CN218071831U - Flexible transparent heating pad pasting - Google Patents
Flexible transparent heating pad pasting Download PDFInfo
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- CN218071831U CN218071831U CN202222327659.0U CN202222327659U CN218071831U CN 218071831 U CN218071831 U CN 218071831U CN 202222327659 U CN202222327659 U CN 202222327659U CN 218071831 U CN218071831 U CN 218071831U
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Abstract
The utility model relates to a flexible transparent heating pad pasting, including the substrate layer and the transparent electric heat membrane that has heating circuit, transparent electric heat membrane sets up on the first surface of substrate layer, its characterized in that: the substrate layer is a colorless polyimide film with the thickness of less than or equal to 50 mu m; the flexible transparent heating film further comprises a flexible circuit board, the flexible circuit board is arranged in the peripheral area of the base material layer, and the circuit of the flexible circuit board is electrically connected with the heating circuit of the transparent electric heating film. The flexible transparent heating film has good bending resistance, can be attached to a display screen with a bending radian, and is not easy to peel off from the screen body.
Description
Technical Field
The utility model relates to a heating pad pasting, concretely relates to flexible transparent heating pad pasting.
Background
The flexible transparent heating film can be used on a liquid crystal display screen, can be electrified and heated in a cold environment, and avoids reduction of response performance of the display screen caused by supercooling temperature.
The existing transparent heating film generally adopts a PET film as a substrate layer, and a transparent electrothermal film with a heating circuit is arranged on the substrate layer, and is made of materials such as ITO. However, because the strength of the PET material is low, the thickness of the adopted PET film needs to be designed to be more than 100 μm, so that the situation that the heating film is subjected to stretching in the pasting process to cause the breakage failure of the transparent heating circuit can be avoided; and the liquid crystal display that has certain crooked radian has appeared in recent years, and when this kind of heating pad pasting that adopts the PET membrane as the substrate layer was attached on the liquid crystal display that has crooked radian, if the thickness of heating pad pasting is great, can produce great stress in crooked process, when the heating pad pasting generates heat, the viscidity of its glue film is lower, and too big stress can lead to heating the pad pasting to peel off from the screen body.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a flexible transparent heating pad pasting is provided, this kind of flexible transparent heating pad pasting has good anti bending property, can attach at the display screen that has crooked radian to be difficult for peeling off from the screen body. The technical scheme is as follows:
the utility model provides a flexible transparent heating pad pasting, includes the substrate layer and has heating circuit's transparent electric heat membrane, transparent electric heat membrane sets up on the first surface of substrate layer, its characterized in that: the substrate layer is a colorless polyimide film with the thickness of less than or equal to 50 mu m; the flexible transparent heating film further comprises a flexible circuit board, the flexible circuit board is arranged in the peripheral area of the base material layer, and the circuit of the flexible circuit board is electrically connected with the heating circuit of the transparent electric heating film.
The colorless polyimide film with the thickness not larger than 50 mu m is adopted as the base material layer, the colorless polyimide film is high in material strength and good in flexibility, and the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, so that the flexible transparent heating film has good bending resistance, the stress generated by the flexible transparent heating film adhered to the display screen with the bending radian is small, and the flexible transparent heating film is not easy to strip out of the screen body of the display screen during heating.
In a preferred embodiment, the flexible circuit board has a thickness of 100 μm to 200 μm.
In a preferable scheme, a transparent adhesive tape layer is arranged on the second surface of the base material layer. The thickness of the tack coat is generally from 10 to 50 μm. The non-drying adhesive layer is used for adhering the heating adhesive film to a screen body of the display.
In a more preferred embodiment, the adhesive layer is an acrylic resin coating.
In another more preferable scheme, the non-drying glue layer is a silica gel layer. Thus, the temperature resistance of the dry glue layer can be better.
