CN218812187U - Electroplating head clamping assembly and electroplating head - Google Patents
Electroplating head clamping assembly and electroplating head Download PDFInfo
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- CN218812187U CN218812187U CN202223300808.0U CN202223300808U CN218812187U CN 218812187 U CN218812187 U CN 218812187U CN 202223300808 U CN202223300808 U CN 202223300808U CN 218812187 U CN218812187 U CN 218812187U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides an electroplating head clamping assembly and an electroplating head, wherein the clamping assembly comprises a support ring, a sealing cover plate and a detachable clamping carrier; the clamping carrier is provided with an electroplating hole for exposing the electroplating surface of the wafer and a raised limiting part surrounding the electroplating hole, and the raised limiting part surrounds the wafer placing position; the clamping carrier comprises a sealing cover and a conducting ring, and the sealing cover plate is covered on the conducting ring and is detachably connected with the sealing cover through a first connecting piece; the support ring is supported on the sealing cover plate and is detachably connected with the sealing cover through a second connecting piece. The utility model discloses only need can adapt to the electroplating work of this shape wafer through the centre gripping carrier that the assembly corresponds according to the wafer shape, solved among the prior art electroplating head exist can't be applicable to the difficult problem that heterotypic wafer was electroplated, simultaneously, the utility model discloses can select the centre gripping carrier that is equipped with a plurality of electroplating holes, once only can realize the electroplating of multi-disc wafer, improve the wafer and electroplate homogeneity and reduce the electroplating differentiation nature greatly.
Description
Technical Field
The utility model relates to an electroplate device technical field, specifically relates to an electroplate first centre gripping subassembly and contain the electroplating head of this centre gripping subassembly, especially relate to one kind applicable in heterotypic wafer, can improve the wafer and electroplate first centre gripping subassembly and contain the electroplating head of this centre gripping subassembly of homogeneity and reduction edge differentiation.
Background
With the increasing demand of modern society for semiconductor electronic products, the increasingly wide field related to semiconductor products and the diversification of semiconductor products, many different requirements are generated on wafers. For example, the shape of the wafer is not limited to a circle, but other shapes such as a square are also possible. In addition, it is important to improve the uniformity of wafer plating and reduce edge variation between wafers.
Electroplating is a critical ring of metal interconnects in the wafer fabrication process. When the wafer is electroplated, the wafer is fixed on the electroplating head by the sealing element, and the electroplating head puts the wafer into the electroplating solution for electroplating. Fig. 1 shows a plating head adopted by a mainstream plating device in the market at present, which is only suitable for a circular wafer and only can process one wafer at a time, and therefore, the defect is that on one hand, the plating head cannot be suitable for a special-shaped wafer such as a square; on the other hand, the processing rate of the wafer is seriously hindered, the electroplating uniformity of the wafer is difficult to ensure, and the differentiation among wafers is difficult to control.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model aims at providing an electroplate first centre gripping subassembly and contain the electroplating ring of this centre gripping subassembly, through the design of dismantled and assembled centre gripping carrier, the electroplating work of adaptable different shape wafers to can once only electroplate the multi-disc wafer based on needs, thereby when promoting process efficiency, improve the wafer and electroplate the homogeneity and reduce the edge differentiation.
In order to achieve the above purpose, the present invention provides the following technical solutions:
an electroplating head clamping assembly comprises a support ring, a sealing cover plate and a detachable clamping carrier; the clamping carrier is provided with an electroplating hole for exposing the electroplating surface of the wafer and a raised limiting part surrounding the electroplating hole, and the raised limiting part surrounds the wafer placing position;
the clamping carrier comprises a sealing cover and a conducting ring, the conducting ring is embedded in the sealing cover, the sealing cover plate covers the conducting ring, and the sealing cover plate is detachably connected with the sealing cover through a first connecting piece; the support ring is supported on the sealing cover plate and detachably connected with the sealing cover through a second connecting piece.
