CN218728859U

CN218728859U - Video image intelligent analysis equipment based on VPX framework

Info

Publication number: CN218728859U
Application number: CN202222765401.9U
Authority: CN
Inventors: 赵世新; 胡新建; 张裕; 吴波; 扬天金; 张鹏伟; 王飞
Original assignee: CETC 52 Research Institute
Current assignee: CETC 52 Research Institute
Priority date: 2022-10-20
Filing date: 2022-10-20
Publication date: 2023-03-24
Anticipated expiration: 2032-10-20

Abstract

The utility model discloses a video image intelligent analysis equipment based on VPX framework, including the box, install module frame in the box, install VPX backplate and radiator unit on module frame to and install the core integrated circuit board subassembly in module frame, wherein: the box is hexahedron and comprises a front panel and a rear panel which are arranged oppositely. The equipment realizes the heat dissipation of each module in the module frame by arranging the first heat dissipation tooth sheet group, the second heat dissipation tooth sheet group and the third heat dissipation tooth sheet group, and the third heat dissipation tooth sheet group is inserted in the middle part of the module frame, so that the heat dissipation effect of each module in the module frame is further improved; all modules of the intelligent video image analysis equipment are arranged in the second cavity or the third cavity in parallel, so that the space is saved, and the space utilization rate is improved; the mainboard module of the video image intelligent analysis equipment adopts a domestic design, and is not influenced by imported transportation conditions.

Description

Video image intelligent analysis equipment based on VPX framework

Technical Field

The utility model belongs to the computer field, concretely relates to video image intelligent analysis equipment based on VPX framework.

Background

In recent years, artificial intelligence technology is rapidly developed and widely applied to various social fields, and the economic development level of various countries is greatly promoted. Meanwhile, artificial intelligence technology is also regarded as a competitive key technology. The three major supports of artificial intelligence are hardware, algorithms and data, wherein the core of the hardware is an AI algorithm chip and a corresponding computing platform. With the great support in the aspect of artificial intelligence, the performance of a commercial AI computing platform used for reasoning and training is continuously improved.

The signal interconnection between each module in the present video image intelligent analysis equipment and with the signal interconnection between the external equipment can produce a large amount of heats, when carrying out the heat dissipation processing to whole equipment among the prior art, generally dispels the heat to the outer wall of whole equipment, and this kind of radiating effect is relatively poor, and rate of heat dissipation is slow.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the problem of proposing in the background art, provide a video image intelligent analysis equipment based on VPX framework.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a video image intelligent analysis equipment based on VPX framework, including the box, install module frame in the box, install VPX backplate and the radiator unit on module frame to and install the core integrated circuit board subassembly in module frame, wherein:

the box is hexahedron, including relative front panel and the rear panel that sets up, relative first side board and the second side board that sets up to and apron and the bottom plate that sets up relatively, each side board and front panel all with bottom plate fixed connection, rear panel and apron all with each side board fixed connection.

The module frame all has open hollow structure for the front and back, and the module frame is located the box, installs on the bottom plate, and laminates with the front panel.

And the VPX back plate is arranged on the module frame and is positioned between the module frame and the rear panel.

The heat dissipation assembly comprises a first heat dissipation tooth sheet group, a second heat dissipation tooth sheet group and at least one third heat dissipation tooth sheet group, wherein the first heat dissipation tooth sheet group is installed at the top of the module frame, the second heat dissipation tooth sheet group is installed at the bottom of the module frame, and the third heat dissipation tooth sheet group is inserted in the middle of the module frame, so that the module frame is divided into an upper cavity and a lower cavity.

The core board card assembly is arranged in the first cavity.

Preferably, at least one partition plate is arranged in each first cavity, so that each first cavity is divided into a second cavity and a third cavity.

Preferably, the core board card assembly comprises a main board module, an AI processing module, a storage and network module, a power module, an exchange module and an acceleration card module, guide rails are arranged on two side walls inside the second cavity and the third cavity, locking strips are arranged on two sides of each module, and each module is installed in a matched mode with the corresponding guide rail through the locking strips.

