CN214818007U - Wafer clamping device - Google Patents
Wafer clamping device Download PDFInfo
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- CN214818007U CN214818007U CN202121048769.2U CN202121048769U CN214818007U CN 214818007 U CN214818007 U CN 214818007U CN 202121048769 U CN202121048769 U CN 202121048769U CN 214818007 U CN214818007 U CN 214818007U
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Abstract
The utility model provides a seed planting wafer clamping device makes the difficult cracked of wafer when the clamping wafer, include: a base, wherein a circular groove for embedding the wafer is formed on one side end face of the base; and the pressing mechanisms are arranged on the base and used for clamping the wafer, each pressing mechanism is provided with a pressing block arranged around the circular groove and an elastic element matched with the pressing block, and the pressing block presses the wafer towards the direction close to the center of the circular groove under the action of the elastic element. Compared with the prior art that the wafer is directly clamped by a device similar to a three-jaw chuck, the wafer clamping device has the advantages that the wafer receives small force, has the functions of lateral supporting and blocking, and can be effectively prevented from being cracked in the clamping process.
Description
Technical Field
The utility model relates to a wafer detects appurtenance, concretely relates to wafer clamping device.
Background
Wafers, which are carriers used in the production of integrated circuits, are referred to as single crystal silicon wafers. The thickness of the wafer is very small, mostly about 1 mm. When the wafer is detected, the wafer needs to be clamped and fixed.
In the prior art, a wafer is clamped by using a lens clamping device for clamping a common lens. The lens clamping device has a claw capable of clamping the lens from the peripheral surface of the lens, and the lens is positioned and clamped by the claw when placed on the lens clamping device. The clamping jaw has a large clamping force on the lens, and if the clamping jaw is used for clamping a wafer, the thickness of the wafer is small, and the strength is small, so that the wafer is easily crushed in the clamping process, the loss of the wafer is caused, and the measurement of the wafer is greatly influenced.
SUMMERY OF THE UTILITY MODEL
For solving the above problem, provide a wafer clamping device, make the wafer difficult cracked when the clamping wafer, the utility model discloses a following technical scheme:
the utility model provides a wafer clamping device, a serial communication port, include: a base, wherein a circular groove for embedding the wafer is formed on one side end face of the base; and the pressing mechanisms are arranged on the base and used for clamping the wafer, each pressing mechanism is provided with a pressing block arranged around the circular groove and an elastic element matched with the pressing block, and the pressing block presses the wafer towards the direction close to the center of the circular groove under the action of the elastic element.
The utility model provides a wafer clamping device can also have such characteristic, wherein, has the three installation department that evenly encircles circular recess on the base, and hold-down mechanism's quantity is three, installs respectively in the installation department that corresponds.
The utility model provides a wafer clamping device can also have such characteristic, and wherein, circular recess has the annular groove wall, has the three passageway portion that is linked together with each installation department on this annular groove wall, and this passageway portion is along the radial extension of circular recess, and the briquetting has protruding projection to circular recess, and the radial movement along circular recess in the passageway portion that this projection can correspond.
The utility model provides a wafer clamping device can also have such characteristic, and wherein, hold-down mechanism still has the depression bar, and the depression bar has as the joint end with briquetting fixed connection's one end along the radial extension of circular recess to and pass the installation department and extend to the outer one end of base as extending the end, and elastic element is pressure spring, and this pressure spring one end is fixed on the briquetting, and the other end is fixed on the installation department.
The utility model provides a wafer clamping device can also have such characteristic, and wherein, hold-down mechanism still has the depression bar handle, and depression bar handle an organic whole takes shape in the extension end of depression bar, and the pressure spring cover is established on the depression bar.
The utility model provides a wafer clamping device can also have such characteristic, wherein, fixed mounting has at least one guide bar parallel with the depression bar in this installation department on the installation department, and the housing of compression spring is established on the guide bar, and the briquetting still has at least one guide bar mounting hole that is used for letting the guide bar pass for when the depression bar removed, the length direction removal along the guide bar was followed to the briquetting.
