CN218812092U - Cooling device for micro laser metal deposition - Google Patents

Cooling device for micro laser metal deposition Download PDF

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CN218812092U
CN218812092U CN202222986158.3U CN202222986158U CN218812092U CN 218812092 U CN218812092 U CN 218812092U CN 202222986158 U CN202222986158 U CN 202222986158U CN 218812092 U CN218812092 U CN 218812092U
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cooling
metal deposition
laser
base
laser metal
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陈博文
马青军
黄薪钢
黄雅馨
王泽军
韦晨
党丽华
魏玉顺
韩美
杨春梅
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Tianjin Institute Of Special Equipment Supervision And Inspection Technology (tianjin Special Equipment Accident Emergency Investigation And Treatment Center)
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Tianjin Institute Of Special Equipment Supervision And Inspection Technology (tianjin Special Equipment Accident Emergency Investigation And Treatment Center)
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

The utility model discloses a cooling device that miniature laser metal deposition used, which comprises a base, a pair of guide rail of setting on the base, be provided with the slide rail that is used for cooling to use fixture on the guide rail, the base surface is spread a set of cooling tube that is used for directly placing by the deposit work piece that is used for, the cooling is used for that the fixture is fixed by the deposit work piece in being used for laser metal deposition process, be equipped with the circulative cooling pipe in the cooling is used fixture, circulative cooling pipe input end has flow control valve, inside cooling fixture, the laminating is by the surface mounting temperature sensor of deposit component, fixed a pair of remote temperature measurement arm on the laser instrument arm that is equipped with the laser head, the tip of remote temperature measurement arm is equipped with one through the universal joint and is to the rotatory remote thermoscope of remote temperature measurement arm along. The temperature difference of the matrix before and after laser energy input is stable and the working condition is consistent, so that the uniformity, dilution rate and metallurgical bonding property of the deposition layer are further optimized.

