CN218831142U - Wall-in terminal equipment - Google Patents

Abstract

The application relates to a wall-in terminal device, include: the bottom shell is of a cavity structure with an opening at the top and closed periphery, and an opening is formed in the bottom shell; the radiating fin comprises a protruding portion and a connecting portion adjacent to the protruding portion, the connecting portion of the radiating fin is lapped on the bottom shell, and the protruding portion of the radiating fin penetrates through the opening and is embedded into the cavity of the bottom shell. This application utilizes the equipment of fin and drain pan, borrows terminal equipment exterior space and material resource heat conduction, is different from the inside heat dissipation of conventional equipment, can great lifting means heat-sinking capability, has simple structure concurrently, be convenient for installation, low cost, the good characteristics of heat dissipation.

Description

Wall-in terminal equipment

Technical Field

The application relates to the technical field of communication equipment, in particular to a wall-in terminal device.

Background

The terminal device is a small computer network device, such as a PON gateway, an intelligent gateway, a router, etc. that provides internet access. Various wall-embedded terminal equipment such as FTTR have difficult radiating defect because most volume embedding is inside the wall body, if terminal equipment heat dispersion is not good, make inside device be in the high temperature state for a long time, with greatly reduced terminal equipment's life.

At present, the wall-mounted terminal equipment in the market generally adopts a mode of adding a large-size multi-fin radiator in the wall-mounted terminal equipment to promote the internal heat dissipation of the terminal equipment, however, because the radiator is arranged in a cavity, the heat is difficult to be effectively conducted out, the integral temperature rise of the equipment is higher, and the multi-fin radiator is complex in processing procedure and very high in cost.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a wall-in terminal device to solve the problem that the wall-in terminal device in the related art has poor heat dissipation performance.

The technical scheme provided by the application is as follows:

the application provides a wall-in terminal equipment includes: the bottom shell is of a cavity structure with an opening at the top and closed periphery, and an opening is formed in the bottom shell;

the radiating fin comprises a protruding portion and a connecting portion adjacent to the protruding portion, the connecting portion of the radiating fin is lapped on the bottom shell, and the protruding portion of the radiating fin penetrates through the opening and is embedded into the cavity of the bottom shell.

In some embodiments, the bottom case includes a bottom wall and a sidewall disposed contiguous with the bottom wall;

the bottom wall and the side wall are provided with the holes, and the raised parts of the radiating fins, the bottom wall and the side wall enclose a radiating cavity with at least two side openings.

In some embodiments, the cover further comprises a shielding plate, wherein the shielding plate is connected with the inner edge of the bulge part and the bottom wall in a sealing mode;

the raised part and the shielding plate enclose a heat dissipation cavity with openings at two sides.

In some embodiments, the fins are in a cross-section that is a zigzag or zig-zag shape.

In some embodiments, the heat sink has a heat sink scale disposed in the raised portion.

In some embodiments, the heat sink is connected to the bottom case by a snap and/or a screw.

In some embodiments, the bottom case is provided with positioning ribs, and the positioning ribs are located on the periphery of the heat dissipation fins.

In some embodiments, the connecting portion of the heat sink is provided with a heat conducting block.

In some embodiments, the heat sink further comprises a face shell, the face shell and the bottom shell enclose a containing cavity, a PCBA component is installed in the containing cavity, and a heat conducting gasket is connected between the PCBA component and the heat sink.

In some embodiments, the bottom shell and the face shell are provided with heat dissipation holes.