The utility model provides a wafer clamping device can also have such characteristic, and wherein, the quantity of guide bar is two, and the difference symmetric distribution is in the both sides of the depression bar that corresponds.
The utility model provides a wafer clamping device can also have such characteristic, and wherein, the installation department still has the butt piece, and this butt piece sets up the one end of keeping away from circular recess at the installation department, has the depression bar mounting hole that lets the depression bar pass, and the other end of spring is fixed on the butt piece.
The utility model provides a wafer clamping device can also have such characteristic, and wherein, the base is circularly, and the center has the through-hole, and circular recess setting is at the center of base to coincide with the centre of a circle of through-hole.
The utility model provides a wafer clamping device can also have such characteristic, wherein, the degree of depth of circular recess and the thickness phase-match of wafer.
Utility model with the functions and effects
According to the utility model discloses a wafer clamping device, including having the base that lets the circular recess of wafer embedding and being used for compressing tightly the hold-down mechanism who inlays the wafer in circular recess, carry out prepositioning to the wafer through circular recess to carry out certain bearing to a side of wafer, hold-down mechanism compresses tightly the wafer through the center of the cooperation looks wafer of elastic element and briquetting in addition, places the wafer and removes in wafer device clamp device, realizes the clamping to the wafer. Because the circular groove pre-positions the wafer and the spring clamping is used for clamping, compared with the prior art that the wafer is directly clamped by a device similar to a three-jaw chuck, the wafer clamping device has the advantages that the wafer receives smaller force, and has the functions of lateral bearing and blocking, so that the wafer can be effectively prevented from being cracked in the clamping process.
Drawings
Fig. 1 is a schematic perspective view of a wafer clamping device according to a first embodiment of the present invention;
fig. 2 is a schematic perspective view of a wafer clamping device according to a first embodiment of the present invention;
fig. 3 is a first cross-sectional view of a wafer clamping device according to a first embodiment of the present invention;
fig. 4 is a second cross-sectional view of the wafer clamping device according to the first embodiment of the present invention;
fig. 5 is a schematic perspective view of a middle pressing rod and a pressing rod handle according to an embodiment of the present invention;
fig. 6 is a schematic perspective view of a wafer clamping device according to a second embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings and examples.
< example one >
Fig. 1 is a schematic perspective view of a wafer clamping device according to an embodiment of the present invention. Fig. 2 is a schematic perspective view of a wafer clamping device according to a first embodiment of the present invention.
As shown in fig. 1 and fig. 2, the present embodiment provides a wafer clamping apparatus 100 for clamping a wafer, which includes a base 10 and three pressing mechanisms 20. In this embodiment, the thickness of the wafer to be clamped is 1 mm.
The susceptor 10 has a disk shape, and has a through hole 11, a circular groove 12, three mounting portions 13, and three channel portions 14 corresponding to the mounting portions 13.
The through hole 11 is circular, penetrates the base 10, and is coaxial with the base 10. In addition, the diameter of the through hole 11 is smaller than that of the wafer to be clamped.
The circular groove 12 is arranged on one side end face of the base 10, the rest base 10 is coaxial, and the diameter of the circular groove 12 is slightly larger than that of a wafer to be clamped, so that the wafer can be embedded and can be pre-positioned. The circular groove 12 has an annular floor 121 and an annular groove wall 122.
When the wafer is inserted into the annular groove 12, the peripheral portion of one end face of the wafer is fitted to the annular bottom face 12.
The depth of the circular groove 12 matches the thickness of the wafer. In this embodiment, the depth of the circular groove 12 is 1mm, so that the wafer is completely accommodated in the annular groove 12 when being embedded in the annular groove 12.
Each mounting portion 13 is used for mounting a corresponding pressing mechanism 20, and is provided on one side end surface of the base 10 provided with the circular groove 12. The mounting portion 13 has a mounting groove 131, an abutting piece 132, and a guide rod 133.
