CN218735710U

CN218735710U - Electromagnetic wave-absorbing heat-conducting gasket

Info

Publication number: CN218735710U
Application number: CN202222595201.3U
Authority: CN
Inventors: 林观成
Original assignee: Shenzhen Meihong Electronic Technology Co ltd
Current assignee: Shenzhen Meihong Electronic Technology Co ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-03-24
Anticipated expiration: 2032-09-28

Abstract

The utility model relates to a gasket technical field just discloses an electromagnetism is inhaled ripples heat conduction gasket, including last gasket and lower gasket, it has first heat conduction silica gel layer with the lateral wall of gasket one side in opposite directions all to coat to go up the gasket, and goes up the gasket and all bond through first heat conduction silica gel layer carbon fiber weaving layer jointly with lower gasket, go up the gasket and all seted up a plurality of recesses with the opposite one end of lower gasket, and the inside of each recess all is filled with second heat conduction silica gel layer, and the inside on each second heat conduction silica gel layer is equallyd divide and has been distributed the silicon carbide granule, each the notch department of recess all fixes and is equipped with the silica gel cover, it has third heat conduction silica gel layer with the opposite one end of lower gasket all to coat to go up the gasket. This application can be when realizing better electromagnetism through carbon fibre and carborundum and inhale the wave effect, can possess better heat conductivility, can satisfy the installation demand of integrating electronic components.

Description

Electromagnetic wave-absorbing heat-conducting gasket

Technical Field

The application relates to the technical field of gaskets, in particular to an electromagnetic wave-absorbing heat-conducting gasket.

Background

In the installation of electronic devices, the heat-conducting gasket is one of the most common installation accessories, such as a ceramic heat-conducting gasket, a silicon rubber heat-conducting gasket and the like, and can be used for the installation of electronic components, so that on one hand, the electronic components and the equipment shell are kept insulated, and on the other hand, the heat generated during the operation of the electronic components can be timely led out for heat dissipation.

In the process of realizing the application, the inventor finds that at least the following problems exist in the technology, along with the development of electronic integration, although the heat dissipation requirement of an electronic element can be met by a common heat conduction gasket, because the integration level of the electronic element is higher, the mutual electromagnetic interference is easy to interfere the signal receiving and processing of an electronic product, and although a wave absorbing material is adhered on the gasket for wave absorption, the mode can block direct heat transfer between the gasket and the electronic element, and the use effect is poor, so that the electromagnetic wave absorbing heat conduction gasket is provided.

SUMMERY OF THE UTILITY MODEL

The purpose of this application is in order to solve among the prior art because electronic components's integrated level is higher, and electromagnetic interference each other easily disturbs electronic product's signal reception and processing, and although there is the mode of inhaling the ripples through pasting absorbing material on the gasket now, this kind of mode can block the direct heat transfer between gasket and the electronic components, the not good problem of result of use, and the electromagnetism heat conduction gasket that absorbs the ripples that provides.

In order to achieve the purpose, the following technical scheme is adopted in the application:

the utility model provides an electromagnetism wave-absorbing heat conduction gasket, includes gasket and lower gasket, it has first heat conduction silica gel layer with the equal coating of lateral wall of gasket one side in opposite directions down to go up the gasket, and goes up the gasket and all bond through first heat conduction silica gel layer jointly with lower gasket and have the carbon fiber weaving layer, go up the gasket and all seted up a plurality of recesses with the opposite one end of gasket down, and the inside of each recess all is filled with second heat conduction silica gel layer, and the inside on each second heat conduction silica gel layer is equallyd divide and is distributed the silicon carbide granule, each the notch department of recess all fixes being equipped with the silica gel cover, it has third heat conduction silica gel layer with the equal coating of the opposite one end of lower gasket to go up the gasket.

Preferably, it is protruding that the equal an organic whole of gasket and lower gasket one end in opposite directions is provided with a set of V-arrangement, and two sets of V-arrangements are the setting of staggering each other, the carbon fiber weaving layer is the wave setting along two sets of V-arrangements are protruding.

Preferably, each groove is arranged corresponding to the position of the V-shaped bulge on the same side.

Preferably, each heat dissipation through hole is formed in the side wall of each V-shaped protrusion, and each heat dissipation through hole is located in one end, close to the wave crest, of each V-shaped protrusion on the same side.

