CN218769109U - Capacitor with improved structure - Google Patents

Abstract

The present invention relates to the field of capacitor technology, and more particularly to a capacitor, which includes a dielectric body, a plurality of inner electrodes and an outer electrode, wherein the dielectric body has a plurality of dielectric layers stacked therein along a first direction; the plurality of internal electrodes are arranged in the dielectric main body and are separated by the dielectric layer, and each internal electrode comprises a first conducting strip and a second conducting strip; the first conducting strip is provided with a first end and a second end which are opposite along the second direction, the second conducting strip is connected to one side of the first end along the direction parallel to the third direction, and one side of the second conducting strip, which is far away from the first end, is exposed through the surface of the dielectric main body; the outer electrode is arranged at the end part of the dielectric main body along the second direction and is connected with the second conducting strip. The utility model discloses the condenser, the both ends face interval of inner electrode and dielectric main body reduces the influence to the joint strength of outer electrode and dielectric main body, strengthens the connection reliability of outer electrode to can increase the overlapping area of two adjacent inner electrodes, with the capacity that increases the condenser.

Description

Capacitor with improved structure

Technical Field

The utility model relates to a condenser technical field especially relates to a condenser.

Background

The multilayer ceramic capacitor (MLCC for short) is one of the most used components in various electronic devices and devices, is mainly used in the aspects of blocking, coupling, bypassing, filtering, tuning loops, energy conversion and control circuits and the like, is the most basic electric energy storage component, and is widely applied to various fields such as aerospace, military weapons and equipment, various consumer electronics products, communication and the like.

The multilayer ceramic capacitor comprises inner electrodes, dielectric layers and outer electrodes, wherein the inner electrodes and the dielectric layers are arranged in a laminated mode, the outer electrodes are connected with the inner electrodes, the inner electrodes and the dielectric layers are formed by laminating and sintering to form chips, the inner electrodes are sequentially and alternately exposed out of two ends of each chip along the laminating direction, and the outer electrodes are arranged at two ends of each chip in a sticking mode and connected with the exposed inner electrodes. Because two adjacent internal electrodes are staggered along the length direction of the chip, and the step formed by staggering the two internal electrodes is extruded and filled through the dielectric layer, when the staggering amplitude of the two internal electrodes is smaller, the formed step is smaller, the part of the dielectric layer filled in the step is easy to fall off, or the filling is difficult to complete through the extrusion of the dielectric layer. The connection acting force between the outer electrode and the chip comes from the adhesive force between the outer electrode and the dielectric layer and has a direct connection relation with the dielectric layer part in the ladder, so that the staggered amplitude of the two adjacent inner electrodes is not too small, namely the overlapping degree is not too large, and the connection strength between the outer electrode and the battery cell is ensured. However, the overlapping area of the two adjacent inner electrodes is reduced due to overlarge staggered amplitude of the two adjacent inner electrodes, and the capacity of the capacitor is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model provides a capacitor can improve the problem that the internal electrode destroys the joint strength between outer electrode and the dielectric layer.

In order to solve the above technical problem, the utility model discloses a technical scheme that embodiment adopted is: providing a capacitor including a dielectric body having a plurality of dielectric layers laminated therein along a first direction, a plurality of inner electrodes, and an outer electrode; the plurality of internal electrodes are arranged in the dielectric main body and are spaced by the dielectric layer, and each internal electrode comprises a first conducting strip and a second conducting strip; the first conducting strip is provided with a first end and a second end which are opposite to each other along the second direction, the second conducting strip is connected to one side of the first end along the direction parallel to the third direction, and one side, away from the first end, of the second conducting strip is exposed through the surface of the dielectric body; the outer electrode is arranged at the end part of the dielectric main body along the second direction and is connected with the second conducting strip; the first direction, the second direction and the third direction are perpendicular to each other.

In some embodiments, the first conductive sheets of the plurality of internal electrodes overlap each other along the first direction.

In some embodiments, the first conductive sheet is located within the dielectric layer as viewed in the first direction.