Preferably, each module is a VPX3U or 6U plug-in module.

Preferably, a first electronic disk is integrated on the main board module, and the first electronic disk is a sata electronic disk.

Preferably, the storage and network module comprises a carrier plate and a second electronic disk, and the second electronic disk is arranged on the carrier plate.

Preferably, the second electronic disk is a SATA electronic disk and an m-electronic disk, the carrier board is provided with a SATA slot position and an m-slot position, and the SATA electronic disk and the m-electronic disk are sequentially and correspondingly inserted into the SATA slot position and the m-slot position.

Preferably, the front panel is provided with at least one air inlet.

Preferably, the inner side of the rear panel is provided with at least one fan, and the rear panel is provided with a ventilation window corresponding to the fan.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the equipment realizes the heat dissipation of each module in the module frame by arranging the first heat dissipation tooth sheet group, the second heat dissipation tooth sheet group and the third heat dissipation tooth sheet group, and the third heat dissipation tooth sheet group is inserted in the middle part of the module frame, so that the heat dissipation effect of each module in the module frame is further improved;

2. the modules of the intelligent video image analysis equipment are arranged in the second cavity or the third cavity in parallel, so that the space is saved, and the space utilization rate is improved; the mainboard module of the video image intelligent analysis equipment adopts a domestic design, and is not influenced by imported transportation conditions.

Drawings

Fig. 1 is a schematic view of a first view structure of a VPX-architecture-based video image intelligent analysis device according to the present invention;

fig. 2 is an assembly schematic diagram of the VPX architecture-based video image intelligent analysis device of the present invention;

FIG. 3 is a schematic structural diagram of a module rack according to the present invention;

fig. 4 is a schematic structural diagram of the VPX3U plug module of the present invention;

fig. 5 is a schematic structural diagram of the VPX6U plug module of the present invention;

fig. 6 is a schematic diagram of a second view structure of the VPX-based video image intelligent analysis device of the present invention.

Description of reference numerals: 1. a box body; 11. a front panel; 12. a rear panel; 13. a first side panel; 14. a second side panel; 15. a cover plate; 16. a base plate; 17. an air inlet; 18. a ventilation window; 19. A fan; 2. a module frame; 3. a VPX backplane; 4. a core board card assembly; 5. a heat dissipating component; 51. A first heat-dissipating tooth sheet set; 52. a second heat-dissipating tooth set; 53. a third heat dissipation tooth sheet set; 6. a guide rail; 7. a locking strip; 8. a separator.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

As shown in fig. 1-6, an intelligent analysis device for video images based on VPX architecture comprises a box 1, a module frame 2 installed in the box 1, a VPX backplane 3 and a heat dissipation assembly 5 installed on the module frame 2, and a core board card assembly 4 installed in the module frame 2, wherein:

the box body 1 is hexahedron and comprises a front panel 11 and a rear panel 12 which are oppositely arranged, a first side panel 13 and a second side panel 14 which are oppositely arranged, and a cover plate 15 and a bottom plate 16 which are oppositely arranged, wherein each side panel and the front panel 11 are fixedly connected with the bottom plate 16, and the rear panel 12 and the cover plate 15 are fixedly connected with each side panel.

The module frame 2 is provided with an open hollow structure at the front and the back, and the module frame 2 is positioned in the box body 1, is arranged on the bottom plate 16 and is attached to the front panel 11.

And the VPX back plate 3 is arranged on the module frame 2 and is positioned between the module frame 2 and the rear panel 12.

The heat dissipation assembly 5 comprises a first heat dissipation tooth sheet group 51, a second heat dissipation tooth sheet group 52 and at least one third heat dissipation tooth sheet group 53, the first heat dissipation tooth sheet group 51 is installed at the top of the module frame 2, the second heat dissipation tooth sheet group 52 is installed at the bottom of the module frame 2, and the third heat dissipation tooth sheet group 53 is inserted in the middle of the module frame 2, so that the module frame 2 is divided into an upper cavity and a lower cavity.

