CN218827071U - Heat dissipation structure for chip packaging, die and chip packaging device - Google Patents
Heat dissipation structure for chip packaging, die and chip packaging device Download PDFInfo
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- CN218827071U CN218827071U CN202222588427.0U CN202222588427U CN218827071U CN 218827071 U CN218827071 U CN 218827071U CN 202222588427 U CN202222588427 U CN 202222588427U CN 218827071 U CN218827071 U CN 218827071U
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Abstract
The utility model discloses a heat radiation structure, mould and chip packaging hardware for chip package, heat radiation structure includes: the heat dissipation base is plate-shaped and is used for being matched with the packaging structure of the chip; the heat dissipation base body is integrally formed with the base, the heat dissipation base body is arranged on the base corresponding to the packaging positions of the chips, and the heat dissipation base body is used for being in expansion matching with the corresponding chips so as to keep the bonding in different temperature states. The heat dissipation base in the heat dissipation structure is matched with the chip packaging structure, only the mounting structure matched with the packaging structure needs to be processed on the heat dissipation base, and an aluminum-based ceramic material does not need to be coated with an aluminum layer for processing or processed, so that the processing cost is greatly reduced; compared with the existing heat dissipation structure for electronic packaging, the heat dissipation structure has stronger applicability to complex structures, greatly reduces the cost of materials, preparation, processing and the like, and can be widely applied.
Description
Technical Field
The utility model relates to an electronic components encapsulates technical field, especially, relates to a heat radiation structure, mould and chip packaging hardware for chip package.
Background
The aluminum silicon carbide (AlSiC) is a short-term aluminum-based silicon carbide particle reinforced composite material, fully combines different advantages of silicon carbide ceramics and metal aluminum, has high thermal conductivity, can design a thermal expansion coefficient matched with a chip, has small density, light weight, high hardness and high bending strength, is an outstanding one in a new generation of electronic packaging material, meets the requirements of portability, high density and the like of packaging, is suitable for the fields of aviation, aerospace, high-iron, microwave and the like, and is a preferred material for solving the problem of thermal management.
The material cost of metal-based ceramics such as electronic packaging materials of aluminum-based silicon carbide/aluminum-based diamond/copper-based silicon carbide/copper-based diamond and the like is high, the difficulty of the preparation process is high, and only a small number of manufacturers in China have the preparation capability of the aluminum-based silicon carbide material. Meanwhile, in the aluminum-based silicon carbide composite material, due to the existence of the reinforced particle silicon carbide with high hardness, high strength and strong wear resistance, the aluminum-based diamond and other materials are similar, so that the processing is very difficult, and the aluminum-based diamond composite material becomes a typical composite material difficult to process. The addition of the high-hardness reinforcing phase causes severe abrasion of the cutter in cutting machining, so that the service life of the cutter is greatly shortened, the machining cost is very high, the machining efficiency is limited to a certain extent, batch machining cannot be realized, the wide application of the material is severely limited, and the material cost, the high machining difficulty and the cost cause no large-scale application capability of a large number of medium and small enterprises.
In prior art for example among the high-power IGBT module, mainly carry out the full coverage encapsulation to the chip through setting up monoblock or polylith aluminium base ceramic base member, through processing aluminium base ceramic base member or process out mounting structure to the aluminium lamination after covering the aluminium lamination to its surface to match packaging structure, there are aforementioned material cost height, processing cost, the degree of difficulty height, technical problem such as inefficiency.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat radiation structure, mould and chip packaging hardware for chip package to solve among the prior art electronic chip packaging structure's aluminium base carborundum with high costs, the high technical problem of the processing degree of difficulty.
The utility model adopts the technical scheme as follows:
a heat dissipation structure for a chip package, the heat dissipation structure comprising:
the heat dissipation base is plate-shaped and is used for being matched with the packaging structure of the chip;
the heat dissipation base body, the heat dissipation base body with the base is the integrated into one piece structure, the heat dissipation base body in on the base correspond the encapsulation position of chip arranges, the heat dissipation base body be used for with correspond the chip carries out the inflation matching and then keeps laminating under the different temperature states.
