CN218730816U - Eutectic mechanism of eutectic machine - Google Patents
Eutectic mechanism of eutectic machine Download PDFInfo
- Publication number
- CN218730816U CN218730816U CN202222682560.2U CN202222682560U CN218730816U CN 218730816 U CN218730816 U CN 218730816U CN 202222682560 U CN202222682560 U CN 202222682560U CN 218730816 U CN218730816 U CN 218730816U
- Authority
- CN
- China
- Prior art keywords
- eutectic
- plate
- zone
- cooling
- guide rail
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005496 eutectics Effects 0.000 title claims abstract description 64
- 230000007246 mechanism Effects 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 55
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000010445 mica Substances 0.000 claims abstract description 9
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims description 50
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 40
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 24
- 238000004321 preservation Methods 0.000 claims description 14
- 238000003825 pressing Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 238000003466 welding Methods 0.000 description 14
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Die Bonding (AREA)
Abstract
The utility model discloses an eutectic mechanism of eutectic machine belongs to eutectic machine technical field, including the protection shield, guide rail seat and the temperature control component generate heat, be formed with the recess on the protection shield, be provided with the guide rail seat that generates heat in the recess, be provided with the temperature control component on the guide rail seat that generates heat, the temperature control component is including the cooling board that generates heat, preheat board and multi-temperature zone, the cooling board that generates heat and preheat the board and install respectively in the both sides of guide rail seat that generates heat, it generates heat to lie in the cooling board that generates heat on the guide rail seat and preheats the board between position department and is provided with the lead wire, the below of protection shield is provided with and cools down the board that generates heat and preheat the multi-temperature zone that the board is connected. The utility model has the advantages that: through the cooperation of the last cooling of temperature control component board that generates heat, preheating plate and multi-temperature-zone, can preheat, heat, keep warm and cool down the lead wire to control the temperature of lead wire, improved the eutectic effect, through the inside mica plate that sets up of protection shield, can keep warm to the lead wire, ensure the accurate control of temperature.
Description
Technical Field
The utility model relates to an eutectic machine technical field particularly, relates to an eutectic mechanism of eutectic machine.
Background
Eutectic welding is also called low melting point alloy welding. The basic characteristics of eutectic alloys are: two different metals may be alloyed at a weight ratio well below their respective melting points. The most common eutectic bond used in microelectronic devices is the bonding of a die to a gold plated submount or leadframe, i.e., "gold-on-die eutectic bonding".
Influence of temperature on the eutectic: the lead pins are deformed due to overhigh temperature, the problem that the finished product chip reflow soldering pins cannot climb tin in the later period to cause insufficient soldering is solved, and meanwhile, the wafer is heated to overhigh temperature, cracks and cracks are blown off, and the electrical performance is influenced; the low temperature can lead to the wafer not weld firmly, influence electric property, also can lead to the not firm thrust of wafer welding not enough simultaneously, pulls up whole wafer in the later stage bonding wire.
In the prior art, the eutectic temperature is difficult to control, the eutectic effect is poor, the eutectic time is long, and the working efficiency of the eutectic machine is influenced.
SUMMERY OF THE UTILITY MODEL
For overcoming the temperature of eutectic among the prior art and being difficult to control, the eutectic effect is relatively poor, and the eutectic time is longer, has influenced the work efficiency scheduling problem of eutectic machine, the utility model provides an eutectic mechanism of eutectic machine, include the protection shield, generate heat guide rail seat and temperature control component, be formed with the recess on the protection shield, be provided with in the recess the guide rail seat generates heat, be provided with temperature control component on the guide rail seat generates heat, temperature control component generates heat the board including the cooling, preheats board and multi-temperature zone, the cooling generate heat the board with preheat the board install respectively in the both sides of guide rail seat generates heat, it is located on the guide rail seat to generate heat the cooling generate heat board and preheat between the board position department and be provided with the lead wire, the below of protection shield be provided with the cooling generate heat the board with preheat the multi-temperature zone that the board is connected.
The lead can be preheated, heated, insulated and cooled through the matching of the cooling heating plate, the preheating plate and the multi-temperature zone on the temperature control assembly, when the lead is preheated, the lead at normal temperature is uniformly heated and reaches the target temperature, the heating rate is controlled in the heating engineering, and thermal shock can be generated at an excessive speed to influence poor welding; during heat preservation, the temperature of each part welded by the lead is kept consistent, and various poor welding phenomena can be generated due to uneven temperature; when heating, the wafer and the lead bonding pad can be welded together; when the temperature is reduced, the welding point can be solidified, so that the temperature of the lead is controlled, and the eutectic effect is improved.
