CN218735148U - Novel circuit board patch jumper wire - Google Patents
Novel circuit board patch jumper wire Download PDFInfo
- Publication number
- CN218735148U CN218735148U CN202222612132.2U CN202222612132U CN218735148U CN 218735148 U CN218735148 U CN 218735148U CN 202222612132 U CN202222612132 U CN 202222612132U CN 218735148 U CN218735148 U CN 218735148U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- copper
- conductive copper
- insulating substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The utility model discloses a novel circuit board patch jumper, wherein the upper surface of a middle insulating substrate is etched with an upper conductive copper foil, and the lower surface of the middle insulating substrate is etched with a lower conductive copper foil; the novel circuit board patch jumper is provided with a front copper pouring hole and a rear copper pouring hole, wherein the front copper pouring hole sequentially penetrates through the front end part of the upper conductive copper foil, the front end edge part of the middle insulating substrate and the front end part of the lower conductive copper foil from top to bottom, and the rear copper pouring hole sequentially penetrates through the rear end part of the upper conductive copper foil, the rear end edge part of the middle insulating substrate and the rear end part of the lower conductive copper foil from top to bottom; a front copper filling piece is arranged in the front copper filling hole, and a rear copper filling piece is arranged in the rear copper filling hole; the novel circuit board patch jumper further comprises a front tin-spraying layer and a rear tin-spraying layer. Through the structure design, the utility model has the advantages of novel in design, simple structure, not only can realize high-speed chip mounter automated production operation, can also improve metal paster wire jumper both ends yielding not enough plane and cause the bad problem of tinning.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a new-type circuit board paster wire jumper.
Background
In the design process of a single-sided circuit board, the following situations are often encountered, specifically: there are multiple circuits across which it is necessary; to the above situation, the prior art generally adopts plug-in tin-plated iron wires or adopts metal patch jumper wires to solve.
Wherein, for the mode of adopting the tinned iron wire, a manual plug-in mode or an automatic plug-in machine board beating mode is generally adopted. For a manual insertion mode, the tin paste production process cannot be realized, and the defect of high labor cost exists; for the plate beating mode of the automatic component inserter, the tin paste production process cannot be realized, and the vibration generated during the working of the automatic component inserter is large, so that the chip capacitor which is easy to burst is easily damaged.
In addition, for the mode of adopting the metal patch jumper, the welding discs at two ends of the metal patch jumper are easy to deform, and the problem of poor tin coating caused by insufficient plane is easy to occur.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to prior art not enough and provide a new-type circuit board paster wire jumper, this new-type circuit board paster wire jumper modern design, simple structure not only can realize high-speed chip mounter automated production operation, can also improve the metal paster wire jumper both ends yielding not enough plane and cause the bad problem of tinning.
In order to achieve the above purpose, the present invention is achieved by the following technical solutions.
A novel circuit board patch jumper comprises a middle insulating substrate, wherein the middle insulating substrate is of a double-sided circuit board structure, an upper conductive copper foil is etched on the upper surface of the middle insulating substrate, a lower conductive copper foil is etched on the lower surface of the middle insulating substrate, and the upper conductive copper foil and the lower conductive copper foil are vertically arranged in an aligned manner;
the novel circuit board patch jumper is provided with a front copper pouring hole and a rear copper pouring hole, wherein the front copper pouring hole sequentially penetrates through the front end part of the upper conductive copper foil, the front edge part of the middle insulating substrate and the front end part of the lower conductive copper foil from top to bottom, and the rear copper pouring hole sequentially penetrates through the rear end part of the upper conductive copper foil, the rear edge part of the middle insulating substrate and the rear end part of the lower conductive copper foil from top to bottom;
a front copper filling piece is arranged in the front copper filling hole, and the front end part of the upper conductive copper foil, the front copper filling piece and the front end part of the lower conductive copper foil are sequentially electrically connected in a conducting manner; a rear copper filling piece is arranged in the rear copper filling hole, and the rear end part of the upper conductive copper foil, the rear copper filling piece and the rear end part of the lower conductive copper foil are sequentially electrically connected in a conducting manner;
the novel circuit board patch jumper further comprises a front tin spraying layer used for covering the front end part of the upper conductive copper foil, the front copper pouring part and the front end part of the lower conductive copper foil, and a rear tin spraying layer used for covering the rear end part of the upper conductive copper foil, the rear copper pouring part and the rear end part of the lower conductive copper foil.