In the technical scheme, by adopting the structural design, the electroplating work of the wafer with the shape can be adapted only by assembling the clamping carrier meeting the shape of the wafer according to the shape of the wafer, the problem that an electroplating head in the prior art cannot be suitable for electroplating of special-shaped wafers is solved, meanwhile, the technical scheme does not limit the selected clamping carrier, a user can select the clamping carrier with a plurality of electroplating holes for electroplating according to actual needs, and therefore electroplating of a plurality of wafers can be realized at one time, the process efficiency is greatly improved, and meanwhile, the uniformity of wafer electroplating is improved and the difference of wafer-to-wafer electroplating is reduced.
Preferably, the sealing cover is provided with a first electroplating hole, and the inner side of the sealing cover is provided with a raised limiting part around the first electroplating hole; the corresponding position of conducting ring is provided with the second electroplating hole that corresponds with first electroplating hole, and the corresponding position around second electroplating hole is provided with the first trompil that makes protruding spacing portion pass on the conducting ring, and during the electroplating, the wafer is placed in the wafer that protruding spacing portion encloses the formation and is put the position, and the electroplating face of wafer loops through second electroplating hole and first electroplating hole and exposes.
In the technical scheme, by adopting the structural design, the clamping carrier is simple in structural design and convenient to disassemble and assemble.
Preferably, the first connecting piece comprises a button type locker arranged on the sealing cover plate and a locking seat arranged in the sealing cover;
two ends of the button type locker are respectively provided with a pressing part and a locking part, the pressing part is positioned on one side of the sealing cover plate far away from the conducting ring, and the locking part is positioned on one side of the sealing cover plate close to the conducting ring;
the corresponding position of conducting ring is provided with the second trompil that supplies the locking seat to pass, the corresponding position of locking seat be provided with can with locking portion complex locking groove.
Among this technical scheme, through adopting above structural design, through the cooperation of button type locker and locking seat, can realize sealed apron and sealed quick dismantlement and the equipment of covering, improve efficiency greatly on the one hand from this, on the other hand is convenient for change and assemble different centre gripping carriers.
Preferably, the button-type locker further comprises a positioning part located on the same side of the sealing cover plate as the locking part, the positioning part is located above the locking part, and a positioning groove matched with the positioning part is arranged at the corresponding position of the locking seat.
In the technical scheme, by adopting the structural design, the verticality of the button type locker after installation can be ensured by utilizing the design of the positioning part and the positioning groove, and the installation eccentricity problem is avoided.
Preferably, the first connecting piece includes a plurality of bulb plunger plugs, the lateral wall of sealed apron is provided with the first screw hole that supplies bulb plunger plug to pass, and the corresponding position of sealed lid lateral wall is provided with the wedge groove, the bulb of bulb plunger plug releases in the wedge groove.
Among this technical scheme, through adopting above structural design, through the cooperation of bulb plunger and wedge groove, can realize sealed apron and sealed quick dismantlement and the equipment of covering, raise the efficiency greatly.
Preferably, the second connecting piece includes the bolt, be provided with the second screw hole on the support ring, the corresponding position of sealed lid is provided with the third screw hole, and the bolt is screwed in second screw hole and third screw hole in proper order and is realized being connected with dismantling of sealed lid in support ring.
In this technical scheme, through adopting above structural design, the support ring is connected fixedly with the screw in realization of sealed lid through the bolt, is fixed in between the two with conducting ring and sealed apron from this, simultaneously, when needs dismouting centre gripping carrier, the quick separation of support ring and sealed lid is realized to the back-off of accessible bolt again.
Preferably, the number of the plated holes is plural.
In the technical scheme, through adopting the structural design, the clamping carrier is provided with a plurality of electroplating holes for exposing the electroplating surface of the wafer, so that the electroplating efficiency is greatly improved, the electroplating uniformity of the wafer can be improved, and the electroplating difference among wafers can be reduced.
Preferably, the plated hole has a circular or square shape.
Among this technical scheme, through adopting above structural design, the shape in the electroplating hole that the centre gripping carrier set up can be for circular or square, and this contains three kinds of circumstances, and one is all designed for circular, and its two is all designed for square, and its three is including circular and square simultaneously, and the user can select and assemble according to actual need, adapts to different electroplating demands from this.
