CN218755531U - Screen heat dissipation buffering support module and electronic display equipment - Google Patents
Screen heat dissipation buffering support module and electronic display equipment Download PDFInfo
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- CN218755531U CN218755531U CN202222162837.9U CN202222162837U CN218755531U CN 218755531 U CN218755531 U CN 218755531U CN 202222162837 U CN202222162837 U CN 202222162837U CN 218755531 U CN218755531 U CN 218755531U
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Abstract
The application provides a screen heat dissipation buffering support module and electronic display equipment. The screen heat dissipation buffering support module is arranged below an inner screen of the electronic display device and comprises a heat conduction silica gel film layer and a heat conduction copper foil, the thickness of the heat conduction silica gel film layer is 30-150 micrometers, the heat conduction silica gel film layer comprises a silica gel main body and heat conduction and antistatic substances added into the silica gel main body, the heat conduction silica gel film layer is provided with an upper bonding surface and a lower bonding surface which are opposite, a release film is arranged on the upper bonding surface and the lower bonding surface respectively, the heat conduction silica gel film layer is arranged after the release film is stripped, the upper bonding surface is connected with the inner screen of the electronic display device in a laminating manner, and the lower bonding surface is connected with the heat conduction copper foil in a laminating manner. The screen heat dissipation buffer support module is convenient to assemble and can provide good heat dissipation, buffer support and antistatic performance.
Description
Technical Field
The application relates to the technical field of electronic display equipment, in particular to a screen heat dissipation buffering support module and electronic display equipment.
Background
With the progress of electronic display technology, electronic display devices are becoming thinner and thinner. The OLED screen has the advantages of no need of a backlight source, high contrast, thin thickness, wide viewing angle and the like, and is a new display technology. However, since the OLED panel is thin, the panel is easily broken during assembly or use, and therefore, foam is usually added as a buffer layer during the fabrication process; because the heat dissipation performance of the common foam is poor, heat dissipation measures need to be taken, and a common heat dissipation mode is to adhere a copper foil adhesive tape; meanwhile, in order to prevent the electrostatic influence, an antistatic layer is required to be arranged. Therefore, the current screen assembling steps are complicated, bubbles and fold marks are easy to generate when the copper foil adhesive tape adopted in the prior art is pasted on foam cotton, and the yield is difficult to improve.
In view of the above, there is a need to provide a new technical solution to overcome the problems in the prior art.
SUMMERY OF THE UTILITY MODEL
The application provides a screen heat dissipation buffering support module and electronic display equipment, and the equipment is convenient and can provide good heat dissipation, buffering support and antistatic performance.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: the utility model provides a screen heat dissipation buffering support module, locates electronic display equipment's interior screen below, screen heat dissipation buffering support module includes heat conduction silica gel film layer and heat conduction copper foil, the thickness of heat conduction silica gel film layer is 30-150 mu m, it include the silica gel main part with add in heat conduction and antistatic substance in the silica gel main part, heat conduction silica gel film layer has relative last laminating face and lower laminating face, is equipped with respectively on two upper and lower laminating faces from the type membrane, heat conduction silica gel film layer in peel off the back from the type membrane, go up the laminating face with electronic display equipment's interior screen laminating is connected, lower laminating face with the laminating of heat conduction copper foil is connected.
Optionally, the release film arranged on the upper attaching surface is a light release film, and the release film arranged on the lower attaching surface is a heavy release film.
Optionally, the light release film and the heavy release film are different in color or provided with different indicators.
Optionally, the thickness of the release film is 50-150 μm.
Optionally, the heat-conducting and antistatic substance includes one or more of artificial graphite, silicon carbide, carbon nanotubes, and graphene.
Optionally, the thermally conductive copper foil is an electrolytic copper foil or a rolled copper foil.
Optionally, the thickness of the thermally conductive copper foil is 18-35 μm.
