CN218755979U

CN218755979U - Chip immersion tinning stack

Info

Publication number: CN218755979U
Application number: CN202222779159.0U
Authority: CN
Inventors: 杨志强; 卜树强
Original assignee: Suzhou Aolideng Technology Co ltd
Current assignee: Suzhou Aolideng Technology Co ltd
Priority date: 2022-10-21
Filing date: 2022-10-21
Publication date: 2023-03-28
Anticipated expiration: 2032-10-21

Abstract

The utility model discloses a chip immersion tinning stack relates to the relevant technical field of chip processing apparatus, including tinned box, chip centre gripping complementary unit and mobile drive mechanism, chip centre gripping complementary unit sets up in the outside top of tinned box, mobile drive mechanism sets up the outside rear end at the tinned box of tinned box, chip centre gripping complementary unit includes first splint, second splint, fixed bolster, fixed plate and telescopic cylinder, first splint set up the below at the fixed bolster, the utility model discloses a cooperation between first splint and the second splint that set up in the chip centre gripping complementary unit is used and can be carried out the centre gripping to the chip and fix, and first splint are provided with two, and at the independent drive work of first splint of during operation, make it can carry out corresponding centre gripping operation to not unidimensional chip, and once can the fixed a plurality of chips of centre gripping to the realization carries out tinning operation to a plurality of chips simultaneously.

Description

Chip immersion tinning stack

Technical Field

The utility model relates to a chip processing apparatus technical field that is correlated with specifically relates to a chip immersion tinning stack.

Background

Chips, also known as microcircuits, microchips, and integrated circuits, are silicon chips containing integrated circuits that are small and often part of a computer or other electronic device. Integrated circuits in which circuits are fabricated on the surface of a semiconductor chip are also called thin film integrated circuits. Another type of thick film integrated circuit is a miniaturized circuit formed by a discrete semiconductor device and passive components integrated into a substrate or wiring board.

The prior art has the following problems: the conventional chip processing process includes several links such as chip design, wafer manufacturing, packaging manufacturing and testing, wherein during packaging manufacturing, corresponding tinning operation is generally performed on the chip to protect a part from being corroded in an alkaline corrosive liquid, when chip tinning is performed by immersing the chip in a tinning box for processing, a plurality of manual matching operations are generally performed to perform workpiece taking and clamping and then placing the workpiece taking and clamping into the tinning box for processing, and when a chip to be tinned is clamped, the number of clamping processes for one time is generally small, chips with different sizes are inconvenient to clamp, and long-term production is not facilitated.

SUMMERY OF THE UTILITY MODEL

For solving above-mentioned technical problem, provide a chip immersion tinning stack, when this technical scheme had solved the chip tinning that proposes in the above-mentioned background art and adopted its processing of submerging in the tinning box, generally get a centre gripping through a plurality of manual work cooperation operations and put into the operation in the tinning box again, and when the centre gripping was treated tinning's chip, generally a centre gripping treatment quantity is less, and is comparatively inconvenient to not unidimensional chip centre gripping, is unfavorable for long-term production, is unfavorable for the problem of use.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

the utility model provides a chip immersion tinning stack, includes tinned box, chip centre gripping complementary unit and removes actuating mechanism, chip centre gripping complementary unit sets up in the outside top of tinned box, remove actuating mechanism and set up the outside rear end at the tinned box of tinned box, chip centre gripping complementary unit includes first splint, second splint, fixed bolster, fixed plate and telescopic cylinder, first splint set up in the below of fixed bolster, the lower fixed surface of fixed bolster is connected with the second splint, the second spacing groove has been seted up to one side of second splint, the spout has been seted up to one side of fixed bolster, the inboard sliding connection of spout has the sliding block, one side fixedly connected with fixed plate of sliding block, the lower fixed surface of fixed plate is connected with first splint, first spacing groove has been seted up to one side of first splint, the last fixed surface of fixed bolster is connected with telescopic cylinder.

Preferably, telescopic cylinder's output and one side fixed connection of fixed plate, sliding block and first splint pass through fixed plate fixed connection, the fixed bolster passes through spout and sliding block sliding connection.

Preferably, the moving driving mechanism comprises a servo motor, a support frame, a movable support, a threaded rod and a positioning rod, the lower surface of the movable support is fixedly connected with the upper surface of the fixed support, and the support frame is fixedly connected with the rear end of the outer portion of the tinning box body.

Preferably, the outside bottom fixedly connected with servo motor of support frame, servo motor's output runs through support frame fixedly connected with threaded rod, the one end of threaded rod runs through the movable support and is connected with the inboard top rotation of support frame.