The beneficial effect that technical scheme that this application provided brought includes: this application is through setting up the trompil on the drain pan, and the fin that will have the bellying inlays through the trompil and locates in the drain pan, the bellying of fin encloses with the drain pan and establishes into the cavity, the space between terminal equipment and the wall body has been increased, do benefit to the air convection, the heat that internal component produced at the operation in-process is outwards discharged fast to finally being absorbed by the wall body through fin and cavity, compare in built-in heat radiation structure, this application external type heat radiation structure's income wall formula terminal equipment has higher radiating efficiency, have simple structure concurrently, be convenient for the installation, low cost, the good characteristics of heat dissipation.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is an exploded view of a wall-mounted terminal device according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a wall-in terminal device according to an embodiment of the present application;

fig. 3 is a cross-sectional view of a wall-in terminal device provided in an embodiment of the present application;

fig. 4 is a schematic structural diagram of a wall-in terminal device according to an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;

FIG. 6 is a cross-sectional view of the heat sink of FIG. 5;

fig. 7 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;

FIG. 8 is a cross-sectional view of the heat sink of FIG. 7;

fig. 9 is a schematic structural diagram of a heat sink provided in an embodiment of the present application;

FIG. 10 is a cross-sectional view of the heat sink of FIG. 9;

fig. 11 is a cross-sectional view of the wall-in terminal device according to the embodiment of the present application when mounted on a wall;

fig. 12 is a cross-sectional view of a wall-in terminal device according to an embodiment of the present application when mounted on a wall;

fig. 13 is an exploded view of the wall-embedded terminal device according to the embodiment of the present application during installation.

In the figure: 1. a bottom case; 101. a bottom wall; 102. a side wall; 103. positioning ribs; 104. buckling; 2. a heat sink; 21. a boss portion; 22. a connecting portion; 201. heat dissipation scales; 202. mounting holes; 3. a shielding plate; 4. a heat conducting block; 5. a face shell; 6. a PCBA component; 601. a heat generating device; 7. a thermally conductive gasket; 8. heat dissipation holes; 9. mounting a shell; 10. a decorative panel.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1 to 3, an embodiment of the present application provides a wall-embedded terminal device, including:

the bottom shell 1 is of a cavity structure with an opening at the top and closed periphery, and an opening 11 is formed in the bottom shell 1;

the radiating fin 2, the radiating fin 2 includes bellying 21 to and the connecting portion 22 adjacent with bellying 21, the connecting portion 22 overlap joint of radiating fin 2 on the drain pan 1, the bellying 21 of radiating fin 2 wear to establish trompil 11, and the embedding in the cavity of drain pan 1.

Specifically, the terminal device described in the embodiment of the present application includes, but is not limited to, a gateway, a router, and the like.

This application is through setting up trompil 11 on drain pan 1, and the fin 2 that will have bellying 21 inlays through trompil 11 and locates in drain pan 1, bellying 21 of fin 2 encloses with drain pan 1 and establishes into the cavity, the space between terminal equipment and the wall body has been increased, do benefit to the air convection, the heat that internal component produced in the operation process is outwards discharged fast to finally being absorbed by the wall body through fin 2 and cavity, compare in built-in heat radiation structure, this application external type heat radiation structure's income wall formula terminal equipment has higher radiating efficiency, have simple structure concurrently, be convenient for installation, low cost, the good characteristics of heat dissipation.

Referring to fig. 11, when the wall-in terminal device provided by the present application is installed on a wall, a mounting shell 9 may be selected to be arranged in a wall mounting groove in advance according to actual needs, and then the wall-in terminal device provided by the present application is fixedly connected with the mounting shell 9 by a screw, wherein a bottom shell 1 of the wall-in terminal device is arranged adjacent to the mounting shell 9, and a wall structure is used as a heat transfer medium, so that a user is effectively prevented from directly contacting a heat dissipation structure, and problems of poor overheating experience and appearance influence due to leakage of a heat sink are reduced;

in fig. 11, the arrows a and B refer to gas heat transfer paths, that is, the wall-mounted terminal device provided in the present application may transfer heat inside the device to the mounting case 9 in the form of air convection through the space between the protruding portion 21 of the heat sink 2, the connecting portion 22 and the mounting case 9, wherein the heat sink 2 is provided with the protruding portion 21 protruding relative to the connecting portion 22, so that on one hand, the distance between the heat sink 2 and the internal heat generating device 601 is reduced, and the heat generated by the heat generating device 601 can be transferred to the heat sink 2 quickly and efficiently; on the other hand, the heat radiation fins 2 are recessed at the bosses 21 with respect to the end surface of the bottom case 1, and the cavities formed at the recesses increase the air convection space, as shown by the arrows B in fig. 11, and thus have higher heat radiation efficiency.

