CN218745516U - Laser processing device - Google Patents

Laser processing device Download PDF

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Publication number
CN218745516U
CN218745516U CN202223097327.4U CN202223097327U CN218745516U CN 218745516 U CN218745516 U CN 218745516U CN 202223097327 U CN202223097327 U CN 202223097327U CN 218745516 U CN218745516 U CN 218745516U
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China
Prior art keywords
laser
component
laser processing
processing apparatus
plate
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CN202223097327.4U
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Chinese (zh)
Inventor
王良法
朱智坤
郭建
陈锐
顾新华
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Changxing Xingyao Laser Equipment Technology Co ltd
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Wenzhou Xingyao Laser Technology Co ltd
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Priority to CN202223097327.4U priority Critical patent/CN218745516U/en
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Abstract

The utility model discloses a laser processing device, which comprises a base, wherein a laser generating mechanism, a vertical plate and a mounting seat which are vertically arranged are arranged on the base, the vertical plate and the mounting seat are fixedly arranged at two sides of the laser generating mechanism to clamp the laser generating mechanism, a reflecting component is arranged on the laser generating mechanism, and the reflecting component corresponds to the output end of the laser generating mechanism; install lifting unit on the mount pad, the last mirror subassembly that shakes of installing of lifting unit, the mirror subassembly that shakes corresponds with the reflection component output, and in the course of the work, laser generation mechanism and reflection component do not have any action, consequently can not lead to the fact the influence to any optical component to guarantee the stability of light path, secondly laser generation component adopts the mode of erectting and placing, and can not move, has saved the space that equipment occupy greatly.

