CN218826437U

CN218826437U - Double-sided electrode patch element convenient for gluing and packaging

Info

Publication number: CN218826437U
Application number: CN202222793729.1U
Authority: CN
Inventors: 陈俊敏; 陈德斌; 陈哲波
Original assignee: Dongguan Tlc Electronic Technology Co ltd
Current assignee: Dongguan Tlc Electronic Technology Co ltd
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2023-04-07
Anticipated expiration: 2032-10-24

Abstract

The utility model discloses a double-sided electrode patch element convenient to rubber coating encapsulation, including electrode patch element body, the one end of electrode patch element body is provided with pad A, be provided with through-hole A on pad A, the other end of electrode patch element body is provided with pad B, through-hole B has been seted up on pad B, be provided with the insulating layer between pad A and pad B, the lateral wall of electrode patch element body is provided with the encapsulated layer; the utility model discloses mainly through PTC material layer, electrode A and electrode B and pad A and pad B's cooperation, realize two-sided electrode design, the tow sides all can weld, improve paster efficiency, through the encapsulated layer that sets up at the lateral wall of electrode paster component body, the rubber coating of being convenient for is sealed not to exist to glue and overflows through-hole A and through-hole B and lead to welding badly or glue the risk that can't seal up completely.

Description

Two-sided electrode paster component convenient to rubber coating encapsulation

Technical Field

The utility model relates to an overcurrent protection component technical field specifically is a two-sided electrode paster component convenient to rubber coating encapsulation.

Background

The polymer PPTC overcurrent protection element is a positive temperature coefficient self-recovery fuse, and when the current or the temperature rises, the resistance value gradually increases to cause the loop current to decrease, so that the overcurrent and overtemperature protection effect is achieved; the main material of the polymeric PPTC overcurrent protection element is compounded and processed by one or more conductive fillers, one or more crystalline or semi-crystalline polymeric materials and various additives. These crystalline or semi-crystalline polymers include polyethylene, polypropylene, polyvinylidene fluoride, and the like, and copolymers thereof; the conductive particles include carbon black, graphite, metal powder, and the like. In the prior art, four sides of a PPTC composite material in a polymer PPTC patch structure product are exposed to air, conductive fillers in the PPTC composite material are easily oxidized or the PPTC composite material is corroded by moisture, and the longer the PPTC composite material is exposed to air, the higher the resistance of the product is, the normal rated working current characteristics of the product are seriously affected, and the normal service life and other performances of the product are affected. In order to avoid the influence of oxidation and moisture erosion on the performance, the PPTC composite material exposed in the air is sealed by adopting a four-side gluing process in the prior art, so that the protection effect is achieved. As shown in fig. 5 and 6;

however, in the design of fig. 5, since the via hole is designed on the outer side surface of the bonding pad, in the existing gluing process, glue is easy to overflow into the via hole, so that solder paste cannot climb tin during welding, thereby causing poor welding; or in order to avoid the situation that the glue overflows into the via hole, abdication treatment is carried out, so that the glue cannot completely seal the PPTC composite material, the sealing protection effect is poor, and the performance is influenced;

the design of fig. 6 avoids the defects of the design of fig. 5, but only can realize single-side welding of the electrode, which is inconvenient in the assembly welding process, and the front and back sides of the electrode are also required to be identified, so that the efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a two-sided electrode paster component convenient to rubber coating encapsulation, through PTC material layer, electrode A and electrode B and pad A and pad B's cooperation, realize the design of two-sided electrode, the tow sides all can weld, improves paster efficiency to solve the problem that proposes in the background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: a double-sided electrode patch element convenient for gluing packaging comprises an electrode patch element body, wherein one end of the electrode patch element body is provided with a bonding pad A, a through hole A is formed in the bonding pad A, the other end of the electrode patch element body is provided with a bonding pad B, a through hole B is formed in the bonding pad B, an insulating layer is arranged between the bonding pad A and the bonding pad B, and an encapsulating layer is arranged on the side wall of the electrode patch element body; the electrode patch element body comprises a PTC material layer, an electrode A and an electrode B, wherein the electrode A and the electrode B are respectively located on two sides of the PTC material layer, the insulating layer is located on the outer surfaces of the electrode A and the electrode B, the electrode A is conducted with a bonding pad A, and the electrode B is conducted with a bonding pad B.