Preferably, the protrusion limiting part is formed by uniformly arranging point-shaped or strip-shaped protrusions around the first electroplating hole on the inner side of the sealing cover.
In the technical scheme, through adopting the structural design, the bump limiting part is formed by the point-shaped bumps or the strip-shaped bumps so as to limit the installation position of the wafer, the structural design is simple, and the operation is convenient and fast.
An electroplating head comprising an electroplating head clamping assembly as claimed in any one of the above
In the technical scheme, by adopting the structural design, the clamping carriers with different shapes and different numbers of electroplating holes can be installed, so that the electroplating work of wafers with different shapes can be realized, and the electroplating efficiency and the electroplating uniformity can be controlled.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model provides an electroplate first centre gripping subassembly, only need satisfy the electroplating work of this shape wafer through the assembly according to the wafer shape through the centre gripping carrier of this wafer shape, the difficult problem of electroplating of the unable heterotypic wafer that is applicable to that has solved among the prior art that electroplate the head and exist, and simultaneously, this technical scheme does not do the restriction to the centre gripping carrier of selection, the user can select the centre gripping carrier that is equipped with a plurality of electroplating holes according to actual need to be used for electroplating, from this the electroplating of disposable multi-disc wafer that can realize, promote the homogeneity that the wafer was electroplated and reduce the difference nature of electroplating between the wafer when improving process efficiency greatly.
2. The utility model provides an electroplate first centre gripping subassembly, the design of parts such as accessible button type locker or parts such as bulb plunger, realize sealed lid and sealed quick dismantlement and the equipment of lapping between, raise the efficiency greatly from this on the one hand, on the other hand, the assembly of the different centre gripping carriers of being convenient for.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic diagram of a plating head according to the prior art;
FIG. 2 is a schematic diagram showing the overall structure of a clamping assembly of the plating head according to embodiment 1;
FIG. 3 is an exploded view of the plating head clamping assembly of example 1;
FIG. 4 is a partially enlarged view of the portion I in the direction of the angle of view indicated by the arrow;
FIG. 5 is a schematic structural view of a ball plunger according to embodiment 1;
FIG. 6 is a schematic view showing the overall structure of the plating head clamping assembly according to embodiment 2;
FIG. 7 is an exploded view of the plating head clamping assembly of example 2;
fig. 8 is a schematic structural view of the push button type locker of embodiment 2;
fig. 9 is a schematic structural view of the locking seat in embodiment 2.
The figures show that:
100-plating head clamping assembly;
10-sealing the cover plate;
11-a first threaded hole;
20-a conductive ring;
21-second plated hole;
22-a first opening;
23-a second opening;
30-a sealing cover;
31 — first plated hole;
32-point-shaped protrusions;
33-a third threaded hole;
34-a wedge-shaped groove;
35-strip-shaped bulges;
40-button type locker;
41-a locking part;
42-a positioning section;
43-a pressing part;
44-a limiting part;
50-a locking seat;
51-a locking groove;
52-positioning grooves;
60-ball head plunger;
61-bulb;
62-a spring;
63-a plunger body;
70-a support ring;
71-a second threaded hole;
80-bolt;
90-clamping carrier
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, as presented in the figures, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures. Furthermore, all directional indicators in this application (such as up, down, left, right, front, back, bottom \8230;) are used only to explain the relative positional relationship between the components, motion, etc. at a particular attitude (as shown in the drawings), and if the particular attitude changes, the directional indicator changes accordingly. Further, the descriptions in this application referring to "first", "second", etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated.
Example 1
As shown in fig. 2 to 5, the present embodiment provides a plating head clamping assembly 100. As shown in fig. 2, the plating head clamping assembly 100 includes a support ring 70, a sealing cover plate 10, and a detachable clamping carrier 90, wherein the clamping carrier 90 is provided with a plating hole for exposing a plating surface of a wafer, and a protruding limiting portion surrounding the plating hole, and the protruding limiting portion surrounds the wafer placing position.