Further, the connecting portion 22 of the present application increases the heat dissipation area of the heat sink 2, and as shown by the arrow a in fig. 11, the heat conducted from the heat sink 2 can be transferred with the air at the connecting portion 22, which has higher heat dissipation efficiency.

Referring to fig. 2, in some embodiments, the bottom case 1 includes a bottom wall 101 and a side wall 102 disposed adjacent to the bottom wall 101;

the bottom wall 101 and the side wall 102 are both provided with the opening 11, and the protruding part 21 of the heat sink 2, the bottom wall 101 and the side wall 102 enclose a heat dissipation cavity with at least two side openings.

In the embodiment of the application, the openings 11 are formed in the bottom wall 101 and the side wall 102, the two openings 11 are arranged adjacently, and the openings 11 in the side wall 102 increase the convection space between the radiating fin 2 and the lateral wall, which is beneficial to improving the radiating efficiency;

further, in order to improve the appearance of the terminal device and reduce the leakage of internal components, it is preferable that the shape of the opening on the bottom wall 101 matches with the lateral outer contour of the protrusion 21 in the heat sink 2, and the shape of the opening on the side wall 102 matches with the longitudinal outer contour of the protrusion 21 in the heat sink 2.

The longitudinal outer contour of the boss portion 21 refers to a cross-sectional shape of the boss portion 21 in the longitudinal extension direction of the heat sink 2, and the lateral outer contour refers to a cross-sectional shape of the boss portion 21 in the width extension direction of the heat sink 2.

Referring to fig. 4, in some embodiments, the present invention further includes a shielding plate 3, where the shielding plate 3 is connected to the inner edge of the protruding portion 21 and the bottom wall 101 in a sealing manner;

the protruding portion 21 and the shielding plate 3 form a heat dissipation cavity with two side openings.

In the embodiment of the application, in order to further improve the appearance effect of the terminal equipment and reduce the leakage of devices inside the equipment, the baffle plate 3 is used for sealing the gap between the bulge part 21 and the bottom wall 101, so that the leakage of the devices inside is avoided, and the visual impression of a user is improved;

specifically, the inner edge of the protruding portion 21 refers to a side of the protruding portion 21 away from the side wall 102.

In a preferred embodiment, the shielding plate 3 may be integrally injection-molded with the bottom case 1, which is beneficial to improving the production efficiency.

In some embodiments, the heat sink 2 has a cross-section in a zigzag or zigzag shape.

The radiating fin 2 provided by the embodiment of the application has the characteristic of simple structure;

as shown in fig. 5 to 6, the longitudinal section of the heat sink 2 is shaped like a Chinese character 'ji', and the two sides of the protruding portion 21 are both provided with the connecting portion 22, so that the two ends of the heat sink 2 can be lapped on the bottom case 1, and the heat sink has the advantage of high installation stability;

as shown in fig. 7-8, the longitudinal section of the heat sink 2 is zigzag, which has a simple structure compared with a zigzag structure, so that the production cost of the heat sink can be further reduced;

referring to fig. 9-10, in some embodiments, the heat sink 2 has a heat sink scale 201 in the raised portion 21.

Referring to fig. 10, in some embodiments, the number of the heat dissipation scales 201 is multiple, the multiple heat dissipation scales 201 are arranged in parallel at intervals and perpendicular to the connection portion 22, and further, one end of each heat dissipation scale 201 is fixedly connected to the protruding portion 21;

the height of the radiating fins 201 can be reasonably selected according to actual needs, and the other ends of the radiating fins 201 can be flush with the horizontal plane of the connecting part 22 and can also exceed the horizontal plane of the connecting part 22.

In some embodiments, the connecting portion 22 of the heat sink 2 is provided with a heat dissipating scale, so as to further increase the heat dissipating area of the heat sink 2 and improve the heat dissipating effect.

