CN218755561U - High-heat-conductivity insulating silica gel cloth heat-conducting silica gel sheet - Google Patents

High-heat-conductivity insulating silica gel cloth heat-conducting silica gel sheet Download PDF

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Publication number
CN218755561U
CN218755561U CN202223371693.4U CN202223371693U CN218755561U CN 218755561 U CN218755561 U CN 218755561U CN 202223371693 U CN202223371693 U CN 202223371693U CN 218755561 U CN218755561 U CN 218755561U
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silica gel
heat
layer
basic unit
conducting layer
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CN202223371693.4U
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Chinese (zh)
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李明
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Shenzhen Shilongxiang Technology Co ltd
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Shenzhen Shilongxiang Technology Co ltd
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Abstract

The utility model discloses a high heat conduction insulating silica gel cloth heat conduction silica gel piece, include: the heat-conducting silica gel sheet body is composed of a silica gel cloth base layer, a heat-conducting layer, an antistatic layer and a high-elastic heat-conducting layer; wherein, the silica gel cloth basic unit is the basic unit, and the heat-conducting layer sets up in the lower extreme of silica gel cloth basic unit, and the antistatic layer sets up between heat-conducting layer and silica gel cloth basic unit, and high-elastic heat-conducting layer sets up in the upper end of silica gel cloth basic unit. Can be applied to between PC mainboard and radiator or the metal machine case, provide sufficient deformability through high-elastic heat-conducting layer, effectual packing realizes the effect of high-efficient heat conduction in the air gap between PC mainboard and radiator or metal machine case, has antistatic function, and the heat dissipation is good, makes electron device can not local overheat. Meanwhile, the vibration absorber has good elasticity and impact resistance, and can better absorb the vibration outside the device. Can be widely used in electronic devices requiring static resistance and heat dissipation.

Description

High-heat-conductivity insulating silica gel cloth heat-conducting silica gel sheet
Technical Field
The utility model belongs to the technical field of heat conduction silica gel piece, a high heat conduction insulating silica gel cloth heat conduction silica gel piece is related to.
Background
The heat-conducting silica gel sheet is a heat-conducting medium material synthesized by a special process, which is also called a heat-conducting silica gel pad, a heat-conducting silica gel sheet, a soft heat-conducting pad, a heat-conducting silica gel gasket and the like in the industry, is specially produced by a design scheme of utilizing gaps to transfer heat, can fill the gaps, and can open a heat channel between a heating part and a heat dissipation part to effectively improve the heat transfer efficiency, simultaneously has the functions of insulation, shock absorption, sealing and the like, can meet the design requirements of equipment miniaturization and ultra-thinness, and has the advantages of manufacturability and usability, wide thickness application range and excellent heat-conducting filling material. After the high polymer material is cured, thermal contraction and thermal expansion are easy to generate, and gaps are easy to generate at the interface, so that the thermal conductivity is reduced.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model discloses a following technical scheme:
a high heat conduction insulating silica gel cloth heat conduction silica gel piece includes: the heat-conducting silica gel sheet body is composed of a silica gel cloth base layer, a heat-conducting layer, an antistatic layer and a high-elastic heat-conducting layer;
wherein, the silica gel cloth basic unit is the basic unit, and the heat-conducting layer sets up in the lower extreme of silica gel cloth basic unit, and the antistatic layer sets up between heat-conducting layer and silica gel cloth basic unit, and high-elastic heat-conducting layer sets up in the upper end of silica gel cloth basic unit.
As a further aspect of the present invention: the high-elastic heat conduction layer is composed of an elastic body and a heat conduction base layer coated on the outer layer of the elastic body.
As a further aspect of the present invention: the elastomer is provided with a plurality of air holes which penetrate through the elastomer.
As a further aspect of the present invention: the elastomer is one of thermoplastic elastomer or liquid crystal elastomer.
As a further aspect of the present invention: the surface of the heat conduction layer is also coated with a micro-adhesive layer made of a silica gel micro-adhesive; a layer of transparent silicone oil release paper is adhered to the surface of each micro-adhesive layer.
The utility model has the advantages that: can be applied to between PC mainboard and radiator or the metal machine case, provide sufficient deformability through high-elastic heat-conducting layer, effectual packing realizes the effect of high-efficient heat conduction in the air gap between PC mainboard and radiator or metal machine case, has antistatic function, and the heat dissipation is good, makes electron device can not local overheat. Meanwhile, the vibration absorber has good elasticity and impact resistance, and can better absorb the vibration outside the device. Can be widely used in electronic devices requiring static resistance and heat dissipation.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it should be understood that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments, and it should be understood that the present application is not limited to the example embodiments disclosed and described herein. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
The utility model provides a please refer to fig. 1, in the embodiment of the utility model, a high heat conduction insulating silica gel cloth heat conduction silica gel piece, include: the heat-conducting silica gel sheet body is composed of a silica gel cloth base layer 2, a heat-conducting layer 4, an antistatic layer 3 and a high-elastic heat-conducting layer 4;
wherein, the silica gel cloth base layer 2 is a base layer, the heat conduction layer 4 is arranged at the lower end of the silica gel cloth base layer 2, the antistatic layer 3 is arranged between the heat conduction layer 4 and the silica gel cloth base layer 2, and the high-elastic heat conduction layer 4 is arranged at the upper end of the silica gel cloth base layer 2; when the product structure is specifically implemented, the product structure can be applied between a PC mainboard and a radiator or a metal case, sufficient deformability is provided through the high-elastic heat conduction layer 4, the air gap between the PC mainboard and the radiator or the metal case is effectively filled, the effect of high-efficiency heat conduction is realized, the antistatic function is realized, the heat dissipation is good, and the electronic device cannot be locally overheated. Meanwhile, the vibration absorber has good elasticity and impact resistance, and can better absorb the vibration outside the device. Can be widely used in electronic devices requiring static resistance and heat dissipation.
Further, high-elastic heat conduction layer 4 comprises elastomer 21 and the heat conduction basic unit 22 of cladding at the outer layer of elastomer 21, provides sufficient elasticity ability for high-elastic heat conduction layer 4 through elastomer 21 to realize the effect of high-efficient heat conduction through heat conduction basic unit 22. Furthermore, a plurality of air holes penetrating through the elastic body 21 are formed in the elastic body 21 for heat extraction work inside the elastic body 21.
Alternatively, the elastomer 21 is one of a thermoplastic elastomer 21 and a liquid crystal elastomer 21.
Further, the surface of the heat conduction layer 4 is coated with a micro-adhesive layer made of a silica gel micro-adhesive; the adhesive is used for attaching and applying the heat-conducting silica gel sheet body, and the surface of the micro adhesive layer is attached with a layer of transparent silicone oil release paper.
It is further noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element described by the phrase "comprising a. -" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (5)