As a further improvement of the above technical solution, the heat dissipation base is provided with an installation structure for matching with the chip packaging structure, and the installation structure includes a positioning hole and/or a positioning groove and/or an installation hole and/or an installation groove.
As a further improvement of the above technical solution, the shape of each heat dissipation substrate is respectively matched with the shape of the chip at the corresponding position; the size of each heat dissipation base body is matched with the size of the chip at the corresponding position, or the size of each heat dissipation base body is larger than the size of the chip at the corresponding position.
As a further improvement of the above technical solution, a connection layer for connecting with the chip is provided on the surface of the heat dissipation substrate.
As a further improvement of the above technical solution, one or more fixing grooves are formed in the side wall of the heat dissipation base, and the heat dissipation base is embedded in the fixing grooves when the material of the heat dissipation base is cooled from a liquid state to a solid state and is molded outside the heat dissipation base.
As a further improvement of the above technical solution, the side wall of the heat dissipation base is provided with an annular fixing groove for embedding the heat dissipation base in the fixing groove when the material of the heat dissipation base is cooled from a liquid state to a solid state and is molded outside the heat dissipation base.
As a further improvement of the technical scheme, the heat dissipation base is an aluminum plate, and the heat dissipation base body is an aluminum-based silicon carbide block or an aluminum-based diamond block matched with the chip in an expansion mode.
On the other hand, a mold is provided for processing any one of the above heat dissipation structures for chip packaging, the mold has a mold cavity for introducing a liquid heat conduction material into the mold cavity to be cooled, solidified and molded into the heat dissipation base, the mold surface has a substrate placement position and/or a substrate placement groove and/or a substrate placement protrusion for placing the heat dissipation substrate, one side of the mold is provided with a liquid guide groove communicated with the mold cavity for guiding a liquid material into the mold cavity from the upper part of one side of the mold cavity.
As a further improvement of the above technical solution, the inner wall of the mold cavity is provided with the heat conductive material in powder or granular form.
On the other hand, a chip packaging device is further provided, and the heat dissipation structure for chip packaging is applied to any one of the above.
The utility model discloses following beneficial effect has: the heat dissipation base in the heat dissipation structure has high heat conductivity, and the heat dissipation function is realized; the heat dissipation base and the heat dissipation base are integrally formed through integral die-casting by high-pressure die-casting equipment, or the heat dissipation structure is integrally formed by introducing liquid heat conduction materials outside the formed heat dissipation base arranged according to a target structure for cooling and solidifying, so that the heat dissipation structure is greatly reduced in preparation cost and preparation efficiency compared with the heat dissipation structure in the prior art that the heat dissipation base is formed on an aluminum plate in a brazing mode or an aluminum layer is coated on the surface of the heat dissipation base in the brazing mode; the heat dissipation substrate is arranged in the heat dissipation structure corresponding to the positions of the chips, the expansion coefficient of the heat dissipation substrate is matched with the chips at the corresponding positions, the heat dissipation substrate can be attached to the chips under different temperature states, the heat conduction and the heat dissipation of the chips are ensured, and the heat dissipation substrate is arranged corresponding to the positions of the chips, so that a whole block or a plurality of metal-based ceramic materials are not required to be arranged for covering, the material cost is greatly reduced, and the secondary processing of the metal-based ceramic blocks is not required, and the processing cost is greatly reduced; the heat dissipation base is matched with the chip packaging structure, only the mounting structure matched with the packaging structure needs to be processed on the heat dissipation base, and an aluminum layer does not need to be coated on the surface of the metal-based ceramic for processing or the metal-based ceramic material is not needed to be processed, so that the processing cost is greatly reduced; compared with the existing heat dissipation structure for electronic packaging, the heat dissipation structure has stronger applicability to complex structures, greatly reduces the cost of materials, preparation, processing and the like, and can be widely applied.