Preferably, a mica plate is arranged between the outer wall of the heating guide rail seat and the inner wall of the groove.
Through the mica plate that the inside set up of protection shield, can keep warm to the lead wire, ensure the accurate control of temperature.
Preferably, the multi-temperature zone comprises three cooling zones, a heating zone, a heat preservation zone and a preheating zone, the three cooling zones are sequentially arranged on the protection plate and located below the cooling heating plate, the heating zone is arranged in the middle of the protection plate, and the heat preservation zone and the preheating zone are sequentially arranged on the protection plate and located below the preheating plate.
Preferably, the cooling zone, the heating zone, the heat preservation zone and the preheating zone are all composed of thermocouples and a plurality of heating rods.
Preferably, install down the subassembly on the protection shield, down the subassembly includes clamp plate, guide rail, slider, cylinder and lift mounting panel, guide rail fixed mounting in the bottom of protection shield, slidable mounting has on the guide rail the slider, install the lift mounting panel on the slider, install the top of lift mounting panel the clamp plate, the clamp plate set up in the top of lead wire, the bottom fixed connection of lift mounting panel in the expansion end of cylinder.
The lead is fixed by adopting the pressing component, and the cylinder controls the pressing plate to compress the lead, so that the eutectic machine can run conveniently.
Preferably, the protection plate is provided with a cooling cover plate and a preheating cover plate which are respectively covered at the positions above the cooling heating plate and the preheating plate.
Preferably, the bottom of protection shield is located be provided with four nitrogen gas pipes on the multi-temperature zone, wherein two the top of nitrogen gas pipe with the fixed intercommunication of the inner chamber of cooling apron, two in addition the top of nitrogen gas pipe with the fixed intercommunication of the inner chamber of preheating the apron, a plurality of nitrogen gas through-hole, a plurality of have all been seted up to the below of cooling apron and preheating the apron the nitrogen gas through-hole with the surface intercommunication of lead wire.
The cover plate is preheated to the cooling that sets up on the protective plate to the intercommunication nitrogen pipe can let in nitrogen gas in the apron by the nitrogen pipe, blows off to the lead wire surface from the nitrogen gas through-hole of apron again, can avoid the face of weld oxidation, improves welding wettability.
Preferably, the bottom of the protection plate is fixedly provided with a plurality of supporting seats.
Has the advantages that:
adopt the utility model discloses technical scheme produces beneficial effect as follows:
(1) The lead can be preheated, heated, insulated and cooled through the matching of the cooling heating plate, the preheating plate and the multi-temperature zone on the temperature control assembly, when the lead is preheated, the lead at normal temperature is uniformly heated and reaches the target temperature, the heating rate is controlled in the heating process, and thermal shock can be generated at an excessive speed to influence poor welding; during heat preservation, the temperature of each part welded by the lead is kept consistent, and various poor welding phenomena can be generated due to uneven temperature; when heating, the wafer and the lead bonding pad can be welded together in the heating area; when the temperature is reduced, the welding point can be solidified, so that the temperature of the eutectic crystal is controlled, and the eutectic effect is improved.
(2) Through the mica plate that the inside set up of protection shield, can keep warm to the lead wire, ensure the accurate control of temperature.
(3) The lead is fixed by adopting the pressing component, and the pressing plate is controlled by the cylinder to move up and down on the guide rail and compress the lead, so that the eutectic machine can run conveniently.
(4) The cover plate is covered with preheating to the cooling that sets up on the backplate to the intercommunication nitrogen pipe can let in the apron with nitrogen gas by the nitrogen gas pipe, blows off to the lead wire surface from the nitrogen gas through-hole of apron again, can avoid the face of weld oxidation, improves welding wettability.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic view of the whole three-dimensional structure of the eutectic mechanism of the eutectic machine of the present invention;
FIG. 2 is a schematic view of the internal structure of the eutectic mechanism of the eutectic machine of the present invention;
FIG. 3 is a schematic structural view of the side of the eutectic mechanism of the eutectic machine of the present invention;
figure 4 is a schematic view of the hold-down assembly of the present invention;
fig. 5 is a schematic diagram of the eutectic mechanism bottom of the utility model.