The upper conductive copper foil comprises an upper copper foil front welding part, an upper copper foil middle part and an upper copper foil rear welding part which are connected from front to back, and the lower conductive copper foil comprises a lower copper foil front welding part, a lower copper foil middle part and a lower copper foil rear welding part which are sequentially connected from front to back;
the front copper filling hole sequentially penetrates through the upper copper foil front welding part, the front end edge part of the middle insulating substrate and the lower copper foil front welding part from top to bottom, and the upper copper foil front welding part, the front copper filling part and the lower copper foil front welding part are sequentially electrically connected in a conducting manner;
the rear copper filling hole penetrates through the upper copper foil rear welding part, the edge part of the rear end of the middle insulating substrate and the lower copper foil rear welding part from top to bottom in sequence, and the upper copper foil rear welding part, the rear copper filling part and the lower copper foil rear welding part are electrically connected in sequence.
The upper surface of the middle insulating substrate is coated with an upper insulating oil layer, the upper insulating oil layer covers the middle part of the upper copper foil, the front welding part of the upper copper foil is positioned on the front end side of the upper insulating oil layer, and the rear welding part of the upper copper foil is positioned on the rear end side of the upper insulating oil layer.
The lower surface of the middle insulating substrate is coated with a lower insulating oil layer, the lower insulating oil layer covers the middle part of the lower copper foil, the lower copper foil front welding part is located on the front end side of the lower insulating oil layer, and the lower copper foil rear welding part is located on the rear end side of the lower insulating oil layer.
The utility model has the advantages that: the utility model relates to a novel circuit board patch jumper wire, which comprises a middle insulating substrate, wherein the middle insulating substrate is of a double-sided circuit board structure, an upper conductive copper foil is etched on the upper surface of the middle insulating substrate, a lower conductive copper foil is etched on the lower surface of the middle insulating substrate, and the upper conductive copper foil and the lower conductive copper foil are vertically arranged in an aligned manner; the novel circuit board patch jumper is provided with a front copper pouring hole and a rear copper pouring hole, wherein the front copper pouring hole sequentially penetrates through the front end part of the upper conductive copper foil, the edge part of the front end of the middle insulating substrate and the front end part of the lower conductive copper foil from top to bottom, and the rear copper pouring hole sequentially penetrates through the rear end part of the upper conductive copper foil, the edge part of the rear end of the middle insulating substrate and the rear end part of the lower conductive copper foil from top to bottom; a front copper filling piece is arranged in the front copper filling hole, and the front end part of the upper conductive copper foil, the front copper filling piece and the front end part of the lower conductive copper foil are sequentially electrically connected in a conducting manner; a rear copper filling piece is arranged in the rear copper filling hole, and the rear end part of the upper conductive copper foil, the rear copper filling piece and the rear end part of the lower conductive copper foil are sequentially electrically connected in a conducting manner; the novel circuit board patch jumper further comprises a front tin spraying layer used for covering the front end part of the upper conductive copper foil, the front copper pouring part and the front end part of the lower conductive copper foil, and a rear tin spraying layer used for covering the rear end part of the upper conductive copper foil, the rear copper pouring part and the rear end part of the lower conductive copper foil. Through the structure design, the utility model has the advantages of novel in design, simple structure, not only can realize high-speed chip mounter automated production operation, can also improve metal paster wire jumper both ends yielding not enough plane and cause the bad problem of tinning.
