CN218730893U

CN218730893U - IC chip positioning block and bearing jig with same

Info

Publication number: CN218730893U
Application number: CN202222229191.1U
Authority: CN
Inventors: 渠海涛; 闫宏杰
Original assignee: Siliconware Technology Suzhou Co ltd
Current assignee: Siliconware Technology Suzhou Co ltd
Priority date: 2022-08-24
Filing date: 2022-08-24
Publication date: 2023-03-24
Anticipated expiration: 2032-08-24

Abstract

The utility model discloses a IC chip locating piece and have tool that bears of this locating piece, the locating piece includes the locating piece body, set up the recess that is used for placing the IC chip on the locating piece body, the equipartition has array's support column in the recess, the tip of locating piece body is provided with the locating hole. The utility model discloses technical scheme's advantage mainly embodies: the retaining wall of the positioning block is used for initial positioning, the positioning pins are arranged in a combined mode, and the solder ball positioning holes of the IC chip are formed by utilizing gaps among the positioning pins, so that the placing stability of the IC chip is further guaranteed, the subsequent test of the IC chip is improved, and the production efficiency and the productivity of the IC chip are indirectly improved.

Description

IC chip positioning block and IC chip positioning device having the same the bearing jig of the locating piece

Technical Field

The utility model belongs to the technical field of the semiconductor test, concretely relates to IC locating piece and have bearing jig of this locating piece.

Background

The semiconductor production process generally includes wafer manufacturing, wafer testing, chip packaging and post-packaging testing, and warehousing and shipping after passing the testing. When testing a semiconductor, it is typically placed on a test fixture and transported to a test area for testing. The existing test fixture generally comprises a test base body, an IC groove used for placing an IC chip is formed in the test base body, a positioning PIN needle is arranged in the IC groove, however, the structure easily causes a test arm to move to obtain the diameter of the IC chip and arrange the diameter of the IC chip in the IC groove, so that the material is placed obliquely, and the subsequent test effect is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the above problems existing in the prior art, providing a high-precision IC locating piece and a bearing jig with the locating piece.

The purpose of the utility model can be realized through the following technical scheme:

the IC chip positioning block comprises a positioning block body, wherein a groove for placing an IC chip is formed in the positioning block body, array-type supporting columns are uniformly distributed in the groove, and positioning holes are formed in the end part of the positioning block body.

Preferably, gaps are arranged among the supporting columns, and the size of each gap is equivalent to the diameter of a solder ball at the bottom of the IC chip.

Preferably, the end of the groove and the middle of the groove extend outwards to form an abdicating part of the IC chip, the cross section of the abdicating part of the end of the groove is semicircular, and the cross section of the abdicating part of the middle of the groove is rectangular.

Preferably, the edge of the groove is chamfered.

Preferably, the upper end of the groove is arranged in an inclined manner.

Preferably, the inclination of the upper end part of the groove and the longitudinal axis form an included angle of 30-60 degrees.

Preferably, the positioning block is made of an antistatic polyetherimide material.

Preferably, the bearing jig is provided with any one of the IC chip positioning blocks, the bearing jig is provided with a plurality of bearing grooves, the positioning block is arranged in the bearing grooves, and the positioning block is fixed with the bearing grooves through fastening screws.

The utility model discloses technical scheme's advantage mainly embodies: the retaining wall of the positioning block is used for initial positioning, the positioning pins are arranged in a combined mode, and the solder ball positioning holes of the IC chip are formed by utilizing gaps among the positioning pins, so that the placing stability of the IC chip is further guaranteed, the subsequent test of the IC chip is improved, and the production efficiency and the productivity of the IC chip are indirectly improved.

Drawings

Fig. 1 is a schematic view of a three-dimensional structure of the positioning block of the present invention.

Fig. 2 is a schematic diagram of an included angle of the groove portion of the positioning block of the present invention.