Preferably, the surface of the threaded rod is in threaded connection with the movable support, the top end of the inner side of the support frame is fixedly connected with a positioning rod, and one end of the positioning rod penetrates through the bottom end of the inner side of the movable support and is fixedly connected with the bottom end of the inner side of the support frame.

Preferably, the surface of the positioning rod is slidably connected with the movable support, the output end of the servo motor is in threaded connection with the movable support through a threaded rod, and the support frame is slidably connected with the movable support through the positioning rod.

Preferably, the first limit groove and the second limit groove are the same in size, and the sliding block is matched with the sliding groove.

Compared with the prior art, the utility model provides a chip immersion tinning stack possesses following beneficial effect:

the utility model discloses be provided with chip centre gripping complementary unit, remove actuating mechanism and tinned box, cooperation between first splint and the second splint that set up through chip centre gripping complementary unit is used and can carry out the centre gripping to the chip and fix, and first splint are provided with two, at the independent drive work of first splint of during operation, make it can carry out the centre gripping operation that corresponds to not unidimensional chip, and once can the centre gripping a plurality of chips, thereby realize carrying out the tinning operation simultaneously to a plurality of chips, with the practicality of increasing the device, and the removal actuating mechanism interior servo motor who sets up, cooperation between threaded rod and the locating lever is used and can all immerse the chip and carry out the tinning operation in the tinned box, thereby stability has been increased, current user demand has been satisfied, and the utility model discloses simple structure, high durability and convenient use.

Drawings

Fig. 1 is a schematic perspective view of a chip immersion tin plating apparatus according to the present invention;

fig. 2 is a schematic view of a three-dimensional structure of the chip clamping auxiliary mechanism provided by the present invention;

fig. 3 is a schematic view of a three-dimensional structure of the mobile driving mechanism of the present invention;

fig. 4 is a schematic perspective view of a chip immersion tin plating apparatus according to another embodiment of the present invention;

the reference numbers in the figures are:

1. a tinning box body; 2. a chip clamping auxiliary mechanism; 3. a movement drive mechanism; 4. fixing a bracket; 5. a telescopic cylinder; 6. a slider; 7. a fixing plate; 8. a first splint; 9. a first limit groove; 10. a second limit groove; 11. a second splint; 12. a servo motor; 13. a support frame; 14. a threaded rod; 15. positioning a rod; 16. a movable support; 17. a chute.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments described below are by way of example only, and other obvious variations will occur to those skilled in the art.

Referring to fig. 1-4, a chip immersion tinning stack, including tinned box 1, chip centre gripping complementary unit 2 and removal actuating mechanism 3, chip centre gripping complementary unit 2 sets up in the outside top of tinned box 1, removal actuating mechanism 3 sets up the outside rear end at tinned box 1 of tinned box 1, chip centre gripping complementary unit 2 includes first splint 8, second splint 11, fixed bolster 4, fixed plate 7 and telescopic cylinder 5, first splint 8 sets up the below at fixed bolster 4, the lower fixed surface of fixed bolster 4 is connected with second splint 11, second spacing groove 10 has been seted up to one side of second splint 11, spout 17 has been seted up to one side of fixed bolster 4, the inboard sliding connection of spout 17 has sliding block 6, sliding block 6 and spout 17 looks adaptation, one side fixedly connected with fixed plate 7 of sliding block 6, the lower fixed surface of fixed plate 7 is connected with first splint 8, first spacing groove 9 has been seted up to one side of first splint 8, first spacing groove 9 is the same size as second spacing groove 10, the upper surface fixedly connected with telescopic cylinder 5 of fixed bolster 4 at the during operation, first splint 8 and telescopic cylinder 5 and the symmetrical corresponding not the operation about the first splint 4 that makes it carry out of operation alone.

The output of telescopic cylinder 5 and one side fixed connection of fixed plate 7, sliding block 6 and first splint 8 pass through 7 fixed connection of fixed plate, fixed bolster 4 passes through

spout

17 and 6 sliding connection of sliding block, it includes servo motor 12 to remove actuating mechanism 3, support frame 13, movable support 16, threaded rod 14 and locating lever 15, the lower surface of movable support 16 and the last fixed surface of fixed bolster 4 are connected, the outside rear end fixedly connected with support frame 13 of tinned box 1, the outside bottom fixedly connected with servo motor 12 of support frame 13, support frame 13 fixedly connected with threaded rod 14 is run through to servo motor 12's output, the inboard top that movable support 16 and support frame 13 were run through to the one end of threaded rod 14 rotates and is connected.