Description

Cooling device for micro laser metal deposition
Technical Field
The utility model relates to a laser metal material processing field, especially a miniature laser is cooling device for metal deposition.
Background
Laser metal deposition is used as a green manufacturing and surface modification technology, is also called as a laser cladding technology, and is widely applied to the industries of aerospace, electric power, petroleum, coal mines and the like. The method mainly has the function of preparing corresponding protective coatings for the key parts of the equipment so as to ensure that the key parts of the equipment still have good mechanical properties in high-temperature and high-pressure corrosive environments. Recent reports have shown that the market for laser metal deposition has an estimated growth rate of 9.6% between 2023 and 2026, reaching $ 8.23 billion by 2026. The region with the fastest growth of the global laser metal deposition market is the Asia-Pacific region where China is located, so that extensive research is carried out on optimizing the laser metal deposition process and increasing the application range of laser metal deposition.
Currently, the laser types include CO 2 Laser, nd-YAG lasers, fiber lasers, etc. The fiber laser is widely applied due to large power and high efficiency. The high-power laser has the advantages that workpieces of different materials and different shapes can be deposited in a large area, and the metallurgical bonding performance of the coating and the substrate can be improved. However, in order to ensure that the prepared coating can play its original role, the dilution rate of the coating needs to be reduced in the laser cladding process, and in the process, coupling of different laser process parameters including but not limited to laser scanning speed, powder feeding amount, overlapping rate and the like is designed, so that the application of a high-power laser is limited. The reason for this is that laser metal deposition is a heat/energy conduction process, i.e. laser energy is transmitted to the powder and the substrate by irradiation, the powder and the substrate are simultaneously melted to form a metallurgical bonding layer, and the cooling solidification is mainly based on air cooling and self-excitation cooling of the substrate. Along with the over-high laser energy, the self-excited cooling of the substrate is slowed down, which can cause the leading edge working condition of the laser metal deposition substrate to be inconsistent with the original substrate working condition, and the deposition layer effect is seriously influenced. Especially for micro-components, the heat dissipation capability of the micro-components is worse, resulting in larger influence. Therefore, if the cooling speed of the cladding layer and the substrate can be controlled, the laser cladding process parameters can be further optimized, and the laser cladding working efficiency is improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a miniature laser is cooling device for metal deposition is provided, control laser metal deposition in-process temperature.
In order to solve the technical problem, the utility model discloses a technical scheme be: a cooling device for micro laser metal deposition comprises a base, a pair of guide rails arranged on the base, a pair of slide rails used for fixing a pair of clamps for cooling is arranged on the guide rails, a group of cooling pipes used for directly placing a deposited workpiece are paved on the surface of the base, the positions of the cooling pipes cannot limit the movement of the clamps for cooling on the base, the clamps for cooling are used for fixing the deposited workpiece in the laser metal deposition process, a circulating cooling pipe is arranged in each clamp for cooling, a flow control valve is arranged at the input end of the circulating cooling pipe, a temperature sensor is arranged in each clamp for cooling and attached to the surface of the deposited workpiece, a pair of remote temperature measuring arms are fixed on a laser mechanical arm provided with a laser head, and a remote temperature measuring instrument capable of rotating along the remote temperature measuring mechanical arms is arranged at the end part of each remote temperature measuring mechanical arm through a universal joint.
The cooling pipe is of a serpentine structure.
The guide rail is embedded in the surface of the base.
The beneficial effects of the utility model are that: the problem of in the laser metal deposition process, because of instantaneous laser energy is too strong, lead to laser metal deposition base member operating mode earlier stage and later stage gap great is solved. Two sets of temperature measuring devices (temperature sensor in the cooling fixture and remote temperature measuring device) can detect the temperature changes of the coating and the substrate on the two sides of the substrate component and before and after the laser metal deposition facula. The two sets of cooling devices (cooling clamps and base cooling pipes) are used for adjusting the flow of a cooling medium according to the temperature change of different positions, ensuring the relative stability of the temperature of the base body before and after laser energy is input, ensuring the consistency of the working condition of the base body in the early stage and the working condition of the base body in the later stage of laser metal deposition, and aiming at ensuring the uniformity, dilution rate and metallurgical bonding property of the deposition layer to meet the requirements.
Drawings
FIG. 1 is a schematic structural view of a cooling device for micro laser metal deposition according to the present invention;
fig. 2 is a schematic view of a top view of the cooling device for micro laser metal deposition according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art without making any creative effort fall within the protection scope of the present invention.
The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention; obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like, are to be interpreted broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
As shown in fig. 1 and 2, the utility model discloses a cooling device that miniature laser metal deposition used, which comprises a base 7, a pair of guide rail 13 of setting on base 7, be provided with a pair of slide rail 12 that is used for fixed a pair of fixture 1 for cooling on guide rail 13, base 7 surface is spread a set of cooling tube 9 that is used for directly placing by depositional work piece 8, and the removal of cooling tube 9 position can not restrict fixture 1 for cooling on base 7, fixture 1 for cooling is used for fixing by depositional work piece 8 in the laser metal deposition process, be equipped with circulative cooling pipe 5 in the fixture 1 for cooling, circulative cooling pipe 5 input has flow control valve 6, inside the cooling fixture, the surface assembly temperature sensor 10 of laminating by depositional component, a pair of remote temperature measurement arm 2 is fixed on the laser instrument arm 3 that is equipped with laser head 4, the tip of remote temperature measurement arm 2 is equipped with a pair of remote temperature measurement appearance 11 that can follow remote temperature measurement arm 2 and rotate through the universal joint.
Preferably, the cooling pipe 9 has a serpentine structure. The guide rails 13 are embedded in the surface of the base 7.
The utility model discloses mainly be in order to control laser metal deposition in-process temperature. The cooling fixture can fix the position of a workpiece to be deposited in the laser metal deposition process, and is input through circulating cooling liquid, so that the base body and the cladding layer in the laser metal deposition process are cooled at controlled temperature. The input end of the circulating cooling pipe is provided with a flow control valve, and the cooling rate of the cooling clamp can be controlled by adjusting the flow of the cooling liquid. A temperature sensor is assembled in the cooling clamp and attached to the surface of the deposited component, so that the temperature at two ends of the component can be detected in real time.
The cooling pipe is positioned at the bottom of the laser metal deposition component and is used for increasing the heat conduction of the component in the laser metal deposition process, so that the temperature uniformity of the base component before and after the laser metal deposition is ensured. The combination of a remote temperature measuring instrument and a remote temperature measuring mechanical arm is adopted, the temperature difference between the coating and the substrate before and after laser spot scanning is detected in real time and fed back to the cooling fixture and the bottom layer cooling device, and the temperature consistency in the laser metal deposition process is further ensured.
Specifically, the base member is first set on the surface of the cooling pipe 9 by pre-deposition, and is fixed by the cooling jig 1. And (3) placing a laser mechanical arm 3 carrying a laser head 4 at a position of 400mm on the surface of the pre-deposition substrate, adjusting laser process parameters and preparing for metal deposition operation.
Before metal deposition, cooling liquid is circulated through the circulating cooling pipe 5, a circulating system of the cooling pipe 9 is opened, and whether the temperature sensor 10 and the remote temperature measuring instrument 11 can normally operate or not is tested.
After laser metal deposition is formally started, the temperatures of different positions of the base member are detected in real time through the temperature sensor 10, the remote temperature measuring instrument 11 and the controller, and feedback is carried out through the flow control valve 6.
Example 1
Adopt the utility model discloses a device carries out laser metal deposition, at 304 stainless steel surface preparation Ni625 sedimentary deposit, and first group is experimental for not utilizing cooling device's deposit later stage heat affected zone, and the second group is experimental for having added cooling device's deposit later stage heat affected zone. The results are shown in Table 1.
TABLE 1 comparison of heat affected zones at the later stages of laser metal deposition using a cooling device
Figure BDA0003922673550000041
Example 2
Adopt the utility model discloses a device carries out laser metal deposition, prepares Cu base alloy at 17-4PH stainless steel surface, and the first group of experiment is the deposit later stage heat affected zone of not using cooling device, and the second group of experiment is the deposit later stage heat affected zone that has added cooling device. The results are shown in Table 2.
TABLE 2 comparison of heat affected zones in the later stages of laser metal deposition using a cooling device
Figure BDA0003922673550000042
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Figure BDA0003922673550000051
According to the above embodiment, the utility model discloses in the laser metal deposition process effectively having solved, because of the too high deposit early stage that leads to of laser energy, later stage because of the too big dilution rate of temperature difference is too big and have crackle scheduling problem.
The utility model discloses a temperature sensor and long-range thermoscope monitoring laser metal deposit front and back base member and the temperature variation of coating. When the temperature change before and after the laser metal deposition component is overlarge, the temperature difference result is fed back to the controller. The controller adjusts the temperature by adjusting the flow rates of the cooling fluids of the different cooling devices. When the temperature of the laser metal deposition substrate rises, the flow of the cooling clamp cooling liquid at the side where the laser metal deposition substrate is not deposited and the flow of the cooling pipe cooling liquid are increased, and the temperature of the laser front substrate is rapidly reduced. It is worth noting that the temperature control rates of the cooling fixture and the cooling tube are different according to the shape of the substrate, the temperature of the cooling fixture on two sides of the thicker substrate is mainly reduced, and the temperature of the cooling tube of the base is mainly reduced for the wider substrate. Therefore, the device is suitable for different types and different shapes of substrates, and can accurately control the temperature change of the laser metal deposition layer and the substrate through multi-point temperature measurement. The quality and speed of laser metal deposition are improved.
It is worth pointing out that the protection scope of the present invention is not limited to the above specific example, and according to the basic technical concept of the present invention, the same basic structure can be used, so as to achieve the purpose of the present invention, as long as the ordinary skilled person in the art does not need to work creatively, the conceivable embodiments all belong to the protection scope of the present invention.