The application also adopts the following technical scheme: the utility model provides an electronic display equipment, its includes interior screen and as above screen heat dissipation buffering support module, screen heat dissipation buffering support module laminate in interior screen below with flexible support interior screen with the heat transfer of interior screen goes out.
Optionally, the inner screen comprises an OLED display screen.
The application also adopts the following technical scheme: the utility model provides a high elasticity heat conduction antistatic silicone membrane, is applied to as above screen heat dissipation buffering support module, high elasticity heat conduction antistatic silicone membrane includes heat conduction silica gel film layer with locate the release liner of heat conduction silica gel film layer both sides.
The screen heat dissipation buffering support module comprises a heat conduction silica gel film layer, wherein the thickness of the heat conduction silica gel film layer is 30-150 microns, the heat conduction silica gel film layer comprises a silica gel main body and a heat conduction and antistatic substance added into the silica gel main body, the antistatic substance can greatly enhance the heat dissipation performance and the buffering performance of the whole body, and therefore the heat conduction silica gel film layer has the functions of buffering support, heat dissipation and antistatic; and heat conduction silica gel film layer has better attached performance, heat conduction silica gel film layer in peel off the back from the type membrane, go up the laminating face with electronic display device's interior screen laminating is connected, down the laminating face with the heat conduction copper foil laminating is connected, and the assembling process is simple and convenient, has automatic laminating ability, has avoided the production of laminating back bubble or pleat mark, has promoted the yields of product.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings of the embodiments will be briefly introduced below, and it is apparent that the drawings in the following description only relate to some embodiments of the present application and are not limiting on the present application.
Fig. 1 is a schematic view of a heat dissipation buffer supporting module of the present application.
FIG. 2 is a schematic view of the high-elasticity heat-conducting antistatic silicone membrane of the present application.
Fig. 3 is a schematic view illustrating an assembly process of the heat dissipation buffer supporting module of the present application.
Description of the reference numerals: 1-inner screen; 2-heat-conducting silica gel film layer; 21-light release film; 22-heavy release film; 3-heat conducting copper foil.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings. The components of embodiments of the present application, generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The use of "first," "second," and similar terms in the description and claims of this application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprise" or "comprises", and the like, means that the element or item listed before "comprises" or "comprising" covers the element or item listed after "comprising" or "comprises" and its equivalents, and does not exclude other elements or items. "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are used only to indicate relative positional relationships that may change when the absolute position of an object being described changes, which are merely for convenience of description and to simplify the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. Features in the embodiments described below may be combined with each other without conflict.
Referring to fig. 1 to 3, the present application provides a screen heat dissipation buffer support module, an electronic display device, and a high-elasticity heat-conducting antistatic silicone film.
The screen heat dissipation buffering support module is arranged below an inner screen 1 of the electronic display device and comprises a heat conduction silica gel film layer 2 and a heat conduction copper foil 3, the thickness of the heat conduction silica gel film layer 2 is 30-150 microns, the heat conduction silica gel film layer comprises a silica gel main body and heat conduction and antistatic substances added into the silica gel main body, the heat conduction silica gel film layer 2 is provided with an upper binding face and a lower binding face which are opposite, and a release film is arranged on the upper binding face and the lower binding face respectively. And after the heat-conducting silica gel film layer 2 is stripped from the release film, the upper binding face is bound and connected with the inner screen 1 of the electronic display equipment, and the lower binding face is bound and connected with the heat-conducting copper foil 3.
The thickness of the heat-conducting silica gel film layer 2 is set to be 30-150 mu m, so that the heat-conducting silica gel film layer has good elasticity and can play a good role in buffering and supporting. Preferably, the thickness of the thermally conductive silicone film layer 2 is set to 100 to 150 μm. In some embodiments, the thickness of the thermal conductive silicone film layer 2 is set to be 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm.