Preferably, the insulating layer includes a first insulating layer located on an outer surface of the electrode B and a second insulating layer located on an outer surface of the electrode a.

Preferably, the pad a includes a first upper pad and a first lower pad, the first upper pad is located on an outer surface of the first insulating layer, the first lower pad is located on an outer surface of the second insulating layer, and the first upper pad, the electrode a and the second lower pad are conducted through the through hole a.

Preferably, the pad B includes a second upper pad and a second lower pad, the second upper pad is located on the outer surface of the first insulating layer, the second lower pad is located on the outer surface of the second insulating layer, the second upper pad, the second lower pad and the electrode B are conducted through the through hole B, and the pad a and the pad B are symmetrically arranged.

Preferably, the polarity of the pad a is different from that of the pad B, and the etched shapes of the pad a and the pad B are the same.

Preferably, the first and second insulating layers are both insulating layers made of PP material, the second insulating layer isolates the electrode a from the first upper pad and the first lower pad, and the first insulating layer isolates the electrode B from the second upper pad and the second lower pad.

Preferably, the PTC material layer is a PTC composite chip composed of at least one polymer base material and at least one metal powder or conductive carbon black, and the electrode a and the electrode B are both provided with copper foil electrode sheets.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses mainly through PTC material layer, electrode A and electrode B and pad A and pad B's cooperation, realize the design of two-sided electrode, positive and negative both sides can all weld, improve paster efficiency, and through the encapsulated layer that sets up at the lateral wall of electrode paster component body, the rubber coating of being convenient for is sealed not to exist and to glue overflow to through-hole A and through-hole B and lead to welding badly or glue the risk that can't seal up completely.

Drawings

FIG. 1 is a schematic structural view of the glue-coated product of the present invention;

fig. 2 is a schematic perspective view of the present invention;

fig. 3 is a schematic sectional structure of the present invention;

fig. 4 is a schematic diagram of the explosion structure of the present invention;

FIG. 5 is a schematic diagram of a first prior art;

fig. 6 is a schematic structural diagram of a second prior art.

In the figure: 1. an insulating layer; 101. a first insulating layer; 102. a second insulating layer; 2. a pad B; 201. a first upper pad; 202. a first lower pad; 3. an encapsulation layer; 4. a through hole B; 5. a bonding pad A; 501. a second upper pad; 502. a second lower pad; 6. a through hole A; 7. an electrode B; 9. a PP layer; 10. an electrode A; 11. a layer of PTC material.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1

Referring to fig. 1-4, the present invention provides a technical solution: a double-sided electrode patch element convenient for gluing packaging comprises an electrode patch element body, wherein one end of the electrode patch element body is provided with a bonding pad A5, a through hole A6 is formed in the bonding pad A5, the other end of the electrode patch element body is provided with a bonding pad B2, a through hole B4 is formed in the bonding pad B2, an insulating layer 1 is arranged between the bonding pad A5 and the bonding pad B2, and an encapsulating layer 3 is arranged on the side wall of the electrode patch element body;

the electrode patch element body comprises a PTC material layer 11, an electrode A10 and an electrode B7, wherein the electrode A10 and the electrode B7 are respectively positioned on two sides of the PTC material layer 11, the insulating layer 1 is positioned on the outer surfaces of the electrode A10 and the electrode B7, the electrode A10 is conducted with a bonding pad A5, and the electrode B7 is conducted with a bonding pad B2; when the electrode patch element body is produced, a second insulating layer 102 and an upper copper foil layer are laminated on the upper layer of the PTC composite chip, and a first insulating layer 101 and a lower copper foil layer are laminated on the lower layer of the PTC composite chip; etching the upper copper foil layer into the contours of the first upper pad 201 and the second upper pad 501; the lower copper foil layer is etched into the shapes of the first lower bonding pad 202 and the second lower bonding pad 502, the through hole A6 and the through hole B4 are formed by adopting the processes of copper deposition and electroplating after drilling, the double-sided electrode design is realized, the front side and the back side can be welded, the surface mounting efficiency is improved, the encapsulating layer 3 adopts a gluing process, and four sides of the electrode surface mounting element body are evenly glued; the final gluing product perspective view is formed, gluing sealing is facilitated, the risk that glue overflows to the through hole A6 and the through hole B4 to cause poor welding or the glue cannot be completely sealed does not exist, an insulating and moisture-proof sealing gluing layer is arranged, the PTC material layer is wrapped in the sealing layer 3, and the problems that the PPTC composite material is exposed in the air, oxidized, corroded by moisture and the like are avoided.

