CN218730944U - Low-cost optical coupler packaging structure - Google Patents

Low-cost optical coupler packaging structure Download PDF

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Publication number
CN218730944U
CN218730944U CN202222915961.8U CN202222915961U CN218730944U CN 218730944 U CN218730944 U CN 218730944U CN 202222915961 U CN202222915961 U CN 202222915961U CN 218730944 U CN218730944 U CN 218730944U
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China
Prior art keywords
paster
golden finger
emitting diode
photo resistance
circuit board
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CN202222915961.8U
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Chinese (zh)
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黄洪钦
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Shenzhen Sunye Electronics Co ltd
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Shenzhen Sunye Electronics Co ltd
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Abstract

The utility model discloses a low-cost opto-coupler packaging structure, including circuit board, paster photo resistance and paster emitting diode, the equal integrated into one piece of center department of paster photo resistance and paster emitting diode both sides has the golden finger, and the slot has all been seted up at the both ends at circuit board both sides outer wall top, and paster photo resistance and paster emitting diode's golden finger is pegged graft in the inside of slot. The utility model discloses an improvement to the optical coupling welding mode, thereby the welding of having removed the paster components and parts from has reduced the production requirement and the equipment debugging degree of difficulty, the practicality of opto-coupler has been improved and the problem that the difficult manufacturing cost of on-the-spot installation and debugging is high has been solved, the piece is held on the top to the golden finger of plug-in connection inside the slot under the effect of limiting plate and spring, make the golden finger agree with and laminate mutually between the inside of constant head tank and conducting strip, fine promotion the fastness and the convenience of equipment between paster photo resistance and paster emitting diode and the circuit board.