In order to further improve the heat dissipation efficiency of the terminal device, the heat dissipation scale 201 is additionally arranged in the protruding portion 21, so that the contact area between the heat dissipation sheet 2 and the air is increased, and the heat dissipation effect is improved.

In the actual use process, the most suitable radiating fin structure can be selected according to the use requirement.

In some embodiments, the heat sink 2 is connected to the bottom case 1 by a snap and/or a screw.

The mounting mode of the heat sink 2 and the bottom case 1 provided by the embodiment of the application includes, but is not limited to, snap connection, screw connection or combination of the two;

as shown in fig. 4, if the heat sink 2 and the bottom case 1 are connected by a snap connection method, the surface of the bottom case 1 is provided with the snap 104, the snap 104 is located on the periphery of the connecting portion 22 in the heat sink 2, the number of the snap 104 can be selected according to actual needs, and is not particularly limited herein, so that the heat sink 2 and the bottom case 1 can be firmly connected;

referring to fig. 5, if the heat sink 2 is connected to the bottom case 1 by screws, mounting holes 202 are formed in the connecting portion 22 of the heat sink 2, so that the screws penetrate through the mounting holes 202 to fixedly connect the heat sink 2 to the bottom case 1.

Referring to fig. 3, in some embodiments, the bottom case 1 is provided with a positioning rib 103, and the positioning rib 103 is located on a peripheral side of the heat sink 2.

Further, the positioning rib 103 is arranged on the periphery of the connecting portion 22 in the heat dissipation plate 2, and the positioning rib 103 can limit the position of the heat dissipation plate 2, so that the heat dissipation plate 2 is prevented from moving, and the installation stability of the heat dissipation plate is improved.

Referring to fig. 12 and 13, in some embodiments, the connecting portion 22 of the heat sink 2 is provided with a heat conducting block 4.

In order to further improve the heat dissipation effect of the terminal device, the heat conduction block 4 is arranged on the connecting part 22 of the heat dissipation plate 2, when the terminal device is installed on a wall body, the heat conduction block 4 is arranged in close contact with the installation shell 9, the arrow C in the attached drawing 12 indicates a solid heat transfer route, the heat conduction block 4 rapidly conducts the heat of the heat dissipation plate 2 to the installation shell 9 and further diffuses into the wall body, the heat dissipation efficiency is higher compared with air heat transfer (the heat conduction coefficient of air is generally 0.023W/m.K), and the terminal device has a better heat dissipation effect integrally by combining with the gas heat transfer route of the heat dissipation plate 2 at the arrow D.

In some embodiments, a heat conducting block can be further arranged in the boss 21, the heat conducting block is arranged in close contact with the boss 21 and the mounting shell 9, and heat is conducted through the heat conducting block at the arrow D for solid heat transfer, so that the heat transfer efficiency is higher;

furthermore, the heat-conducting blocks on the connecting part 22 and the heat-conducting blocks on the protruding part 21 can be integrally formed, so that the production process is simplified, and the production efficiency is improved.

Further, the fixing manner of the heat conducting block and the heat sink includes but is not limited to: adhesive bonding, and the like.

Further, the heat conductive block 4 may be a solid heat conductive device commonly used in the art, and is not particularly limited thereto, and for example, the heat conductive block 4 may have a heat conductivity of 2 to 3W/m · K.

Referring to fig. 1 and 3, in some embodiments, the heat sink further includes a face shell 5, the face shell 5 and the bottom shell 1 enclose a receiving cavity, a PCBA assembly 6 is mounted in the receiving cavity, and a heat conductive gasket 7 is connected between the PCBA assembly 6 and the heat sink 2.

Further, preferably, the opening 11 on the bottom case 1 and the heating component 601 on the PCBA assembly 6 are located on the same axis, so that the protrusion 21 faces the heating component 601, the heat transfer distance between the heat sink 2 and the heating source is reduced, and the heat dissipation efficiency is improved;

for improving the heat transfer effect between PCBA subassembly 6 and the fin 2, preferably set up between device 601 and the fin 2 generate heat conduction gasket 7 to make fin 2 and heat conduction gasket 7 compression contact, terminal equipment during operation, heat conduction gasket 7 will generate heat device 601's heat conduction to fin 2 rapidly, then fin 2 with heat conduction to the installation shell 9 on, and then spread in the wall body, heat in with terminal equipment is transmitted to the outside through multiple medium, effectively solve the not good problem of income wall formula terminal equipment radiating effect.