Preferably, the opposite ends of the upper gasket and the lower gasket are integrally provided with frame-shaped bulges, and the third heat-conducting silica gel layer is arranged in the frame-shaped bulges at the same side.

Preferably, release paper is bonded to the opposite ends of the two third heat-conducting silica gel layers.

Preferably, the cross section of each groove is in a trapezoidal shape, and the ratio of the groove depth of each groove to the total thickness of the upper gasket and the lower gasket is 1.

Compared with the prior art, this application provides an electromagnetism wave absorption heat conduction gasket, possesses following beneficial effect:

1. this electromagnetism wave-absorbing heat conduction gasket, last gasket through being equipped with, lower gasket, first heat conduction silica gel layer, the carbon fiber weaving layer, a groove, second heat conduction silica gel layer, the silicon carbide granule, mutually support on silica gel mounting and third heat conduction silica gel layer, utilize the carbon fiber weaving layer, can realize better ripples function of inhaling, reduce electromagnetic interference, and the carbon fiber weaving layer possesses better heat conduction heat transfer performance, and the stretch-proofing performance is good, and through the silicon carbide granule, can further improve the electromagnetism wave-absorbing performance, and cooperate first heat conduction silica gel layer, second heat conduction silica gel layer and third heat conduction silica gel layer, can realize better heat conductivity, can satisfy the installation demand of integrating electronic components.

2. This electromagnetism is inhaled ripples thermal gasket, protruding through the V-arrangement that is equipped with, can improve the rubbish stability between gasket and the lower gasket, and can improve the microwave absorbing effect of carbon fiber weaving layer.

The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, and when this application can realize better electromagnetic wave absorbing effect through carbon fiber and carborundum, can possess better heat conductivility, can satisfy the installation demand of integrating electronic components.

Drawings

Fig. 1 is a schematic structural view of an electromagnetic wave-absorbing heat-conducting gasket according to the present application;

fig. 2 is an enlarged view of a portion a of fig. 1.

In the figure: 1. an upper gasket; 2. a lower gasket; 3. a first heat-conducting silica gel layer; 4. a carbon fiber woven layer; 5. a groove; 6. a second heat-conducting silica gel layer; 7. silicon carbide particles; 8. sealing a silica gel sheet; 9. a third heat-conducting silica gel layer; 10. a V-shaped protrusion; 11. a heat dissipating through hole; 12. a frame-shaped protrusion; 13. and (4) release paper.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.

Referring to fig. 1-2, an electromagnetism wave-absorbing heat-conducting gasket, including last gasket 1 and lower gasket 2, the lateral wall of going up gasket 1 and lower gasket 2 one side in opposite directions all coats and has first heat conduction silica gel layer 3, and go up gasket 1 and lower gasket 2 and all bond through first heat conduction silica gel layer 3 jointly and have carbon fiber braid 4, the one end homogeneous body that goes up gasket 1 and lower gasket 2 in opposite directions is provided with a set of V-arrangement arch 10, and two sets of V-arrangement arch 10 are the setting of staggering each other, carbon fiber braid 4 is the wave setting along two sets of V-arrangement arch 10, through V-arrangement arch 10, both can improve the joint strength between gasket 1 and the lower gasket 2, can make carbon fiber braid 4 be the wave distribution again, do benefit to improving carbon fiber braid 4's absorbing effect.

Heat dissipation through-hole 11 has all been seted up to the lateral wall of each V-arrangement arch 10, and each heat dissipation through-hole 11 all is located the inside setting of the one end that homonymy V-arrangement arch 10 is close to crest department, through this kind of setting, can do benefit to the inside temperature of gasket 1 and lower gasket 2 and give off.

Go up gasket 1 and 2 opposite one ends of lower gasket and all seted up a plurality of recesses 5, each recess 5 all is corresponding setting with the protruding 10 position of homonymy V-arrangement, through this kind of setting, can avoid recess 5 to influence the bulk strength of gasket 1 or lower gasket 2.

Each recess 5's inside all is filled with second heat conduction silica gel layer 6, and the inside on each second heat conduction silica gel layer 6 is equallyd divide and is distributed silicon carbide particle 7, each recess 5's notch department all fixes and is equipped with silica gel mounting 8, each recess 5's cross-section all is "ladder" font setting, and each recess 5's the groove depth is 1 with the gross thickness proportion of last gasket 1 and lower gasket 2 for 4 settings, through this kind of setting, when can ensure that recess 5 satisfies the use, can reduce the excessive influence to last gasket 1 or 2 intensity of lower gasket.