1. The utility model provides a high heat conduction insulating silica gel cloth heat conduction silica gel piece which characterized in that includes: the heat-conducting silica gel sheet body is composed of a silica gel cloth base layer, a heat-conducting layer, an antistatic layer and a high-elastic heat-conducting layer;
wherein, the silica gel cloth basic unit is the basic unit, and the heat-conducting layer sets up in the lower extreme of silica gel cloth basic unit, and the antistatic layer sets up between heat-conducting layer and silica gel cloth basic unit, and high-elastic heat-conducting layer sets up in the upper end of silica gel cloth basic unit.
2. The silicone sheet according to claim 1, wherein the high elastic heat conducting layer comprises an elastomer and a heat conducting base layer coated on the elastomer.
3. The silicon rubber sheet as claimed in claim 2, wherein the elastomer has a plurality of holes formed therethrough.
4. The silicon rubber sheet as claimed in claim 2, wherein the elastomer is one of thermoplastic elastomer or liquid crystal elastomer.
5. The silica gel sheet of claim 1, wherein the surface of the heat conducting layer is further coated with a micro-adhesive layer made of silica gel micro-adhesive; a layer of transparent silicone oil release paper is adhered to the surface of the micro-adhesive layer.
CN202223371693.4U 2022-12-15 2022-12-15 High-heat-conductivity insulating silica gel cloth heat-conducting silica gel sheet Active CN218755561U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223371693.4U CN218755561U (en) 2022-12-15 2022-12-15 High-heat-conductivity insulating silica gel cloth heat-conducting silica gel sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223371693.4U CN218755561U (en) 2022-12-15 2022-12-15 High-heat-conductivity insulating silica gel cloth heat-conducting silica gel sheet

Publications (1)

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CN218755561U true CN218755561U (en) 2023-03-28

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CN (1) CN218755561U (en)

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