During electroplating, a wafer is placed on the wafer placing position of the clamping carrier 90, the sealing cover plate 10 is detachably connected with the clamping carrier 90 through a first connecting piece, the support ring 70 is supported on the sealing cover plate 10, and the support ring 70 is detachably connected with and fixed to the clamping carrier 90 through a second connecting piece. When it is desired to plate a certain number (e.g., 1 or more) of wafers or perform a certain shape (e.g., circular or square) of wafers, it may be adapted to fit a gripper carrier 90 provided with a corresponding number or shape of plating holes. In this embodiment, a clamping carrier 90 with 4 square plating holes is used, specifically:
as shown in fig. 3, the clamping carrier 90 includes a sealing cover 30 and a conductive ring 20, the conductive ring 20 is embedded in the sealing cover 30, the sealing cover plate 10 covers the conductive ring 20, and the sealing cover plate 10 is detachably connected to the sealing cover 30 through a first connecting member; the support ring 70 is supported on the seal cover plate 10 and the support ring 70 is detachably coupled and fixed with the seal cover 30 by a second coupling member.
The sealing cover 30 is provided with four square first electroplating holes 31, the inner side of the sealing cover 30 is provided with point-shaped protrusions 32 around the square first electroplating holes 31, and the point-shaped protrusions 32 form protrusion limiting parts. The corresponding position of conducting ring 20 is provided with the second electroplating hole 21 that corresponds with first electroplating hole 31, the quantity, the position, the shape, and the size of second electroplating hole 21 all match with first electroplating hole 31, and, conducting ring 20 corresponds around second electroplating hole 21 and is provided with first trompil 22, the quantity, the position, the shape of first trompil 22, and the size matches with the punctiform arch 32 that sets up on the sealed lid 30, when conducting ring 20 inlays and locates in sealed lid 30, thereby punctiform arch 32 that sets up on the sealed lid 30 can pass first trompil 22 in order to expose on conducting ring 20 and form the wafer and place the position.
When electroplating is needed, 4 square wafers are placed in the wafer placing position one by one, and the electroplating surface of each wafer is exposed through the second electroplating holes 21 and the first electroplating holes 31. After the wafer is placed, the sealing cover plate 10 is covered on the conductive ring 20, so that the sealing cover plate 10 is quickly detachably connected with the sealing cover 30 through the first connecting piece, and then the support ring 70 is supported on the sealing cover plate 10, so that the support ring 70 is detachably connected with the sealing cover 30 through the second connecting piece and is fixed.
In terms of the detachable connection of the sealing cover plate 10 and the sealing cover 30, in this embodiment, the first connecting member includes a plurality of ball plungers 60, and fig. 5 shows a basic structure of the ball plungers 60, which includes a plunger body 63, a ball 61 and a spring 62, wherein the plunger body 63 is opened with a semi-closed cavity, the spring 62 is disposed in the semi-closed cavity, and the ball 61 is mounted at an open end of the semi-closed cavity and connected with the spring 62. When external force is applied to the ball 61 or the plunger body 63, the ball 61 sinks into the semi-closed cavity, and when the external force applied to the ball 61 or the plunger body 63 is relieved, the ball 61 is released and returns to the original position.
In this embodiment, that is, by using the structural property of the ball stud plug 60, as shown in fig. 3 and fig. 4, the side wall of the sealing cover plate 10 is provided with a circle of first threaded holes 11 for the ball stud plug 60 to pass through, a circle of wedge-shaped grooves 34 matched with the ball 61 of the ball stud plug 60 is provided at corresponding positions of the side wall of the sealing cover 30, and when the plating head clamping assembly 100 provided in this embodiment is installed, the ball 61 of the ball stud plug 60 is released in the wedge-shaped grooves 34, so as to achieve quick connection between the sealing cover plate 10 and the sealing cover 30.
In the case of the detachable connection of the support ring 70 to the sealing cover 30, in the present embodiment, as shown in fig. 3, the second connection member is a bolt 80 (note: fig. 3 shows only one bolt 80, and actually the number of bolts 80 is plural). The support ring 70 is provided with a plurality of second threaded holes 71, a corresponding number of third threaded holes 33 are provided at corresponding positions of the sealing cover 30, and the bolts 80 are screwed into the second threaded holes 71 and the third threaded holes 33 in sequence, so that the support ring 70 and the sealing cover 30 can be fixedly connected, and the conductive ring 20 and the sealing cover plate 10 are fixed therebetween.
