CN218743001U

CN218743001U - Quick drying device of automatic dispensing chip mounter

Info

Publication number: CN218743001U
Application number: CN202222972948.6U
Authority: CN
Inventors: 曹晟; 陈忠发
Original assignee: Wujiang Nanlian Electronics Co ltd
Current assignee: Wujiang Nanlian Electronics Co ltd
Priority date: 2022-11-09
Filing date: 2022-11-09
Publication date: 2023-03-28
Anticipated expiration: 2032-11-09

Abstract

The utility model discloses a quick-drying device of an automatic adhesive dispensing chip mounter, which comprises an operation table and a support frame which is arranged on the operation table and is in an inverted L shape, wherein an adhesive dispensing head for dispensing a PCB is arranged on the support frame, and a driving mechanism for dispensing the PCB by the adhesive dispensing head is arranged between the adhesive dispensing head and the support frame; the PCB drying machine comprises a support frame, wherein a working station for placing a PCB is arranged on the operating table, a drying mechanism for drying after dispensing and pasting is arranged at the bottom of the support frame, the drying mechanism comprises a heating cavity arranged at the bottom of the support frame, and a heating resistor is arranged in the heating cavity; the utility model discloses an air supply pipe accesss to the intracavity that heats with external wind to make the intracavity that heats maintain certain temperature through heating resistor work, later through the work of air guide motor, make the intracavity that heats hot-blast through guide duct and wind scooper cooperate, make can be with hot-blast conduction on the PCB board on the station, thereby accelerate drying rate, increased work efficiency.

Description

Quick drying device of automatic dispensing chip mounter

Technical Field

The utility model relates to a quick-drying device specifically is an automatic quick-drying device of chip mounter is glued to point.

Background

At present, a dispensing chip mounter is generally a device capable of quickly and accurately mounting some electronic components to a pad position designated by a PCB, and in the manufacturing process of an electronic product, the dispensing chip mounter has a dispensing process to achieve bonding between the PCB and the electronic components, thereby achieving the effect of wrapping pins of the components.

In the existing device, after the chip is mounted, the PCB needs to be timely removed from the operation table, so that some electrons and devices are easy to fall off from the PCB due to undried glue when the PCB is removed from the operation table through a production line, and the PCB is damaged, and therefore, the electronic components after being glued and mounted need to be dried, the electronic components are generally dried by a fan in the prior art, but when the glue is coated too much, the glue is easy to overflow by air flow generated by the fan; while adversely affecting the patch operation of other devices.

SUMMERY OF THE UTILITY MODEL

In order to solve the problems that in the prior art, some electrons and devices are easy to fall off from a PCB due to undried glue when the electronic components are taken down from an operation table, so that the damage of the PCB is caused, the electronic components after glue dispensing and surface mounting are required to be dried, the electronic components are generally dried by a fan in the prior art, but when the glue is coated too much, the glue is easy to overflow due to air flow generated by the fan; and the paster work of giving other devices brings adverse effect's defect, the utility model provides an automatic point is glued quick-drying device of chip mounter.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model relates to a quick-drying device of automatic adhesive dispensing chip mounter, including the operation panel and set up on the operation panel and be the support frame of type of falling L, be equipped with the dispensing head that carries out the point to the PCB board on the support frame, be equipped with between dispensing head and the support frame and supply the dispensing head to carry out the actuating mechanism that the point was glued to the PCB board; the drying mechanism comprises a heating cavity arranged at the bottom of the support frame, a heating resistor is arranged in the heating cavity, an air guide pipe is arranged at the bottom of the heating cavity, an air guide cover is arranged at the air outlet end of the air guide pipe, and an air guide motor for guiding air to the station is arranged on the air guide pipe; the heating cavity is provided with an air supply pipe; the air outlet end of the air guide cover is provided with a buffer mechanism for buffering air flow, the buffer mechanism comprises a first air resistance plate arranged on the inner wall of the air guide cover, and a second air resistance plate is arranged on the inner wall of the air guide cover from bottom to top and at the opposite position.