Description

Low-cost optical coupler packaging structure
Technical Field
The utility model relates to a photoelectric application technical field, concretely relates to low-cost opto-coupler packaging structure.
Background
The liquid level inside the oil well casing for oil field test mostly adopts a liquid level tester, the liquid level signal adopted by the tester needs to use a filtering amplification plate, and the amplification plate adopts an optical coupler to automatically adjust and amplify gain. Most of the optical couplers purchased at present adopt a direct-insert photoresistor and a direct-insert light-emitting diode.
If the authorization notice number is CN207557537U, and the authorization notice date is 2018-06-29, the packaging structure of the low-cost optical module consists of a connector, a main PCBA, a chip, an auxiliary PCBA and an optical fiber connector, wherein the main PCBA is connected with the auxiliary PCBA, and a main PCBA structure and an auxiliary PCBA structure are adopted, wherein the main PCBA and the auxiliary PCBA are fixed at 90 degrees, so that the optical path fixing is facilitated, the LENS optical path conversion is omitted, and the LENS cost is saved; one end of the main PCBA is connected with the connector, so that the main PCBA can be plugged and pulled conveniently and quickly; the chip is packaged in the auxiliary PCBA, the auxiliary PCBA is connected with the optical fiber connector, the rear end of the optical fiber connector is connected with the optical fiber or the optical-electrical hybrid cable, and when the optical module packaging device is used, the front end of the optical fiber connector is buckled on the auxiliary PCBA, so that the top surface of the optical fiber connector is pressed on the chip of the optical module, and the optical module is packaged; the optical fiber coupling part of the optical fiber connector adopts an optical fiber V-shaped groove or an optical fiber Jumper mode to couple and fix the optical fiber.
Because the distance between the diode and the photoresistor is difficult to control by welding the light-emitting diode which is directly inserted, the difference of the output resistance of the manufactured optocoupler is large under the condition of the same voltage input, hidden dangers are buried for later application, the optocoupler is difficult to debug and qualified in the field debugging process, the debugging time is increased, and the batch production cost of the oil field liquid level tester is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a low-cost opto-coupler packaging structure to solve the above-mentioned weak point among the prior art.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a low-cost opto-coupler packaging structure, includes circuit board, paster photo resistance and paster emitting diode, the homogeneous body shaping of center department of paster photo resistance and paster emitting diode both sides has the golden finger, and the slot has all been seted up at the both ends at circuit board both sides outer wall top, the golden finger of paster photo resistance and paster emitting diode is pegged graft in the inside of slot, and laminates mutually between paster photo resistance and paster emitting diode and the circuit board, the unthreaded hole has been seted up to the axle center department of circuit board.
Furthermore, a positioning groove is formed in one end of the inner wall of one side of the slot, and a conducting strip is integrally formed on the inner wall of the positioning groove.
Furthermore, the golden finger is matched with the inside of the positioning groove, and the golden finger is electrically connected with the conducting strip.
Furthermore, a communicating groove is formed in the inner wall of the other side, away from the positioning groove, of the slot, a rectangular groove is formed in the communicating groove, a supporting block extending to the inside of the rectangular groove is inserted into the communicating groove, and a limiting plate is welded to one side, located inside the rectangular groove, of the supporting block.
Furthermore, the other side of the limiting plate, which is far away from the jacking block, is welded with a spring, and the jacking block is jacked on one side of the golden finger under the action of the limiting plate and the spring.
Furthermore, guide parts are arranged at two ends of the outer wall of one side, attached to the golden finger, of the supporting block, and chamfering parts matched with the guide parts are arranged at two sides of the outer wall of one side, attached to the golden finger, of the supporting block.
In the technical scheme, the utility model provides a pair of low-cost opto-coupler packaging structure, (1) the utility model discloses a to the improvement of opto-coupler welding mode, thereby the welding of having removed the paster components and parts from has reduced the production requirement and the equipment debugging degree of difficulty, has improved the practicality of opto-coupler and has solved the difficult high problem of manufacturing cost of on-the-spot installation and debugging. (2) Through the top of setting up and holding the piece, the top is held the piece and is carried out the top to the golden finger of plug-in connection inside the slot under the effect of limiting plate and spring and hold for the golden finger agrees with and laminates mutually between the inside of constant head tank and conducting strip, fine promotion paster photo resistance and the fastness and the convenience of equipment between paster emitting diode and the circuit board.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to these drawings.
Fig. 1 is the utility model relates to a spatial structure schematic diagram that low-cost opto-coupler packaging structure embodiment provided.
Fig. 2 is the utility model relates to a circuit board sectional structure schematic diagram that low-cost opto-coupler packaging structure embodiment provided.
Fig. 3 is the utility model relates to a slot sectional structure schematic diagram that low-cost opto-coupler packaging structure embodiment provided.
Fig. 4 is the utility model relates to a local enlarged structure schematic diagram of rectangular channel that low-cost opto-coupler packaging structure embodiment provided.
Description of reference numerals:
1. a circuit board; 2. a photosensitive resistor is pasted; 3. a surface mount light emitting diode; 4. a light hole; 5. a gold finger; 6. a slot; 7. positioning a groove; 8. a conductive sheet; 9. chamfering the corner; 10. a communicating groove; 11. a rectangular groove; 12. a limiting plate; 13. a spring; 14. a jacking block; 15. a guide portion.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-4, the utility model provides a pair of low-cost opto-coupler packaging structure, including circuit board 1, paster photo resistance 2 and paster emitting diode 3, the central department homogeneous body shaping of paster photo resistance 2 and paster emitting diode 3 both sides has golden finger 5, and slot 6 has all been seted up at the both ends at 1 both sides outer wall top of circuit board, the inside at slot 6 is pegged graft to golden finger 5 of paster photo resistance 2 and paster emitting diode 3, and laminate mutually between paster photo resistance 2 and paster emitting diode 3 and the circuit board 1, unthreaded hole 4 has been seted up to the axle center department of circuit board 1, peg graft inside at slot 6 to golden finger 5 of paster photo resistance 2 and paster emitting diode 3 both sides, the welding of having removed paster components and parts need not adjust the distance of two kinds of paster components and parts from, thereby production requirement and the assembly debugging degree of difficulty have been reduced, the practicality of opto-coupler has been improved and the difficult high problem of manufacturing cost of on-site installation debugging has been solved.
The utility model provides a further embodiment, as fig. 1, as shown in fig. 3 and fig. 4, constant head tank 7 has been seted up to the one end of slot 6 one side inner wall, and integrated into one piece has conducting strip 8 on the inner wall of constant head tank 7, golden finger 5 agrees with the inside at constant head tank 7, and be electric connection between golden finger 5 and the conducting strip 8, intercommunication groove 10 has been seted up on the opposite side inner wall that constant head tank 7 was kept away from to slot 6, and rectangular channel 11 has been seted up to the inside of intercommunication groove 10, the inside grafting of intercommunication groove 10 has the top of extending to rectangular channel 11 inside and holds piece 14, and the welding of top piece 14 in one side of rectangular channel 11 has limiting plate 12, limiting plate 12 keeps away from the opposite side welding of top piece 14 has spring 13, and top is held one side of golden finger 5 under the effect of limiting plate 12 and spring 13, top piece 14 and the both ends of golden finger 5 laminating one side outer wall have all seted up guide part 15, and all seted up the portion 9 of agreeing with the chamfer between guide part 15 with the both sides of the outer wall of golden finger 14 and the effect of top piece 14 mutually laminating, the inside finger paster of the luminous resistance of the paster and the luminous paster of limiting plate 5 and the luminous finger make the luminous paster of luminous finger stick up between the luminous diode 5 and the luminous paster 2 and the luminous paster of the luminous finger and the luminous paster of the opposite side of the luminous finger 5.
The working principle is as follows: the 5 pegs graft in the inside of slot 6 of golden finger of 3 both sides of paster photo resistance 2 and paster emitting diode, the piece 14 is held on the top to the golden finger 5 of pegging graft in slot 6 inside under limiting plate 12 and spring 13's effect, make golden finger 5 agree with and laminate mutually between the inside of constant head tank 7 and conducting strip 8, fine promotion the fastness and the convenience of equipment between paster photo resistance 2 and paster emitting diode 3 and circuit board 1, the welding of having removed the paster components and parts from need not adjust the distance of two kinds of paster components and parts, thereby the production requirement and the equipment debugging degree of difficulty have been reduced, the practicality of opto-coupler has been improved and the problem that the difficult manufacturing cost of on-the-site installation debugging is high has been solved.
Certain exemplary embodiments of the present invention have been described above by way of illustration only, and it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive on the scope of the appended claims.