The core board card assembly 4 is mounted in the first cavity.

Specifically, taking fig. 2 as an example, the front panel 11, the front side of the module frame 2, the VPX backplane 3 and the rear panel 12 are sequentially arranged from front to back, the first side panel 13 is located on the right side of the module frame 2, the second side panel 14 is located on the left side of the module frame 2, the cover panel 15 is located above the module frame 2, and the bottom panel 16 is located below the module frame 2, which are only convenient for description and are not particularly limited. The front panel 11 and the VPX backplane 3 seal the front and rear openings of the module frame 2. The first heat dissipation tooth sheet set 51 is fixedly installed at the top of the module frame 2, the second heat dissipation tooth sheet set 52 is fixedly installed at the bottom of the module frame 2, the number of the third heat dissipation tooth sheet sets 53 is not limited, and may be set according to actual requirements, in this embodiment, the number of the third heat dissipation tooth sheet sets 53 is one. Each radiating tooth sheet group consists of a plurality of radiating tooth sheets. Through all setting up heat dissipation tooth piece group in module frame 2 upper, middle, lower, and then improve the radiating effect to module frame 2 inside core integrated circuit board subassembly 4. The VPX backplane 3 realizes signal interconnection among modules in the core board card assembly 4 and signal connection of external interfaces of the whole equipment.

In one embodiment, at least one partition 8 is provided in each first cavity, so that each first cavity is divided into a second cavity and a third cavity.

Specifically, the number of the partition plates 8 is not limited, and the partition plates 8 may be arranged according to actual requirements, in this embodiment, one partition plate 8 is fixedly installed in each first cavity, the partition plates 8 are vertically placed, the sizes of the second cavity and the third cavity may be equal or unequal, and the size of the core board card assembly 4 which is actually installed is determined specifically.

In one embodiment, the core board card assembly 4 includes a main board module, an AI processing module, a storage and network module, a power module, a switching module and an acceleration card module, wherein two inner side walls of the second cavity and the third cavity are provided with guide rails 6, locking strips 7 are mounted on two sides of each module, and each module is mounted in cooperation with the corresponding guide rail 6 through the locking strips 7.

Specifically, when each module is installed in the second cavity or the third cavity, each module in the second cavity and the third cavity is installed in the corresponding guide rail 6 in parallel, so that the space utilization rate is greatly improved. The switching module mainly comprises a switching circuit, a control circuit and the like. The switching circuit preferably selects a domestic advanced CTC8096 chip as a core switching chip, mainly realizes the switching and forwarding of Ethernet data and is a core functional unit of a module. The CTC8096 enables communication with the CPU over PCIe. The control circuit preferably selects domestic LS2H as a core chip, and realizes real-time monitoring of the working state of the whole single board and configuration and management of each subsystem. The switching module is provided with 24 paths of gigabit Ethernet interfaces, wherein 22 paths of gigabit networks are connected with the AI acceleration card module, and 2 paths of gigabit networks are connected with the mainboard module through the storage and network module in a transfer mode, so that the internal network communication and the external data interaction of the equipment are realized. An accelerator card module: the equipment can be loaded with 6 AI acceleration card modules, each acceleration card module integrates 4 AI acceleration modules, the acceleration module selects Atlas200, can provide the computing power of 16TOPSINT8 or 8TOPSFP16, and can realize the analysis and the reasoning computation of various data such as images, videos and the like. The acceleration card module performs data interaction with the main board through the gigabit network. A power supply module: the power module provides required power for the mainboard module, the exchange module, the acceleration card module and the like. The input of the power supply module is alternating current 220V voltage, and the output is various voltages required by the whole machine, such as direct current 12V, 5V, 3.3V and the like.

In one embodiment, each module is a VPX3U or 6U plug module.

Specifically, in this embodiment, the left and right widths of the second cavity and the third cavity correspond to the sizes of the VPX3U and 6U plug modules in sequence. Fig. 4 is a VPX6U plug module, and fig. 5 is a VPX3U plug module.