The insulating layer 1 includes a first insulating layer 101 and a second insulating layer 102, the first insulating layer 101 is located on the outer surface of the electrode B7, and the second insulating layer 102 is located on the outer surface of the electrode a 10.

The pad A5 includes a first upper pad 201 and a first lower pad 202, the first upper pad 201 is located on the outer surface of the first insulating layer 101, the first lower pad 202 is located on the outer surface of the second insulating layer 102, and the first upper pad 201, the electrode a10 and the second lower pad 502 are conducted through a via A6.

Pad B2 includes pad 501 and second lower pad 502 on the second, pad 501 is located the surface of first insulating layer 101 on the second, second lower pad 502 is located the surface of second insulating layer 102, pad 501, second lower pad 502 and electrode B7 switch on through-hole B4 on the second, just pad A5 and pad B2 are the symmetry setting, and regional printing hinders between first upper pad 201 and second upper pad 501 and between first lower pad 202 and second lower pad 502 and welds printing ink layer and character, can effectively protect copper foil layer and subsequent product character printing or the radium-shine character of laser provides the effective area through hindering the printing ink.

Pad A5 and pad B2's polarity is different, and if pad A5 is anodal then pad B2 is the negative pole, otherwise, pad A5 is the negative pole, and pad B2 is then anodal, the appearance of pad A5 and pad B2 etching is the same, is convenient for realize carrying out two-sided welding to pad A5 and pad B2.

The first insulating layer 101 and the second insulating layer 102 are insulating layers made of PP materials, the second insulating layer 102 isolates the electrode a10 from the first upper pad 201 and the first lower pad 202, and the first insulating layer 101 isolates the electrode B7 from the second upper pad 501 and the second lower pad 502, so that the short circuit risk of the non-conductive part is avoided.

The PTC material layer 11 is a PTC composite chip composed of at least one polymer base material and at least one metal powder or conductive carbon black, the PTC composite chip is processed into a PTC composite chip with the thickness of 0.18mm-1.0mm, the width of 250 mm-300 mm and the length of 200 mm-450 mm, and the electrode A10 and the electrode B7 are both provided with copper foil electrode plates.

Example 2

The PTC material layer 11 is a multilayer PPTC polymer chip and has a patch structure convenient for gluing and packaging; the difference from the embodiment 1 is that the PPTC high-molecular chip is a multilayer board, different layers of boards are in parallel connection, and PPTC chips of different layers are conducted in parallel by adopting abdication etching and through hole design; the other processes were the same as in example 1.

FIG. 5 shows a structure of the first prior art, which adopts a blind hole single-sided electrode design; the structure comprises a single-sided electrode A10, a single-sided electrode B7, a PPTC composite material, a PPTC copper foil, an insulating layer 1, a PP material adopted by the insulating layer 1, a blind hole A, a blind hole B and a glue coating layer; the insulating layer 1 plays an insulating role, the blind hole A is used for connecting the PPTC copper foil A and the single-sided electrode A10, the blind hole B is used for connecting the PPTC copper foil B and the single-sided electrode B7, the gluing layer is used for preventing the PPTC composite material from being exposed in the air, only the single-sided electrode welding can be realized, the assembly welding process is inconvenient, the front side and the back side of the electrode need to be identified, and the efficiency is low.