In some embodiments, the width of the dielectric layer protruding from the internal electrode in a direction parallel to the second direction is smaller than the width of the dielectric layer protruding from the internal electrode in a direction parallel to the third direction.

In some embodiments, the step structure formed by the inner electrode and the adjacent dielectric layer is filled with a filler.

In some embodiments, the inner electrode includes two second conductive sheets connected to two sides of the first conductive sheet along a third direction.

In some embodiments, the second conductive sheet is flush with the first conductive sheet along the second direction.

In some embodiments, the second conductive sheet has a width of 0.01% to 10.00% of a chip width in the second direction.

In some embodiments, the second conductive sheet extends from the first conductive sheet.

In some embodiments, the capacitor includes two external electrodes disposed at two ends of the dielectric body, respectively; the inner electrode is connected to the outer electrode adjacent the first end thereof.

Different from the situation of the related art, the capacitor of the embodiment of the present invention, by providing the second conductive sheet, the second conductive sheet is exposed from the dielectric body along the third direction, so that the inner electrode is spaced from the two end faces of the dielectric body, and the outer electrode is disposed at the end of the dielectric body, so that the connection strength between the outer electrode and the dielectric body is not easily affected by the inner electrode, and the connection reliability between the outer electrode and the dielectric body is enhanced; because the influence of the inner electrode on the connection strength of the outer electrode is small, the overlapping degree of the inner electrodes can be increased so as to increase the overlapping area of two adjacent inner electrodes and increase the capacity of the capacitor.

Drawings

Fig. 1 is a schematic structural diagram of a capacitor according to an embodiment of the present invention;

fig. 2 is a half sectional view of a capacitor according to an embodiment of the present invention;

fig. 3 is a cross-sectional view of a capacitor according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of the structure of FIG. 2 in which adjacent dielectric layers are mated with inner electrodes;

fig. 5 is a schematic structural view of the dielectric body and the inner electrode according to an embodiment of the present invention.

The reference numerals in the detailed description are as follows:

100. a capacitor;

1. a dielectric body; 11. a dielectric layer; 111. a filler; 12. a cover layer;

2. an inner electrode; 21. a first conductive sheet; 211. a first end; 212. a second end; 22. a second conductive sheet;

3. an outer electrode.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by directional terms such as "front, back, upper, lower, left, right", "horizontal, vertical, horizontal" and "top, bottom", etc. are usually based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these directional terms do not indicate and imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore, should not be construed as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

In the description of the present invention, it should be noted that the terms "first", "second", etc. are used to define the components, and are only used for the convenience of distinguishing the corresponding components, and if not stated otherwise, the terms do not have special meanings, and therefore, should not be construed as limiting the scope of the present invention. In the description of the embodiments of the present application, "a plurality" means two or more unless specifically defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the present application described below may be combined with each other as long as they do not conflict with each other.

In order to solve the above technical problem, as shown in fig. 1 and 2, an embodiment of the present invention provides a capacitor 100, the capacitor 100 includes a dielectric body 1, a plurality of inner electrodes 2 and two outer electrodes 3, the dielectric body 1 is used for providing insulation, the plurality of inner electrodes 2 are disposed in the dielectric body 1 along a first direction interval, the inner electrodes 2 are exposed through the surface of the dielectric body 1, one ends of the inner electrodes 2 exposed are connected to the outer electrodes 3, and the plurality of inner electrodes 2 are connected to the outer electrodes 3 along the first direction alternately to form a multilayer capacitor. Optionally, the dielectric body 1 is made of ceramic, and the inner electrode 2 and the outer electrode 3 are both made of conductive metal.

Next, specific structures of the dielectric body 1, the inner electrode 2, and the outer electrode 3 described above will be explained in order.