Threaded rod 14's surface and movable support 16 threaded connection, the inboard top fixedly connected with locating lever 15 of support frame 13, the inboard bottom fixed connection of movable support 16 and support frame 13 is run through to the one end of locating lever 15, locating lever 15's surface and movable support 16 sliding connection, threaded rod 14 and movable support 16 threaded connection are passed through to servo motor 12's output, support frame 13 passes through locating lever 15 and movable support 16 sliding connection, the servo motor 12 and the telescopic cylinder 5 that set up all are connected through external switch and power, the demand of device at work power supply volume has been ensured.

The utility model discloses during the use, will need tinned chip centre gripping between first splint 8 and second splint 11, at first with the chip on one side through the second spacing groove 10 butt joint of seting up on second splint 11, then start telescopic cylinder 5 work, make its output drive fixed plate 7 and remove, fixed plate 7 then drives sliding block 6 and carries out corresponding removal on the spout 17 of seting up in the fixed bolster 4, thereby it removes to drive the first splint 8 of fixing in fixed plate 7 bottom, make the first spacing groove 9 of its seting up be close to the another side of chip gradually, stop telescopic cylinder 5's work after the inboard bottom of another side and first spacing groove 9 meets, then place all the other chips that need to process together between first spacing groove 9 and second spacing groove 10, start telescopic cylinder 5 work once more after putting, it drives first splint 8 and removes, the another side stops telescopic cylinder 5 work after the chip that makes the first spacing groove 9 inner wall of seting up closely laminate at last and place, thereby accomplish the centre gripping of chip fixed.

When immerging its fixed chip in tin-plating box 1, can start the work of removal actuating mechanism 3, the servo motor 13 output that sets up in the removal actuating mechanism 3 drives threaded rod 14 and rotates on support frame 13, because movable support 16 and locating lever 15 sliding connection, so movable support 16 can not follow the rotation when threaded rod 14 rotates, the perpendicular downstream of surface that can follow locating lever 15 at last, thereby the chip after the drive centre gripping carries out corresponding downstream, at last with the chip all dip to tin-plating box 1 back in, stop servo motor 12 work, thereby carry out the tin-plating operation to the chip.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the principles of the present invention may be applied to any other embodiment without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The chip immersion type tinning device is characterized by comprising a tinning box body (1), a chip clamping auxiliary mechanism (2) and a moving driving mechanism (3), wherein the chip clamping auxiliary mechanism (2) is arranged above the outer part of the tinning box body (1), and the moving driving mechanism (3) is arranged at the rear end of the outer part of the tinning box body (1);

chip centre gripping complementary unit (2) are including first splint (8), second splint (11), fixed bolster (4), fixed plate (7) and telescopic cylinder (5), first splint (8) set up the below at fixed bolster (4), the lower fixed surface of fixed bolster (4) is connected with second splint (11), second spacing groove (10) have been seted up to one side of second splint (11), spout (17) have been seted up to one side of fixed bolster (4), the inboard sliding connection of spout (17) has sliding block (6), one side fixedly connected with fixed plate (7) of sliding block (6), the lower fixed surface of fixed plate (7) is connected with first splint (8), first spacing groove (9) have been seted up to one side of first splint (8), the last fixed surface of fixed bolster (4) is connected with telescopic cylinder (5).

2. The apparatus of claim 1, wherein: the output of telescopic cylinder (5) and one side fixed connection of fixed plate (7), sliding block (6) and first splint (8) are through fixed plate (7) fixed connection, fixed bolster (4) are through spout (17) and sliding block (6) sliding connection.

3. The apparatus of claim 2, wherein: the mobile driving mechanism (3) comprises a servo motor (12), a support frame (13), a movable support (16), a threaded rod (14) and a positioning rod (15), the lower surface of the movable support (16) is fixedly connected with the upper surface of the fixed support (4), and the support frame (13) is fixedly connected with the rear end of the outer portion of the tinning box body (1).

4. The apparatus of claim 3, wherein: outside bottom fixedly connected with servo motor (12) of support frame (13), the output of servo motor (12) runs through support frame (13) fixedly connected with threaded rod (14), the inboard top rotation that movable support (16) and support frame (13) were run through to the one end of threaded rod (14) is connected.

5. The apparatus of claim 4, wherein: the surface of the threaded rod (14) is in threaded connection with the movable support (16), the inner side top end of the support frame (13) is fixedly connected with a positioning rod (15), and one end of the positioning rod (15) penetrates through the inner side bottom end of the movable support (16) and the support frame (13) to be fixedly connected.

6. The apparatus of claim 5, wherein: the surface of the positioning rod (15) is in sliding connection with the movable support (16), the output end of the servo motor (12) is in threaded connection with the movable support (16) through a threaded rod (14), and the support frame (13) is in sliding connection with the movable support (16) through the positioning rod (15).

7. The apparatus of claim 2, wherein: the first limiting groove (9) and the second limiting groove (10) are the same in size, and the sliding block (6) is matched with the sliding groove (17).