In the figure: 1. a protection plate; 2. a cooling cover plate; 3. preheating a cover plate; 4. a supporting seat; 5. a nitrogen gas pipe; 6. a thermocouple; 7. a heating guide rail seat; 8. mica plates; 9. pressing the assembly; 10. a heating rod; 11. a cooling and heating plate; 12. preheating a plate; 13. a lead; 14. pressing a plate; 15. a guide rail; 16. a slider; 17. a cylinder; 18. a lifting mounting plate; 19. a cooling zone; 20. a heating zone; 21. a heat preservation area; 22. a preheating zone.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
This embodiment passes through the cooperation of last cooling of temperature control components board that generates heat, preheating plate and multi-temperature-zone, can preheat, heat, keep warm and cool down the lead wire to welded requirement has been satisfied, thereby controls the temperature of eutectic, has improved the eutectic effect. The specific implementation mode is as follows:
as shown in fig. 1 to 5, an eutectic mechanism of eutectic machine, including protection shield 1, guide rail seat 7 and the temperature control component generate heat, be formed with the recess on the protection shield 1, be provided with guide rail seat 7 that generates heat in the recess, be provided with the temperature control component on the guide rail seat 7 that generates heat, the temperature control component includes cooling heating plate 11, preheat board 12 and multi-temperature-zone, cooling heating plate 11 and preheat board 12 are installed respectively in the both sides of guide rail seat 7 that generates heat, it is provided with lead wire 13 to lie in cooling heating plate 11 and preheat the position department between board 12 on the guide rail seat 7 that generates heat, the below of protection shield 1 is provided with the multi-temperature-zone of being connected with cooling heating plate 11 and preheat board 12. Through the cooperation of the temperature-reducing heating plate 11, the preheating plate 12 and the multi-temperature zone on the temperature control assembly, the lead 13 can be preheated, heated, insulated and cooled, so that the temperature of eutectic is controlled, and the eutectic effect is improved.
Install mica plate 8 between the outer wall of the guide rail seat 7 that generates heat and the inner wall of recess, through the mica plate 8 of the inside setting of protection shield 1, can keep warm to lead 13, ensure the accurate control of temperature.
The multi-temperature zone comprises three cooling zones 19, a heating zone 20, a heat preservation zone 21 and a preheating zone 22, the three cooling zones 19 are sequentially arranged on the protection plate 1 and located below the cooling heating plate 11, the heating zone 20 is arranged in the middle of the protection plate 1, the heat preservation zone 21 and the preheating zone 22 are sequentially arranged on the protection plate 1 and located below the preheating plate 12, and preheating, heating, heat preservation and cooling of the lead 13 can be achieved through the cooling zones 19, the heating zone 20, the heat preservation zone 21 and the preheating zone 22.
The cooling zone 19, the heating zone 20, the heat preservation zone 21 and the preheating zone 22 are all composed of thermocouples 6 and a plurality of heating rods 10, the thermocouples 6 are matched with the heating rods 10, the heating rods 10 can be used for heating, and the thermocouples 6 are used for controlling the temperature.
Install down subassembly 9 on protection shield 1, down subassembly 9 includes clamp plate 14, guide rail 15, slider 16, cylinder 17 and lift mounting panel 18, guide rail 15 fixed mounting is in the bottom of protection shield 1, slidable mounting has slider 16 on guide rail 15, install lift mounting panel 18 on the slider 16, clamp plate 14 is installed at the top of lift mounting panel 18, clamp plate 14 sets up in the top of lead wire 13, the bottom fixed connection of lift mounting panel 18 is in the expansion end of cylinder 17, adopt down subassembly 9 fixed lead wire 13, control clamp plate 14 by cylinder 17 and reciprocate at guide rail 15, and compress tightly lead wire 13, thereby be convenient for the operation of eutectic machine.
The protection plate 1 is respectively covered with a cooling cover plate 2 and a preheating cover plate 3 at positions above the cooling heating plate 11 and the preheating plate 12, and the leads 13 can be protected by covering the cooling cover plate 2 and the preheating cover plate 3.
The bottom of protection shield 1 is located the multi-temperature zone and is provided with four nitrogen gas pipes 5, and wherein the fixed intercommunication of the top of two nitrogen gas pipes 5 and the inner chamber of cooling apron 2, the fixed intercommunication of the top of two other nitrogen gas pipes 5 and the inner chamber of preheating apron 3, a plurality of nitrogen gas through-hole and lead wire 13's surface intercommunication have all been seted up to cooling apron 2 and the below of preheating apron 3.