In one embodiment, a first electronic disk is integrated on the motherboard module, and the first electronic disk is an mSATA electronic disk.

Specifically, the motherboard module adopts a Feiteng domestic CPU as a core, integrates domestic DDR3 memory particles, a domestic FPGA, a domestic IO expansion chip, a domestic gigabit network card, a domestic display card, a BMC module and the like, and provides interfaces such as PCIe3.0, display, a gigabit network, USB2.0, SATA3.0 and the like and health state information management. A CPU: choose for use the D2000-8 treater, possess tertiary buffer, integrated 4 DDR3 memory controller and 32 Lane's PCIE3.0 interface, compatible 2.0, 1.0 specifications contain 2 x16RootComplex interfaces, PCIE0 and PCIE1, every x16RootComplex interface all can be split into two x8 interfaces, can support x1, x2, x4, x8, and support the upset, include abundant peripheral hardware simultaneously: I2C, SPI, UART, LPC, GPIO, etc. DDR3 memory particles: preferably purple light national core SCB12Q4G160AF-07Q or SCB13H8G802BF-13KI. FPGA: preferably domestic micro SM2210, used for power supply time sequence control. IO extension chip: preferably, domestic megacore ZX-200 is selected, USB, SATA and gigabit network controllers are integrated inside, and abundant external interfaces are led out. A display card: selecting a Jingjiawei MWG6801JH920 video card, providing 1-path VGA and 4-path HDMI interfaces, supporting H.265 and H.264 video coding and decoding, and supporting video formats such as MPEG4 and the like; support 4k @60fps, 16 way 1080p @60fps decodes, support 1 way 4k @60fps, 4 way 1080p @60fps and encode. A BMC module: preferably megaz GD32F450VIT6, the processor is ARM architecture. And 3 paths of I2C buses are connected to the BMC module. Wherein, I2C1 and I2C2 are used for IPMB protocol communication of the whole equipment, and I2C3 is used for monitoring the temperature, voltage and current on the local carrier plate. An electronic disk: the mainboard is integrated with an mSATA electronic disk, and is used for installing an operating system, the operating system is preferably an Eucin operating system of the Galaxy, and the electronic disk is preferably to the capacity of 128GB, namely EXSAM1B001TB2M1I00, supports SATA3.0 and is compatible with SATA1.5Gbps,3Gbps and 6Gbps interfaces. Gigabit network: preferably, the home network is a WX1860AL4 network providing 4-way gigabit network interface.

In one embodiment, the storage and network module includes a carrier board and a second electronic disk, the second electronic disk being disposed on the carrier board.

In one embodiment, the second electronic disks are SATA electronic disks and m.2 electronic disks, the carrier board is provided with a SATA slot position and an m.2 slot position, and the SATA electronic disks and the m.2 electronic disks are sequentially and correspondingly inserted into the SATA slot position and the m.2 slot position.

Specifically, 2 SATA electronic disk slots and two M.2 electronic disk slots are designed in the carrier plate, and the electronic disk is preferably selected from Hualanwei SS3125-E04T0M-BN00I5 for data storage. In addition, the storage and network module carries a WX1860 network port, and 4 network ports can be expanded for the motherboard module through the PCIE interface, wherein two paths are used to connect two paths of the ATLAS200, and the other two paths are connected to the switching module.

In one embodiment, the front panel 11 is provided with at least one air inlet 17.

In one embodiment, the inner side of the rear panel 12 is provided with at least one fan 19, and the rear panel 12 is provided with a ventilation window 18 corresponding to the fan 19.

Specifically, air enters from the air inlet 17 and exits from the ventilation window 18, the heat dissipation effect of the whole equipment is improved, the fan 19 further improves the heat dissipation effect, the number of the air inlet 17, the ventilation window 18 and the fan 19 can be set according to actual needs, in the embodiment, 12 air inlets 17 are provided, and 4

ventilation windows

18 and 4 fans 19 are provided.