When the clamping carrier 90 needs to be replaced, the bolt 80 is screwed out in the opposite direction to release the fixed connection state of the support ring 70 and the sealing cover 30, then pressure and driving force for upward movement are applied to the sealing cover plate 10, the ball head 61 sinks into the plunger body 63 under the action of the pressure, and the ball head plunger 60 moves upward along with the sealing cover plate 10 under the action of the upward driving force, so that the connection state of the sealing cover plate 10 and the sealing cover 30 is rapidly released, and the rapid replacement of the clamping carrier 90 can be realized.
Example 2
As shown in fig. 6 to 9, the present embodiment provides a plating head clamping assembly 100, which has a structure substantially the same as that of the plating head clamping assembly 100 described in embodiment 1, and mainly differs from the first embodiment in that, in the first embodiment, a point-shaped protrusion 32 is disposed around a square-shaped first plating hole 31 inside a sealing cover 30 to form a protrusion limiting portion, and in the present embodiment, as shown in fig. 7, a strip-shaped protrusion 35 is disposed around the square-shaped first plating hole 31 inside the sealing cover 30 to form a protrusion limiting portion; second, in the embodiment 1, the sealing cover 30 and the sealing cover plate 10 are rapidly disassembled and assembled by the ball plunger 60, and in the embodiment, the sealing cover 30 and the sealing cover plate 10 are rapidly disassembled and assembled by the engagement of the button type locker 40 and the locking socket 50. Specifically, the method comprises the following steps:
as shown in fig. 7, in the present embodiment, the first connecting member includes a button type locker 40 provided on the sealing cover 10 and a locking seat 50 provided in the sealing cover 30. As shown in fig. 8, the push-button type locker 40 is provided with a pressing portion 43, a position-limiting portion 44, a positioning portion 42 and a locking portion 41 from top to bottom, wherein the pressing portion 43 and the position-limiting portion 44 are located on a side of the sealing cover plate 10 away from the conductive ring 20, and the positioning portion 42 and the locking portion 41 are located on a side of the sealing cover plate 10 close to the conductive ring 20. As shown in fig. 7, the corresponding position of the conductive ring 20 is provided with a second opening 23 for the locking seat 50 to pass through, and as shown in fig. 9, the corresponding position of the locking seat 50 is provided with a locking groove 51 capable of cooperating with the locking portion 41 and a positioning groove 52 cooperating with the positioning portion 42.
When the plating head clamping assembly 100 provided by the embodiment is installed, the pressing part 43 of the button type locker 40 is firstly utilized to press the locking part 41 into the locking groove 51 of the locking seat 50, the aperture of the locking groove 51 is smaller than the outer diameter of the locking part 41, and the locking part 51 and the locking groove are tightly connected by the principle similar to interference fit; after the locking part 41 is pressed into the locking groove 51, the positioning part 42 enters the positioning groove 52, the aperture of the positioning groove 52 is larger than that of the locking groove 51, the positioning groove and the locking groove 51 form a step-shaped design, and through the structural design of the positioning part 42 and the positioning groove 52, the button type locker 40 can be ensured not to be eccentrically installed, and the eccentric problem caused by external force after installation can be avoided. In the process that the locking portion 41 of the push-button type locker 40 is pressed into the locking groove 51, the limiting portion 44 limits itself and the pressing portion 43 to the side of the sealing cover plate 10 away from the conductive ring 20, and the design of the limiting portion 44 prevents the locking portion 41 from being pressed too deep to cause damage to the locking seat 50.
When it is necessary to replace the clamp carrier 90, the bolts 80 are outwardly unscrewed to release the coupling fixation state of the support ring 70 with the sealing cover 30, and then the push button type locker 40 is upwardly pulled to separate the locking part 41 from the locking groove 51 of the locking seat 50, thereby rapidly releasing the coupling state of the sealing cover plate 10 with the sealing cover 30.