The mounting groove 131 is a square groove extending in a radial direction of the circular groove 12. One end of the mounting groove has a certain interval with the circular mounting groove, and the other end extends to the circumferential surface of the base 10.
The abutting member 132 has a long bar shape, and is fixedly installed in the installation groove 131 by a screw at a side close to the circumferential surface of the base 10. The central position of the abutment 132 has a strut mounting hole 134 extending in the radial direction of the circular groove 12.
In this embodiment, the number of the guide rods 133 is two, and the two guide rods extend from two ends of the abutting member 132 in the length direction to one side surface of the mounting groove 131 close to the circular groove 12. The guide rod 133 is parallel to the axis of the strut mounting hole 134.
The channel portion 14 extends from the annular groove wall 122 to the mounting groove 131. The passage portion 14 is opened at one end thereof to the annular groove wall 122 and opened at the other end thereof to a side surface of the mounting groove 131 adjacent to the circular groove 12.
Fig. 3 is a first cross-sectional view of a wafer clamping device according to a first embodiment of the present invention. Fig. 4 is a second cross-sectional view of the wafer clamping device according to the first embodiment of the present invention.
As shown in fig. 3 and 4, a pressing mechanism 20 is mounted on the mounting portion 13 for pressing the wafer, and has a pressing block 21, an elastic member 22, a pressing rod 23, and a pressing rod handle 24.
The pressing block 21 is slidably installed in the installation groove 131 at a side close to the circular groove 12, and has a long bar shape with a convex column 211 and a guide rod installation hole 212.
The convex column 211 extends from the pressing block 21 along the radial direction of the circular groove 12 and is arranged in the channel part 14, when the pressing block 21 slides in the installation groove 131, the convex column 211 moves along the channel part 14, that is, the convex column 211 moves along the radial direction of the circular groove 12 to approach or depart from the wafer.
In this embodiment, the pressing block 21 includes two parts, namely a first part 213 and a second part 214, the first part 213 is completely located in the installation groove 131, the second part 214 is fixedly connected to the first part 213 through a bolt and is located on one side of the first part 213 away from the groove bottom of the installation groove 131, and the protruding column 211 is disposed on the second part 214.
The guide bar installation holes 212 are provided at both ends of the pressing block 21 in the length direction for the guide bar 133 to pass through so that the pressing block 21 can slide in the installation groove 131 in the length direction of the guide bar 133.
In this embodiment, the elastic element 22 is a pressing spring 22, one end of the pressing spring 22 is fixed on the pressing block 21, the other end of the pressing spring 22 is fixed on the abutting member, and the compression spring 221 is in a compressed state and is used for providing a pressing force towards the center of the circular groove 12 for the pressing block 21, so that the convex column 211 on the pressing block 21 protrudes out of the channel portion 14 and presses the wafer in the circular groove 12.
Fig. 1 shows a state where the boss 211 does not protrude from the channel portion 14, fig. 2 shows a state where the boss 211 protrudes from the channel portion 14, and fig. 2 shows a state where the wafer chucking apparatus 100 clamps a wafer.
Fig. 5 is a schematic perspective view of a middle pressing rod and a pressing rod handle according to an embodiment of the present invention.
As shown in fig. 5, the pressing rod 21 is installed in the installation groove 131 to extend in a radial direction of the circular groove 12. The two guide rods 133 are parallel to the pressing rod 21.
One end of the pressing rod 21 is a connecting end 231 fixedly connected with the pressing block 21, and the other end is an extending end 232 penetrating through the pressing rod mounting hole 134 on the abutting part 132.
The extension end 232 extends out of the circumferential wall of the base 10 through the plunger mounting hole 134, and the plunger handle 24 is mounted on the extension end 232 at the side of the abutment 132 away from the circular groove 12. In this embodiment, the lever handle 24 is integrally formed on the extension end 232 of the lever 23.
The compression spring 22 is sleeved on the compression rod 21.
When the wafer chuck apparatus 100 according to the first embodiment is used, the specific operation procedure is as follows.
