CN218734956U

CN218734956U - Combined sensor

Info

Publication number: CN218734956U
Application number: CN202223090187.8U
Authority: CN
Inventors: 孙延娥; 闫文明; 裴振伟; 韩晓东
Original assignee: Goertek Microelectronics Inc
Current assignee: Goertek Microelectronics Inc
Priority date: 2022-11-17
Filing date: 2022-11-17
Publication date: 2023-03-24
Anticipated expiration: 2032-11-17

Abstract

The utility model discloses a combined sensor, which comprises a substrate and a shell, wherein the substrate and the shell enclose a containing cavity, and an acceleration sensor and a microphone are arranged in the containing cavity; the acceleration sensor comprises an acceleration sensor MEMS chip and an acceleration sensor AS IC chip, the acceleration sensor MEMS chip is electrically connected with the acceleration sensor AS IC chip, and the acceleration sensor AS IC chip is electrically connected with the substrate; the microphone comprises a microphone MEMS chip and a microphone AS IC chip, the microphone MEMS chip is arranged on the substrate and electrically connected with the microphone AS IC chip, the microphone AS IC chip is electrically connected with the substrate, and the substrate is provided with a sound hole. The acceleration sensor picks up low-frequency vibration signals, and the microphone picks up high-frequency voice signals. Therefore, the utility model discloses can accomplish two unification functions of low frequency radio reception and high frequency radio reception, realize the high-quality conversation.

Description

Combined sensor

Technical Field

The utility model relates to a sensor technical field especially relates to a combined sensor.

Background

When a user communicates, if there is a large noise around, such as wind noise, subway noise, etc., the sound reception of the microphone is affected, resulting in poor quality of the heard voice at the other end of the communication.

The frequencies of wind and subway sounds are typically concentrated below 4 KHz. If the frequency is below 4KHz, the microphone is not used for receiving sound, but a sound receiving mode which is insensitive to wind sound and subway sound is adopted, the communication quality can be greatly improved.

Most of the solutions currently on the market employ a bone voiceprint sensor and a microphone working in conjunction. The bone voiceprint sensor mainly collects bone vibration signals caused by the sounding of a person below 4KHz, and the microphone mainly collects voice signals above 4 KHz. Based on the two devices, high-quality conversation in a wider frequency band can be realized through algorithm processing. However, this solution requires two devices, i.e., the bone-vocal print sensor and the microphone, to be packaged in the earphone, which requires a larger assembly space for the whole earphone, and increases the waterproof cost and reduces the process efficiency.

SUMMERY OF THE UTILITY MODEL

To the above-mentioned not enough, the utility model discloses the technical problem that will solve is: a combined sensor is provided, which can complete the two-in-one function of low-frequency reception and high-frequency reception and realize high-quality communication.

In order to solve the technical problem, the technical scheme of the utility model is that:

a combined sensor comprises a substrate and a shell arranged on the substrate, wherein the substrate and the shell jointly enclose a containing cavity, and an acceleration sensor and a microphone are arranged in the containing cavity; the acceleration sensor comprises an acceleration sensor MEMS chip and an acceleration sensor ASI C chip, wherein the acceleration sensor MEMS chip is electrically connected with the acceleration sensor ASI C chip, and the acceleration sensor ASI C chip is electrically connected with the substrate; the microphone comprises a microphone MEMS chip and a microphone ASI C chip, the microphone MEMS chip is arranged on the substrate, the microphone MEMS chip is electrically connected with the microphone ASI C chip, the microphone ASI C chip is electrically connected with the substrate, and a sound hole is formed in the substrate.

Preferably, the acceleration sensor MEMS chip, the acceleration sensor ASI C chip, and the microphone ASI C chip are respectively provided on the substrate.

Preferably, the MEMS chip of the acceleration sensor is disposed on the substrate, and the AS ic chip of the acceleration sensor and the AS ic chip of the microphone are respectively embedded in the substrate.

Preferably, the shell is a PCB shell; the MEMS chip of the acceleration sensor and the AS IC chip of the acceleration sensor are respectively arranged on the PCB shell, and the AS IC chip of the microphone is arranged on the substrate.

