CN218772819U - Vehicle rail DC-DC power module - Google Patents
Vehicle rail DC-DC power module Download PDFInfo
- Publication number
- CN218772819U CN218772819U CN202222689194.3U CN202222689194U CN218772819U CN 218772819 U CN218772819 U CN 218772819U CN 202222689194 U CN202222689194 U CN 202222689194U CN 218772819 U CN218772819 U CN 218772819U
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- Prior art keywords
- power module
- liquid storage
- air
- module body
- gas
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- 238000001816 cooling Methods 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000005057 refrigeration Methods 0.000 claims abstract description 10
- 239000000110 cooling liquid Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 abstract description 21
- 239000002826 coolant Substances 0.000 abstract description 19
- 239000007788 liquid Substances 0.000 abstract description 16
- 238000005457 optimization Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a rail DC-DC power module, including the power module body, the both sides of power module body are all inlayed and are had coolant liquid storage box, and the inside horizontal intercommunication of coolant liquid storage box has the gas-cooled tube, and the inside of coolant liquid storage box is provided with the gas collecting box, and the gas-cooled tube is close to the one end of gas collecting box and the surface intercommunication of gas collecting box, the inboard fixedly connected with semiconductor refrigeration piece of coolant liquid storage box. The utility model discloses a set up the power module body, coolant liquid storage box, the air-cooled pipe, the gas collection box, the semiconductor refrigeration piece, the gas outlet, the cooperation of fan and heat-conducting plate is used, it generally adopts nature forced air cooling and single fan to carry out the forced air cooling heat dissipation when the heat dissipation to have solved current power module, such radiating mode still remains to be improved, when outside temperature is higher, just can not carry out effectual heat dissipation to power module after the external hot-blast entering, be unfavorable for power module to keep the balanced problem of inside temperature after dispelling the heat fast.
Description
Technical Field
The utility model relates to an electron device technical field specifically is a rail DC-DC power module.
Background
The power supply module is a power supply device which can be directly attached to a printed circuit board and is characterized by supplying power to an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array and other digital or analog loads.
However, the existing power module generally adopts natural air cooling and a single fan to perform air cooling heat dissipation during heat dissipation, such a heat dissipation mode still needs to be improved, when the outside air temperature is higher, the outside hot air cannot be effectively dissipated after entering the power module, and the heat dissipation is not favorable for keeping the internal air temperature balance after the power module rapidly dissipates heat.
Therefore, the power module needs to be designed and modified, so that the phenomenon that the heat dissipation cannot be effectively carried out when the outside air temperature is higher is effectively prevented.
SUMMERY OF THE UTILITY MODEL
For solving the problem that provides among the above-mentioned background art, the utility model aims to provide a rail DC-DC power module has possessed quick radiating advantage, has solved current power module and has generally adopted natural forced air cooling and single fan to carry out the forced air cooling heat dissipation when the heat dissipation, and such radiating mode still remains to improve, and when outside temperature is higher, just can not carry out effectual heat dissipation to power module after the external hot-blast entering, is unfavorable for power module to keep the balanced problem of inside temperature after dispelling the heat fast.
In order to achieve the above object, the utility model provides a following technical scheme: a rail DC-DC power module comprises a power module body;
the cooling device comprises a power module body and is characterized in that cooling liquid storage boxes are inlaid in two sides of the power module body, an air cooling pipe is transversely communicated in the cooling liquid storage boxes, a gas collecting box is arranged in the cooling liquid storage boxes, one end, close to the gas collecting box, of the air cooling pipe is communicated with the surface of the gas collecting box, a semiconductor refrigerating sheet is fixedly connected to the inner side of the cooling liquid storage box, a gas outlet matched with the semiconductor refrigerating sheet is formed in the surface of the gas collecting box, two fans are inlaid in the front of the power module body, and heat conducting plates are inlaid in two sides of the front of the power module body.
As the utility model discloses preferred, the quantity of air-cooled pipe is a plurality of, and a plurality of air-cooled pipe is the inside of the horizontal intercommunication of rectangle at coolant liquid storage box.
As the utility model discloses it is preferred, the shape of gas outlet is the rectangle, the gas outlet is located the inboard of semiconductor refrigeration piece.
As the utility model discloses preferred, the quantity of coolant liquid storage box and gas collection box is four, and four coolant liquid storage boxes and gas collection box evenly distributed are in the both sides of power module body.