In addition to the above-described objects, features and advantages, the present invention has other objects, features and advantages. The present invention will be described in further detail below with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. In the drawings:
fig. 1 is a first schematic structural diagram of a preferred embodiment of the present invention;
FIG. 2 is a schematic structural diagram II of the preferred embodiment of the present invention;
fig. 3 is a schematic structural view of a heat dissipation base according to an embodiment of the present invention;
fig. 4 is a schematic structural view of the mold according to the preferred embodiment of the present invention;
fig. 5 is a cross-sectional view of the mold according to the preferred embodiment of the present invention.
1. Heat dissipation base 11, mounting structure 2, heat dissipation base 21, fixing groove 3, mold 31, mold cavity 32, base body placing groove 33 and liquid guide groove
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
Referring to fig. 1 to 5, a preferred embodiment of the present invention provides a heat dissipation structure for chip packaging, including:
the heat dissipation base 1 is plate-shaped, and the heat dissipation base 1 is used for being matched with a packaging structure of a chip;
the heat dissipation substrate 2 is integrally formed with the base, the heat dissipation substrate 2 is arranged on the base corresponding to the packaging positions of the chips, the number of the heat dissipation substrates 2 is less than or equal to that of the chips, for example, when the two chips are close to each other and have the same height, one heat dissipation substrate 2 can be arranged corresponding to the positions of the two chips; for example, when the distance between two or more chips is large, the heat dissipation substrates 2 with the same number as the chips are arranged on the heat dissipation base 1 corresponding to the chip positions respectively;
the heat dissipation base body 2 is used for expansion matching with a corresponding chip so as to keep the attachment in different temperature states.
It can be understood that the heat dissipation base 1 is an aluminum plate or a copper plate with wider heat conductivity used in electronic packaging, and the heat dissipation base 2 is a metal-based ceramic block (such as an aluminum-based silicon carbide block or an aluminum-based diamond block or a copper-based silicon carbide block or a copper-based diamond block) matched with the chip in an expansion manner, wherein the thermal expansion coefficients of the metal-based ceramic block are matched according to the corresponding chip in a specific packaging heat dissipation structure, and the heat conductivity of the metal-based ceramic block meets the heat conduction requirement of the chip, so that the heat dissipation base 2 is matched with the corresponding chip in an expansion manner, and is attached under different temperature states;
the heat dissipation base 1 in the heat dissipation structure has high heat conductivity, and realizes the heat dissipation function; the heat dissipation base 1 and the heat dissipation base body 2 are integrally formed through integral die-casting by high-pressure die-casting equipment, or the heat dissipation structure of the embodiment is integrally formed by introducing liquid heat conduction materials (aluminum liquid and copper liquid) outside the formed heat dissipation base body 2 arranged according to a target structure for cooling and curing, compared with the heat dissipation structure in the prior art that the heat dissipation base body 2 is formed by brazing on an aluminum plate or an aluminum layer is coated on the surface of the heat dissipation base body 2, the required preparation cost and preparation efficiency of the heat dissipation structure are greatly reduced; the heat dissipation substrate 2 is arranged in the heat dissipation structure corresponding to the positions of the chips, the expansion coefficient of the heat dissipation substrate is matched with the chips in the corresponding positions, the heat dissipation substrate can be attached to the chips in different temperature states, the heat conduction and the heat dissipation of the chips are guaranteed, the heat dissipation substrate 1 is arranged corresponding to the positions of the chips, the whole or multiple aluminum-based ceramic materials are not required to be arranged for covering, the material cost is greatly reduced, the metal-based ceramic blocks are not required to be secondarily processed, and the processing cost is greatly reduced; the heat dissipation base 1 is matched with the chip packaging structure, only the mounting structure 11 matched with the packaging structure needs to be processed on the heat dissipation base 1, and a metal layer is not required to be coated on the surface of the metal-based ceramic for processing or a metal-based ceramic material is not required to be processed, so that the processing cost is greatly reduced; compared with the existing heat dissipation structure for electronic packaging, the heat dissipation structure has stronger applicability to complex structures, greatly reduces the cost of materials, preparation, processing and the like, and can be widely applied.
