures 1-2.

The embodiment of the application discloses a semiconductor element shearing device. Referring to fig. 1 and 2, a semiconductor device cutting apparatus includes a base 1, a buffer assembly 2, a supporting shaft 3 and a pressing assembly 4, wherein one end of the base 1 is provided with a shaft seat 11, the supporting shaft 3 is vertically and fixedly installed in the shaft seat 11, the top of the supporting shaft 3 is fixedly installed with the pressing assembly 4, the pressing assembly 4 includes an upper seat 42, a transmission member 41 and a lower seat 43, the upper seat 42 is provided with a shaft penetrating hole 421, the diameter of the shaft penetrating hole 421 is identical to the diameter of the supporting shaft 3, the upper seat 42 is fixedly arranged on the supporting shaft 3 through the shaft penetrating hole 421, a transmission member is arranged in the upper seat 42, the transmission member 41 includes a pressing handle 411 and a connecting shaft 415, one end of the pressing handle 411 is fixedly provided with a torsion shaft 412, the torsion shaft 412 is rotatably arranged on the side surface of the upper seat 42, the connecting shaft 415 is movably arranged in the upper seat 42, the torsion shaft 412 is rotated by the pressing handle 411 to drive the downward movement of the connecting shaft 415, further, the top of upper seat 42 is provided with connecting rod 413, connecting rod 413 is the L shape, the upper end level of connecting rod 413 extends one section, the horizontal position at the top of connecting shaft 415 corresponds to the middle part of connecting rod 413, the top of connecting shaft 415 is provided with the fixed plate, the fixed plate passes through the bolt fastening at the top of connecting shaft 415, still seted up the perforation on the fixed plate, connecting rod 413 passes the perforation setting and fixed connection at the top of upper seat 42, the top of bolt is provided with two hook holes, connecting rod 413 is provided with answer spring 414, two sections of answer spring 414 are two hooks, answer spring 414 one end hook at the horizontal extension part of connecting rod 413, the other end hook of answer spring 414 is in two hook holes of bolt, the fixed connection piece 416 that is provided with of lower extreme of connecting shaft 415. The fixed lower seat 43 that is provided with in bottom of connection piece 416, two buffering hole 431 have been seted up on lower seat 43, buffering subassembly 2 sets up on mounting panel 12, buffering subassembly 2 includes two buffering axle 22, buffering axle 22 divides into two sections, the diameter ratio of half section is less than half section diameter on the lower, the cover is equipped with second buffer spring 23 on half section down, the top butt of second buffer spring 23 is in the bottom of half section on the upper, the surface of half section on the upper is provided with a plurality of evenly distributed's buffering arch, the cover is equipped with cushion collar 21 on buffer axle 22, the cover is equipped with a plurality of evenly distributed's buffering recess on the inner wall of cushion collar 21, buffering arch and buffering recess cooperation, cushion collar 21 sets up in the buffering hole 431 of lower seat 43, in order to carry out cushioning effect in the in-process that lower seat 43 pushed down, lower seat 43 still includes connecting plate 432 and pressing piece 433, pressing piece 433 includes upper plate 4331, 4332 spliced pole and hypoplastron 4334, upper plate 4331 fixed connection is on 432, 4331 carries out the buffering in-process pushed down by 4334.

Referring to fig. 2, a mounting board 13 is disposed on a mounting board 12, the mounting board 13 is disposed with a mounting groove 132 to accommodate a semiconductor element in a plate shape, and a side surface of the semiconductor element abuts against a groove wall of the mounting groove 132, a groove bottom of a middle portion of the mounting groove 132 is disposed with two shearing walls 133, an avoiding groove 131 is disposed between the two shearing walls 133, the avoiding groove 131 can accommodate a single semiconductor element, the shearing walls 133 can abut against pins of the semiconductor element, and a lower plate 4334 of a pressing member 433 presses down the plate-shaped semiconductor element to press the pins between the lower plate 4334 and the shearing walls 133 so as to be cut.

The implementation principle of the semiconductor element shearing device in the embodiment of the application is as follows: a defective semiconductor element is found among the plate-shaped semiconductor elements, the plate-shaped semiconductor element is placed in the placement groove 132, the defective semiconductor element is aligned in the avoiding groove 131, the lead of the defective semiconductor element is placed on the cutout wall 133, further, the user pulls down the pressing handle 411, the torsion shaft 412 rotates, the connecting shaft 415 is pressed down and presses the lower base 43 down, the pressing piece 433 in the lower base 43 moves down, and the lower plate 4334 in the pressing piece 433 presses the plate-shaped semiconductor element placed on the placement plate 13, so that the lead of the defective semiconductor element is pressed and cut off on the cutout wall 133.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: equivalent changes in structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A semiconductor element shearing apparatus, characterized in that: including base (1), back shaft (3) and press down subassembly (4), base (1) includes mounting panel (12), the top of mounting panel (12) is provided with places board (13), place board (13) middle part has been seted up standing groove (132), the cell wall of standing groove (132) is for cuting wall (133), the both sides of cuting wall (133) have been seted up and have been dodged groove (131), the one end of base (1) is provided with axle bed (11), back shaft (3) set up in axle bed (11), press down subassembly (4) and set up back shaft (3), press down subassembly (4) including upper seat (42) and lower seat (43), upper seat (42) are provided with driving medium (41), driving medium (41) include connecting axle (415) and press down handle (411), connecting axle (415) pass upper seat (42) in order to link together lower seat (43), press down handle (411) set up the side of upper seat (42), lower seat (43) include press down pressing piece (433), press down the bottom of pressing piece (433) with the bottom of pressing piece (13) butt.

2. A semiconductor element trimming apparatus according to claim 1, wherein: the driving medium (41) still includes torsion shaft (412) and connecting rod (413), torsion shaft (412) are connected perpendicularly press the one end of handle (411), torsion shaft (412) run through the setting in seat of honour (42) side, connecting rod (413) set up at seat of honour (42) top, connecting rod (413) cover is equipped with answer spring (414), the one end of connecting axle (415) is provided with connection piece (416) perpendicularly, connection piece (416) with seat of honour (43) fixed connection down.

3. A semiconductor element shearing device as defined in claim 1, wherein: the pressing piece (433) comprises an upper plate (4331) and a lower plate (4334), a plurality of connecting columns (4332) are arranged between the upper plate (4331) and the lower plate (4334), and the connecting columns (4332) are sleeved with first buffer springs (4333).

4. A semiconductor element trimming apparatus according to claim 1, wherein: mounting panel (12) are provided with buffering subassembly (2), the mounting hole has been seted up in mounting panel (12), buffering subassembly (2) are including buffering axle (22), buffering axle (22) set up perpendicularly in the mounting hole, buffering axle (22) cover is equipped with cushion collar (21), cushion collar (21) are equipped with second buffer spring (23), buffer hole (431) have been seted up down in seat (43), buffer hole (431) have been passed to the other end of buffering axle (22).

5. A semiconductor element shearing device as defined in claim 4, wherein: the inner wall of the buffer sleeve (21) is provided with a plurality of buffer grooves, the buffer shaft (22) is provided with a plurality of buffer bulges, and the buffer bulges are arranged in the buffer grooves.

6. A semiconductor element shearing device as defined in claim 2, wherein: the upper seat (42) is provided with a fillet.