Because the heating pad pasting is too soft, in order to make things convenient for operations such as pasting it, more preferred scheme, the non-setting adhesive layer coats and is stamped first from the type membrane. The first release film can adopt a PC film, a PET film or a PVC film, and the thickness of the first release film is generally not less than 100 μm. The first type membrane of leaving can play the guard action to the non-setting adhesive layer to play the supporting role to flexible circuit board in packing, transportation, thereby guarantee the storage transportation of heating pad pasting.
Because the heating pad pasting is too soft, in order to make things convenient for operation such as paste it, in the preferred scheme, flexible transparent heating pad pasting still includes the second and leaves the type membrane, and the second leaves the type membrane adhesion and is in on the first surface of substrate layer and cover other regions except flexible circuit board. Generally, the second release film is a PC film, a PET film or a PVC film, and has the same thickness as the flexible circuit board. The second is from the adhesion of type membrane in the substrate layer first surface can play the supporting role to the substrate layer, and the heating pad pasting of being convenient for keeps flat in adhesion operation process to can improve the protectiveness of pasting the process. The second can have low viscidity glue film from the type membrane, can tear from the substrate layer after the heating pad pasting adheres to the display screen.
In a more preferable scheme, the flexible transparent heating film further comprises a third release film, and the third release film is adhered on the flexible circuit board and the second release film. Generally, the third release film is a PC film, a PET film or a PVC film, and has a thickness of not less than 100 μm. The third is from type membrane adhesion on flexible circuit board and second are from the type membrane, can play the supporting role from the type membrane to flexible circuit board and second in the bonding process, avoids from this in the adhesion process, and the heating pad pasting is excessive in the gap department bending of type membrane at flexible circuit board and second to can improve the protectiveness of pasting the process, avoid flexible circuit board binding position the cracked condition to appear in bonding operation in-process.
Compared with the prior art, the utility model, have following advantage:
the substrate layer in the flexible transparent heating film adopts the colorless polyimide film with the thickness not more than 50 mu m, and the flexible circuit board is arranged in the peripheral area of the substrate layer, because the colorless polyimide film has the characteristics of high material strength and good flexibility, and the flexible circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, the flexible transparent heating film has good bending resistance, can be attached to a display screen with a bending radian, and has small stress generated by the adhesion on the display screen with the bending radian, thereby ensuring that the flexible transparent heating film is not easy to peel off from the screen body of the display screen when being heated.
Drawings
Fig. 1 is a schematic structural diagram of a first preferred embodiment of the present invention.
Fig. 2 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 1.
Fig. 3 is a schematic structural diagram of a second preferred embodiment of the present invention.
Fig. 4 is a sectional view B-B of fig. 3.
Detailed Description
Example one
As shown in fig. 1 and fig. 2, the flexible transparent heating film comprises a substrate layer 1, a flexible circuit board 2 and a transparent electrothermal film 3 with a heating circuit; the substrate layer 1 is a colorless polyimide film with the thickness of less than or equal to 50 mu m; the transparent electrothermal film 3 is arranged on the first surface of the substrate layer 1; the flexible circuit board 2 is arranged in the peripheral area of the base material layer 1, and the circuit of the flexible circuit board 2 is electrically connected with the heating circuit of the transparent electrothermal film 3; and a transparent adhesive sticker layer 4 is arranged on the second surface of the substrate layer 1.
In the present embodiment, the thickness of the flexible circuit board 2 is 100 μm to 200 μm.
In this embodiment, the adhesive layer 4 is a silica gel layer or an acrylic resin coating layer, and the thickness thereof is 10 to 50 μm. The adhesive sticker layer 4 is used for adhering the heating film on a screen body of a display, and has better temperature resistance.
Because the heating pad pasting is too soft, for the convenience of pasting the operation such as it, in this embodiment, non-setting adhesive layer 4 coats and is stamped first release liner 5. The first release film 5 may be a PC film, a PET film or a PVC film, and has a thickness of generally not less than 100 μm. The first type film 5 of leaving can play the guard action to non-setting adhesive layer 4 to play the supporting role to flexible circuit board 2 in packing, transportation, thereby guarantee the storage transportation of heating pad pasting.