The pressing rod handles 24 of the three pressing mechanisms 20 are pulled outwards from the base 10, so that the pressing rods 23 drive the pressing block 21 to move in the direction away from the circular groove 12, and the convex columns 211 on the pressing block 21 are retracted into the channel part 14. Then, the wafer to be detected is completely embedded into the circular groove 12, and since the thickness of the wafer is 1mm and the depth of the circular groove 12 is 1mm, after the wafer is placed into the circular groove 12, one side surface of the wafer is attached to the annular bottom surface 121 of the circular groove 12, and the other side surface of the wafer is flush with the end surface of one side of the base 10 with the circular groove 12. Finally, the three pressure lever handles 24 are loosened, the pressing block 21 moves towards the direction close to the circular groove 12 under the action of the elastic force of the pressing spring 22, so that the convex column 211 on the pressing block 21 presses the wafer from the radial direction of the wafer, and the positioning and the limiting of the wafer are realized.
Example one action and Effect
The wafer clamping device provided by the embodiment comprises a base with a circular groove for embedding a wafer and a pressing mechanism for pressing the wafer embedded in the circular groove, wherein the wafer is pre-positioned through the circular groove, one side face of the wafer is supported to a certain degree, the pressing mechanism presses the wafer through the center of the elastic element and the pressing block which are matched with each other, the wafer is placed to move in the wafer clamping device, and the wafer is clamped. Because the circular groove pre-positions the wafer and the spring clamping is used for clamping, compared with the prior art that the wafer is directly clamped by a device similar to a three-jaw chuck, the wafer clamping device has the advantages that the wafer receives smaller force, and has the functions of lateral bearing and blocking, so that the wafer can be effectively prevented from being cracked in the clamping process.
In addition, the base is provided with three pressing mechanisms which uniformly surround the circular groove, the three pressing mechanisms press the wafer from three directions, so that the force received by the wafer is relatively balanced, the quantity of the forces in different directions on the circumferential surface of the wafer is reduced, and the wafer is most stably limited and is not easy to shake during clamping in three directions.
In addition, the pressing mechanism comprises a pressing block and a convex column sliding in the channel part of the base, the convex column is pressed towards the wafer under the action of the elastic element, and when the wafer needs to be unloaded, the convex column can be retracted into the channel part and then taken out.
In addition, the base is provided with an abutting part connected to the base through a bolt, the extending end of the pressure rod penetrates through the abutting part, and the extending end is provided with an integrally formed pressure rod handle.
In addition, the abutting part is provided with a guide rod, the pressing block is sleeved on the guide rod, and because the guide rod is parallel to the pressing rod, when a user pulls the handle of the pressing rod to enable the pressing rod to move outwards of the base, the pressing block can smoothly slide along the guide rod. And because the quantity of guide bars is two, the branch puts in the both sides of depression bar, consequently can make the slip of briquetting more smooth-going.
In addition, the depth of the circular groove of the base is matched with the thickness of the wafer, so that the wafer is completely embedded into the circular groove, and after the wafer is embedded, the end face of the wafer is flush with the end face of the base, and the wafer can be further prevented from being broken in the clamping process.
< example two >
In the second embodiment, the same components as those in the second embodiment are denoted by the same reference numerals, and the description thereof is omitted.
Fig. 6 is a schematic perspective view of a wafer clamping device according to a second embodiment of the present invention.
As shown in fig. 6, the present embodiment provides a wafer clamping device 100 ', which has a susceptor 10' having the same diameter but having a through hole 11 'and a circular groove 12' having a larger diameter than the wafer clamping device 100 of the first embodiment.
In addition, the wafer clamping device 100 ' has the pressing mechanism 20 ', and the lengths of the guide rod 133 of the base 10 ', the pressing rod 23 ' of the pressing mechanism 20 ' and the pressing spring 22 ' are smaller than the corresponding structure in the corresponding wafer device 100, so that the wafer clamping device 100 ' of the second embodiment can be used for clamping a wafer with a larger diameter.