As for the dielectric body 1, as shown in fig. 1 and 2, the dielectric body 1 has a plurality of dielectric layers 11 stacked therein along a first direction, the dielectric body 1 is formed by sintering the plurality of dielectric layers 11, the dielectric layers 11 are used for spacing two adjacent internal electrodes 2, a cover layer 12 is disposed on the outermost side of the stacked internal electrodes 2 to isolate the internal electrodes 2 from the outside, the thickness of the cover layer 12 is greater than that of the dielectric layers 11 along the first direction, and the material of the cover layer 12 is the same as that of the dielectric layers. Two sides of the dielectric body 1 along the second direction are used for being connected with the external electrodes 3; both sides of the dielectric body 1 in the third direction are used to expose the inner electrode 2 so as to be connected to the outer electrode 3. Wherein the first direction, the second direction and the third direction are perpendicular to each other.

As for the above-described internal electrode 2, as shown in fig. 3 and 4, the internal electrode 2 includes a first conductive sheet 21 and a second conductive sheet 22; the first conducting strip 21 has a first end 211 and a second end 212 opposite to each other along the second direction, and the second conducting strip 22 is connected to one side of the first end 211 along the third direction; the side of the second conductive sheet 22 facing away from the first end 211 is exposed through the surface of the dielectric body 1, and the inner electrode 2 is exposed from the side of the dielectric body 1 along the third direction. Namely, the inner electrode 2 is spaced from two end faces of the dielectric body 1, and the connection strength between the outer electrode 3 and the dielectric body 1 is not easily affected by the inner electrode 2, so that the connection reliability between the outer electrode 3 and the dielectric body 1 is enhanced; moreover, since the influence of the internal electrode 2 on the connection strength of the external electrode 3 is small, the overlapping degree of the internal electrodes 2 can be increased to increase the overlapping area of two adjacent internal electrodes 2, increase the effective area for storing charges, and further increase the capacity of the capacitor 100. Optionally, the second conductive sheet 22 is formed by extending from the first conductive sheet 21, that is, the first conductive sheet 21 and the second conductive sheet 22 are integrally processed, so that the connection effect is good, the strength is high, and the electrical performance is enhanced. Optionally, an arc-shaped chamfer is arranged at the joint of the second conducting plate 22 and the first conducting plate 21. Alternatively, the second conductive sheet 22 is formed by punching the inner electrode 2, and the processing is simple. Optionally, the first conductive sheet 21 is rectangular, and the second conductive sheet 22 is rectangular or rectangular.

As shown in fig. 3, the adjacent two inner electrodes 2 are disposed in the opposite direction in the second direction, and the inner electrodes 2 are connected to the outer electrodes 3 adjacent to the first end 211 thereof, so that the inner electrodes 2 are alternately connected to the two outer electrodes 3 in the first direction.

As for the first conductive sheet 21, as shown in fig. 2 to 4, along the first direction, the first conductive sheets 21 of the plurality of inner electrodes 2 are overlapped with each other, and then the area of the first conductive sheet 21 is the area of the overlapped region of the inner electrodes 2, that is, the effective area for storing charges, so that the space in the capacitor 100 is fully utilized, and the capacity of the capacitor 100 is increased.

As shown in fig. 2 to 4, the first conductive sheet 21 is located in the dielectric layers 11 when viewed along the first direction, so that the two adjacent dielectric layers 11 can wrap the first conductive sheet 21 therebetween in the sintering process. Further, the width a of the dielectric layer 11 protruding from the inner electrode 2 in the direction parallel to the second direction is smaller than the width b of the dielectric layer 11 protruding from the inner electrode 2 in the direction parallel to the third direction, so as to further increase the area ratio of the inner electrode 2 to the dielectric layer 11 and increase the capacity of the capacitor 100 per unit volume, and since the two ends of the dielectric layer 11 in the second direction are connected to the outer electrodes 3, the two ends of the dielectric body 1 in the second direction are not easily broken. Optionally, the width a is greater than 1 micron and the width b is 10 to 300 microns. Still further, as shown in fig. 3, a step structure formed by the inner electrode 2 and the adjacent dielectric layer 11 is filled with a filler 111, and the filler 111 and the dielectric layer 11 are made of the same material, so that the problem that the dielectric layer 11 cannot wrap the inner electrode 2 because the distance from the dielectric layer 11 to the inner electrode 2 is too small can be solved, and the area ratio of the inner electrode 2 to the dielectric layer 11 can be further increased.