As a preferred technical scheme of the utility model, actuating mechanism is including setting up the fixed plate at the support frame both ends, be equipped with the transmission lead screw between the fixed plate, be equipped with on the transmission lead screw along transmission lead screw pivoted sliding sleeve, be equipped with the arm on the sliding sleeve, the head is glued to the point is fixed in the bottom of arm.

The utility model discloses an optimal technical scheme, the both ends of station are equipped with the purification mechanism that purifies the PCB board, purify the mechanism including setting up the cover of breathing in the station both sides, the cover of breathing in passes through the air duct and connects outside purifier, be equipped with the motor of bleeding of outwards bleeding on the air duct.

As an optimized technical scheme of the utility model, be equipped with the dust screen between the air-out end of guide duct and the wind scooper.

As an optimized technical scheme of the utility model, be equipped with the air supply motor to the air supply of heating intracavity on the blast pipe.

As an optimal technical scheme of the utility model, first windage board, second windage board are the slope setting.

As an optimized technical scheme of the utility model, be equipped with drive transmission lead screw pivoted driving motor on the fixed plate.

The utility model has the advantages that: according to the quick drying device of the automatic dispensing chip mounter, the driving screw rod is driven to rotate through the driving motor, so that the sliding sleeve slides along the driving screw rod, the dispensing head on the mechanical arm of the synchronous driving mechanical arm reaches the position right above a station, and then the dispensing head can perform dispensing treatment on a PCB through multi-angle rotation of the mechanical arm; after the dispensing and the pasting are finished, the air supply motor works, outside air is led into the heating cavity through the air supply pipe, the heating cavity is kept at a certain temperature through the work of the heating resistor, and then hot air in the heating cavity is matched with the air guide pipe and the air guide cover through the work of the air guide motor, so that the hot air can be conducted onto the PCB on the station, the drying speed is accelerated, and the working efficiency is improved; the first wind resistance plate and the second wind resistance plate in the wind scooper are matched with each other, so that the air flow flowing to the station through the wind scooper is subjected to a slow flow effect, the speed of the air flow is reduced to a certain degree, and glue is not easy to overflow; secondly before the point is glued and the in-process is glued through the motor work of bleeding for dust gets rid of through the air duct around the PCB board, and get rid of through the air duct simultaneously with leaving over the hot-blast of last time, not only reached certain purifying effect, also prevented to lead to the point gluing to dry in advance and lead to can not in time carry out paster work because of leaving over hot-blast.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural view of a quick drying device of an automatic adhesive dispensing chip mounter according to the present invention;

fig. 2 is a side view of the drying mechanism of the quick drying device of the automatic adhesive dispensing chip mounter according to the present invention;

fig. 3 is a schematic structural view of a buffering mechanism of a quick drying device of an automatic adhesive dispensing chip mounter according to the present invention;

fig. 4 is a schematic structural diagram of a purification mechanism of a quick drying device of an automatic adhesive dispensing chip mounter.