Claims (6)

1. The utility model provides a low-cost opto-coupler packaging structure, includes circuit board (1), paster photo resistance (2) and paster emitting diode (3), its characterized in that, the center department homogeneous body shaping of paster photo resistance (2) and paster emitting diode (3) both sides has golden finger (5), and slot (6) have all been seted up at the both ends at circuit board (1) both sides outer wall top, the golden finger (5) of paster photo resistance (2) and paster emitting diode (3) are pegged graft in the inside of slot (6), and laminate mutually between paster photo resistance (2) and paster emitting diode (3) and circuit board (1), unthreaded hole (4) have been seted up to the axle center department of circuit board (1).
2. The low-cost optical coupler packaging structure according to claim 1, wherein a positioning groove (7) is formed at one end of the inner wall of one side of the slot (6), and a conductive sheet (8) is integrally formed on the inner wall of the positioning groove (7).
3. A low-cost optical coupling package structure according to claim 2, wherein the gold finger (5) fits inside the positioning groove (7), and the gold finger (5) is electrically connected to the conductive sheet (8).
4. The low-cost optocoupler package structure according to claim 2, wherein a communicating groove (10) is formed in an inner wall of the other side of the slot (6) away from the positioning groove (7), a rectangular groove (11) is formed in the communicating groove (10), a supporting block (14) extending into the rectangular groove (11) is inserted into the communicating groove (10), and a limiting plate (12) is welded on one side of the supporting block (14) in the rectangular groove (11).
5. A low-cost optical coupler packaging structure according to claim 4, wherein a spring (13) is welded on the other side of the limiting plate (12) far away from the supporting block (14), and the supporting block (14) is supported on one side of the golden finger (5) under the action of the limiting plate (12) and the spring (13).
6. The low-cost optical coupler packaging structure according to claim 4, wherein two ends of the outer wall of one side, which is attached to the golden finger (5), of the supporting block (14) are provided with guide parts (15), and two sides of the outer wall of one side, which is attached to the supporting block (14), of the golden finger (5) are provided with chamfer parts (9) which are engaged with the guide parts (15).
CN202222915961.8U 2022-11-03 2022-11-03 Low-cost optical coupler packaging structure Active CN218730944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222915961.8U CN218730944U (en) 2022-11-03 2022-11-03 Low-cost optical coupler packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222915961.8U CN218730944U (en) 2022-11-03 2022-11-03 Low-cost optical coupler packaging structure

Publications (1)

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CN218730944U true CN218730944U (en) 2023-03-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116779463A (en) * 2023-07-13 2023-09-19 江苏富坤光电科技有限公司 Optical semiconductor device and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116779463A (en) * 2023-07-13 2023-09-19 江苏富坤光电科技有限公司 Optical semiconductor device and preparation method thereof
CN116779463B (en) * 2023-07-13 2023-12-12 江苏富坤光电科技有限公司 Optical semiconductor device and preparation method thereof

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