Description

Laser processing device
Technical Field
The utility model belongs to the technical field of the processing equipment, specifically a laser processing device.
Background
The laser application can process various metals and non-metals due to the excellent physical property, particularly can process high-hardness materials, and is suitable for fine processing of high-end materials. For example, patent publication CN217193269U, a laser processing device and a processing apparatus are summarized as including a moving device, a laser is mounted on the moving device, an air nozzle is mounted at an output end of the laser, the moving device and the laser control the laser to move up and down, and laser generated by the laser is emitted from the air nozzle; as can be seen from fig. 1, the laser is transversely disposed and has a certain length, so that a relatively large space is required to be occupied for driving the laser to move;
in addition, various optical components are arranged in the laser to complete the processes of energy gathering, reflection, beam expanding and the like, a coherent light path can be formed in the secondary process, but the moving device drives the laser to move integrally, so that the conditions of vibration and the like can occur in the moving process, the optical components are displaced, and the hidden trouble of light path deviation is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a laser processing device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a laser processing device comprises a base, wherein a laser generating mechanism, a vertical plate and a mounting seat which are vertically arranged are arranged on the base, the vertical plate and the mounting seat are fixedly arranged on two sides of the laser generating mechanism to clamp the laser generating mechanism, a reflecting component is arranged on the laser generating mechanism, and the reflecting component corresponds to the output end of the laser generating mechanism;
install lifting unit on the mount pad, the last mirror subassembly that shakes of installing of lifting unit, the mirror subassembly that shakes corresponds with the reflection assembly output.
Further technical scheme, the height homogeneous phase of riser, laser emergence mechanism and mount pad is the same, the reflection component sets firmly in the upper end of riser and mount pad to take place the mechanism upper end with laser and offset.
According to the further technical scheme, after laser emitted by the laser generating mechanism is processed by the reflecting assembly, a vertically downward laser beam is formed, and the laser beam enters the galvanometer assembly.
Further technical scheme, the reflection assembly includes the fixed plate, install the first reflection part, the second reflection part and the third reflection part that the right angle distributes on the fixed plate, install the beam expander between the third reflection part and the second reflection part, correspond and be equipped with the input hole on the fixed plate for the first reflection part, the input hole corresponds with laser generation mechanism's output, corresponds and is equipped with the delivery outlet on the fixed plate for the third reflection part, the delivery outlet corresponds with the mirror subassembly that shakes.
According to the technical scheme, the vibrating mirror assembly comprises a vibrating mirror body installed on the lifting assembly, a reflecting portion IV communicated with the vibrating mirror body is installed on one side of the vibrating mirror body, and the reflecting portion IV corresponds to the output hole.
According to the further technical scheme, the base is further provided with a two-dimensional adjusting frame, and the two-dimensional adjusting frame corresponds to the galvanometer component.
According to a further technical scheme, the two-dimensional adjusting frame comprises a bottom plate, a partition plate and a support plate which are arranged from bottom to top, an X-axis position adjusting mechanism is arranged between the bottom plate and the partition plate, and a Y-axis position adjusting mechanism is arranged between the partition plate and the support plate.
According to the technical scheme, the X-axis position adjusting mechanism comprises a sliding rail fixedly arranged on the bottom plate, the sliding rail penetrates through a connecting block arranged at the bottom of the partition plate, so that the connecting block can slide relative to the sliding rail, and a locking pin is connected to the connecting block in a threaded manner and can abut against the sliding rail.
According to the further technical scheme, the sliding rail is connected with a plurality of sliding blocks in a sliding mode, and the sliding blocks are fixedly arranged at the bottom of the partition plate.
According to the further technical scheme, the Y-axis position adjusting mechanism and the X-axis position adjusting mechanism are identical in structure.
The utility model has the advantages that:
in the working process, the laser generating mechanism and the reflecting component do not move, so that any optical component is not influenced, the stability of a light path is ensured, and the laser generating component is vertically placed and does not move, so that the space occupied by equipment is greatly saved;
secondly, the vertical plate, the mounting seat, the reflecting component and the base form a four-side clamping state for the laser generating mechanism, so that the laser generating mechanism and the four components form a whole, and the stability of a light path is ensured; and the relative position of the reflecting component and the laser generating mechanism is fixed, so that the stability of a laser beam emitted to the reflecting component by the laser generating mechanism can be ensured, and the hidden danger of light path deviation is avoided.
Other features and advantages of the present invention will be described in detail in the detailed description which follows.
Drawings
FIG. 1: the utility model discloses a three-dimensional structure picture one.
FIG. 2: the utility model discloses a spatial structure chart two.
FIG. 3: the utility model discloses a reflection assembly and mirror subassembly structure chart that shakes.
FIG. 4: the utility model discloses a two-dimentional alignment jig structure picture.
Reference numerals: 1-base, 2-laser generating mechanism, 3-vertical plate, 4-mounting base, 5-reflecting assembly, 51-fixing plate, 52-first reflecting part, 53-second reflecting part, 54-third reflecting part, 55-beam expander, 56-input hole, 57-output hole, 6-lifting assembly, 7-galvanometer assembly, 71-galvanometer body, 72-fourth reflecting part, 8-two-dimensional adjusting frame, 81-bottom plate, 82-clapboard, 83-carrier plate, 84-X axis position adjusting mechanism, 841-sliding rail, 842-connecting block, 843-locking pin, 844-sliding block and 85-Y axis position adjusting mechanism.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Please refer to fig. 1-4;
the utility model discloses a laser processing device, which comprises a base 1, wherein a laser generating mechanism 2, a vertical plate 3 and a mounting seat 4 which are vertically arranged are arranged on the base 1, in the embodiment, the vertical plate 3 and the mounting seat 4 are fixedly arranged at two sides of the laser generating mechanism 2 to clamp the laser generating mechanism, a reflecting component 5 is arranged on the laser generating mechanism 2, and the reflecting component 5 corresponds to the output end of the laser generating mechanism 2; a lifting assembly 6 is arranged on the mounting seat 4, a galvanometer assembly 7 is arranged on the lifting assembly 6, and the galvanometer assembly 7 corresponds to the output end of the reflecting assembly 5;
when the device works, the galvanometer component 7 adjusts the corresponding height through the lifting component 6 according to preset data, then the laser generating mechanism 2 is started to emit laser beams to the reflecting component 5, the laser beams are reflected into the galvanometer component 7 after being processed by the reflecting component 5, and the laser beams are emitted onto a workpiece to be processed after being processed by the galvanometer component 7;
in the process, the laser generating mechanism 2 and the reflecting component 5 do not move, so that any optical component is not influenced, the stability of a light path is ensured, and the laser generating component is vertically placed and does not move, so that the space occupied by equipment is greatly saved;
in the embodiment, the heights of the vertical plate 3, the laser generating mechanism 2 and the mounting seat 4 are the same, the reflecting component 5 is fixedly arranged at the upper ends of the vertical plate 3 and the mounting seat 4 and is abutted against the upper end of the laser generating mechanism 2, and the laser generating mechanism 2 is clamped on four sides by the vertical plate 3, the mounting seat 4, the reflecting component 5 and the base 1, so that the laser generating mechanism 2 and the four components form a whole, and the stability of a light path is ensured; and the relative position of the reflecting component 5 and the laser generating mechanism 2 is fixed, so that the stability of a laser beam emitted to the reflecting component 5 by the laser generating mechanism 2 can be ensured, and the hidden danger of light path deviation is avoided.
In the utility model, the galvanometer component 7 moves up and down through the lifting component 6, if the laser beam processed by the laser generating mechanism 2 through the reflecting component 5 is still transversely emitted, the laser beam can be guided into the galvanometer component 7 by additionally arranging a laser conversion direction device; the reflection assembly 5 in this embodiment is internally adjusted to output the laser beam vertically downward.
The specific structure of the reflection assembly 5 comprises a fixed plate 51, wherein a first reflection part 52, a second reflection part 53 and a third reflection part 54 which are distributed at a right angle are installed on the fixed plate 51, a beam expander 55 is installed between the third reflection part 54 and the second reflection part 53, an input hole 56 is formed in the fixed plate 51 corresponding to the first reflection part 52, the input hole 56 corresponds to the output end of the laser generating mechanism 2, an output hole 57 is formed in the fixed plate 51 corresponding to the third reflection part 54, and the output hole 57 corresponds to the galvanometer assembly 7;
the laser beam enters from the input port, sequentially passes through the first reflecting part 52, the second reflecting part 53, the beam expander 55 and the third reflecting part 54 to form an L-shaped light path, and finally passes through the third reflecting part 54 to emit the laser beam from the output hole 57 to the galvanometer assembly 7.
In this embodiment, the galvanometer assembly 7 includes a galvanometer body 71 mounted on the lifting assembly 6, a reflecting portion four 72 communicated with the galvanometer body 71 is mounted on one side of the galvanometer body 71, and the reflecting portion four 72 corresponds to the output hole 57.
The laser processing device of the utility model is also provided with a two-dimensional adjusting frame 8 on the base 1, the two-dimensional adjusting frame 8 is used for loading a workpiece to be processed or loading a jig, and the adjusting frame can adjust the front, back, left and right positions of the loaded object, thereby determining the processing position;
the mechanism of the two-dimensional adjusting frame 8 comprises a bottom plate 81, a partition plate 82 and a support plate 83 which are arranged from bottom to top, an X-axis position adjusting mechanism 84 is arranged between the bottom plate 81 and the partition plate 82, a Y-axis position adjusting mechanism 85 is arranged between the partition plate 82 and the support plate 83, the position of the partition plate 82 relative to the bottom plate 81 along the X axis is controlled through the X-axis position adjusting mechanism 84, the position of the support plate 83 relative to the partition plate 82 along the Y axis is controlled through the Y-axis position adjusting mechanism 85, and therefore adjustment of the plane position is achieved;
in the present embodiment, the Y-axis position adjustment mechanism 85 and the X-axis position adjustment mechanism 84 have the same structure, and therefore the operation principle is the same, and the structure of the X-axis position adjustment mechanism 84 will be described as an example below;
the sliding rail 841 is fixedly arranged on the bottom plate 81, the sliding rail 841 penetrates through a connecting block 842 arranged at the bottom of the partition plate 82, so that the connecting block 842 can slide relative to the sliding rail 841, a locking pin 843 is connected with the connecting block 842 in a threaded manner, and the locking pin 843 can be abutted against the sliding rail 841; in a normal state, the lock pin 843 abuts against the slide rail 841, so that the connecting block 842 cannot move relative to the slide rail 841, when the position needs to be adjusted, the lock pin 843 is unscrewed, the connecting block 842 can move relative to the slide rail 841, after the position is adjusted, the lock pin 843 is screwed down, so that the lock pin 843 abuts against the slide rail 841 again, and at the moment, the relative position of the partition plate 82 and the bottom plate 81 is fixed;
further, in order to improve the smoothness of the movement of the partition 82, a plurality of sliders 844 are slidably connected to the sliding rail 841, and the sliders 844 are fixedly arranged at the bottom of the partition 82.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims (10)