Preferably, the PCB housing comprises a top plate and two side plates respectively arranged at two sides of the top plate, the top plate is arranged opposite to the base plate, and the two side plates are connected with the top plate and the base plate; the acceleration sensor MEMS chip and the acceleration sensor AS IC chip are respectively arranged on the top plate.

Preferably, the acceleration sensor MEMS chip and the acceleration sensor AS ic chip are electrically connected by a first gold wire, and/or the acceleration sensor AS ic chip and the substrate are electrically connected by a second gold wire.

Preferably, the acceleration sensor MEMS chip is electrically connected to the substrate through a third gold wire, and the substrate is electrically connected to the acceleration sensor AS ic chip through a built-in circuit or a built-in first conductive member; the microphone MEMS chip is electrically connected with the substrate through a fourth gold wire, and the substrate is electrically connected with the microphone AS IC chip through a built-in circuit or a built-in second conductive piece.

Preferably, the acceleration sensor AS ic chip is electrically connected to the substrate through the side plate on one side.

Preferably, the side plate is electrically connected to the substrate through a built-in circuit or a third conductive member.

After the technical scheme is adopted, the beneficial effects of the utility model are that:

because the combined sensor of the utility model comprises the base plate and the shell arranged on the base plate, the base plate and the shell jointly enclose a containing cavity, and an acceleration sensor and a microphone are arranged in the containing cavity; the acceleration sensor comprises an acceleration sensor MEMS chip and an acceleration sensor AS IC chip, the acceleration sensor MEMS chip is electrically connected with the acceleration sensor AS IC chip, and the acceleration sensor AS IC chip is electrically connected with the substrate; the microphone comprises a microphone MEMS chip and a microphone AS IC chip, the microphone MEMS chip is arranged on the substrate and electrically connected with the microphone AS IC chip, the microphone AS IC chip is electrically connected with the substrate, and the substrate is provided with a sound hole. When a person speaks, a skeleton vibration signal and a voice signal are generated, the acceleration sensor can pick up a low-frequency vibration signal which is mainly below 4KHz, and the microphone can pick up a high-frequency voice signal which is mainly above 4 KHz. Therefore, the utility model discloses can accomplish two unification functions of low frequency radio reception and high frequency radio reception, realize the high-quality conversation.

Because the acceleration sensor MEMS chip is arranged on the substrate, and the acceleration sensor ASI C chip and the microphone ASI C chip are respectively buried in the substrate, the overall height is reduced, the size is reduced, and the space requirement of an application place is met.

Because the shell is a PCB shell; the MEMS chip and the ASI C chip of the acceleration sensor are respectively arranged on the PCB shell, and the AS IC chip of the microphone is arranged on the substrate, so that the overall height is reduced, the size is reduced, and the space requirement of an application place is met.

The PCB shell comprises a top plate and two side plates which are respectively arranged at two sides of the top plate, the top plate and the base plate are oppositely arranged, and the two side plates are connected with the top plate and the base plate; the acceleration sensor MEMS chip and the acceleration sensor ASI C chip are respectively arranged on the top plate, and signal transmission is realized by utilizing the PCB shell.

In summary, the combined sensor of the utility model solves the technical problems of the prior art that the combined sensor has large volume and limited use place; the utility model discloses set up acceleration sensor and microphone in the encapsulation, when guaranteeing the reliable collection of the high low frequency signal of sensor, reduced whole thickness, make it satisfy the place space of using, and simple structure, easily realize.

Drawings

FIG. 1 is a schematic structural diagram of a combinational sensor in accordance with a first embodiment;

FIG. 2 is a schematic structural view of a combination sensor according to a second embodiment;