Go up gasket 1 and the equal coating of the opposite one end of lower gasket 2 and have third heat conduction silica gel layer 9, it is protruding 12 with the equal an organic whole frame type that is provided with to go up gasket 1 and the opposite one end of lower gasket 2, two third heat conduction silica gel layers 9 all are located the inside setting of the protruding 12 of homonymy frame type, through protruding 12 of frame type, can protect the outer fringe department of third heat conduction silica gel layer 9, the opposite one end of two third heat conduction silica gel layers 9 all bonds and has from type paper 13, through from type paper 13, can protect the outer terminal surface of third heat conduction silica gel layer 9.

In this application, during the use, to treat that the electronic components of installation installs on last gasket 1 through third heat conduction silica gel layer 9, install gasket 2 in positions department such as equipment casing through third heat conduction silica gel layer 9 down, through third heat conduction silica gel layer 9, can in time derive the heat of electronic components during operation, and outwards transmit fast through second heat conduction silica gel layer 6 and first heat conduction silica gel layer 3 and carbon fiber weaving layer 4, thereby can do benefit to the heat dissipation, utilize carbon fiber weaving layer 4 and silicon carbide granule 7 simultaneously, can inhale the ripples to the electromagnetism and handle, thereby can effectively reduce the mutual electromagnetic interference of electronic components.

The above description is only for the preferred embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present application, and all equivalent substitutions and changes according to the technical solutions and the inventive concepts of the present application should be covered by the scope of the present application.

Claims

1. The utility model provides an electromagnetism wave-absorbing heat conduction gasket, includes gasket (1) and lower gasket (2), its characterized in that, go up gasket (1) and all coat with the lateral wall of lower gasket (2) one side in opposite directions and have first heat conduction silica gel layer (3), and go up gasket (1) and lower gasket (2) and all bond through first heat conduction silica gel layer (3) jointly and have carbon fiber weaving layer (4), go up gasket (1) and the opposite one end of lower gasket (2) and all seted up a plurality of recesses (5), and the inside of each recess (5) all is filled with second heat conduction silica gel layer (6), and the inside of each second heat conduction silica gel layer (6) is equallyd divide and is distributed silicon carbide particle (7), each the notch department of recess (5) all fixes and is equipped with silica gel cover (8), it has third heat conduction silica gel layer (9) to go up gasket (1) and the opposite one end of lower gasket (2) and all coat.

2. The electromagnetic wave absorbing and heat conducting gasket according to claim 1, wherein a set of V-shaped protrusions (10) are integrally formed at opposite ends of the upper gasket (1) and the lower gasket (2), the two sets of V-shaped protrusions (10) are arranged in a staggered manner, and the carbon fiber woven layer (4) is arranged in a wave shape along the two sets of V-shaped protrusions (10).

3. The electromagnetic wave absorbing and heat conducting gasket as claimed in claim 2, wherein each of said grooves (5) is disposed corresponding to the position of the V-shaped protrusions (10) on the same side.

4. The electromagnetic wave absorbing and heat conducting gasket according to claim 2, wherein the side wall of each V-shaped protrusion (10) is provided with a heat dissipating through hole (11), and each heat dissipating through hole (11) is disposed inside one end of the V-shaped protrusion (10) close to the wave crest on the same side.

5. The electromagnetic wave absorbing and heat conducting gasket according to claim 1, wherein frame-shaped protrusions (12) are integrally formed at opposite ends of the upper gasket (1) and the lower gasket (2), and the two third heat conducting silica gel layers (9) are arranged inside the frame-shaped protrusions (12) on the same side.

6. The electromagnetic wave absorbing and heat conducting gasket according to claim 1, wherein release paper (13) is adhered to opposite ends of the two third heat conducting silica gel layers (9).

7. The electromagnetic wave absorbing and heat conducting gasket according to claim 1, wherein the cross section of each groove (5) is in a shape like a Chinese character 'ji', and the ratio of the groove depth of each groove (5) to the total thickness of the upper gasket (1) and the lower gasket (2) is 1.