In the figure: 1. an operation table; 2. a support frame; 3. dispensing a glue head; 4. a station; 5. a heating cavity; 6. a heating resistor; 7. an air guide pipe; 8. a wind scooper; 9. an air supply pipe; 10. a fixing plate; 11. a transmission screw rod; 12. a sliding sleeve; 13. a mechanical arm; 14. an air intake cover; 15. an air duct; 16. a dust screen; 17. an air supply motor; 18. a wind guide motor; 19. an air extraction motor; 20. a first wind resistance plate; 21. a second wind resistance plate.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Example (b): as shown in fig. 1, fig. 2, fig. 3 and fig. 4, the quick drying device of an automatic adhesive dispensing chip mounter of the present invention includes an operation table 1 and a support frame 2 disposed on the operation table 1 and in an inverted L shape, wherein a dispensing head 3 for dispensing a PCB is disposed on the support frame 2, and a driving mechanism for dispensing the PCB by the dispensing head 3 is disposed between the dispensing head 3 and the support frame 2; a station 4 for placing a PCB is arranged on the operating platform 1, a drying mechanism for drying after dispensing and pasting is arranged at the bottom of the support frame 2, the drying mechanism comprises a heating cavity 5 arranged at the bottom of the support frame 2, a heating resistor 6 is arranged in the heating cavity 5, an air guide pipe 7 is arranged at the bottom of the heating cavity 5, an air guide cover 8 is arranged at the air outlet end of the air guide pipe 7, and an air guide motor 18 for guiding air to the station 4 is arranged on the air guide pipe 7; the heating cavity 5 is provided with an air supply pipe 9; the air outlet end of the air guide cover 8 is provided with a buffer mechanism for buffering air flow, the buffer mechanism comprises a first wind resistance plate 20 arranged on the inner wall of the air guide cover 8, and the inner wall of the air guide cover 8 is provided with a second wind resistance plate 21 from bottom to top and at a relative position; the driving motor drives the transmission screw rod 11 to rotate, so that the sliding sleeve 12 slides along the transmission screw rod 11, the dispensing head 3 on the mechanical arm 13 is synchronously driven to reach the position right above the station 4, and then the dispensing head 3 can perform dispensing treatment on the PCB through multi-angle rotation of the mechanical arm 13; after the dispensing and the pasting are finished, the air supply motor 17 works, outside air is led into the heating cavity 5 through the air supply pipe 9, the heating cavity 5 is kept at a certain temperature through the work of the heating resistor 6, and then hot air in the heating cavity 5 is matched through the air guide pipe 7 and the air guide cover 8 through the work of the air guide motor 18, so that the hot air can be conducted onto the PCB on the station 4, the drying speed is accelerated, and the working efficiency is increased; and through setting up the first wind-resistance board 20 and the mutual cooperation of second wind-resistance board 21 in the wind-guiding cover 8 for the air current that flows to station 4 through the wind-guiding cover 8 obtains the unhurried current effect, has reduced the speed of air current to a certain degree, thereby makes glue be difficult to overflow and glue.

Wherein, set up the temperature sensor in the heating chamber 5 on to detect the temperature in the heating chamber 5, when the temperature reaches the heating temperature in the heating chamber 5, just carry out initiative work by the heating resistor 6

Wherein, actuating mechanism is equipped with transmission lead screw 11 including setting up the fixed plate 10 at support frame 2 both ends between the fixed plate 10, is equipped with on the transmission lead screw 11 along transmission lead screw 11 pivoted sliding sleeve 12, is equipped with arm 13 on the sliding sleeve 12, and dispensing head 3 is fixed in the bottom of arm 13.

Wherein, arm 13 is prior art, can help dispensing head 3 to carry out the point to the pad position on the PCB board by the multi-angle.

Wherein, the two ends of the station 4 are provided with purification mechanisms for purifying the PCB, the purification mechanisms comprise air suction covers 14 arranged at the two sides of the station 4, the air suction covers 14 are connected with an external purification device through air guide pipes 15, and the air guide pipes 15 are provided with air suction motors 19 for exhausting air outwards; certain purifying effect has been reached, has also prevented to lead to glue drying in advance and lead to can not in time carrying out paster work because of leaving over hot-blast.

Wherein, a dust screen 16 is arranged between the air outlet end of the air guide pipe 7 and the air guide cover 8.

Wherein, the blast pipe 9 is provided with a blast motor 17 which blows air into the heating cavity 5.

The first wind resistance plate 20 and the second wind resistance plate 21 are both arranged obliquely.