The above embodiments are merely illustrative of specific embodiments of the present invention, and the present invention is not limited to the description of the above embodiments.
In this embodiment, the pressing mechanism has only one pressing spring, and the pressing spring is sleeved on the pressing rod. For the wafer clamping device with the longer guide rod, the two pressing springs are arranged, so that the pressing block can move smoothly.
Claims (10)
1. A wafer clamping device for clamping a wafer, comprising:
a base, wherein a circular groove for embedding the wafer is formed on one side end face of the base;
a plurality of clamping mechanisms mounted on the base for clamping the wafer,
wherein each pressing mechanism is provided with a pressing block surrounding the circular groove and an elastic element matched with the pressing block,
the pressing block presses the wafer towards the direction close to the center of the circular groove under the action of the elastic element.
2. The wafer clamping device of claim 1, wherein:
wherein the base is provided with three mounting parts which uniformly surround the circular groove,
the number of the pressing mechanisms is three, and the pressing mechanisms are respectively installed in the corresponding installation parts.
3. The wafer clamping device of claim 2, wherein:
wherein the circular groove has an annular groove wall on which three passage portions communicating with the respective mounting portions are provided, the passage portions extending in a radial direction of the circular groove,
the pressing block is provided with a convex column protruding towards the circular groove, and the convex column can move along the radial direction of the circular groove in the corresponding channel part.
4. The wafer clamping device of claim 3, wherein:
wherein the pressing mechanism is also provided with a pressing rod,
the compression bar extends along the radial direction of the circular groove, and is provided with one end fixedly connected with the pressing block as a combination end and one end penetrating through the mounting part and extending out of the base as an extension end,
the elastic element is a compression spring, one end of the compression spring is fixed on the pressing block, and the other end of the compression spring is fixed on the mounting portion.
5. The wafer clamping device of claim 4, wherein:
wherein the pressing mechanism is also provided with a pressing rod handle,
the compression bar handle is integrally formed at the extending end of the compression bar,
the compression spring is sleeved on the compression rod.
6. The wafer clamping device of claim 4, wherein:
wherein at least one guide rod parallel to the pressure rod in the mounting part is fixedly mounted on the mounting part,
the compression spring is sleeved on the guide rod,
the pressing block is also provided with at least one guide rod mounting hole for the guide rod to pass through, so that when the pressing rod moves, the pressing block moves along the length direction of the guide rod.
7. The wafer clamping device of claim 6, wherein:
the number of the guide rods is two, and the guide rods are symmetrically distributed on two sides of the corresponding pressure rod respectively.
8. The wafer clamping device of claim 4, wherein:
wherein the mounting part is also provided with an abutting part which is arranged at one end of the mounting part far away from the circular groove and is provided with a pressure lever mounting hole for the pressure lever to pass through,
the other end of the spring is fixed to the abutting member.
9. The wafer clamping device of claim 1, wherein:
wherein the base is circular, the center of the base is provided with a through hole,
the circular groove is arranged in the center of the base and is overlapped with the circle center of the through hole.
10. The wafer clamping device of claim 1, wherein:
and the depth of the circular groove is matched with the thickness of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121048769.2U CN214818007U (en) | 2021-05-17 | 2021-05-17 | Wafer clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121048769.2U CN214818007U (en) | 2021-05-17 | 2021-05-17 | Wafer clamping device |
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| Publication Number | Publication Date |
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| CN214818007U true CN214818007U (en) | 2021-11-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202121048769.2U Active CN214818007U (en) | 2021-05-17 | 2021-05-17 | Wafer clamping device |
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| CN (1) | CN214818007U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI819854B (en) * | 2022-06-10 | 2023-10-21 | 大陸商西安奕斯偉材料科技股份有限公司 | Silicon chip positioning method and device |
-
2021
- 2021-05-17 CN CN202121048769.2U patent/CN214818007U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI819854B (en) * | 2022-06-10 | 2023-10-21 | 大陸商西安奕斯偉材料科技股份有限公司 | Silicon chip positioning method and device |
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