As the utility model discloses preferred, the inside fixedly connected with of air-cooled pipe hinders the thing net, the quantity of gas outlet is a plurality of.
As the utility model discloses preferred, the positive fixedly connected with guard net of fan, two fans are the front of distributing at the power module body one on the other.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up the power module body, the coolant liquid storage box, the air-cooled pipe, the gas collection box, the semiconductor refrigeration piece, the gas outlet, the cooperation of fan and heat-conducting plate is used, current power module has been solved and has generally adopted natural forced air cooling and single fan to carry out the forced air cooling heat dissipation when the heat dissipation, such radiating mode still remains to be improved, when outside temperature is higher, just can not carry out effectual heat dissipation to power module after external hot-blast entering, be unfavorable for power module to keep the balanced problem of inside temperature after dispelling the heat fast, quick radiating advantage has been possessed, power module's radiating effect has been improved.
2. The utility model discloses a set up the quantity of air-cooled pipe into a plurality of, can make the outside air get into the inside of gas collection box fast through a plurality of air-cooled pipe, improved the inside speed of outside air admission power module body.
Drawings
FIG. 1 is a schematic front view of the structure of the present invention;
FIG. 2 is an enlarged schematic view of the point A in the structure diagram 1 of the present invention;
fig. 3 is a schematic perspective sectional view of the structural air-cooling pipe of the present invention.
In the figure: 1. a power module body; 2. a coolant storage tank; 3. an air-cooled pipe; 4. a gas collection box; 5. a semiconductor refrigeration sheet; 6. an air outlet; 7. a fan; 8. a heat conducting plate; 9. an object blocking net; 10. and (4) a protection net.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 3, the present invention provides a rail DC-DC power module, which includes a power module body 1;
Referring to fig. 2, the number of the air-cooling pipes 3 is several, and the several air-cooling pipes 3 are in rectangular transverse communication with the inside of the cooling fluid storage box 2.
As a technical optimization scheme of the utility model, set up to a plurality of through the quantity with air-cooled pipe 3, can make the outside air get into the inside of gas collecting box 4 through a plurality of air-cooled pipe 3 fast, improved the inside speed that the outside air got into power module body 1.
Referring to fig. 2, the shape of the air outlet 6 is rectangular, and the air outlet 6 is located inside the semiconductor chilling plate 5.
As the utility model discloses a technical optimization scheme sets up to the rectangle through the shape with gas outlet 6, can make a plurality of gas outlets 6 evenly set up the back, evenly makes the air circulate on the surface of semiconductor refrigeration piece 5.
Referring to fig. 2, the number of the coolant storage case 2 and the air collecting case 4 is four, and the four coolant storage cases 2 and the air collecting case 4 are uniformly distributed at both sides of the power module body 1.
As a technical optimization scheme of the utility model, all set up to four through the quantity with coolant liquid storage box 2 and air collecting box 4, can make four coolant liquid storage boxes 2 and air collecting box 4 dispel the heat with the inside of the leading-in power module body of outside air 1 fast.
Referring to fig. 2, an obstruction net 9 is fixedly connected to the inside of the air-cooling pipe 3, and the number of the air outlets 6 is several.
As a technical optimization scheme of the utility model, block thing net 9 through the setting, can filter the inside air that gets into air-cooled pipe 3, make the impurity in the air effectively blocked, improved the cleanliness factor that gets into 1 inside air of power module body.
Referring to fig. 1, a protection net 10 is fixedly connected to the front surface of the fan 7, and the two fans 7 are distributed on the front surface of the power module body 1.
As the utility model discloses a technical optimization scheme through setting up protection network 10, can protect fan 7, prevents that the user from touching fan 7 damage by mistake, has improved fan 7's security.