Claims (3)

1. A cooling device for micro laser metal deposition is characterized by comprising a base (7) and a pair of guide rails (13) arranged on the base (7), wherein a pair of slide rails (12) used for fixing a pair of cooling clamps (1) are arranged on the guide rails (13), a group of cooling pipes (9) used for directly placing a deposited workpiece (8) are paved on the surface of the base (7), the positions of the cooling pipes (9) cannot limit the movement of the cooling clamps (1) on the base (7), the cooling clamps (1) are used for fixing the deposited workpiece (8) in the laser metal deposition process, a circulating cooling pipe (5) is arranged in each cooling clamp (1), a flow control valve (6) is arranged at the input end of each circulating cooling pipe (5), a temperature sensor (10) is arranged in each cooling clamp and attached to the surface of the deposited workpiece, a pair of remote temperature measuring mechanical arms (2) are fixed on a laser mechanical arm (3) provided with a laser head (4), and a remote temperature measuring instrument (11) capable of rotating along the remote temperature measuring mechanical arms (2) is arranged at the end parts of the remote temperature measuring mechanical arms (2) through universal joints.
2. The cooling device for micro laser metal deposition according to claim 1, wherein the cooling tube (9) has a serpentine structure.
3. The cooling device for micro laser metal deposition according to claim 1, wherein the guide rail (13) is embedded in the surface of the base (7).
CN202222986158.3U 2022-11-02 2022-11-02 Cooling device for micro laser metal deposition Active CN218812092U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222986158.3U CN218812092U (en) 2022-11-02 2022-11-02 Cooling device for micro laser metal deposition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222986158.3U CN218812092U (en) 2022-11-02 2022-11-02 Cooling device for micro laser metal deposition

Publications (1)

Publication Number Publication Date
CN218812092U true CN218812092U (en) 2023-04-07

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Country Status (1)

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CN (1) CN218812092U (en)

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