Wherein, a driving motor for driving the transmission screw rod 11 to rotate is arranged on the fixing plate 10

When the automatic dispensing machine works, firstly, the driving screw rod 11 is driven to rotate through the driving motor, so that the sliding sleeve 12 slides along the driving screw rod 11, the dispensing head 3 on the mechanical arm 13 is synchronously driven to reach the position right above the station 4, and then the dispensing head 3 can perform dispensing treatment on a PCB through multi-angle rotation of the mechanical arm 13; after the dispensing and the pasting are finished, the air supply motor 17 works, outside air is led into the heating cavity 5 through the air supply pipe 9, the heating cavity 5 is kept at a certain temperature through the work of the heating resistor 6, and then the air guide motor 18 works, so that hot air in the heating cavity 5 is matched through the air guide pipe 7 and the air guide cover 8, the hot air can be conducted to the PCB on the station 4, the drying speed is accelerated, and the working efficiency is increased; the first wind resistance plate 20 and the second wind resistance plate 21 in the wind scooper 8 are matched with each other, so that the air flow flowing to the station 4 through the wind scooper 8 is delayed, the speed of the air flow is reduced to a certain degree, and glue is not easy to overflow; secondly before the point is glued and the in-process is glued through the work of air exhaust motor 19 for dust passes through air duct 15 around the PCB board and gets rid of, and get rid of the hot-blast air duct 15 that will leave over last time simultaneously, not only reached certain purifying effect, also prevented to lead to glue to dry in advance and lead to in time carrying out the paster work because of the hot-blast glue that leaves over.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A quick drying device of an automatic dispensing chip mounter comprises an operation table (1) and a support frame (2) which is arranged on the operation table (1) and is of an inverted L shape, and is characterized in that a dispensing head (3) for dispensing a PCB is arranged on the support frame (2), and a driving mechanism for dispensing the PCB by the dispensing head (3) is arranged between the dispensing head (3) and the support frame (2); a station (4) for placing a PCB is arranged on the operating platform (1), a drying mechanism for drying after dispensing and pasting is arranged at the bottom of the support frame (2), the drying mechanism comprises a heating cavity (5) arranged at the bottom of the support frame (2), a heating resistor (6) is arranged in the heating cavity (5), an air guide pipe (7) is arranged at the bottom of the heating cavity (5), an air guide cover (8) is arranged at the air outlet end of the air guide pipe (7), and an air guide motor (18) for guiding air to the station (4) is arranged on the air guide pipe (7); an air supply pipe (9) is arranged on the heating cavity (5); the air outlet end of the air guide cover (8) is provided with a buffer mechanism for buffering air flow, the buffer mechanism comprises a first air resistance plate (20) arranged on the inner wall of the air guide cover (8), and a second air resistance plate (21) is arranged on the inner wall of the air guide cover (8) from bottom to top and at the opposite position.

2. The quick drying device of an automatic dispensing chip mounter according to claim 1, wherein the driving mechanism comprises fixing plates (10) disposed at two ends of the supporting frame (2), a transmission lead screw (11) is disposed between the fixing plates (10), a sliding sleeve (12) rotating along the transmission lead screw (11) is disposed on the transmission lead screw (11), a mechanical arm (13) is disposed on the sliding sleeve (12), and the dispensing head (3) is fixed at the bottom of the mechanical arm (13).

3. The quick drying device of the automatic dispensing chip mounter according to claim 1, wherein both ends of the station (4) are provided with purification mechanisms for purifying the PCB, the purification mechanisms comprise air suction covers (14) arranged on both sides of the station (4), the air suction covers (14) are connected with an external purification device through air guide pipes (15), and air suction motors (19) for sucking air outwards are arranged on the air guide pipes (15).

4. The quick drying device of the automatic adhesive dispensing chip mounter according to claim 1, wherein a dust screen (16) is arranged between the air outlet end of the air guide pipe (7) and the air guide cover (8).

5. The quick drying device of the automatic dispensing chip mounter according to claim 1, wherein an air supply motor (17) for supplying air into the heating cavity (5) is provided on the air supply pipe (9).

6. The quick drying device of an automatic dispensing chip mounter according to claim 1, wherein said first and second windshields (20, 21) are both disposed obliquely.

7. The quick drying device of an automatic dispensing chip mounter according to claim 2, wherein a driving motor for driving the transmission screw rod (11) to rotate is provided on the fixing plate (10).