FIG. 6 shows a structure of the second prior art, which employs the design of the outer side of via hole and double-sided electrode; the structure comprises a double-sided electrode A10, a double-sided electrode B7, a PPTC composite material, a PPTC copper foil, a PP layer 9, a via hole A6, a via hole B4 and a glue coating layer; the PP layer 9 has an insulating effect, the conducting hole A6 is used for connecting and conducting the upper electrode A10 and the lower electrode B4 is used for connecting and conducting the upper electrode B7, and the gluing layer is used for preventing the PPTC composite material from being exposed in the air; the via hole is designed on the outer side surface of the bonding pad, and in the existing gluing process, glue is easy to overflow into the via hole, so that tin paste cannot climb tin during welding, and poor welding is generated; or in order to avoid the situation that the glue overflows into the via hole, yielding treatment is carried out, so that the glue cannot completely seal the PPTC composite material, the sealing protection effect is poor, and the performance is affected.

Comparing the products of the first prior art, the second prior art and the products of the examples 1 and 2, and adopting the same gluing process for comparison; in the second prior art, 1-3% of glue is not coated well, and the glue overflows into a through hole, so that the soldering cannot have poor tin climbing, and the poor phenomenon does not exist in the

embodiments

1 and 2; the prior art has a low packaging efficiency, which is generally 35% less than that of examples 1 and 2.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a two-sided electrode patch element convenient to rubber coating encapsulation, includes electrode patch element body, its characterized in that: a bonding pad A (5) is arranged at one end of the electrode patch element body, a through hole A (6) is formed in the bonding pad A (5), a bonding pad B (2) is arranged at the other end of the electrode patch element body, a through hole B (4) is formed in the bonding pad B (2), an insulating layer (1) is arranged between the bonding pad A (5) and the bonding pad B (2), and an encapsulating layer (3) is arranged on the side wall of the electrode patch element body;

the electrode patch element body comprises a PTC material layer (11), an electrode A (10) and an electrode B (7), wherein the electrode A (10) and the electrode B (7) are respectively located on two sides of the PTC material layer (11), the insulating layer (1) is located on the outer surfaces of the electrode A (10) and the electrode B (7), the electrode A (10) is conducted with a pad A (5), and the electrode B (7) is conducted with a pad B (2).

2. A double-sided electrode patch element for facilitating adhesive encapsulation according to claim 1, wherein: the insulating layer (1) comprises a first insulating layer (101) and a second insulating layer (102), wherein the first insulating layer (101) is positioned on the outer surface of the electrode B (7), and the second insulating layer (102) is positioned on the outer surface of the electrode A (10).

3. A double-sided electrode patch element for facilitating adhesive encapsulation according to claim 2, wherein: the pad A (5) comprises a first upper pad (201) and a first lower pad (202), the first upper pad (201) is located on the outer surface of the first insulating layer (101), the first lower pad (202) is located on the outer surface of the second insulating layer (102), and the first upper pad (201), the electrode A (10) and the second lower pad (502) are conducted through the through hole A (6).

4. A double-sided electrode patch element for facilitating adhesive encapsulation according to claim 3, wherein: pad B (2) includes pad (501) and second lower pad (502) on the second, pad (501) are located the surface of first insulating layer (101) on the second, pad (502) are located the surface of second insulating layer (102) down on the second, pad (501), second lower pad (502) and electrode B (7) are switched on through-hole B (4) on the second, just pad A (5) and pad B (2) are the symmetry and set up.

5. A double-sided electrode patch element for facilitating adhesive encapsulation according to claim 4, wherein: the first insulating layer (101) and the second insulating layer (102) are both insulating layers made of PP material, the second insulating layer (102) isolates the electrode A (10) from the first upper pad (201) and the first lower pad (202), and the first insulating layer (101) isolates the electrode B (7) from the second upper pad (501) and the second lower pad (502).

6. A double-sided electrode patch element for facilitating adhesive encapsulation according to claim 1, wherein: the polarity of the pad A (5) is different from that of the pad B (2), and the etched outlines of the pad A (5) and the pad B (2) are the same.

7. A double-sided electrode patch element for facilitating adhesive encapsulation according to claim 1, wherein: and the electrode A (10) and the electrode B (7) are both arranged as copper foil electrode plates.