The thickness of the heat-conducting silica gel film layer 2 is 30-150 μm, the heat-conducting silica gel film layer comprises a silica gel main body and a heat-conducting and antistatic substance added into the silica gel main body, and the antistatic substance can greatly enhance the heat dissipation performance and the buffer performance of the whole body, so that the heat-conducting silica gel film layer 2 has the functions of buffer support, heat dissipation and antistatic; and heat conduction silica gel film layer 2 has better attached performance, heat conduction silica gel film layer 2 in peel off the back from the type membrane, go up the laminating face with electronic display device's interior screen 1 laminating is connected, down the laminating face with heat conduction copper foil 3 laminating is connected, and the assembling process is simple and convenient, has automatic laminating ability, has avoided the production of laminating back bubble or pleat mark, has promoted the yields of product.
The heat-conducting and antistatic substance comprises one or more of artificial graphite, silicon carbide, carbon nano tubes and graphene. Materials such as artificial graphite, carborundum, carbon nanotube, graphite alkene have good heat conduction and antistatic properties concurrently, and the dispersion distributes in the silica gel main part for heat conduction silica gel film layer 2 has buffering support, heat dissipation and antistatic properties. In an embodiment, the thermal conductive silica gel film layer 2 is formed by adding 3% -10% of carbon nanotubes by mass into a silica gel main body.
Referring to fig. 2, release films are attached to two sides of the heat conductive silicone film layer 2 to form the high-elasticity heat conductive antistatic silicone film. When the heat-conducting antistatic silica gel film is used, the release film of the high-elasticity heat-conducting antistatic silica gel film is peeled off, and the heat-conducting silica gel film layer 2 is attached to the inner screen 1 for use. In this embodiment, the release film disposed on the upper bonding surface of the thermal conductive silicone rubber film layer 2 is a light release film 21, and the release film disposed on the lower bonding surface of the thermal conductive silicone rubber film layer 2 is a heavy release film 22. The light release film 21 and the heavy release film 22 have different colors or are provided with different indication marks for distinguishing the use sequence and saving working procedures and labor. In one embodiment, the light release film 21 is a transparent fluoroplastic release film, and is used as a first peeling surface during use; the heavy release film 22 is a color fluoroplastic release film and is used as a second stripping surface for stripping after the heat-conducting silica gel film layer 2 is attached to the inner screen 1. It is understood that the heavy release film and the light release film refer to the magnitude of the release force of the release film compared with each other, i.e. the release force of the heavy release film 22 is greater than that of the light release film 21. In some embodiments, the color of the heavy release film 22 is one of blue, green, yellow, black, and white. In another embodiment, the light release film 21 is printed or adhered with an indicator, such as "1", and the heavy release film 22 is printed or adhered with an indicator, such as "2", to indicate the peeling sequence.
Optionally, the thickness of the release film is 50-150 μm. For example, the thickness of the light release film 21 can be 50-100 μm, and the thickness of the heavy release film 22 can be 50-150 μm.
Referring to fig. 1 again, the heat conductive copper foil 3 is attached to the bonding surface of the heat conductive silicone film layer 2 away from the inner screen 1. The heat-conducting silica gel film layer 2 is high in initial adhesion, high in elastic modulus, good in high temperature resistance and good in automatic bonding performance with the inner screen 1 and the heat-conducting copper foil 3. The heat conductive copper foil 3 may be an electrolytic copper foil or a rolled copper foil. In an embodiment, the heat conductive copper foil 3 is a rolled copper foil, which can reduce the production cost compared to the conventional scheme of heat dissipation using a copper foil tape. Optionally, the thickness of the thermally conductive copper foil is 18-35 μm.
The application provides a pair of electronic display equipment, it includes interior screen 1 and as above screen heat dissipation buffering support module, screen heat dissipation buffering support module laminate in interior screen 1 below is with flexible support interior screen 1 and with the heat transfer of interior screen 1 goes out. In an embodiment, the inner screen 1 comprises an OLED display screen.