FIG. 3 is a schematic structural view of a combination sensor according to a third embodiment;

in the figure: 1-shell, 2-substrate, 30-acceleration sensor MEMS chip, 31-acceleration sensor ASI C chip, 40-microphone MEMS chip, 41-microphone ASI C chip, 5-sound hole, 6-top plate, 7-side plate, 80-first gold wire, 81-second gold wire, 82-third gold wire, 83-fourth gold wire, 84-fifth gold wire and 85-sixth gold wire.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

as shown in fig. 1, a combination sensor includes a substrate 2 and a housing 1 disposed on the substrate 2, the substrate 2 and the housing 1 together enclose a containing cavity, and an acceleration sensor and a microphone are disposed in the containing cavity; the acceleration sensor comprises an acceleration sensor MEMS chip 30 and an acceleration sensor ASI C chip 31, the acceleration sensor MEMS chip 30 is electrically connected with the acceleration sensor AS IC chip 31, and the acceleration sensor AS IC chip 31 is electrically connected with the substrate 2; the microphone comprises a microphone MEMS chip 40 and a microphone AS IC chip 41, the microphone MEMS chip 40 is electrically connected with the microphone AS IC chip 41, the microphone AS IC chip 41 is electrically connected with the substrate 2, and the substrate 2 is provided with a sound hole 5.

The acceleration sensor MEMS chip 30, the acceleration sensor AS IC chip 31, the microphone MEMS chip 40 and the microphone AS IC chip 41 are arranged on the substrate 2 and are respectively arranged on the substrate 2, namely the acceleration sensor and the microphone are arranged on the same side.

The acceleration sensor MEMS chip 30 and the acceleration sensor AS ic chip 31 are electrically connected by a first gold wire 80, and/or the acceleration sensor AS ic chip 31 and the substrate 2 are electrically connected by a second gold wire 81, and the substrate 2 is electrically connected to the acceleration sensor AS ic chip 31 by a built-in line or a built-in fifth conductive member. The microphone MEMS chip 40 is electrically connected to the microphone AS ic chip 41 by a fifth gold wire 84, the microphone AS ic chip 41 is electrically connected to the substrate 2 by a sixth gold wire 85, and the substrate 2 is electrically connected to the microphone AS ic chip 41 by a built-in wire or a built-in sixth conductive member.

As shown in FIG. 1, the utility model discloses a combined sensor because of its inside acceleration sensor and microphone that can produce skeleton vibration signal and speech signal when the people speaks, mainly below 4KHz, acceleration sensor MEMS chip 30 gathers behind vibration signal or the speech signal, transmits for acceleration sensor AS IC chip 31, and the signal transmission after acceleration sensor AS IC handles is for base plate 2, and base plate 2 exports again.

The microphone MEMS chip 40 picks up a high-frequency voice signal, mainly above 4KHz, the microphone MEMS chip 40 transmits the acquired voice signal to the microphone AS ic chip 41, the signal processed by the microphone AS ic is transmitted to the substrate 2, and the substrate 2 outputs the signal.

It is visible, the utility model discloses a combination sensor has accomplished two unification functions of low frequency radio reception and high frequency radio reception, realizes the high-quality conversation, and simple structure, easily realizes, and is with low costs.

In addition, the first, second, third, fourth, fifth, sixth, and the like referred to above are all described as differences, and there is no substantial difference.

Example two:

this embodiment is substantially the same as the first embodiment, except that:

AS shown in fig. 2, the acceleration sensor AS ic chip 31 and the microphone AS ic chip 41 are embedded in the substrate 2, and the acceleration sensor MEMS chip 30 and the microphone MEMS chip 40 are disposed on the substrate 2.

The acceleration sensor MEMS chip 30 is electrically connected with the substrate 2 through a third gold wire 82, and the substrate 2 is electrically connected with the acceleration sensor AS IC chip 31 through a built-in circuit or a built-in first conductive member; the microphone MEMS chip 40 is electrically connected to the substrate 2 by a fourth gold wire 83, and the substrate 2 is electrically connected to the microphone AS ic chip 41 by a built-in wire or a built-in second conductive member.

The combined sensor of this embodiment, when realizing the high-quality conversation, through burying acceleration sensor AS IC chip 31 and microphone AS IC chip 41 in basic, reduced holistic height, reduced holistic volume, make the utility model discloses do not receive the restraint in application department space, have good commonality.

In addition, the first, second, third, fourth and the like referred to above are all described as differences, and there is no substantial difference.