1. A laser processing device, includes base (1), its characterized in that: the laser generation mechanism is characterized in that a laser generation mechanism (2), a vertical plate (3) and a mounting seat (4) which are vertically arranged are arranged on the base (1), the vertical plate (3) and the mounting seat (4) are fixedly arranged on two sides of the laser generation mechanism (2) to clamp the laser generation mechanism, a reflection assembly (5) is arranged on the laser generation mechanism (2), and the reflection assembly (5) corresponds to the output end of the laser generation mechanism (2);
install lifting unit (6) on mount pad (4), install mirror subassembly (7) that shakes on lifting unit (6), mirror subassembly (7) that shakes corresponds with reflection assembly (5) output.
2. A laser processing apparatus according to claim 1, wherein: the height homogeneous phase of riser (3), laser emergence mechanism (2) and mount pad (4) is the same, reflection component (5) set firmly in the upper end of riser (3) and mount pad (4) to it offsets with laser emergence mechanism (2) upper end.
3. A laser processing apparatus according to claim 2, wherein: the laser emitted by the laser generating mechanism (2) is processed by the reflecting component (5) to form a vertical and downward laser beam, and the laser beam enters the galvanometer component (7).
4. A laser processing apparatus according to claim 3, wherein: reflection subassembly (5) are including fixed plate (51), install reflecting part one (52), reflecting part two (53) and reflecting part three (54) that the right angle distributes on fixed plate (51), install beam expander mirror (55) between reflecting part three (54) and reflecting part two (53), correspond reflecting part one (52) and be equipped with input hole (56) on being located fixed plate (51), input hole (56) correspond with laser generation mechanism (2) output, correspond reflecting part three (54) and be equipped with delivery outlet (57) on being located fixed plate (51), delivery outlet (57) correspond with mirror subassembly (7) that shakes.
5. A laser processing apparatus according to claim 4, wherein: the galvanometer component (7) comprises a galvanometer body (71) installed on the lifting component (6), a reflecting part four (72) communicated with the galvanometer body (71) is installed on one side of the galvanometer body (71), and the reflecting part four (72) corresponds to the output hole (57).
6. A laser processing apparatus according to claim 5, wherein: still install two-dimentional alignment jig (8) on base (1), two-dimentional alignment jig (8) correspond with mirror assembly (7) that shakes.
7. A laser processing apparatus according to claim 6, wherein: the two-dimensional adjusting frame (8) comprises a bottom plate (81), a partition plate (82) and a support plate (83) which are arranged from bottom to top, an X-axis position adjusting mechanism (84) is arranged between the bottom plate (81) and the partition plate (82), and a Y-axis position adjusting mechanism (85) is arranged between the partition plate (82) and the support plate (83).
8. A laser processing apparatus according to claim 7, wherein: the X-axis position adjusting mechanism (84) comprises a sliding rail (841) fixedly arranged on the bottom plate (81), the sliding rail (841) penetrates through a connecting block (842) arranged at the bottom of the partition plate (82) to enable the connecting block (842) to slide relative to the sliding rail (841), the connecting block (842) is in threaded connection with a locking pin (843), and the locking pin (843) can abut against the sliding rail (841).
9. A laser processing apparatus according to claim 8, wherein: the sliding rail (841) is connected with a plurality of sliding blocks (844) in a sliding mode, and the sliding blocks (844) are fixedly arranged at the bottom of the partition plate (82).
10. A laser processing apparatus according to claim 9, wherein: the Y-axis position adjusting mechanism (85) and the X-axis position adjusting mechanism (84) have the same structure.
CN202223097327.4U 2022-11-22 2022-11-22 Laser processing device Active CN218745516U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223097327.4U CN218745516U (en) 2022-11-22 2022-11-22 Laser processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223097327.4U CN218745516U (en) 2022-11-22 2022-11-22 Laser processing device