Specifically, the mounting structure 11 disposed on the heat dissipation base 1 may be a positioning hole and/or a positioning groove and/or a mounting hole and/or a mounting groove, which are disposed on the heat dissipation base 1 and used for matching with a chip packaging structure, that is, a metal-based ceramic block does not need to be processed, thereby avoiding high loss and low efficiency of processing cost; it can be understood that the heat dissipation structure may be a heat dissipation structure provided only for a chip package, that is, only having a heat dissipation substrate 2, processing the mounting structure 11 on the heat dissipation substrate 1, and packaging a single chip location;
it should be understood that the shape of each heat-dissipating substrate 2 matches the shape of the chip at the corresponding position; the size of each heat dissipation base body 2 is respectively matched with the size of the chip at the corresponding position, or the size of each heat dissipation base body 2 is larger than the size of the chip at the corresponding position; for example, the thickness of a heat dissipation substrate 2 is less than the thickness of the heat dissipation substrate 1, or the molding position of the heat dissipation substrate 2 is not parallel to the heat dissipation substrate 1, so that the packaging surface of the heat dissipation substrate 1 forms a groove/protrusion at the position of the heat dissipation substrate 2, the size of the groove/protrusion is greater than or equal to the size of the chip corresponding to the groove/protrusion, when packaging is performed, the chip is connected with the heat dissipation substrate 2 with the protrusion, or the chip is correspondingly embedded into the groove and connected with the heat dissipation substrate 2;
in this embodiment, a connection layer for connecting with a chip is disposed on the surface of the heat dissipation substrate 2, and the connection layer may be an adhesive layer, a resin layer, or the like, and covers the surface of the heat dissipation substrate 2 to connect/adhere with the chip during packaging.
In some embodiments, the heat dissipation base body 2 and the heat dissipation base 1 are integrally formed by introducing aluminum liquid outside the heat dissipation base body 2 in the manner described above; one or more fixing grooves 21 are formed in the side wall of the heat dissipation base body 2, preferably, the fixing grooves 21 are formed in the side wall of the heat dissipation base body 2 in an annular shape in the present embodiment, and the heat dissipation base body 1 is embedded in the fixing grooves 21 when the material of the heat dissipation base body 1 is cooled from a liquid state to a solid state and is formed outside the heat dissipation base body 2, so that the aluminum liquid can be filled in the fixing grooves 21, and a mutual embedding structure is formed between the formed heat dissipation base body 1 and the heat dissipation base body 2, so that the fixing is more stable.
On the other hand, the preferred embodiment further provides a mold 3, which is used for the heat dissipation structure for chip packaging in the preferred embodiment, the mold 3 has a mold cavity 31 for introducing liquid heat conduction materials (copper liquid, aluminum liquid) into the mold cavity 31 for cooling, curing and molding into the heat dissipation base 1, the surface of the mold 3 has a substrate placing position and/or a substrate placing groove 32 and/or a substrate placing protrusion for placing the heat dissipation base 2, one side of the mold 3 is provided with a liquid guide groove 33 communicated with the mold cavity 31 for introducing the liquid heat conduction materials into the mold cavity 31 from the upper part of one side of the mold cavity 31, it can be understood that the substrate placing groove 32 and the substrate placing protrusion can be used for realizing the non-parallel structure of the heat dissipation base 2 and the heat dissipation base 1, so that the heat dissipation base 2 protrudes or forms a groove relative to the packaging surface of the heat dissipation base 1 to match the chip packaging heights of different positions; the mold cavity 31 is formed by slotting the upper surface of the mold 3, and the guide groove 33 is opened on one side of the surface of the mold 3 to be communicated with the mold cavity 31, so that the molten aluminum can be slowly guided into the mold cavity 31 by the guide groove 33, the molten aluminum can reach the target thickness in the mold cavity 31 and surround the heat dissipation base bodies 2, after cooling and molding, the heat dissipation base 1 and the heat dissipation structure with the integral molding structure are basically formed, and the heat dissipation base 1 is subjected to milling and other processes to form the mounting structure 11, so that the preparation and the processing are completed.
In this embodiment, the cavity of the mold cavity 31 is provided with a powdery or granular heat conducting material, specifically, aluminum alloy powder/granules and copper alloy powder/granules, so as to avoid the generation of casting defects.