The application provides a pair of antistatic silicone membrane of high elasticity heat conduction is applied to as above screen heat dissipation buffering support module, antistatic silicone membrane of high elasticity heat conduction includes heat conduction silica gel film layer 2 with locate the type membrane from heat conduction silica gel film layer 2 both sides.
Referring to fig. 3, the assembly process of the screen heat dissipation buffer supporting module is as follows: peeling the light release film 21 of the high-elasticity heat-conducting antistatic silica gel film shown in fig. 2, and attaching the exposed upper attaching surface of the heat-conducting silica gel film layer 2 to the inner side surface of the inner screen 1 of the electronic display device; and (3) peeling the heavy release film 22, and attaching the heat-conducting copper foil 3 to the exposed lower attaching surface of the heat-conducting silica gel film layer 2 to complete the assembly.
As can be seen from the above description of the specific embodiments, the screen heat dissipation buffer support module, the electronic display device and the high-elasticity heat-conducting antistatic silicone film provided by the application include a heat-conducting silicone film layer, the thickness of the heat-conducting silicone film layer is 30-150 μm, the heat-conducting silicone film layer includes a silicone main body and a heat-conducting and antistatic substance added in the silicone main body, and the antistatic substance can greatly enhance the heat dissipation performance and the buffer performance of the whole body, so that the heat-conducting silicone film layer has the buffer support, heat dissipation and antistatic effects; and heat conduction silica gel film layer has better attached performance, heat conduction silica gel film layer in peel off the back from the type membrane, go up the laminating face with electronic display device's interior screen laminating is connected, down the laminating face with the heat conduction copper foil laminating is connected, and the assembling process is simple and convenient, has automatic laminating ability, has avoided the production of laminating back bubble or pleat mark, has promoted the yields of product.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (8)
1. The utility model provides a screen heat dissipation buffering support module, locates electronic display device's inner screen below, its characterized in that, screen heat dissipation buffering support module includes heat conduction silica gel film layer and heat conduction copper foil, the thickness of heat conduction silica gel film layer is 30-150 mu m, heat conduction silica gel film layer has relative last binding face and lower binding face, is equipped with respectively on two upper and lower binding faces from the type membrane, heat conduction silica gel film layer in peel off the back from the type membrane, go up the binding face with electronic display device's inner screen laminating is connected, lower binding face with the laminating of heat conduction copper foil is connected.
2. The screen cooling buffering support module of claim 1, wherein the release film disposed on the upper attaching surface is a light release film, and the release film disposed on the lower attaching surface is a heavy release film.
3. The screen-cooling buffering support module of claim 2, wherein the light release film and the heavy release film are different in color or have different indicators thereon.
4. The screen-cooling buffer support module of claim 1, wherein the thickness of the release film is 50-150 μm.
5. The screen cooling buffering support module of claim 1, wherein the thermally conductive copper foil is an electrolytic copper foil or a rolled copper foil.
6. The screen heat dissipation buffer support module of claim 5, wherein the thickness of the thermally conductive copper foil is 18-35 μm.
7. An electronic display device, comprising an inner screen and the screen heat dissipation buffer support module set as claimed in any one of claims 1 to 6, wherein the screen heat dissipation buffer support module set is attached under the inner screen to flexibly support the inner screen and transfer heat of the inner screen.
8. The electronic display device of claim 7, wherein the inner screen comprises an OLED display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222162837.9U CN218755531U (en) | 2022-08-17 | 2022-08-17 | Screen heat dissipation buffering support module and electronic display equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222162837.9U CN218755531U (en) | 2022-08-17 | 2022-08-17 | Screen heat dissipation buffering support module and electronic display equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218755531U true CN218755531U (en) | 2023-03-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222162837.9U Active CN218755531U (en) | 2022-08-17 | 2022-08-17 | Screen heat dissipation buffering support module and electronic display equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218755531U (en) |
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- 2022-08-17 CN CN202222162837.9U patent/CN218755531U/en active Active
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