The bottom of the protection plate 1 is fixedly provided with a plurality of supporting seats 4.
The cooling apron 2 that sets up on the protective plate 1 and preheat apron 3 intercommunication nitrogen gas pipe 5 can let in the apron with nitrogen gas by nitrogen gas pipe 5, blow off to lead 13 surfaces from the nitrogen gas through-hole of apron again, can avoid the face of weld oxidation, improve welding wettability.
The bottom fixed mounting of protection shield 1 has a plurality of supporting seat 4, through supporting seat 4, can be convenient for the installation and the fixed of whole mechanism.
The working principle is as follows: the lead is arranged on a heating guide rail seat inside the protective plate, temperature control components are arranged around the lead, a cooling heating plate is arranged on the temperature control components, the preheating plate and a multi-temperature zone are matched, the lead can be preheated, heated, kept warm and cooled, the temperature of eutectic is controlled, the eutectic effect is improved, the multi-temperature zone comprises a cooling area, a heating area, a heat preservation area and a preheating area, the multi-temperature zone comprises a heating rod and a thermocouple, heating and temperature control can be achieved respectively, meanwhile, a mica plate is arranged outside the heating guide rail seat, the lead can be kept warm, accurate temperature control is guaranteed, a cooling cover plate and a preheating cover plate are arranged on the cooling heating plate and the preheating plate respectively, a nitrogen pipe is communicated, nitrogen can be introduced into the cover plate through the nitrogen pipe, the nitrogen is blown out to the surface of the lead from a nitrogen through hole of the cover plate, welding surface oxidation can be avoided, welding wettability is improved, a pressing component is used for fixing the lead, a cylinder control pressing plate to move up and down, and press the lead tightly, and eutectic is convenient for completion of eutectic.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides an eutectic mechanism of eutectic machine, its characterized in that includes protection shield (1), the guide rail seat (7) and the temperature control subassembly that generate heat, be formed with the recess on protection shield (1), be provided with in the recess the guide rail seat (7) generate heat, be provided with temperature control assembly on the guide rail seat (7) generate heat, temperature control assembly generates heat board (11), preheating plate (12) and multi-temperature-zone including the cooling, the cooling generate heat board (11) and preheating plate (12) install respectively in the both sides of guide rail seat (7) generate heat, it is located on guide rail seat (7) to generate heat the department of position is provided with lead wire (13) between board (11) and preheating plate (12) generate heat to reduce the temperature, the below of protection shield (1) be provided with the cooling generate heat board (11) with the multi-temperature-zone that preheating plate (12) are connected.
2. The eutectic mechanism of the eutectic machine of claim 1, characterized in that a mica plate (8) is installed between the outer wall of the heating guide rail seat (7) and the inner wall of the groove.
3. The eutectic mechanism of an eutectic machine according to claim 1, wherein the multiple temperature zones include three cooling zones (19), one heating zone (20), one heat preservation zone (21) and one preheating zone (22), the three cooling zones (19) are sequentially disposed on the protection plate (1) at a position below the cooling and heating plate (11), the heating zone (20) is disposed in the middle of the protection plate (1), and the heat preservation zone (21) and the preheating zone (22) are sequentially disposed on the protection plate (1) at a position below the preheating plate (12).
4. The eutectic mechanism of the eutectic machine according to claim 3, wherein the cooling zone (19), the heating zone (20), the holding zone (21) and the preheating zone (22) are each composed of a thermocouple (6) and a plurality of heating rods (10).
5. The eutectic mechanism of eutectic machine of claim 1, characterized in that install down-pressing subassembly (9) on protection shield (1), down-pressing subassembly (9) includes clamp plate (14), guide rail (15), slider (16), cylinder (17) and lift mounting panel (18), guide rail (15) fixed mounting in the bottom of protection shield (1), slidable mounting has on guide rail (15) slider (16), install lift mounting panel (18) on slider (16), install the top of lift mounting panel (18) clamp plate (14), clamp plate (14) set up in the top of lead wire (13), the bottom fixed connection of lift mounting panel (18) in the expansion end of cylinder (17).
6. The eutectic mechanism of the eutectic machine according to claim 1, wherein the protection plate (1) is covered with a cooling cover plate (2) and a preheating cover plate (3) at positions above the cooling and heating plate (11) and the preheating plate (12).