Drawings
The invention will be further described with reference to the drawings, but the embodiments in the drawings do not constitute any limitation of the invention.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic cross-sectional view of the present invention.
Included in fig. 1 and 2 are:
1-intermediate insulating base plate 21-upper conductive copper foil
211-copper foil-on-front-welded part 212-copper foil-on-middle part
213-upper copper foil rear welding part 22-lower conductive copper foil
221 lower copper foil front welding part 222 lower copper foil middle part
223-lower copper foil rear welding part 311-front copper filling hole
312-front copper pouring part 321-rear copper pouring hole
322-rear copper pouring part 41-upper insulating oil layer
42-lower insulating oil layer 51-front tin spraying layer
52-post-tinning.
Detailed Description
The present invention will be described with reference to specific embodiments.
As shown in fig. 1 and 2, a novel circuit board patch jumper includes a middle insulating substrate 1, the middle insulating substrate 1 is a double-sided circuit board structure, an upper conductive copper foil 21 is etched on the upper surface of the middle insulating substrate 1, a lower conductive copper foil 22 is etched on the lower surface of the middle insulating substrate 1, and the upper conductive copper foil 21 and the lower conductive copper foil 22 are vertically aligned.
The novel circuit board patch jumper is provided with a front copper filling hole 311 and a rear copper filling hole 321, wherein the front copper filling hole 311 sequentially penetrates through the front end part of the upper conductive copper foil 21, the front end edge part of the middle insulating substrate 1 and the front end part of the lower conductive copper foil 22 from top to bottom, and the rear copper filling hole 321 sequentially penetrates through the rear end part of the upper conductive copper foil 21, the rear end edge part of the middle insulating substrate 1 and the rear end part of the lower conductive copper foil 22 from top to bottom.
Further, a front copper filling piece 312 is arranged in the front copper filling hole 311, and the front end part of the upper conductive copper foil 21, the front copper filling piece 312 and the front end part of the lower conductive copper foil 22 are electrically connected in turn; the rear copper-filling hole 321 is internally provided with a rear copper-filling piece 322, and the rear end part of the upper conductive copper foil 21, the rear copper-filling piece 322 and the rear end part of the lower conductive copper foil 22 are electrically connected in turn.
In addition, the novel circuit board patch jumper further comprises a front tin-spraying layer 51 used for covering the front end parts of the upper conductive copper foil 21, the front copper pouring piece 312 and the lower conductive copper foil 22 and a rear tin-spraying layer 52 used for covering the rear end parts of the upper conductive copper foil 21, the rear copper pouring piece 322 and the lower conductive copper foil 22, and certainly, the novel circuit board patch jumper can be used for gold plating or gold deposition without a tin spraying process, so that the tin coating effect is better.
It should be explained that the front end of the upper conductive copper foil 21 and the front end of the lower conductive copper foil 22 are electrically connected through the front copper-pouring member 312, the rear end of the upper conductive copper foil 21 and the rear end of the lower conductive copper foil 22 are electrically connected through the rear copper-pouring member 322, and the front copper-pouring member 312 and the rear copper-pouring member 322 can effectively improve the bonding strength of the chip to ensure the bonding quality of the chip.
Compared with the design mode of the circuit board of the existing plug-in tin-plated copper wire clip, the utility model can effectively simplify the production process, realize the automatic production of an automatic chip mounter and improve the product quality; for current metal patch wire jumper mode, the utility model discloses can improve the metal patch wire jumper both ends yielding not enough the bad problem of last tin that the plane caused.
Synthesize the above-mentioned condition and know, through above-mentioned structural design, the utility model has the advantages of novel in design, simple structure, not only can realize high-speed chip mounter automated production operation, can also improve metal paster wire jumper both ends yielding not enough plane and cause the bad problem of tin.