Wherein, 1 locating piece body, 11 middle part lets position portion, 12 support columns, 112 groove lateral walls, 113 locating holes, 114 tip lets position portion.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. These embodiments are merely exemplary embodiments for applying the technical solutions of the present invention, and all technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the scope of the present invention.

The utility model discloses a IC chip locating piece combines to be shown in fig. 1-2, including locating piece body 1, the tip of locating piece body 1 is provided with and is used for locating piece body 1 installs locating hole 113 on bearing the weight of the tool. The positioning block body 1 is provided with a groove for placing an IC chip, the size of the groove is equivalent to that of the IC chip, namely, the IC chip can be smoothly placed in the groove, and the specific tolerance can be adjusted according to actual requirements. Array-type support columns 12 protruding upwards are uniformly distributed in the groove, gaps are arranged among the support columns 12, and the size of each gap is equal to the diameter of a solder ball at the bottom of the IC chip. When the IC chip is placed in the groove, the solder balls at the bottom of the IC chip are embedded into the gaps between the adjacent support pillars 12, so that the IC chip can be positioned more accurately, and meanwhile, the stability of the IC chip in the groove is ensured, and the inclination is avoided.

The groove side walls 112 of the recess form retaining walls which serve as a preliminary positioning for the IC chip when it is placed in the recess. The four end parts of the groove and the middle part of the groove extend outwards to form a yielding part of the IC chip, the cross section of the end yielding part 114 of the groove is semicircular, and the cross section of the middle yielding part 11 of the groove is rectangular. Let position portion make the IC chip can have better place space when placing, be convenient for take. Meanwhile, in order to prevent the IC chip from being placed in the groove and being scratched, the edge of the groove is chamfered. The upper end part of the groove is arranged in a slope manner. The included angle A between the inclination of the upper end part of the groove and the longitudinal axis is generally 30-60 degrees. In this embodiment, to further facilitate the material sliding into place during placement, the included angle is preferably 30 °. The positioning block is made of an ESD420 antistatic material, so that the electrical property can be further improved, the signal circulation can be blocked, and the accuracy of subsequent testing is improved.

The utility model also discloses a bearing jig of IC chip locating piece more than having arbitrary, bearing jig is last to have seted up a plurality of and to bear the weight of the groove, the locating piece is arranged in the bearing groove, the locating piece pass through fastening screw with the bearing groove is fixed through locating hole 113. During testing, the IC chip is placed in the groove through the testing arm, the positioning block is conveyed to the testing platform by the bearing jig for testing, and the specific testing process is the same as that in the prior art, so that the detailed description is omitted.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. The utility model has a plurality of implementation modes, and all technical schemes formed by adopting equivalent transformation or equivalent transformation all fall within the protection scope of the utility model.

Claims

IC chip locating piece, its characterized in that: the positioning block comprises a positioning block body, wherein a groove for placing an IC chip is formed in the positioning block body, array-type support columns are uniformly distributed in the groove, and a positioning hole is formed in the end part of the positioning block body;

gaps are arranged among the supporting columns, and the size of each gap is equivalent to the diameter of the solder ball at the bottom of the IC chip;

the tip of recess reaches the middle part of recess all outwards extends the portion of stepping down that forms the IC chip, the tip of recess steps down the portion cross-section and is semi-circular, the middle part of recess steps down the portion cross-section and is the rectangle.
2. The IC chip positioning block of claim 1, wherein: the edge of the groove is arranged in a chamfer way.
3. The IC chip positioning block of claim 2, wherein: the upper end of the groove is arranged in a slope manner.
4. The IC chip positioning block according to claim 3, the method is characterized in that: the included angle between the inclination of the upper end part of the groove and the longitudinal axis is 30-60 degrees.
5. The IC chip positioning block of claim 4, wherein: the positioning block is made of an antistatic polyetherimide material.
6. The carrier fixture with the positioning block for IC chips according to any one of claims 1-5, wherein: the bearing jig is provided with a plurality of bearing grooves, the positioning blocks are arranged in the bearing grooves, and the positioning blocks are fixed with the bearing grooves through fastening screws.