As for the second conductive sheet 22, as shown in fig. 5, the second conductive sheets 22 of two adjacent inner electrodes 2 are arranged at intervals along the second direction, so as to be connected to the two outer electrodes 3 respectively. Specifically, as shown in fig. 4, the widths of the first end 211 and the second end 212 in the second direction are equal, the width c of the second conductive sheet 22 in the second direction is smaller than the width d of the first end 211 in the second direction, and the second conductive sheet 22 is disposed adjacent to the end of the inner electrode 2 in the second direction, so that the second conductive sheets 22 of two adjacent inner electrodes 2 are spaced apart in the second direction. Further, as shown in fig. 4, along the second direction, the second conductive sheet 22 is flush with the first conductive sheet 21, and the second conductive sheet 22 is sufficiently close to the outer electrode 3, so as to reduce the distance that the outer electrode 3 extends towards the center of the dielectric body 1 along the direction parallel to the second direction, reduce the volume of the outer electrode 3, and increase the distance between the two outer electrodes 3.

As shown in fig. 4, if the width c of the second conductive sheet 22 along the second direction is smaller than the width e of the internal electrode 2 along the third direction, the second conductive sheet 22 can shorten the width of the exposed portion of the internal electrode 2, and reduce the frequency of delamination and cracks between the dielectric body 1 and the internal electrode 2, thereby reducing the probability of the plating solution penetrating into the dielectric body 1, further improving the problem of reduction of the insulation resistance of the capacitor 100, improving the condition of cracks caused by hydrogen or reducing gas generated by the plating solution in the dielectric body 1, and improving the reliability of high temperature resistance and humidity resistance of the capacitor 100. Optionally, along the second direction, the width c of the second conductive sheet 22 is 0.01% to 10.00% of the chip width f, so as to ensure the connection effect between the second conductive sheet 22 and the first conductive sheet 21 and the outer electrode 3. Wherein the chip comprises the plurality of dielectric layers 11 and the plurality of internal electrodes 2, the chip is a whole formed by sintering the dielectric layers 11 and the internal electrodes 2, and the width f of the chip along the second direction is equal to the width f of the dielectric layers 11 along the second direction.

As shown in fig. 4, the inner electrode 2 includes two second conductive sheets 22, the two second conductive sheets 22 are connected to two sides of the first conductive sheet 21 along a third direction, and the inner electrode 2 is connected to the outer electrode 3 through the two second conductive sheets 22, so as to enhance the connection effect. And when the delamination or cracks occur between one second conductive sheet 22 and the dielectric body 1, the delamination or cracks are not easy to spread to the periphery of the other second conductive sheet 22, and the frequency of the delamination or cracks occurring between the dielectric body 1 and the inner electrode 2 is further reduced.

As for the external electrodes 3, as shown in fig. 1 to 3, two external electrodes 3 are disposed at two end portions of the dielectric body 1 along the second direction, the two external electrodes 3 extend along the surface of the dielectric body 1 to be close to each other, that is, to be close to the middle portion of the dielectric body 1 along the second direction, so as to form a groove shape, the bottom of the groove of the external electrode 3 is connected to the end surface of the dielectric body 1 along the second direction, the sidewall of the groove is connected to the second conductive sheet 22, so as to connect the external electrode 3 to the second conductive sheet 22, and the sidewall of the groove is further connected to two sidewalls of the dielectric body 1 along the first direction and two sidewalls along the third direction, so as to further enhance the connection stability between the external electrode 3 and the dielectric body 1. Further, the side wall of the groove completely wraps the exposed part of the second conductive sheet 22, so that the sealing effect of the capacitor 100 is enhanced. Optionally, one side of the outer electrode 3 facing away from the dielectric body 1 is a curved surface.