Publications (1)

Publication Number Publication Date
CN218745516U true CN218745516U (en) 2023-03-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223097327.4U Active CN218745516U (en) 2022-11-22 2022-11-22 Laser processing device

Country Status (1)

Country Link
CN (1) CN218745516U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116571875A (en) * 2023-07-13 2023-08-11 西南交通大学 Laser processing and detecting integrated equipment and method based on active projection technology

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116571875A (en) * 2023-07-13 2023-08-11 西南交通大学 Laser processing and detecting integrated equipment and method based on active projection technology
CN116571875B (en) * 2023-07-13 2023-11-03 西南交通大学 Laser processing and detecting integrated equipment and method based on active projection technology

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GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20240306

Address after: 313000 East side of the first floor, Building 8, National University Science Park Headquarters, No. 669, High speed Railway, the Taihu Lake Street, Changxing County, Huzhou City, Zhejiang Province

Patentee after: Changxing Xingyao Laser Equipment Technology Co.,Ltd.

Country or region after: China

Address before: Room 201, Floor 2, Building 21, Wenzhou National University Science Park, No. 89, Fengfang Road, Wutian Street, Ouhai District, Wenzhou City, Zhejiang Province, 325036

Patentee before: Wenzhou Xingyao Laser Technology Co.,Ltd.

Country or region before: China

TR01 Transfer of patent right