As shown in fig. 1 and 2, the upper conductive copper foil 21 preferably includes an upper copper foil front-welding portion 211, an upper copper foil intermediate portion 212, and an upper copper foil rear-welding portion 213 connected from front to rear, and the lower conductive copper foil 22 preferably includes a lower copper foil front-welding portion 221, a lower copper foil intermediate portion 222, and a lower copper foil rear-welding portion 223 connected in this order from front to rear.
The front copper filling hole 311 sequentially penetrates through the upper copper foil front welding part 211, the front end edge part of the middle insulating substrate 1 and the lower copper foil front welding part 221 from top to bottom, and the upper copper foil front welding part 211, the front copper filling part 312 and the lower copper foil front welding part 221 are sequentially electrically connected in a conducting manner.
Similarly, the rear copper via 321 sequentially penetrates the upper copper foil rear welding portion 213, the rear edge portion of the middle insulating substrate 1, and the lower copper foil rear welding portion 223 from top to bottom, and the upper copper foil rear welding portion 213, the rear copper via 322, and the lower copper foil rear welding portion 223 are sequentially electrically connected.
As shown in fig. 1 and 2, in a preferred embodiment, the upper surface of the intermediate insulating substrate 1 is coated with an upper insulating oil layer 41, the upper insulating oil layer 41 covers the upper copper foil intermediate portion 212, the upper copper foil front-welding portion 211 is located on the front end side of the upper insulating oil layer 41, and the upper copper foil rear-welding portion 213 is located on the rear end side of the upper insulating oil layer 41.
Similarly, the lower surface of the intermediate insulating substrate 1 is coated with the lower insulating oil layer 42, the lower insulating oil layer 42 covers the lower copper foil intermediate portion 222, the lower copper foil front-welding portion 221 is located on the front end side of the lower insulating oil layer 42, and the lower copper foil rear-welding portion 223 is located on the rear end side of the lower insulating oil layer 42.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (4)
1. A novel circuit board patch jumper comprises a middle insulating substrate (1), wherein the middle insulating substrate (1) is of a double-sided circuit board structure, an upper conductive copper foil (21) is etched on the upper surface of the middle insulating substrate (1), a lower conductive copper foil (22) is etched on the lower surface of the middle insulating substrate (1), and the upper conductive copper foil (21) and the lower conductive copper foil (22) are vertically arranged in an aligned manner;
the method is characterized in that: the novel circuit board patch jumper is provided with a front copper pouring hole (311) and a rear copper pouring hole (321), wherein the front copper pouring hole (311) sequentially penetrates through the front end part of an upper conductive copper foil (21), the front end edge part of a middle insulating substrate (1) and the front end part of a lower conductive copper foil (22) from top to bottom, and the rear copper pouring hole (321) sequentially penetrates through the rear end part of the upper conductive copper foil (21), the rear end edge part of the middle insulating substrate (1) and the rear end part of the lower conductive copper foil (22) from top to bottom;
a front copper filling piece (312) is arranged in the front copper filling hole (311), and the front end part of the upper conductive copper foil (21), the front copper filling piece (312) and the front end part of the lower conductive copper foil (22) are electrically connected in turn; a rear copper filling piece (322) is arranged in the rear copper filling hole (321), and the rear end part of the upper conductive copper foil (21), the rear copper filling piece (322) and the rear end part of the lower conductive copper foil (22) are electrically connected in turn;
the novel circuit board patch jumper further comprises a front tin spraying layer (51) used for covering the front end part of the upper conductive copper foil (21), the front copper pouring piece (312) and the front end part of the lower conductive copper foil (22), and a rear tin spraying layer (52) used for covering the rear end part of the upper conductive copper foil (21), the rear copper pouring piece (322) and the rear end part of the lower conductive copper foil (22).