On the other hand, the preferred embodiment further provides a chip packaging apparatus, and the heat dissipation structure for chip packaging of the preferred embodiment is applied.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A heat dissipation structure for a chip package, the heat dissipation structure comprising:
the heat dissipation base (1) is plate-shaped, and the heat dissipation base (1) is used for being matched with the packaging structure of the chip;
the heat dissipation substrate (2), the heat dissipation substrate (2) with the base is the integrated into one piece structure, the heat dissipation substrate (2) in correspond on the base the encapsulation position of chip is arranged, the heat dissipation substrate (2) be used for with correspond the chip carry out the inflation matching and then keep laminating under the different temperature states.
2. The heat dissipation structure for chip packaging according to claim 1, wherein the heat dissipation base (1) is provided with a mounting structure (11) for matching with the packaging structure of the chip, and the mounting structure (11) comprises a positioning hole and/or a positioning slot and/or a mounting hole and/or a mounting groove.
3. The heat dissipation structure for chip packaging according to claim 1, wherein the shape of each of the heat dissipation substrates (2) is matched with the shape of the chip at the corresponding position, respectively; the size of each heat dissipation base body (2) is matched with the size of the chip at the corresponding position, or the size of each heat dissipation base body (2) is larger than the size of the chip at the corresponding position.
4. The heat dissipation structure for chip packaging according to claim 1, wherein a surface of the heat dissipation base (2) is provided with a connection layer for connection with the chip.
5. The heat dissipation structure for chip packaging according to claim 1, wherein the side wall of the heat dissipation substrate (2) is opened with one or more fixing grooves (21), and the heat dissipation substrate (1) is embedded in the fixing grooves (21) when the material of the heat dissipation substrate (1) is cooled from liquid state to solid state and is molded outside the heat dissipation substrate (2).
6. The heat dissipation structure for chip packaging according to claim 1, wherein the side wall of the heat dissipation substrate (2) is opened with a fixing groove (21) having a ring shape, and the heat dissipation substrate (1) is embedded in the fixing groove (21) when the material of the heat dissipation substrate (1) is cooled from a liquid state to a solid state and is molded outside the heat dissipation substrate (2).
7. The heat dissipation structure for chip packaging according to any one of claims 1 to 6, wherein the heat dissipation base (1) is an aluminum or copper plate, and the heat dissipation substrate (2) is an aluminum-based silicon carbide block or an aluminum-based diamond block or a copper-based silicon carbide block or a copper-based diamond block that is expansion-matched with the chip.
8. A mold for processing the heat dissipation structure for chip packaging according to any one of claims 1 to 6, wherein the mold (3) has a cavity (31) for introducing a liquid heat conductive material into the cavity (31) to be cooled and cured to form the heat dissipation base (1), the surface of the mold (3) has a substrate placement location and/or a substrate placement groove (32) and/or a substrate placement protrusion for placing the heat dissipation substrate (2), and a liquid guide groove (33) communicating with the cavity (31) is formed on one side of the mold (3) for introducing a liquid material into the cavity (31) from an upper portion of the one side of the cavity (31).
9. Mould according to claim 8, characterized in that the cavity of the mould cavity (31) is provided with the heat-conducting material in powder or granular form.
10. A chip packaging apparatus, characterized in that the heat dissipation structure for chip packaging according to any one of claims 1 to 6 is applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222588427.0U CN218827071U (en) | 2022-09-29 | 2022-09-29 | Heat dissipation structure for chip packaging, die and chip packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222588427.0U CN218827071U (en) | 2022-09-29 | 2022-09-29 | Heat dissipation structure for chip packaging, die and chip packaging device |
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| Publication Number | Publication Date |
|---|---|
| CN218827071U true CN218827071U (en) | 2023-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222588427.0U Active CN218827071U (en) | 2022-09-29 | 2022-09-29 | Heat dissipation structure for chip packaging, die and chip packaging device |
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| CN (1) | CN218827071U (en) |
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- 2022-09-29 CN CN202222588427.0U patent/CN218827071U/en active Active
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