Example two
Referring to fig. 3 and 4, in the case that the other parts are the same as the first embodiment, the difference is that: in this embodiment, the flexible transparent heating film further includes a second release film 6, and the second release film 6 is adhered to the first surface of the substrate layer 1 and covers other regions except the flexible circuit board 2. The second is from type membrane 6 and adopts PC membrane, PET membrane or PVC membrane, and its thickness is the same with flexible circuit board 2's thickness. The second is from type membrane 6 adhesion on substrate layer 1 first surface, can play the supporting role to substrate layer 1, and the heating pad pasting of being convenient for keeps flat in adhesion operation process to can improve the protectiveness of pasting the process. The second is equipped with first low viscose layer 61 from type membrane 6, can tear from substrate layer 1 after the adhesion of heating pad pasting is in the display screen.
In this embodiment, the flexible transparent heating film further includes a third release film 7, and the third release film 7 is adhered to the flexible circuit board 2 and the second release film 6 through a second low-adhesive layer 71. The third release film 7 is a PC film, a PET film or a PVC film, and the thickness thereof is not less than 100 μm. The third is from type membrane 7 adhesion on flexible circuit board 2 and second are from type membrane 6, can play the supporting role to flexible circuit board 2 and second from type membrane 6 in the bonding process, avoids from this in the adhesion process, and the heating pad pasting is excessive in flexible circuit board 2 and the second is crooked from the gap department of type membrane 6 to can improve the protectiveness of pasting the process, avoid the condition that flexible circuit board 2 binding site appears breaking in bonding operation in-process.
In addition, it should be noted that the names of the various parts of the embodiments described in the present specification may be different, and all the equivalent or simple changes made according to the structures, characteristics and principles of the present invention are included in the protection scope of the present invention. Those skilled in the art can modify or supplement the described embodiments or substitute them in a similar manner without departing from the scope of the invention as defined by the claims.
Claims (8)
1. The utility model provides a flexible transparent heating pad pasting, includes the substrate layer and has heating circuit's transparent electric heat membrane, transparent electric heat membrane sets up on the first surface of substrate layer, its characterized in that: the substrate layer is a colorless polyimide film with the thickness of less than or equal to 50 mu m; the flexible transparent heating film further comprises a flexible circuit board, the flexible circuit board is arranged in the peripheral area of the base material layer, and the circuit of the flexible circuit board is electrically connected with the heating circuit of the transparent electric heating film.
2. The flexible transparent heating film according to claim 1, wherein: and a transparent non-drying adhesive layer is arranged on the second surface of the base material layer.
3. The flexible transparent heating film according to claim 2, wherein: the non-drying glue layer is an acrylic resin coating.
4. The flexible transparent heating film as set forth in claim 2, wherein: the non-drying glue layer is a silica gel layer.
5. The flexible transparent heating film according to claim 2, wherein: the adhesive sticker layer is covered with a first release film.
6. The flexible transparent heating film according to any one of claims 1 to 5, wherein: the flexible transparent heating film further comprises a second release film, and the second release film is adhered to the first surface of the base material layer and covers other areas except the flexible circuit board.
7. The flexible transparent heating film of claim 6, wherein: the thickness of the second release film is the same as that of the flexible circuit board.
8. The flexible transparent heating film of claim 6, wherein: the flexible transparent heating pad pasting still includes the third from the type membrane, and the third is from the type membrane adhesion in flexible circuit board with the second is from on the type membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222327659.0U CN218071831U (en) | 2022-09-02 | 2022-09-02 | Flexible transparent heating pad pasting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222327659.0U CN218071831U (en) | 2022-09-02 | 2022-09-02 | Flexible transparent heating pad pasting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218071831U true CN218071831U (en) | 2022-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222327659.0U Active CN218071831U (en) | 2022-09-02 | 2022-09-02 | Flexible transparent heating pad pasting |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218071831U (en) |
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2022
- 2022-09-02 CN CN202222327659.0U patent/CN218071831U/en active Active
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