Further, the face shell 5 and the bottom shell 1 are detachably connected, for example, by a snap and a screw, so that the face shell 5 and the bottom shell 1 can be assembled and disassembled conveniently.

Referring to fig. 2, in some embodiments, the bottom case 1 and the face case 5 are both provided with heat dissipation holes 8.

In order to further improve the heat dissipation efficiency of the wall-in terminal equipment, the heat dissipation holes 8 are formed in the bottom shell 1 and the face shell 5, so that the convection space between the heating device 601 and the outside air is increased, and the heat dissipation efficiency is improved;

specifically, the heat dissipation holes 8 include, but are not limited to, circular holes, strip-shaped holes, and the like.

Referring to fig. 13, in some embodiments, when the in-wall terminal device is installed on a wall, the in-wall terminal device further includes a decoration panel 10, the decoration panel 10 is detachably connected to the installation shell 9, the decoration panel 10 and the installation shell 9 enclose a mounting cavity, the in-wall terminal device is located in the mounting cavity, and the decoration panel 10 can perform a decoration function, so as to improve an appearance effect and user experience when the in-wall terminal device is installed.

In the description of the present application, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience of describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

It is noted that, in this application, relational terms such as "first" and "second," and the like, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising a … …" does not exclude the presence of another identical element in a process, method, article, or apparatus that comprises the element.

The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A wall-in terminal device, comprising:

the bottom shell (1), the bottom shell (1) is of a cavity structure with an opening at the top and a closed periphery, and an opening (11) is formed in the bottom shell (1);

the radiating fin (2), the radiating fin (2) include bellying (21) to and connecting portion (22) adjacent with bellying (21), connecting portion (22) overlap joint of radiating fin (2) in drain pan (1), bellying (21) of radiating fin (2) wear to establish trompil (11) to the embedding in the cavity of drain pan (1).

2. A wall-mounted terminal device according to claim 1, wherein the bottom case (1) comprises a bottom wall (101) and a side wall (102) disposed contiguous to the bottom wall (101);

the bottom wall (101) and the side wall (102) are both provided with the open holes (11), and the bulge part (21) of the radiating fin (2), the bottom wall (101) and the side wall (102) form a radiating cavity with at least two side openings in a surrounding mode.

3. A wall-entry terminal device according to claim 2, further comprising a shutter (3), said shutter (3) being sealingly connected to the inner edge of said boss (21) and to the bottom wall (101);

the protruding part (21) and the shielding plate (3) enclose a heat dissipation cavity with openings at two sides.

4. A wall-mounted terminal device according to claim 1, wherein the heat sink (2) has a cross-section in a shape of a few squares or a zigzag.

5. A wall-mounted terminal device according to claim 1, wherein the heat sink (2) has a heat sink scale (201) in the boss portion (21).

6. A wall-mounted terminal device according to claim 1, wherein the heat sink (2) is connected to the bottom case (1) by means of a snap and/or screw.

7. A wall-embedded terminal device according to claim 1, wherein a positioning rib (103) is provided on the bottom case (1), and the positioning rib (103) is located on a peripheral side of the heat sink (2).

8. A wall-mounted terminal device according to claim 1, wherein the heat sink (2) is provided with a heat conducting block (4) on the connecting portion (22).

9. A wall-mounted terminal device according to claim 1, further comprising a face housing (5), wherein the face housing (5) and the bottom housing (1) enclose a receiving cavity, a PCBA assembly (6) is mounted in the receiving cavity, and a heat conductive gasket (7) is connected between the PCBA assembly (6) and the heat sink (2).

10. A wall-mounted terminal device according to claim 9, wherein the bottom case (1) and the face case (5) are each provided with heat dissipation holes (8).

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