The equipment realizes the heat dissipation of each module in the module frame by arranging the first heat dissipation tooth sheet group, the second heat dissipation tooth sheet group and the third heat dissipation tooth sheet group, and the third heat dissipation tooth sheet group is inserted in the middle part of the module frame, so that the heat dissipation effect of each module in the module frame is further improved; the modules of the intelligent video image analysis equipment are arranged in the second cavity or the third cavity in parallel, so that the space is saved, and the space utilization rate is improved; the mainboard module of the video image intelligent analysis equipment adopts a domestic design, and is not influenced by imported transportation conditions.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express the more specific and detailed embodiments described in the present application, but not be construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A video image intelligent analysis equipment based on VPX framework, its characterized in that: the intelligent video image analysis equipment comprises a box body (1), a module frame (2) installed in the box body (1), a VPX backboard (3) and a heat dissipation assembly (5) installed on the module frame (2), and a core board card assembly (4) installed in the module frame (2), wherein:

the box body (1) is hexahedral and comprises a front panel (11) and a rear panel (12) which are oppositely arranged, a first side panel (13) and a second side panel (14) which are oppositely arranged, and a cover plate (15) and a bottom plate (16) which are oppositely arranged, wherein each side panel and the front panel (11) are fixedly connected with the bottom plate (16), and the rear panel (12) and the cover plate (15) are fixedly connected with each side panel;

the module frame (2) is of a hollow structure with openings at the front and the rear, and the module frame (2) is positioned in the box body (1), is arranged on the bottom plate (16) and is attached to the front panel (11);

the VPX back plate (3) is arranged on the module frame (2) and is positioned between the module frame (2) and the rear panel (12);

the heat dissipation assembly (5) comprises a first heat dissipation tooth sheet group (51), a second heat dissipation tooth sheet group (52) and at least one third heat dissipation tooth sheet group (53), the first heat dissipation tooth sheet group (51) is installed at the top of the module frame (2), the second heat dissipation tooth sheet group (52) is installed at the bottom of the module frame (2), and the third heat dissipation tooth sheet group (53) is inserted in the middle of the module frame (2), so that the module frame (2) is divided into an upper first cavity and a lower first cavity;

the core board card assembly (4) is installed in the first cavity.

2. The VPX architecture-based video image intelligent analysis device of claim 1, wherein: at least one partition plate (8) is arranged in each first cavity, so that each first cavity is divided into a second cavity and a third cavity.

3. The VPX architecture-based video image intelligent analysis device of claim 2, wherein: the core board card assembly (4) comprises a mainboard module, an AI processing module, a storage and network module, a power module, an exchange module and an acceleration card module, guide rails (6) are arranged on two inner side walls of the second cavity and the third cavity, locking strips (7) are arranged on two sides of each module, and each module is installed through the locking strips (7) and the corresponding guide rails (6) in a matched mode.

4. The VPX architecture-based video image intelligent analysis device of claim 3, wherein: each module is a VPX3U or 6U plug-pull module.

5. The VPX architecture-based video image intelligent analysis device of claim 3, wherein: the mainboard module is integrated with a first electronic disk, and the first electronic disk is an mSATA electronic disk.

6. The VPX architecture-based video image intelligent analysis device of claim 3, wherein: the storage and network module comprises a support plate and a second electronic disk, and the second electronic disk is arranged on the support plate.

7. The VPX architecture-based video image intelligent analysis device of claim 6, wherein: the second electronic disk is a SATA electronic disk and an M.2 electronic disk, the carrier plate is provided with a SATA slot position and an M.2 slot position, and the SATA electronic disk and the M.2 electronic disk are correspondingly inserted into the SATA slot position and the M.2 slot position in sequence.

8. The VPX architecture-based video image intelligent analysis device of claim 1, wherein: the front panel (11) is provided with at least one air inlet (17).

9. The VPX architecture-based video image intelligent analysis device of claim 1, wherein: the inner side of the rear panel (12) is provided with at least one fan (19), and the rear panel (12) is provided with a ventilation window (18) corresponding to the fan (19).