The capacitor 100 of the embodiment of the present invention, by providing the second conductive sheet 22, the second conductive sheet 22 is exposed from the dielectric body 1 along the third direction, so that the inner electrode 2 is spaced from the two end faces of the dielectric body 1, and the outer electrode 3 is disposed at the end of the dielectric body 1, so that the connection strength between the outer electrode 3 and the dielectric body 1 is not easily affected by the inner electrode 2, and the connection reliability between the outer electrode 3 and the dielectric body 1 is enhanced; since the influence of the internal electrodes 2 on the connection strength of the external electrodes 3 is small, the overlapping degree of the internal electrodes 2 can be increased to increase the overlapping area of two adjacent internal electrodes 2 and increase the capacity of the capacitor 100; the step structure formed by the internal electrode 2 and the adjacent dielectric layer 11 is filled with the filler, so that the problem that the dielectric layer 11 cannot wrap the internal electrode 2 because the distance from the dielectric layer 11 to the internal electrode 2 is too small can be solved, the area ratio of the internal electrode 2 to the dielectric layer 11 can be further increased, and the capacity of the capacitor 100 can be further increased; in addition, the width of the second conductive sheet 22 is smaller than the width of the first end 211 along the second direction, so that the width of the exposed portion of the internal electrode 2 can be reduced, the probability of the plating solution penetrating into the dielectric body 1 can be reduced, the occurrence of cracks caused by hydrogen or reducing gas generated in the dielectric body 1 by the plating solution can be improved, and the reliability of high temperature resistance and moisture resistance of the capacitor 100 can be improved.

It should be noted that the preferred embodiments of the present invention are described in the specification and the drawings, but the present invention can be realized in many different forms, and is not limited to the embodiments described in the specification, and these embodiments are not provided as additional limitations to the present invention, and are provided for the purpose of making the understanding of the disclosure of the present invention more thorough and complete. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. A capacitor, comprising:

a dielectric body having a plurality of dielectric layers laminated therein along a first direction;

a plurality of internal electrodes disposed within the dielectric body, the plurality of internal electrodes being spaced apart by the dielectric layer, the internal electrodes including a first conductive tab and a second conductive tab; the first conducting strip is provided with a first end and a second end which are opposite along a second direction, the second conducting strip is connected to one side of the first end along a direction parallel to a third direction, and one side of the second conducting strip, which is far away from the first end, is exposed through the surface of the dielectric body; and

the outer electrode is arranged at the end part of the dielectric main body along the second direction and is connected with the second conducting strip;

wherein the first direction, the second direction and the third direction are perpendicular to each other.

2. The capacitor of claim 1, wherein the first conductive sheets of the plurality of internal electrodes overlap each other along the first direction.

3. The capacitor of claim 1, wherein said first conductive sheet is located within said dielectric layer as viewed in said first direction.

4. The capacitor of claim 3 wherein the width of said dielectric layer projecting parallel to said second direction beyond said internal electrodes is less than the width of said dielectric layer projecting parallel to said third direction beyond said internal electrodes.

5. The capacitor of claim 3, wherein the step structure formed by the inner electrode and the adjacent dielectric layer is filled with a filler.

6. The capacitor according to claim 1, wherein the internal electrode comprises two of the second conductive sheets connected to the first conductive sheet on both sides in a direction parallel to the third direction.

7. The capacitor of claim 1, wherein the second conductive plate is flush with the first conductive plate along the second direction.

8. The capacitor of claim 1, wherein the second conductive sheet has a width in the second direction that is 0.01% to 10.00% of a chip width.

9. The capacitor of claim 1, wherein the second conductive sheet extends from the first conductive sheet.

10. The capacitor as claimed in any one of claims 1 to 9, wherein the capacitor comprises two external electrodes disposed at both ends of the dielectric body, respectively; the inner electrode is connected to the outer electrode adjacent the first end thereof.

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