7. The eutectic mechanism of eutectic machine of claim 6, characterized in that, four nitrogen gas pipes (5) are arranged on the bottom of the protection plate (1) at the multi-temperature zone, wherein the tops of two nitrogen gas pipes (5) are fixedly communicated with the inner cavity of the cooling cover plate (2), the tops of the other two nitrogen gas pipes (5) are fixedly communicated with the inner cavity of the preheating cover plate (3), a plurality of nitrogen gas through holes are arranged below the cooling cover plate (2) and the preheating cover plate (3), and a plurality of nitrogen gas through holes are communicated with the surface of the lead (13).
8. The eutectic mechanism of the eutectic machine according to claim 7, wherein a plurality of supporting seats (4) are fixedly installed at the bottom of the protection plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222682560.2U CN218730816U (en) | 2022-10-12 | 2022-10-12 | Eutectic mechanism of eutectic machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222682560.2U CN218730816U (en) | 2022-10-12 | 2022-10-12 | Eutectic mechanism of eutectic machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218730816U true CN218730816U (en) | 2023-03-24 |
Family
ID=85583490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222682560.2U Active CN218730816U (en) | 2022-10-12 | 2022-10-12 | Eutectic mechanism of eutectic machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218730816U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117497425A (en) * | 2023-12-29 | 2024-02-02 | 深圳平晨半导体科技有限公司 | High-precision eutectic device for semiconductor processing and eutectic processing method thereof |
-
2022
- 2022-10-12 CN CN202222682560.2U patent/CN218730816U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117497425A (en) * | 2023-12-29 | 2024-02-02 | 深圳平晨半导体科技有限公司 | High-precision eutectic device for semiconductor processing and eutectic processing method thereof |
| CN117497425B (en) * | 2023-12-29 | 2024-03-19 | 深圳平晨半导体科技有限公司 | High-precision eutectic device for semiconductor processing and eutectic processing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100762195B1 (en) | Heat spreader module and method of manufacturing same | |
| CN218730816U (en) | Eutectic mechanism of eutectic machine | |
| US11948856B2 (en) | Heat sink for an electronic component | |
| CN103000559A (en) | Positioning clamp for semiconductor chip and manufacture method for semiconductor device | |
| US11581596B2 (en) | Cooling block for a battery module and a manufacturing method thereof | |
| JP6405999B2 (en) | Chip bonding apparatus and chip bonding method | |
| JP2016188426A (en) | Component and method for manufacturing the component part | |
| JP2008235672A (en) | Semiconductor device and its manufacturing method | |
| CN106856180A (en) | A kind of method for welding IGBT module | |
| CN117340378A (en) | Mini LED combined laser welding process | |
| CN102254877B (en) | Power module without metal baseplate | |
| CN116247508A (en) | Negative electrode structure for improving Smile effect of semiconductor laser | |
| JP5011088B2 (en) | Heat dissipation device and power module | |
| CN103846541B (en) | Metal liquid-solid interface thermal extrusion welding method | |
| CN103878473B (en) | Molten metal solid-state interface hot extrusion welder | |
| CN108581253A (en) | A kind of packaging method of the graphene-based heat sink of sandwich type | |
| CN103208473B (en) | Adopt the power model of laser welding terminal | |
| CN113714753A (en) | Method for producing a multipart cooling plate | |
| JP7154410B2 (en) | Warpage control structure of metal base plate, semiconductor module and inverter device | |
| CN105458435A (en) | Lead welding device and technique for packaging semiconductor power device | |
| KR100317649B1 (en) | Wire Bonding Device of Semiconductor Package | |
| CN211276864U (en) | Constant temperature hot-pressing welding head | |
| JPH0970659A (en) | Tool for thermo compression bonding | |
| KR100336153B1 (en) | Mold for forming a braun tube glass a method of making the same | |
| CN214481559U (en) | Welding point butt joint device for FPC flexible circuit board processing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230707 Address after: Rongke Zhigu Industrial Project (Phase III), No. 555 Wenhua Avenue, Hongshan District, Wuhan City, Hubei Province, 430070, Building C2, Unit 2, 5th Floor (2), R&D No. -3 Patentee after: Wuhan Ascenm Semiconductor Equipment Co.,Ltd. Address before: 430070 Room 01, Floor 1, Building 2-04, Phase II, Optics Valley Center, 303 Optics Valley Avenue, Donghu New Technology Development Zone, Wuhan, Hubei Province Patentee before: WUHAN RUIHONGXIN PRECISION MANUFACTURING Co.,Ltd. |
|
| TR01 | Transfer of patent right |