The utility model discloses a theory of operation and use flow: when the cooling type power module is used, when a user needs to quickly reduce the internal temperature of the power module body 1, the fan 7 and the semiconductor refrigerating sheet 5 are sequentially started, after the fan 7 is started, external air circulates inside the cooling liquid storage box 2 through the plurality of air-cooling pipes 3, the air circulating inside the cooling liquid storage box 2 can exchange heat with cooling liquid inside the cooling liquid storage box 2 under the conduction of the air-cooling pipes 3, so that the temperature of the air circulating inside the air-cooling pipes 3 is reduced, the air entering the air collecting box 4 from the air-cooling pipes 3 flows on the surface of the semiconductor refrigerating sheet 5 through the air outlets 6 after the air is extracted from the inside of the power module body 1 by the fan 7, the internal temperature of the power module body 1 is quickly reduced, the speed of the air circulating inside the power module body 1 can be further accelerated by the two fans 7, the internal temperature of the power module body 1 is further reduced, then the temperature of the cooled air can be quickly reduced inside the power module body 1 under the extraction of the fan 7, the heat of the power module body can be further absorbed by the power module, and the heat dissipation effect of the heat dissipation module can be further accelerated by the heat dissipation module, and the heat dissipation plate can be further achieved.
In summary, the following steps: this rail DC-DC power module, through setting up power module body 1, coolant liquid storage box 2, the air-cooled pipe 3, gas collection box 4, semiconductor refrigeration piece 5, gas outlet 6, fan 7 and heat-conducting plate 8's cooperation is used, it carries out the forced air cooling heat dissipation with single fan to have solved current power module and generally adopted natural forced air cooling and carry out when the heat dissipation, such radiating mode still remains to be improved, when outside temperature is higher, just can not carry out effectual heat dissipation to power module after the hot-blast entering in the external world, be unfavorable for keeping the balanced problem of inside temperature after the power module dispels the heat fast.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A rail DC-DC power module comprises a power module body (1);
the method is characterized in that: the improved refrigerating power supply module is characterized in that cooling liquid storage boxes (2) are inlaid in two sides of a power supply module body (1), air-cooling pipes (3) are transversely communicated in the cooling liquid storage boxes (2), gas collecting boxes (4) are arranged in the cooling liquid storage boxes (2), one ends, close to the gas collecting boxes (4), of the air-cooling pipes (3) are communicated with the surfaces of the gas collecting boxes (4), semiconductor refrigerating sheets (5) are fixedly connected to the inner sides of the cooling liquid storage boxes (2), gas outlets (6) matched with the semiconductor refrigerating sheets (5) for use are formed in the surfaces of the gas collecting boxes (4), fans (7) are inlaid in the front of the power supply module body (1), the number of the fans (7) is two, and heat conducting plates (8) are inlaid in two sides of the front of the power supply module body (1).
2. The rail DC-DC power module of claim 1, wherein: the number of the air cooling pipes (3) is a plurality, and the air cooling pipes (3) are transversely communicated in the cooling liquid storage box (2) in a rectangular shape.
3. The rail DC-DC power supply module of claim 1, wherein: the air outlet (6) is rectangular, and the air outlet (6) is located on the inner side of the semiconductor refrigeration piece (5).
4. The rail DC-DC power module of claim 1, wherein: the number of the cooling liquid storage boxes (2) and the gas collecting boxes (4) is four, and the four cooling liquid storage boxes (2) and the four gas collecting boxes (4) are uniformly distributed on two sides of the power module body (1).
5. The rail DC-DC power module of claim 1, wherein: the interior of the air cooling pipe (3) is fixedly connected with an obstruction net (9), and the number of the air outlets (6) is several.
6. The rail DC-DC power supply module of claim 1, wherein: the front face of each fan (7) is fixedly connected with a protection net (10), and the two fans (7) are distributed on the front face of the power module body (1) in an up-and-down mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222689194.3U CN218772819U (en) | 2022-10-13 | 2022-10-13 | Vehicle rail DC-DC power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222689194.3U CN218772819U (en) | 2022-10-13 | 2022-10-13 | Vehicle rail DC-DC power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218772819U true CN218772819U (en) | 2023-03-28 |
Family
ID=85698498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222689194.3U Active CN218772819U (en) | 2022-10-13 | 2022-10-13 | Vehicle rail DC-DC power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218772819U (en) |
-
2022
- 2022-10-13 CN CN202222689194.3U patent/CN218772819U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240510 Address after: Room 302, Building 4, No. 63 Punan Road, Huangpu District, Guangzhou City, Guangdong Province, 510000 Patentee after: GUANGZHOU AIPU ELECTRON TECHNOLOGY Co.,Ltd. Country or region after: China Address before: 510000 Room 301, building 4, No. 63, Punan Road, Huangpu District, Guangzhou, Guangdong Patentee before: Guangzhou InBo Electronic Technology Co.,Ltd. Country or region before: China |