Example 3
The present embodiment provides a plating head having substantially the same structure as the plating head used in the prior art shown in fig. 1, except that the plating head of the present embodiment is equipped with the plating head clamping assembly 100 described in embodiment 1 or embodiment 2 for clamping a wafer.
The embodiments of the present invention have been described, and various changes and modifications can be made by workers without departing from the technical spirit of the present invention.
Claims (10)
1. An electroplating head clamping assembly is characterized by comprising a support ring, a sealing cover plate and a detachable clamping carrier; the clamping carrier is provided with an electroplating hole for exposing the electroplating surface of the wafer and a raised limiting part surrounding the electroplating hole, and the raised limiting part surrounds the wafer placing position;
the clamping carrier comprises a sealing cover and a conducting ring, the conducting ring is embedded in the sealing cover, the sealing cover plate covers the conducting ring, and the sealing cover plate is detachably connected with the sealing cover through a first connecting piece; the support ring is supported on the sealing cover plate and detachably connected with the sealing cover through a second connecting piece.
2. The plating head clamping assembly as recited in claim 1, wherein the sealing cap defines a first plated hole, and a raised limiting portion is disposed around the first plated hole inside the sealing cap; the corresponding position of conducting ring is provided with the second electroplating hole that corresponds with first electroplating hole, and the corresponding position around second electroplating hole is provided with the first trompil that makes protruding spacing portion pass on the conducting ring, and during the electroplating, the wafer is placed in the wafer that protruding spacing portion encloses the formation and is put the position, and the electroplating face of wafer loops through second electroplating hole and first electroplating hole and exposes.
3. The plating head clamping assembly of claim 1, wherein the first connector comprises a push button type locker disposed on the sealing cover plate and a locking seat disposed within the sealing cover;
two ends of the button type locker are respectively provided with a pressing part and a locking part, the pressing part is positioned on one side of the sealing cover plate far away from the conducting ring, and the locking part is positioned on one side of the sealing cover plate close to the conducting ring;
the corresponding position of conducting ring is provided with the second trompil that supplies the locking seat to pass, and the corresponding position of locking seat is provided with can with locking portion complex locking groove.
4. The plating head clamping assembly as recited in claim 3, wherein the button-type locker further comprises a positioning portion located on the same side of the sealing cover plate as the locking portion, the positioning portion is located above the locking portion, and a positioning groove matched with the positioning portion is provided at a corresponding position of the locking seat.
5. The plating head clamping assembly as recited in claim 1, wherein the first connecting member comprises a plurality of ball stud plugs, the side wall of the sealing cover plate is provided with a first threaded hole for the ball stud plugs to pass through, a wedge groove is arranged at a corresponding position of the side wall of the sealing cover plate, and a ball head of the ball stud plug is released in the wedge groove.
6. The plating head clamping assembly as recited in claim 1, wherein the second connector comprises a bolt, the support ring has a second threaded hole, the seal cover has a third threaded hole at a corresponding position, and the bolt is sequentially screwed into the second threaded hole and the third threaded hole to detachably connect the support ring and the seal cover.
7. The plating head clamping assembly of claim 1, wherein the number of plating holes is plural.
8. The plating head clamping assembly of claim 7, wherein the plating aperture is circular or square in shape.
9. The plating head holding assembly according to claim 2, wherein the projection stopper is formed by uniformly providing spot-like or strip-like projections around the first plating hole inside the sealing cover.
10. An electroplating head comprising the electroplating head clamping assembly of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223300808.0U CN218812187U (en) | 2022-12-09 | 2022-12-09 | Electroplating head clamping assembly and electroplating head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223300808.0U CN218812187U (en) | 2022-12-09 | 2022-12-09 | Electroplating head clamping assembly and electroplating head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218812187U true CN218812187U (en) | 2023-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223300808.0U Active CN218812187U (en) | 2022-12-09 | 2022-12-09 | Electroplating head clamping assembly and electroplating head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218812187U (en) |
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- 2022-12-09 CN CN202223300808.0U patent/CN218812187U/en active Active
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