Example three:

the present embodiment is substantially the same as the first embodiment, except that:

as shown in fig. 3, the housing is a PCB housing; the acceleration sensor MEMS chip 30 and the acceleration sensor AS ic chip 31 are respectively disposed on the PCB housing, and the microphone AS ic chip 41 and the microphone MEMS chip 40 are respectively disposed on the substrate 2, that is, the acceleration sensor and the microphone are disposed on opposite sides.

The PCB shell comprises a top plate 6 and two side plates 7 which are respectively arranged on two sides of the top plate 6, the top plate 6 is arranged opposite to the base plate 2, the two side plates 7 are connected with the top plate 6 and the base plate 2, and specifically, the top plate 6 can be welded with the side plates 7 on two sides through welding pads. At this time, the acceleration sensor MEMS chip 30 and the acceleration sensor AS ic chip 31 are respectively provided on the upper surface of the top plate 6, that is, the inner side surface of the top plate 6, and the acceleration sensor AS ic chip 31 is electrically connected to the substrate 2 through the one side plate 7, specifically, the side plate 7 is electrically connected to the substrate 2 through a built-in wiring or a third conductive member.

The combined sensor of this embodiment when realizing the high-quality conversation, through setting up acceleration sensor and microphone relatively, specifically, makes acceleration sensor MEMS chip 30 and microphone AS IC chip 41 set up relatively, and microphone MEMS chip 40 sets up with microphone AS IC chip 41 relatively, has reduced holistic height, has reduced holistic volume, makes the utility model discloses do not receive the restraint in application department space, have good commonality.

The above is merely a preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent improvements of the combination sensor, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims

1. A combined sensor comprises a substrate and a shell arranged on the substrate, wherein the substrate and the shell jointly enclose an accommodating cavity;

the acceleration sensor comprises an acceleration sensor MEMS chip and an acceleration sensor ASIC chip, the acceleration sensor MEMS chip is electrically connected with the acceleration sensor ASIC chip, and the acceleration sensor ASIC chip is electrically connected with the substrate;

the microphone comprises a microphone MEMS chip and a microphone ASIC chip, the microphone MEMS chip is arranged on the substrate, the microphone MEMS chip is electrically connected with the microphone ASIC chip, the microphone ASIC chip is electrically connected with the substrate, and a sound hole is formed in the substrate.

2. The combination sensor of claim 1, wherein the acceleration sensor MEMS chip, the acceleration sensor ASIC chip, and the microphone ASIC chip are respectively provided on an upper face of the substrate.

3. The combination sensor of claim 1, wherein the acceleration sensor MEMS chip is provided on the upper surface of the substrate, and the acceleration sensor ASIC chip and the microphone ASIC chip are buried in the substrate, respectively.

4. The combination sensor of claim 1, wherein the housing is a PCB housing;

the acceleration sensor MEMS chip and the acceleration sensor ASIC chip are respectively arranged on the PCB shell, and the microphone ASIC chip is arranged on the substrate.

5. The combination sensor of claim 4, wherein the PCB housing comprises a top plate and two side plates disposed on two sides of the top plate, the top plate is disposed opposite to the base plate, and the two side plates connect the top plate and the base plate;

the acceleration sensor MEMS chip and the acceleration sensor ASIC chip are respectively arranged on the top plate.

6. The combination sensor of claim 2, 4 or 5, wherein the acceleration sensor MEMS chip and the acceleration sensor ASIC chip are electrically connected by a first gold wire, and/or the acceleration sensor ASIC chip and the substrate are electrically connected by a second gold wire.

7. A combination sensor according to claim 3, wherein the acceleration sensor MEMS chip is electrically connected to the substrate by a third gold wire, and the substrate is electrically connected to the acceleration sensor ASIC chip by a built-in wire or a built-in first conductive member;

the microphone MEMS chip is electrically connected with the substrate through a fourth gold wire, and the substrate is electrically connected with the microphone ASIC chip through a built-in circuit or a built-in second conductive piece.

8. The combination sensor of claim 5, wherein the acceleration sensor ASIC chip is electrically connected to the base plate through one side of the side plate.

9. The combination sensor of claim 8, wherein the side plate is electrically connected to the substrate through a built-in wiring or a third conductive member.