2. The novel circuit board patch jumper of claim 1, wherein: the upper conductive copper foil (21) comprises an upper copper foil front welding part (211), an upper copper foil middle part (212) and an upper copper foil rear welding part (213) which are connected from front to back, and the lower conductive copper foil (22) comprises a lower copper foil front welding part (221), a lower copper foil middle part (222) and a lower copper foil rear welding part (223) which are sequentially connected from front to back;
the front copper filling hole (311) sequentially penetrates through the upper copper foil front welding part (211), the front end edge part of the middle insulating substrate (1) and the lower copper foil front welding part (221) from top to bottom, and the upper copper foil front welding part (211), the front copper filling part (312) and the lower copper foil front welding part (221) are sequentially electrically connected in a conducting manner;
the rear copper filling hole (321) penetrates through the upper copper foil rear welding part (213), the rear end edge part of the middle insulating substrate (1) and the lower copper foil rear welding part (223) from top to bottom in sequence, and the upper copper foil rear welding part (213), the rear copper filling part (322) and the lower copper foil rear welding part (223) are electrically connected in sequence.
3. The novel circuit board patch jumper of claim 2, wherein: the upper surface of the middle insulating substrate (1) is coated with an upper insulating oil layer (41), the upper insulating oil layer (41) covers the upper copper foil middle part (212), the upper copper foil front welding part (211) is located on the front end side of the upper insulating oil layer (41), and the upper copper foil rear welding part (213) is located on the rear end side of the upper insulating oil layer (41).
4. The novel circuit board patch jumper of claim 3, wherein: the lower surface of the middle insulating substrate (1) is coated with a lower insulating oil layer (42), the lower insulating oil layer (42) covers the lower copper foil middle part (222), the lower copper foil front welding part (221) is positioned at the front end side of the lower insulating oil layer (42), and the lower copper foil rear welding part (223) is positioned at the rear end side of the lower insulating oil layer (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222612132.2U CN218735148U (en) | 2022-09-30 | 2022-09-30 | Novel circuit board patch jumper wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222612132.2U CN218735148U (en) | 2022-09-30 | 2022-09-30 | Novel circuit board patch jumper wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735148U true CN218735148U (en) | 2023-03-24 |
Family
ID=85639706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222612132.2U Active CN218735148U (en) | 2022-09-30 | 2022-09-30 | Novel circuit board patch jumper wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735148U (en) |
-
2022
- 2022-09-30 CN CN202222612132.2U patent/CN218735148U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8210422B2 (en) | Solder containment brackets | |
| CN102689065A (en) | Method for welding circuit board components | |
| US5823801A (en) | Electrical connector having thin contacts with surface mount edges | |
| CN211240270U (en) | Double-sided boss substrate | |
| CN103187640B (en) | Surface-pasted metal wiring terminal and attaching method thereof can be carried out | |
| CN218735148U (en) | Novel circuit board patch jumper wire | |
| CN108601203B (en) | PCB and PCBA | |
| EP2717658B1 (en) | Wiring board and method for manufacturing wiring board | |
| CN2660712Y (en) | Terminal of electrical connector | |
| CN101436723B (en) | Sealing off resistant hollow pin | |
| CN216873464U (en) | Novel circuit connection patch plate | |
| CN218300304U (en) | Novel circuit board jumper module | |
| CN207052391U (en) | A kind of SMD high-current inductors | |
| CN207884973U (en) | A kind of pad using ink spray plane | |
| CN204966286U (en) | Can provide condenser that metal spraying face carries out surface mounting | |
| CN210670756U (en) | Welding pad conducting structure of circuit board | |
| CN215301027U (en) | Novel group formula paster wire jumper | |
| CN207765336U (en) | A kind of thin film capacitor of surface installation | |
| CN216960300U (en) | High-adhesion metallized edge-wrapped circuit board | |
| CN218352814U (en) | Connecting structure of lead and printed circuit board | |
| CN216253366U (en) | Circuit structure for improving conductivity of dual in-line package assembly | |
| CN201352675Y (en) | Terminal material-band structure and terminal structure | |
| CN204834345U (en) | Inductance transformer surface mounting pin welded structure | |
| CN211656529U (en) | Multilayer circuit board structure with replaceable chip | |
| CN203731074U (en) | Electronic weldment made of poor-welding materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |