CN218730922U - Lead frame for realizing high-density pins - Google Patents
Lead frame for realizing high-density pins Download PDFInfo
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- CN218730922U CN218730922U CN202222269844.9U CN202222269844U CN218730922U CN 218730922 U CN218730922 U CN 218730922U CN 202222269844 U CN202222269844 U CN 202222269844U CN 218730922 U CN218730922 U CN 218730922U
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Abstract
The utility model relates to a semiconductor manufacturing process field just discloses a realize pin frame of high density pin, including first frame, one side fixedly connected with insulating coating of first frame, one side fixedly connected with cardboard of first frame, the first arch of top fixedly connected with of cardboard, one side fixedly connected with rubber strip of first frame. This realize pin frame of high density pin, through first frame, insulating coating, the cardboard, first arch, the rubber strip, the rubber block, the fixed plate, the second is protruding, trapezoidal piece, connecting plate and spacing hole, make this pin frame can be convenient for splice, thereby use this pin frame, when needing to splice the installation to a plurality of this pin frame, can make things convenient for people to carry out quick effectual concatenation to this pin frame, change this pin frame's length, people's operating pressure has been alleviateed, people's work demand has been satisfied, this pin frame's work efficiency has been improved.
Description
Technical Field
The utility model relates to a semiconductor manufacturing process field specifically is a realize pin frame of high density pin.
Background
At present, in the field of semiconductor manufacturing processes, a lead frame is used as a chip carrier of an integrated circuit, is a key structural component for realizing electrical connection between a circuit leading-out terminal inside a chip and an external lead and forming an electrical loop, plays a role of a bridge connected with an external lead, and is required to be used in most semiconductor integrated circuits.
The existing pin frame is not convenient to splice, so that when the pin frame is used and two or more pin frames need to be spliced and installed, people can not be effectively and conveniently spliced and installed on the pin frames, the working pressure of people is increased, the working requirements of people are not met, the working efficiency of the pin frame is reduced, and the work of people is inconvenient.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
Not enough to prior art, the utility model provides a realize pin frame of high density pin possesses the advantage such as being convenient for splice, has solved the problem among the above-mentioned background art.
(II) technical scheme
For the purpose of realizing the aforesaid and being convenient for carry out the concatenation, the utility model provides a following technical scheme: the utility model provides a realize pin frame of high density pin, includes first frame, one side fixedly connected with insulating coating of first frame, one side fixedly connected with cardboard of first frame, the first arch of top fixedly connected with of cardboard, one side fixedly connected with rubber strip of first frame, the top fixedly connected with block rubber of rubber strip, one side fixedly connected with fixed plate of first frame, the bottom fixedly connected with second of fixed plate is protruding, one side fixedly connected with trapezoidal piece of first frame.
One side fixedly connected with connecting plate of first frame, spacing hole has been seted up to the bottom of connecting plate, one side swing joint of first frame has the second frame, makes this pin frame can be convenient for splice to using this pin frame, when needing to splice the installation to a plurality of this pin frame, can making things convenient for people to carry out quick effectual concatenation to this pin frame, changing this pin frame's length, alleviateed people's operating pressure, satisfied people's work demand, improved this pin frame's work efficiency.
Preferably, the first protruding shape size and the second protruding shape size all match each other, and the cardboard passes through first arch and second arch and fixed plate swing joint, can effectual increase the frictional force between cardboard and the fixed plate through first arch and second arch to conveniently splice.
Preferably, a first chip pin is arranged at the top of the first frame, a chip base is fixedly connected to the top of the first frame, a second chip pin is arranged at the top of the first frame, and therefore the lead frame can be used for high-density pins conveniently, so that the high-density pins can be realized when the lead frame is used for leading wires, the working pressure of people is reduced, the working requirements of people are met, the working efficiency of the lead frame is improved, and convenience is brought to the work of people.
Preferably, the shape and size of the first frame and the shape and size of the second frame are matched with each other, the first frame is movably connected with the second frame through the fixing plate and the clamping plate, and the first frame and the second frame are spliced through the fixing plate and the clamping plate, so that the first frame and the second frame can be conveniently spliced and installed.
Preferably, the shape and size of the limiting hole are matched with the shape and size of the rubber block, and the rubber block) penetrates through the connecting plate through the limiting hole, the rubber block penetrates through the connecting plate through the limiting hole conveniently, and therefore the first frame and the second frame are connected and fixed conveniently.
Preferably, the bottom of rubber strip and the top swing joint of trapezoidal piece, and the rubber strip passes through trapezoidal piece and connecting plate swing joint, makes things convenient for the rubber strip to take place deformation through the trapezoidal piece to can increase the frictional force between rubber strip and the connecting plate.
Preferably, one side and the insulating coating swing joint of fixed plate, and one side of cardboard and one side of connecting plate all with insulating coating swing joint, be connected with insulating coating through fixed plate, cardboard and connecting plate to can improve insulating nature through insulating coating.
(III) advantageous effects
Compared with the prior art, the utility model provides a realize pin frame of high density pin possesses following beneficial effect:
1. this realize pin frame of high density pin, through first frame, insulating coating, the cardboard, first arch, the rubber strip, the rubber block, the fixed plate, the second is protruding, trapezoidal piece, connecting plate and spacing hole, make this pin frame can be convenient for splice, thereby use this pin frame, when needing to splice the installation to a plurality of this pin frame, can make things convenient for people to carry out quick effectual concatenation to this pin frame, change this pin frame's length, people's operating pressure has been alleviateed, people's work demand has been satisfied, this pin frame's work efficiency has been improved.
2. This lead frame who realizes high density pin through first frame, first chip pin, chip base and second chip pin, makes this lead frame can be convenient for carry out the high density pin to when using this lead frame to lead wire, can realize the high density pin, alleviateed people's operating pressure, satisfied people's work demand, improved this lead frame's work efficiency, the work of giving people has brought the facility.
Drawings
Fig. 1 is a cross-sectional view of a lead frame of the present invention;
FIG. 2 is a connection structure diagram of the first frame and the second frame of the present invention;
fig. 3 is a top view of the first frame of the present invention;
FIG. 4 is an enlarged view of the structure A in FIG. 2 according to the present invention;
fig. 5 is a schematic view of a three-dimensional structure of the trapezoidal block of the present invention.
In the figure: 1. a first frame; 2. insulating paint; 3. clamping a plate; 4. a first protrusion; 5. a rubber strip; 6. A rubber block; 7. a fixing plate; 8. a second protrusion; 9. a trapezoidal block; 10. a connecting plate; 11. a limiting hole; 12. a second frame; 13. a first chip pin; 14. a chip base; 15. a second chip pin.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
Example 1
The preferred embodiment of the lead frame for high density leads is shown in fig. 1-5: the utility model provides a realize pin frame of high density pin, including first frame 1, one side fixedly connected with insulating coating 2 of first frame 1, one side fixedly connected with cardboard 3 of first frame 1, the first arch 4 of top fixedly connected with of cardboard 3, one side fixedly connected with rubber strip 5 of first frame 1, the top fixedly connected with block rubber 6 of rubber strip 5, one side fixedly connected with fixed plate 7 of first frame 1, the bottom fixedly connected with second of fixed plate 7 is protruding 8, one side fixedly connected with trapezoidal piece 9 of first frame 1.
One side fixedly connected with connecting plate 10 of first frame 1, spacing hole 11 has been seted up to the bottom of connecting plate 10, one side swing joint of first frame 1 has second frame 12, make this pin frame can be convenient for splice, thereby using this pin frame, when needing to splice the installation to a plurality of this pin frame, can make things convenient for people to carry out quick effectual concatenation to this pin frame, change this pin frame's length, people's operating pressure has been alleviateed, people's work demand has been satisfied, this pin frame's work efficiency has been improved.
In this embodiment, the shape and size of first arch 4 and the shape and size of second arch 8 all match each other, and cardboard 3 is through first arch 4 and second arch 8 and fixed plate 7 swing joint, can effectual increase the frictional force between cardboard 3 and the fixed plate 7 through first arch 4 and second arch 8 to the convenience is spliced.
Example 2
Based on embodiment 1, the preferred embodiment of the lead frame for realizing high-density leads provided by the present invention is shown in fig. 1 to 5: first chip pin 13 has been seted up at first frame 1's top, first frame 1's top fixedly connected with chip base 14, second chip pin 15 has been seted up at first frame 1's top, make this pin frame can be convenient for carry out the high density pin, thereby when using this pin frame to lead wire, can realize the high density pin, people's operating pressure has been alleviateed, people's work demand has been satisfied, this pin frame's work efficiency has been improved, the work of giving people has brought the facility.
In this embodiment, the shape and size of the first frame 1 and the shape and size of the second frame 12 are both matched with each other, and the first frame 1 is movably connected with the second frame 12 through the fixing plate 7 and the clamping plate 3, and is spliced through the fixing plate 7 and the clamping plate 3, so that the first frame 1 and the second frame 12 can be conveniently spliced and installed.
Further, the shape and size of the limiting hole 11 and the shape and size of the rubber block 6 are matched with each other, the rubber block 6 penetrates through the connecting plate 10 through the limiting hole 11, the rubber block 6 penetrates through the connecting plate 10 conveniently through the limiting hole 11, and therefore the first frame 1 and the second frame 12 are connected and fixed conveniently.
Further, the bottom of rubber strip 5 and the top swing joint of trapezoidal piece 9, and rubber strip 5 makes things convenient for rubber strip 5 to take place deformation through trapezoidal piece 9 and connecting plate 10 swing joint through trapezoidal piece 9 to can increase the frictional force between rubber strip 5 and the connecting plate 10.
Besides, one side of the fixing plate 7 is movably connected with the insulating paint 2, one side of the clamping plate 3 and one side of the connecting plate 10 are movably connected with the insulating paint 2, and the fixing plate 7, the clamping plate 3 and the connecting plate 10 are connected with the insulating paint 2, so that the insulating property can be improved through the insulating paint 2.
When using, when splicing first frame 1 and second frame 12, insert cardboard 3 in the fixed plate 7, increase the frictional force between cardboard 3 and the fixed plate 7 through second arch 8 and first arch 4, thereby fix cardboard 3 and fixed plate 7, rubber strip 5 inserts the bottom of connecting plate 10, insert the in-process, rubber strip 5 causes the extrusion through trapezoidal piece 9, take place deformation, rubber piece 6 runs through connecting plate 10 through spacing hole 11, it is convenient to fix rubber strip 5 from scratch, the completion is fixed first frame 1 and second frame 12's installation.
To sum up, this lead frame who realizes high density pin can be convenient for splice, thereby use this lead frame, when needing to splice a plurality of this lead frame installation, can make things convenient for people to carry out quick effectual concatenation to this lead frame, change this lead frame's length, can be convenient for carry out high density pin, thereby when using this lead frame to lead wire, can realize high density pin, people's operating pressure has been alleviateed, people's work demand has been satisfied, this lead frame's work efficiency has been improved, the work of giving people has brought the facility.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A lead frame for implementing high-density leads, comprising a first frame (1), characterized in that: one side of the first frame (1) is fixedly connected with an insulating coating (2), one side of the first frame (1) is fixedly connected with a clamping plate (3), the top of the clamping plate (3) is fixedly connected with a first bulge (4), one side of the first frame (1) is fixedly connected with a rubber strip (5), the top of the rubber strip (5) is fixedly connected with a rubber block (6), one side of the first frame (1) is fixedly connected with a fixing plate (7), the bottom of the fixing plate (7) is fixedly connected with a second bulge (8), and one side of the first frame (1) is fixedly connected with a trapezoidal block (9);
one side fixedly connected with connecting plate (10) of first frame (1), spacing hole (11) have been seted up to the bottom of connecting plate (10), one side swing joint of first frame (1) has second frame (12).
2. The lead frame of claim 1, wherein: the size and shape of the first protrusion (4) are matched with the size and shape of the second protrusion (8), and the clamping plate (3) is movably connected with the fixing plate (7) through the first protrusion (4) and the second protrusion (8).
3. The lead frame of claim 1, wherein: first chip pin (13) have been seted up at the top of first frame (1), top fixedly connected with chip base (14) of first frame (1), second chip pin (15) have been seted up at the top of first frame (1).
4. The lead frame of claim 1, wherein: the shape and size of the first frame (1) are matched with the shape and size of the second frame (12), and the first frame (1) is movably connected with the second frame (12) through the fixing plate (7) and the clamping plate (3).
5. The lead frame of claim 1, wherein: the shape and size of the limiting hole (11) are matched with those of the rubber block (6), and the rubber block (6) penetrates through the connecting plate (10) through the limiting hole (11).
6. The lead frame of claim 1, wherein: the bottom of the rubber strip (5) is movably connected with the top of the trapezoidal block (9), and the rubber strip (5) is movably connected with the connecting plate (10) through the trapezoidal block (9).
7. The lead frame of claim 1, wherein: one side of the fixing plate (7) is movably connected with the insulating paint (2), and one side of the clamping plate (3) and one side of the connecting plate (10) are both movably connected with the insulating paint (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222269844.9U CN218730922U (en) | 2022-08-26 | 2022-08-26 | Lead frame for realizing high-density pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222269844.9U CN218730922U (en) | 2022-08-26 | 2022-08-26 | Lead frame for realizing high-density pins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218730922U true CN218730922U (en) | 2023-03-24 |
Family
ID=85631754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222269844.9U Active CN218730922U (en) | 2022-08-26 | 2022-08-26 | Lead frame for realizing high-density pins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218730922U (en) |
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2022
- 2022-08-26 CN CN202222269844.9U patent/CN218730922U/en active Active
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